CN108838555A - A kind of laser head for laser cutting device - Google Patents
A kind of laser head for laser cutting device Download PDFInfo
- Publication number
- CN108838555A CN108838555A CN201810554838.3A CN201810554838A CN108838555A CN 108838555 A CN108838555 A CN 108838555A CN 201810554838 A CN201810554838 A CN 201810554838A CN 108838555 A CN108838555 A CN 108838555A
- Authority
- CN
- China
- Prior art keywords
- gas
- laser
- inner casing
- cutting device
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003698 laser cutting Methods 0.000 title claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 239000007789 gas Substances 0.000 claims description 46
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000005520 cutting process Methods 0.000 abstract description 11
- 238000004140 cleaning Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of laser head for laser cutting device, the present invention realizes cleaning using first gas and keeps the function of the temperature of cutting position, prevents the non-homogenized of damage and the cutting of cutting position；Second gas is passed through by the way that copper pipe is selectable, may be implemented quickly to reduce the temperature of laser head because second gas temperature is lower, to protect laser head；When second gas is not passed through in the copper pipe, copper pipe also serves as heat-dissipating pipe, by the heat transfer of inner casing to second intracavitary, and for heating the first gas.
Description
Technical field
The present invention relates to laser process equipment field more particularly to a kind of laser heads for laser cutting device.
Background technique
Field of semiconductor processing common means when laser cutting especially carry out singulation to semiconductor substrate or wafer
Cutting.The particle that many ablations or pollution can be generated during cutting, on substrate and come, these particles are for laser cutting
Unfavorable, the prior art often carries out base-plate cleaning in advance, but this cleaning means are can not to solve in cutting process
The particle issues of generation.In addition, laser focuses on some dotted position of substrate, and is located at dotted position in cutting process
The temperature for setting surrounding can be far below the dotted position, this results in this two parts temperature difference excessive, for cutting position
Surrounding causes lattice mismatch equivalent damage.
Summary of the invention
Based on solving the above problems, the present invention provides a kind of laser heads for laser cutting device, including：
The shell and inner casing of concentric tube-shaped, the first chamber of the Inner Constitution laser beam propagation path of the inner casing, the inner casing
Second chamber of the space as gas delivery path between shell intracavitary is provided with condenser described first；Described second
It is connected to a conveying gas device outside chamber, so that the second chamber has the first gas of flowing in laser cutting process；
It is surrounded on the copper pipe of the inner casing outer surface, the copper pipe has air intake and a gas outlet, the air intake and goes out
Port is all set on the top of inner casing, and the air intake is connected to another conveying gas device, so that can in the copper pipe
Second gas with flowing；
Outlet cover, the outlet cover is physically connected to the shell, and first gas is flowed out by outlet cover；
Laser exit, the laser exit are surrounded by the metal tube for being connected to first chamber.
According to an embodiment of the invention, further including the temperature sensor being set on the inner casing outer surface, the temperature
It is intracavitary that sensor gos deep into described second.
According to an embodiment of the invention, further include that the barn door of the condenser more rearward is compared on optical path direction,
The barn door has the opening of central area, and the opening may make laser after focusing to pass through.
According to an embodiment of the invention, the first gas is air, the second gas is nitrogen, argon gas or chlorine.
According to an embodiment of the invention, the temperature of the second gas is lower than the temperature of the first gas.
According to an embodiment of the invention, the focus that the laser focuses is in the outside of the laser exit.
Advantages of the present invention is as follows：
(1) present invention realizes cleaning using first gas and keeps the function of the temperature of cutting position, prevents cutting position
Damage and cutting non-homogenized；
(2) second gas is passed through by the way that copper pipe is selectable, may be implemented because second gas temperature is lower by laser head
Temperature quickly reduces, to protect laser head；
(3) when second gas is not passed through in the copper pipe, copper pipe also serves as heat-dissipating pipe, by the heat transfer of inner casing to second
It is intracavitary, and for heating the first gas.
Detailed description of the invention
Fig. 1 is the schematic diagram of the laser head for laser cutting device of the invention.
