CN108834327B - Assembly method of EEPROM chip - Google Patents

Assembly method of EEPROM chip Download PDF

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Publication number
CN108834327B
CN108834327B CN201810565559.7A CN201810565559A CN108834327B CN 108834327 B CN108834327 B CN 108834327B CN 201810565559 A CN201810565559 A CN 201810565559A CN 108834327 B CN108834327 B CN 108834327B
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China
Prior art keywords
eeprom chip
lead
chip
circuit board
eeprom
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CN108834327A (en
Inventor
王继林
王宁
孟祥涛
刘玲
左明璐
姚俊华
祁兵霞
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Beijing Aerospace Times Optical Electronic Technology Co Ltd
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Beijing Aerospace Times Optical Electronic Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

The invention relates to an assembly method of an EEPROM chip, belongs to the field of assembly processes in the electronic industry, in particular to an assembly method of an EEPROM chip of an optical fiber gyroscope inertia measurement device, and can be applied to the technical field of aerospace inertia measurement. According to the invention, a program downloading interface is not required to be added, so that the installation space is saved, and the product performance requirement is met; the mounting and fixing of the components are realized by binding the EEPROM chip which is inversely mounted on the circuit board by the lead wire, so that the mechanical property requirement is met; the invention realizes the electrical connection between the EEPROM chip lead and the printed circuit board by using the lead, thereby meeting the electrical performance requirement.

