CN108822760B - Anisotropic conductive adhesive and substrate structure bonded by anisotropic conductive adhesive - Google Patents

Anisotropic conductive adhesive and substrate structure bonded by anisotropic conductive adhesive Download PDF

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Publication number
CN108822760B
CN108822760B CN201810538062.6A CN201810538062A CN108822760B CN 108822760 B CN108822760 B CN 108822760B CN 201810538062 A CN201810538062 A CN 201810538062A CN 108822760 B CN108822760 B CN 108822760B
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conductive particles
substrate
particle size
gap
preset
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CN108822760A (en
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范佳铭
许雅筑
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention provides an anisotropic conductive adhesive, which is used for conducting an electrode of a first substrate and an electrode of a second substrate, wherein the electrode of the first substrate and the electrode of the second substrate are arranged in an alignment way, and gaps of at least two groups of alignment electrodes are different, and the anisotropic conductive adhesive comprises: more than two types of conductive particles with different particle diameters are used for generating deformation when the first substrate and the second substrate are pressed, so that the electrodes of the first substrate and the second substrate are conducted; the conductive particles with the particle size larger than a preset particle size threshold are used for conducting the counter electrode with the gap larger than a preset gap threshold, and the conductive particles with the particle size smaller than the preset particle size threshold are used for conducting the counter electrode with the gap smaller than the preset gap threshold; and the glue material is used for solidifying the alignment electrode of the corresponding conductive particles and the corresponding conductive particles so as to maintain the stable conduction state of the alignment electrode.

Description

Anisotropic conductive adhesive and substrate structure bonded by anisotropic conductive adhesive
Technical Field
The invention relates to the technical field of conductive adhesives, in particular to an anisotropic conductive adhesive and a substrate structure bonded by the anisotropic conductive adhesive.
Background
Anisotropic Conductive Film (ACF) is used to connect two substrates, for example, to join electrodes between an FPC (flexible circuit board) chip and an LCD (liquid crystal display panel) substrate, and the Anisotropic conductive film includes polymer adhesive and conductive particles.
The working principle of the anisotropic conductive adhesive for bonding two substrates is as follows: the electrodes of the two substrates are aligned and attached, then the two substrates are pressurized, so that the conductive particles in the anisotropic conductive adhesive are extruded to deform, then the electrodes aligned and attached to the two substrates are connected to form a conducting state, and then the electrodes are thermally cured by using a glue material to maintain the conducting state.
Traditional anisotropic conducting resin, to the electrode of the even equal interval counterpoint of two base plates, conductive particle is by even pressure heating in the clearance, then produces deformation and reaches the electrode that switches on two base plates, if two base plates have the counterpoint electrode in the interval that varies, and each position pressure degree to the base plate is the same again, and then the counterpoint electrode that part clearance is big probably because of conductive particle can't reach enough deformation and do not switch on.
Disclosure of Invention
Accordingly, there is a need for an anisotropic conductive adhesive.
An anisotropic conductive adhesive comprising:
conductive particles of two or more kinds of particle diameters; and
and a glue material for providing adhesiveness to the anisotropic conductive glue and curing the conductive particles of two or more particle sizes when in use.
The anisotropic conductive adhesive comprises more than two conductive particles with different particle sizes, and for two substrates with different gap alignment electrodes, the conductive particles with large particle sizes and the conductive particles with small particle sizes can deform under the same pressing condition, so that the conductive particles with large particle sizes can more easily conduct the alignment electrodes with large gaps. For two substrates with the alignment electrodes with different gaps, the failure risk of the alignment electrode with a larger partial gap is reduced.
In one embodiment, the two or more conductive particles are mixed and distributed in the rubber material, so that each region of the rubber material has the two or more conductive particles.
In one embodiment, the glue material is made of epoxy resin, polymethyl methacrylate or polyvinyl acetate.
In one embodiment, the conductive particles of two or more particle sizes have a particle size range of 5um to 20 um.
In one embodiment, the material used to prepare the two or more particle sizes of conductive particles includes at least two of gold, silver, tin, and indium.