Specific embodiment
Referring to Fig. 1, the laser head for laser cutting device of the invention, including：
The shell 1 and inner casing 2 of concentric tube-shaped, the first chamber 4 of the Inner Constitution laser beam propagation path of the inner casing 1 are described
Second chamber 3 of the space as gas delivery path between inner casing 2 and shell 1, is provided with condenser in first chamber 4
5；It is connected to a conveying gas device outside second chamber 3, so that the second chamber 3 has the of flowing in laser cutting process
One gas；
Be surrounded on the copper pipe 7 of 2 outer surface of inner casing, the copper pipe 7 has air intake and a gas outlet, the air intake and
Gas outlet is all set on the top of inner casing 2, and the air intake is connected to another conveying gas device, so that the copper pipe 7
In can have the second gas of flowing；
Outlet cover 9, the outlet cover 9 is physically connected to the shell 1, and first gas is flowed by outlet cover 9
Out；
Laser exit 10, the laser exit 10 are surrounded by the metal tube for being connected to first chamber 4；
The temperature sensor 8 being set on 2 outer surface of inner casing, the temperature sensor 8 go deep into second chamber 3.
In addition, further including compared to the barn door 6 of the condenser 5 more rearward on optical path direction, the barn door 6 has
There is the opening of central area, the opening may make laser after focusing to pass through.
Wherein, the first gas be air, the second gas be nitrogen, argon gas or chlorine, the second gas
Temperature is lower than the temperature of the first gas.
According to an embodiment of the invention, the focus 13 that the laser focuses is in the outside of the laser exit, such as Fig. 1 institute
Show, the focus of focusing concentrates on substrate 20, is cut off in the position of focus 13.Specific operation can be：Laser head edge
The direction S shown in FIG. 1 it is mobile, the first gas of first direction 11 and the first gas of second direction 12 are to the substrate 20
It is cleaned and is heated, this is allowed for, and substrate 20 is clean and its temperature keeps slightly higher, prevents temperature difference band with this
The problems such as lattice mismatch come.In addition, testing out the laser head by temperature sensor 8 when the temperature is excessively high, passing through copper
Pipe 7 conveys cooling of the second gas realization to laser head
Finally it should be noted that：Obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Other various forms of variations or variation out.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (6)
1. a kind of laser head for laser cutting device, including：
The shell and inner casing of concentric tube-shaped, the first chamber of the Inner Constitution laser beam propagation path of the inner casing, the inner casing and outer
Second chamber of the space as gas delivery path between shell intracavitary is provided with condenser described first；Outside second chamber
It is connected to a conveying gas device, so that the second chamber has the first gas of flowing in laser cutting process；
It is surrounded on the copper pipe of the inner casing outer surface, the copper pipe has air intake and gas outlet, the air intake and gas outlet
It is all set on the top of inner casing, the air intake is connected to another conveying gas device, so that can have in the copper pipe
The second gas of flowing；
Outlet cover, the outlet cover is physically connected to the shell, and first gas is flowed out by outlet cover；
Laser exit, the laser exit are surrounded by the metal tube for being connected to first chamber.
2. the manufacturing method of the laser head according to claim 1 for laser cutting device, it is characterised in that：Further include
The temperature sensor being set on the inner casing outer surface, it is intracavitary that the temperature sensor gos deep into described second.
3. the manufacturing method of the laser head according to claim 1 for laser cutting device, it is characterised in that：Further include
The barn door of the condenser more rearward is compared on optical path direction, the barn door has the opening of central area, described
Opening may make laser after focusing to pass through.
4. the manufacturing method of the laser head according to claim 1 for laser cutting device, it is characterised in that：Described
One gas is air, and the second gas is nitrogen, argon gas or chlorine.
5. the manufacturing method of the laser head according to claim 1 for laser cutting device, it is characterised in that：Described
The temperature of two gases is lower than the temperature of the first gas.