Description

Assembly method of EEPROM chip
Technical Field
The invention relates to an assembly method of an EEPROM chip, belongs to the field of assembly processes in the electronic industry, in particular to an assembly method of an EEPROM chip of an optical fiber gyroscope inertia measurement device, and can be applied to the technical field of aerospace inertia measurement.
Background
With the continuous development of satellite application technology, the requirement on the on-orbit reliability of the satellite is continuously improved. The medium and low orbit satellites generally require no quality problem within 5-8 years, and the high orbit satellites generally require no quality problem within 10-15 years. The fiber optic gyroscope inertia measurement device is used as an important measurement component of a satellite control system, is applied to satellites more and more widely, and the quality reliability of the fiber optic gyroscope inertia measurement device directly influences the use reliability of the satellites.
In order to meet the requirement that parameters need to be adjusted for many times in the debugging and testing process of the continuously working fiber-optic gyroscope inertia measuring device for aerospace, an EEPROM chip capable of programming for many times is designed in a product, the chip is installed on an IC seat of a circuit board, the EEPROM chip and the IC seat are temporary carriers of software in the debugging and testing process of the product, the EEPROM chip and the IC seat need to be detached before the product is delivered, and then the PROM chip is welded.
In the debugging and testing process of the continuously working fiber-optic gyroscope inertia measuring device for aerospace, the situation of poor contact often occurs under the vibration environment of an EEPROM chip arranged on an IC seat, and the trouble shooting and the cover opening repair of a product need to be carried out for a long time, so that great quality hidden danger is brought to the product; meanwhile, a certain voltage difference can be caused between the EEPROM chip lead and the IC seat lead due to poor contact in a vibration environment, so that a discharging condition is generated, the connection reliability of an electrical system is seriously influenced, and even other static sensitive devices are damaged, so that the static sensitive devices fail in advance, and a large quality hidden danger risk is brought to products, and therefore, the electrical connection reliability of the EEPROM chip is a key link of the quality reliability of the optical fiber gyro inertia measuring device.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the method is characterized in that the EEPROM chip is inversely arranged on the printed circuit board and is fixed with the printed circuit board by silk yarns; the heat-conducting insulating sheet is used for realizing the electrical insulation between the EEPROM chip and the printed circuit board; electrically interconnecting the EEPROM chip and the printed circuit board by using a lead; the EEPROM chip is detached before the PROM chip is installed, the method meets the requirements of mechanical property and electrical property of the product, so that the electrical property and the mechanical property can be simultaneously met, and the reliability is improved.
The technical solution of the invention is as follows:
a method of assembling an EEPROM chip, the method comprising the steps of:
(1) adhering a heat-conducting insulating sheet to the upper surface of the EEPROM chip, wherein the thickness of the heat-conducting insulating sheet is 10-20 mil;
(2) welding one end of a lead on the lead shoulder of the EEPROM chip obtained in the step (1), and welding the other end of the lead in a welding hole of the printed circuit board;
(3) and (3) binding the EEPROM chip obtained in the step (2) on the printed circuit board by using a silk thread, enabling the heat conduction insulation sheet to face downwards, and enabling the lead of the EEPROM chip to face upwards, so that the EEPROM chip is assembled.
When the program burning is needed, one end of the other wire is welded on the lead of the IC seat, and the other end of the other wire is connected with the program burning device; then inserting the IC seat into a lead of the EEPROM chip to burn the program; and after the burning program is finished, the IC seat is taken down, and the program burning process of the EEPROM chip is realized.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, a program downloading interface is not required to be added, so that the installation space is saved, and the product performance requirement is met;
(2) the mounting and fixing of the components are realized by binding the EEPROM chip which is inversely mounted on the circuit board by the lead wire, so that the mechanical property requirement is met;
(3) the invention realizes the electrical connection between the EEPROM chip lead and the printed circuit board by using the lead, thereby meeting the electrical performance requirement.
(4) The invention provides an assembly method of a direct-insertion EEPROM chip, which comprises the following steps: 1. 2 groups of same direct-insert EEPROM chip mounting pads are designed on the printed circuit board; 2. sticking a heat-conducting insulation sheet with the thickness of 20mil on the body of the direct-insert EEPROM chip; 3. welding 0.08mm at the shoulder position of the lead of the direct-insert EEPROM chip2The lead of (a); 4. welding the other end of the lead at the lead shoulder of the direct-insert EEPROM chip in a corresponding welding hole of the printed circuit board; 5. binding and fixing the direct-insertion EEPROM chip on the printed circuit board by using a lead wire; 6. installing an IC seat on a lead of the direct-insertion EEPROM chip for programming; 7. after the programming is finished, an IC seat without a lead is arranged on the lead of the direct-insert EEPROM chip to prevent the lead from being oxidized; 8. before the PROM chip is welded, the lead on the printed circuit board and the lead wire for binding the chip are detached, the direct-insert EEPROM chip is taken down, and the PROM chip is welded on the other group of 2 groups of bonding pads. The assembly method can effectively solve the problem of poor contact of the direct-insertion EEPROM chip arranged on the IC seat in the vibration process, realizes the repeated programming of the chip program on the premise of not increasing a program programming interface, and ensures that a printed circuit is printedThe reliability of the electrical and mechanical properties of the plate in a vibration environment effectively improves the test reliability of the product.
Drawings
FIG. 1 is a schematic view of a printed circuit board used in the present invention;
FIG. 2 is a schematic diagram of an EEPROM chip having a thermally conductive insulating sheet mounted thereon in accordance with the present invention;
FIG. 3 is a schematic diagram of bonding wires to leads of an EEPROM chip in accordance with the present invention;
FIG. 4 is a schematic diagram of an EEPROM chip mounted and flipped by using lead wire;
FIG. 5 is a schematic diagram of an embodiment of the present invention in which an IC socket is mounted on the leads of an EEPROM chip for programming;
fig. 6 is a schematic diagram of the EEPROM chip and the conductive lines removed and the PROM chip installed in the embodiment of the present invention.
Detailed Description
The method comprises the following steps:
(1) designing 2 groups of EEPROM chip mounting pads with N leads on a printed circuit board, wherein N is a positive integer;
(2) sticking a heat-conducting insulation sheet with the thickness of 20mil on the body of the direct-insert EEPROM chip with the N leads;
(3) welding 0.08mm at the shoulder position of the lead of the direct-insert EEPROM chip2The lead of (a);
(4) welding the other end of the lead at the lead shoulder of the direct-inserted EEPROM chip into a corresponding welding hole of the printed circuit board according to the corresponding relation;
(5) binding and fixing the direct-insertion EEPROM chip on the printed circuit board by using a lead wire;
(6) installing an IC seat on a lead of the direct-insertion EEPROM chip for programming;
(7) after the programming is finished, an IC seat without leads is arranged on the leads of the in-line EEPROM chip to prevent the leads from being oxidized.
(8) Before the PROM chip is welded, the lead on the printed circuit board and the lead wire for binding the chip are detached, the direct-insert EEPROM chip is taken down, and the PROM chip is welded on one group of 2 groups of bonding pads.
In the step (1), 2 groups of EEPROM chip mounting pads are designed according to the number of leads of the EEPROM chip, and the distance between the 2 groups of pads is 2 mm.
In the step (1), 2 groups of EEPROM chip mounting pads are designed according to the number of leads of the EEPROM chip, and the 2 groups of pads are used for binding the chip by using the through holes and mounting and welding the chip by using the through holes.
And selecting the specification of the heat-conducting insulating sheet according to the electrical insulation characteristic of the system.
And according to the electrical connection relation of the system, the EEPROM chip is electrically interconnected with the electrical system by using a lead.
The EEPROM chip is inversely arranged on the printed circuit board, the chip is fixed by using a silk thread binding method according to the weight and the length of the chip, and the binding position is more than or equal to 2.
And according to the number of the leads of the direct-inserted EEPROM chip, installing IC seats with corresponding specifications on the leads of the direct-inserted EEPROM chip, and connecting the IC seats with a programming device through leads for programming.
And according to the number of leads of the direct-insert EEPROM chip, installing an IC seat without leads of a corresponding specification on the leads of the direct-insert EEPROM chip to prevent the leads from being oxidized.
Before the PROM chip is welded, the lead on the printed circuit board and the lead wire for binding the chip are detached, the direct-insert EEPROM chip is taken down, and the PROM chip is welded on one group of 2 groups of bonding pads.
The invention is described in further detail below with reference to the following figures and specific examples:
the EEPROM chip is used as a temporary carrier of a program in the test process of the fiber-optic gyroscope inertia measurement device and plays a key role in verifying the test program. The EEPROM chip assembling method provided by the invention effectively solves the reliability problems of mechanical fixation, electrical connection and the like in the EEPROM chip vibration process, realizes program programming of the EEPROM chip on the premise of not increasing an electrical interface, saves space and time, and improves the reliability of product connection.
When in burning, one end of one wire is welded on the lead of the IC seat, and the other end of the other wire is connected with the program burner; inserting the IC seat into a lead of the EEPROM chip to burn the program; and after the program burning is finished, the IC seat is taken down, and the program burning process of the EEPROM chip is realized.
Examples
An EEPROM chip assembly method, comprising the steps of:
(1) EEPROM mounting pads 12 are designed on printed circuit board 11 with 2 sets of electrically uniform hole spacing of 2mm as shown in fig. 1.
(2) As shown in fig. 2, heat-conducting insulation sheets 22(10mil, 15mil, 20mil) with corresponding thickness are mounted on the EEPROM chip body 21 according to actual needs.
(3) As shown in fig. 3, one end of the wire 33 is welded on the shoulder of the lead of the EEPROM chip; and welding the other end of the lead in a corresponding welding hole of the printed circuit board.
(4) As shown in fig. 4, the EEPROM chip obtained in step (3) is bound on the printed circuit board by using a lead wire 34, and the heat-conducting insulating sheet faces downward, and the lead of the EEPROM chip faces upward, so that the EEPROM chip is assembled;
(5) as shown in fig. 5, a program programming IC socket 41 is mounted on the EEPROM chip lead wire, and program programming is performed.
(6) After the programming of the EEPROM chip is finished, an IC seat without a lead is arranged on the lead of the EEPROM chip to prevent the lead of the EEPROM chip from being oxidized.
(7) After the program is fixed, the EEPROM chip and the leads are detached, and the PROM chip is installed on the bonding pad, as shown in FIG. 6, the EEPROM chip with the leads can be repeatedly used on other circuit boards.
The above description is only for the best mode of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Those skilled in the art will appreciate that the invention may be practiced without these specific details.