A substrate structure bonded with anisotropic conductive paste is also provided.
A substrate structure bonded with anisotropic conductive paste, the substrate structure comprising:
a first substrate;
the electrode of the first substrate and the electrode of the second substrate are arranged in an alignment way, and the gaps of at least two groups of alignment electrodes are different; and
the anisotropic conductive adhesive according to any of the embodiments above is located in the gap between the first substrate and the second substrate, so as to conduct the alignment electrodes of the first substrate and the second substrate; the conductive particles with the particle size larger than the preset particle size threshold in the anisotropic conductive adhesive are used for conducting the alignment electrode with the gap larger than the preset gap threshold, and the conductive particles with the particle size smaller than the preset particle size threshold are used for conducting the alignment electrode with the gap smaller than the preset gap threshold.
In one embodiment, the conductive particles with the particle size larger than the preset particle size threshold are also used for conducting the counter electrode with the gap smaller than the preset gap threshold.
In one embodiment, the number of the first conductive particles in the first region is greater than that of the first conductive particles in the second region, and the number of the second conductive particles in the first region is less than that of the second conductive particles in the second region; the first region is a region of the counter electrode with a gap larger than a preset gap threshold, the second region is a region of the counter electrode with a gap smaller than a preset gap threshold, the first conductive particles are conductive particles with a particle size larger than a preset particle size threshold, and the second conductive particles are conductive particles with a particle size smaller than a preset particle size threshold.
In one embodiment, the first substrate and the second substrate are both substrates having a single curvature or substrates having a double curvature.
In one embodiment, the anisotropic conductive paste has the same particle size as the counter electrode, and the particle size of the conductive particles corresponds to the gap size of the counter electrode conducted by the conductive particles.
According to the substrate structure jointed by the anisotropic conductive adhesive, the anisotropic conductive adhesive comprises more than two conductive particles with different particle sizes, and for two substrates with alignment electrodes with different gaps, the conductive particles with large particle sizes and the conductive particles with small particle sizes can deform under the same pressing condition, and the conductive particles with large particle sizes can more easily conduct the alignment electrodes with large gaps. For two substrates with the alignment electrodes with different gaps, the failure risk of the alignment electrode with a larger partial gap is reduced.
Drawings
FIG. 1 is a schematic diagram of an embodiment of an anisotropic conductive film;
FIG. 2 is a schematic diagram of a substrate structure bonded by anisotropic conductive paste in one embodiment;
FIG. 3 is a schematic diagram of a substrate structure bonded by an anisotropic conductive adhesive according to another embodiment;
FIG. 4 is a diagram illustrating a substrate structure having a planar substrate according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
An embodiment of the invention provides an anisotropic conductive adhesive, and fig. 1 is a schematic diagram of the anisotropic conductive adhesive in an embodiment. Referring to fig. 1, the anisotropic conductive film includes: conductive particles 110 of two or more kinds of particle diameters; and a glue material 120 for providing adhesiveness to the anisotropic conductive glue and curing the conductive particles of two or more particle sizes when in use.
The anisotropic conductive adhesive can conduct the substrate of the alignment electrode with different gaps. The substrates with the alignment electrodes having different gaps may be two substrates with the alignment electrodes having different gaps, such as a planar substrate and a curved substrate. Referring to fig. 2, the embodiment will be described below by taking an example in which the anisotropic conductive adhesive is applied to the first substrate 210 and the second substrate 220. The electrodes may be the same size for the same substrate.
The anisotropic conductive adhesive in this embodiment is used to conduct the electrode 230 of the first substrate 210 and the electrode 240 of the second substrate 220, the electrode 230 of the first substrate 210 and the electrode 240 of the second substrate 220 are placed in an aligned manner, and at least two groups of gaps between the alignment electrodes are different, wherein the conductive particles 110 with a particle size larger than a predetermined particle size threshold in the anisotropic conductive adhesive are used to conduct the alignment electrodes with a gap larger than a predetermined gap threshold, and the conductive particles 110 with a particle size smaller than the predetermined particle size threshold are used to conduct the alignment electrodes with a gap smaller than the predetermined gap threshold; the glue material is used for solidifying the corresponding conductive particle and the corresponding alignment electrode so as to maintain the stable conduction state of the alignment electrode.