6. the manufacturing method of the laser head according to claim 1 for laser cutting device, it is characterised in that：It is described to swash
The focus that light focuses is in the outside of the laser exit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810554838.3A CN108838555A (en) | 2018-06-01 | 2018-06-01 | A kind of laser head for laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810554838.3A CN108838555A (en) | 2018-06-01 | 2018-06-01 | A kind of laser head for laser cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108838555A true CN108838555A (en) | 2018-11-20 |
Family
ID=64211169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810554838.3A Pending CN108838555A (en) | 2018-06-01 | 2018-06-01 | A kind of laser head for laser cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108838555A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111590212A (en) * | 2020-05-11 | 2020-08-28 | 浙江摩多巴克斯科技股份有限公司 | High-speed high-precision multi-axis linkage laser cutting machine with free circular cutting function |
| CN114346488A (en) * | 2021-09-10 | 2022-04-15 | 苏州创鑫激光科技有限公司 | Gas conveying gas path system for laser processing equipment |
| WO2022099983A1 (en) * | 2020-11-16 | 2022-05-19 | 淮安特创科技有限公司 | Anti-reflection laser processing device and laser processing equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993016838A2 (en) * | 1992-02-25 | 1993-09-02 | Altec S.R.L. | Laser processing apparatus |
| CA2093286A1 (en) * | 1992-04-03 | 1993-10-04 | Koichi Haruta | Pulse laser irradiation apparatus for coated metal material |
| BE1012409A3 (en) * | 1997-07-30 | 2000-10-03 | Matsushita Electric Ind Co Ltd | GAS LASER OSCILLATOR. |
| CA2371504A1 (en) * | 2001-11-30 | 2003-05-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor laser device and optical fiber amplifier |
| US20090291197A1 (en) * | 2008-05-21 | 2009-11-26 | Fraunhofer Usa | Laser cladding of tubes |
| CN103737933A (en) * | 2014-01-03 | 2014-04-23 | 广东奥基德信机电有限公司 | Manufacturing equipment of laser additive |
| EP2875896A1 (en) * | 2013-11-22 | 2015-05-27 | SALVAGNINI ITALIA S.p.A. | Laser cutting head for tool machine with a cooling unit fixed to the head |
-
2018
- 2018-06-01 CN CN201810554838.3A patent/CN108838555A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993016838A2 (en) * | 1992-02-25 | 1993-09-02 | Altec S.R.L. | Laser processing apparatus |
| CA2093286A1 (en) * | 1992-04-03 | 1993-10-04 | Koichi Haruta | Pulse laser irradiation apparatus for coated metal material |
| BE1012409A3 (en) * | 1997-07-30 | 2000-10-03 | Matsushita Electric Ind Co Ltd | GAS LASER OSCILLATOR. |
| CA2371504A1 (en) * | 2001-11-30 | 2003-05-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor laser device and optical fiber amplifier |
| US20090291197A1 (en) * | 2008-05-21 | 2009-11-26 | Fraunhofer Usa | Laser cladding of tubes |
| EP2875896A1 (en) * | 2013-11-22 | 2015-05-27 | SALVAGNINI ITALIA S.p.A. | Laser cutting head for tool machine with a cooling unit fixed to the head |
| CN103737933A (en) * | 2014-01-03 | 2014-04-23 | 广东奥基德信机电有限公司 | Manufacturing equipment of laser additive |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111590212A (en) * | 2020-05-11 | 2020-08-28 | 浙江摩多巴克斯科技股份有限公司 | High-speed high-precision multi-axis linkage laser cutting machine with free circular cutting function |
| WO2022099983A1 (en) * | 2020-11-16 | 2022-05-19 | 淮安特创科技有限公司 | Anti-reflection laser processing device and laser processing equipment |
| CN114346488A (en) * | 2021-09-10 | 2022-04-15 | 苏州创鑫激光科技有限公司 | Gas conveying gas path system for laser processing equipment |
| CN114346488B (en) * | 2021-09-10 | 2024-09-03 | 深圳市桓日激光有限公司 | Gas conveying gas circuit system for laser processing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20231201 |