Claims (8)

1. A method of assembling an EEPROM chip, the method comprising the steps of:
(1) adhering a heat-conducting insulating sheet on the upper surface of the EEPROM chip;
(2) welding one end of a lead on the lead shoulder of the EEPROM chip obtained in the step (1), and welding the other end of the lead in a welding hole of the printed circuit board;
(3) fixing the EEPROM chip obtained in the step (2) on a printed circuit board, enabling the heat conduction insulation sheet to face downwards, and enabling a lead of the EEPROM chip to face upwards, so as to realize the assembly of the EEPROM chip;
and (3) fixing the EEPROM chip on the printed circuit board in a binding mode, and binding by adopting silk yarns during binding.
2. The method of assembling an EEPROM chip of claim 1, wherein: in the step (1), the thickness of the heat-conducting insulating sheet is 10-20 mil.
3. The method of assembling an EEPROM chip of claim 2, wherein: the thickness of the heat-conducting insulation sheet is 10mil, 15mil or 20 mil.
4. The method of assembling an EEPROM chip of claim 1, wherein: the binding position is more than or equal to 2.
5. The method of assembling an EEPROM chip of claim 4, wherein: binding parts are 3 and are uniformly distributed.
6. The method of assembling an EEPROM chip of claim 1, wherein: in the step (2), the printed circuit board is provided with 2 groups of EEPROM chip mounting bonding pads with N leads, wherein N is a positive integer.
7. The method of assembling an EEPROM chip of claim 6, wherein: the distance of 2 sets of pads is 2 mm.
8. The method of assembling an EEPROM chip of claim 1, wherein: in the step (2), the lead shoulder of the EEPROM chip is welded with 0.08mm2The lead of (2).
CN201810565559.7A 2018-06-04 2018-06-04 Assembly method of EEPROM chip Active CN108834327B (en)

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Application Number Priority Date Filing Date Title
CN201810565559.7A CN108834327B (en) 2018-06-04 2018-06-04 Assembly method of EEPROM chip

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Application Number Priority Date Filing Date Title
CN201810565559.7A CN108834327B (en) 2018-06-04 2018-06-04 Assembly method of EEPROM chip

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CN108834327B true CN108834327B (en) 2020-09-18

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60202987A (en) * 1984-03-28 1985-10-14 三菱電機株式会社 Method of identifying printed board
CN1835220A (en) * 2005-03-16 2006-09-20 松下电器产业株式会社 Semiconductor device
CN105895542A (en) * 2016-04-20 2016-08-24 上海斐讯数据通信技术有限公司 Fixing device and fixing method for chip, PCB and electronic equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60202987A (en) * 1984-03-28 1985-10-14 三菱電機株式会社 Method of identifying printed board
CN1835220A (en) * 2005-03-16 2006-09-20 松下电器产业株式会社 Semiconductor device
CN105895542A (en) * 2016-04-20 2016-08-24 上海斐讯数据通信技术有限公司 Fixing device and fixing method for chip, PCB and electronic equipment

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