The conductive particles 110 with two or more particle sizes are mixed and distributed in the rubber material, so that each region of the rubber material 110 has the conductive particles with two or more particle sizes, namely, each region has both the conductive particles 110 with large particle size and the conductive particles 110 with small particle size.
Specifically, the conductive particles 110 may have a particle size ranging from 5um to 20 um. The particle diameter of the conductive particles may be specifically arranged according to the gap between the counter electrodes of the two substrates. After the two substrates are pressed, the ratio of the particle size of the conductive particles 110 to the gap between the substrates after pressing is in the range of 80% to 130% of the particle size of the conductive particles. The particle size of the conductive particles can be controlled by the electroplating process.
The number of the types of the particle diameters of the conductive particles 110 may be the same as the number of the types of the gaps of the counter electrodes, and the size of the particle diameters of the conductive particles 110 may be matched to the gaps of the counter electrodes. For example, referring to fig. 3, if there are 3 kinds of alignment electrodes with different gaps between two substrates, the anisotropic conductive adhesive has 3 kinds of conductive particles 110 with different particle diameters, as shown in fig. 3, the conductive particle 110 with the largest particle diameter is used to conduct the alignment electrode with the largest gap (the alignment electrode on the left in fig. 3 is the alignment electrode with the largest gap), the conductive particle 110 with the second particle diameter is used to conduct the alignment electrode with the next gap (the alignment electrode on the right in fig. 3 is the alignment electrode with the next gap), and the conductive particle 110 with the smallest particle diameter is used to conduct the alignment electrode with the smallest gap (the alignment electrode in the middle in fig. 3 is the alignment electrode with the smallest gap).
The anisotropic conductive adhesive comprises more than two conductive particles with different particle sizes, and for two substrates with different gap alignment electrodes, the conductive particles with large particle sizes and the conductive particles with small particle sizes can deform under the same pressing condition, so that the conductive particles with large particle sizes can more easily conduct the alignment electrodes with large gaps. For two substrates with the alignment electrodes with different gaps, the failure risk of the alignment electrode with a larger partial gap is reduced. The conductive particles with corresponding particle sizes are configured in the regions of different gaps, so that the conductive particle pairs with corresponding particle sizes can be applied to the counter electrodes of the corresponding gaps, and the conduction efficiency is improved.
Referring to fig. 2, the substrate structure includes a first substrate 210, a second substrate 220 and the anisotropic conductive adhesive in any of the above embodiments, wherein the anisotropic conductive adhesive includes conductive particles 110 with two or more particle sizes and an adhesive material 120; in fig. 2, the electrodes of the first substrate 210 and the electrodes of the second substrate 220 are aligned, and at least two groups of gaps between the alignment electrodes are different, the anisotropic conductive adhesive is located in the gap between the first substrate 210 and the second substrate 220, and the anisotropic conductive adhesive contains two or more conductive particles 110 with particle sizes for deforming when the first substrate 210 and the second substrate 220 are pressed together, so as to conduct the alignment electrodes; the conductive particles 110 with the particle size larger than the preset particle size threshold are used for conducting the counter electrode with the gap larger than the preset gap threshold, and the conductive particles 110 with the particle size smaller than the preset particle size threshold are used for conducting the counter electrode with the gap smaller than the preset gap threshold; the glue material 120 in the anisotropic conductive glue is used to solidify the alignment electrode and the corresponding conductive particles of the corresponding conductive particles, so as to maintain the stable conduction state of the alignment electrode.
The preset particle size threshold may be a value set by a user for distinguishing the size of the particle size of the conductive particles, and the preset gap threshold may be a value set by the user for distinguishing the size of the gap between the alignment electrodes. For example, there are conductive particles with a particle size of 5um and conductive particles with a particle size of 20um, the preset particle size threshold may be set to 10um, there are counter electrodes with a gap range of 4um and 19um, and the preset gap threshold may be set to 9 um.
For the first substrate 210 and the second substrate 220, two substrates with alignment electrodes having different gaps may be used, such as a planar substrate and a curved substrate, or one substrate having a larger curvature and the other substrate having a smaller curvature. For example, as shown in fig. 2 to 3, the first substrate 210 and the second substrate 220 both have curvatures, the first substrate 210 is above the second substrate 220, the electrode 230 is disposed on the lower surface of the first substrate 210, the electrode 240 is disposed on the upper surface of the second substrate 220, and the electrode 230 of the first substrate 210 and the electrode 240 of the second substrate 220 are aligned one to one. The gap between the alignment electrodes at the middle of the first substrate 210 and the second substrate 220 is small, and conduction can be achieved by using the conductive particles 110 with small particle size, and the gap between the alignment electrodes at the two sides of the first substrate 210 and the second substrate 220 is large, and conduction can be achieved by using the conductive particles 110 with large particle size.
Specifically, the first substrate 210 is a substrate having a single curvature or a substrate having a double curvature, and the second substrate 220 may be a planar substrate, or a substrate having a single curvature or a substrate having a double curvature. The second substrate 220 is a substrate having a single curvature or a substrate having a double curvature, and the first substrate 210 may be a planar substrate, a substrate having a single curvature, or a substrate having a double curvature.
For example, as shown in fig. 4, the first substrate 210 in fig. 4 is a substrate having a curvature, the second substrate 220 is a planar substrate, the first substrate 210 is above the second substrate 220, the electrode 230 is disposed on the lower surface of the first substrate 210, the electrode 240 is disposed on the upper surface of the second substrate 220, and the electrode 230 of the first substrate 210 and the electrode 240 of the second substrate 220 are aligned one to one. Since one of the first substrate 210 and the second substrate 220 is a planar substrate and the other is a substrate having a curvature, the gap between the pair electrodes is large or small, the pair electrodes having a small gap can be conducted by the conductive particles 110 having a small particle size, and the pair electrodes having a large gap can be conducted by the conductive particles 110 having a large particle size.
In one embodiment, the conductive particles 110 with a particle size larger than the predetermined threshold value can also be used to conduct the alignment electrode with a gap smaller than the predetermined gap threshold value. If the difference between the particle diameters of the conductive particles 110 with the particle diameters larger than the preset particle diameter threshold value and the conductive particles 110 with the particle diameters smaller than the preset particle diameter threshold value is not large, and the conductive particles 110 with the particle diameters larger than the preset particle diameter threshold value can generate enough deformation, the conductive particles 110 with the particle diameters larger than the preset particle diameter threshold value can be used for conducting the alignment electrode with the gap larger than the preset gap threshold value, and can also be used for conducting the alignment electrode with the gap smaller than the preset gap threshold value.
In one embodiment, the number of the first conductive particles arranged in the first region is larger than that of the first conductive particles arranged in the second region; the first region is a region of the alignment electrode with a gap larger than a preset gap threshold, the second region is a region of the alignment electrode with a gap smaller than a preset gap threshold, the first conductive particles are conductive particles 110 with a particle size larger than a preset particle size threshold, and the second conductive particles are conductive particles 110 with a particle size smaller than a preset particle size threshold. Therefore, the conductive particle pairs with corresponding particle diameters can be applied to the counter electrodes with corresponding gaps, and the conduction efficiency is improved. For example, as shown in fig. 2, the large-diameter conductive particles on both sides of the two substrates are more than the large-diameter conductive particles in the middle of the two substrates, and the small-diameter conductive particles on both sides of the two substrates are less than the small-diameter conductive particles in the middle of the two substrates.
In one embodiment, the number of the types of the particle diameters of the conductive particles 110 may be the same as the number of the gap types of the counter electrode, and the particle diameter of the conductive particles 110 corresponds to the gap size of the counter electrode conducted by the conductive particles 110. For example, referring to fig. 3, if there are 3 kinds of counter electrodes with different gaps between the two substrates, the anisotropic conductive adhesive has 3 kinds of conductive particles with different particle sizes. As shown in fig. 3, the conductive particles 110 with the largest particle size are used to conduct the alignment electrode with the largest gap (the alignment electrode on the left in fig. 3 is the alignment electrode with the largest gap), the conductive particles 110 with the second particle size are used to conduct the alignment electrode with the second gap (the alignment electrode on the right in fig. 3 is the alignment electrode with the second gap), and the conductive particles with the smallest particle size are used to conduct the alignment electrode with the smallest gap (the alignment electrode in the middle in fig. 3 is the alignment electrode with the smallest gap).
The first substrate 210 and the second substrate 220 may be both hard substrates, or both soft substrates, or one hard substrate and one soft substrate. Specifically, the first substrate 210 is a flexible circuit board (FPC), and the second substrate 220 is a liquid crystal substrate (LCD).
Specifically, the materials of the first substrate 210 and the second substrate 220 are glass, silicon substrate, PET (polyethylene terephthalate), PC (polycarbonate), PI (polyimide), or PEN (polyethylene naphthalate).
According to the substrate structure jointed by the anisotropic conductive adhesive, the anisotropic conductive adhesive comprises more than two conductive particles with different particle sizes, and for two substrates with alignment electrodes with different gaps, the conductive particles with large particle sizes and the conductive particles with small particle sizes can deform under the same pressing condition, and the conductive particles with large particle sizes can more easily conduct the alignment electrodes with large gaps. For two substrates with the alignment electrodes with different gaps, the risk of conduction failure between the alignment electrodes with larger gaps is reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (4)

1. A substrate structure bonded with anisotropic conductive paste, the substrate structure comprising:
a first substrate;
the first substrate and the second substrate are both substrates with single curvature or substrates with double curvatures, electrodes of the first substrate and electrodes of the second substrate are arranged in an alignment mode, and gaps of at least two groups of alignment electrodes are different; and
the anisotropic conductive adhesive comprises conductive particles with three particle sizes and an adhesive material used for providing adhesiveness for the anisotropic conductive adhesive and curing the conductive particles with the three particle sizes when in use, and is positioned in a gap between the first substrate and the second substrate so as to conduct the counter electrodes of the first substrate and the second substrate; the particle size number of the conductive particles in the anisotropic conductive adhesive is the same as the gap number of the alignment electrodes, the particle size of the conductive particles corresponds to the gap size of the alignment electrodes conducted by the conductive particles, the conductive particles with the particle size larger than a preset particle size threshold value in the anisotropic conductive adhesive are used for conducting the alignment electrodes with the gaps larger than the preset gap threshold value, the conductive particles with the particle size smaller than the preset particle size threshold value are used for conducting the alignment electrodes with the gaps smaller than the preset gap threshold value, and the particle size range of the conductive particles with the three particle sizes is 5-20 um;
the number of the first conductive particles in the first region is greater than that of the first conductive particles in the second region, and the number of the second conductive particles in the first region is less than that of the second conductive particles in the second region; the first region is a region of the counter electrode with a gap larger than a preset gap threshold, the second region is a region of the counter electrode with a gap smaller than a preset gap threshold, the first conductive particles are conductive particles with a particle size larger than a preset particle size threshold, and the second conductive particles are conductive particles with a particle size smaller than a preset particle size threshold.
2. The substrate structure of claim 1,
the conductive particles with the particle size larger than the preset particle size threshold are also used for conducting the counter electrode with the gap smaller than the preset gap threshold.
3. The substrate structure according to any one of claims 1 to 2, wherein the material for preparing the three particle-sized conductive particles comprises at least two of gold, silver, tin, and indium.
4. The substrate structure of any one of claims 1 to 2, wherein the adhesive material is at least one of epoxy resin, polymethyl methacrylate or polyvinyl acetate.
CN201810538062.6A 2018-05-30 2018-05-30 Anisotropic conductive adhesive and substrate structure bonded by anisotropic conductive adhesive Active CN108822760B (en)

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