CN108822749A - A kind of epoxy resin heating pressurizing device - Google Patents
A kind of epoxy resin heating pressurizing device Download PDFInfo
- Publication number
- CN108822749A CN108822749A CN201810948915.3A CN201810948915A CN108822749A CN 108822749 A CN108822749 A CN 108822749A CN 201810948915 A CN201810948915 A CN 201810948915A CN 108822749 A CN108822749 A CN 108822749A
- Authority
- CN
- China
- Prior art keywords
- negative pressure
- epoxy resin
- outer cylinder
- pressurizing device
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
Abstract
The present invention relates to a kind of epoxy resin to heat pressurizing device, including fixed device, pressurizing device, heating device；The fixed device includes magnet base, negative pressure adsorption equipment；The pressurizing device includes side upper plate, external screw thread cylinder, sliding inserted link, crimping following, heat-insulated lantern ring, compressed spring；The heating device includes temperature sensor, temperature control equipment, power supply.The epoxy resin heats pressurizing device, can complete to fix by magneticaction or suction-operated；Epoxy resin can be coated in crimping following lower end surface in advance, the compressed spring drives downwards the heat-insulated lantern ring, crimping following, generates pressure to the epoxy resin；It rotates the external screw thread cylinder and then adjusts the compression degree and elastic force of compressed spring, adjust the pressure of epoxy resin；Epoxy resin can also be heated by heating device, the temperature sensor detects heating tape temperature and passes to temperature control equipment, the temperature control equipment control temperature height.
Description
Technical field
The present invention relates to mechanical device technical fields, and in particular to a kind of epoxy resin heating pressurizing device.
Background technique
Epoxide-resin glue needs generate best bonding effect under certain high temperature and pressure.The prior art lacks profession
Heating pressurizing device, it is therefore desirable to design it is a kind of with various working use environment epoxy resin heating pressurizing device, mention
For good temperature and pressure control effect.
Summary of the invention
In order to solve the technical problems in background technology, the present invention provides a kind of epoxy resin heating pressurizing device,
The epoxy resin heats pressurizing device, can complete to fix by magneticaction or suction-operated；It can be by epoxy resin
It is coated in crimping following lower end surface in advance, the compressed spring drives downwards the heat-insulated lantern ring, crimping following, to the epoxy
Resin generates pressure；It rotates the external screw thread cylinder and then adjusts the compression degree and elastic force of compressed spring, adjust epoxy resin
Pressure；Epoxy resin can also be heated by heating device, the temperature sensor detects heating tape temperature and transmits
To temperature control equipment, the temperature control equipment control temperature height.
The technical solution adopted by the present invention to solve the technical problems is：
A kind of epoxy resin heating pressurizing device, including fixed device, pressurizing device, heating device；
The fixed device includes magnet base, further includes negative pressure adsorption equipment, and the negative pressure adsorption equipment includes：
Negative pressure outer cylinder is located on the right side of the magnet base, and the negative pressure outer cylinder is in hollow cylinder tubular；
Soft sucker, it is upper narrow below the ring part including being fixed on the ring part of negative pressure outer tube inner wall lower end, being located at
Lower wide tapered portion, the soft sucker lower edge is lower than the magnet base lower edge under normality；
Piston only is closely plugged in the outer tube inner chamber of the negative pressure；
External thread rod is fixed on above the piston only；
Axial direction jack, edge are axially disposed on the external thread rod；
Inserted link is limited, the outer tube inner chamber of the negative pressure is fixed on, the limit inserted link is plugged in axial direction jack；
Nut groove is located above the negative pressure outer tube inner wall, and the nut groove is annular；
Nut is driven, is rotatably located in the nut groove；
Rotating cylinder is coaxially located at the driving nut upper surface, and the rotating cylinder is set on the external thread rod,
The rotating cylinder passes through the outer tube inner chamber of negative pressure and is emerging in above negative pressure outer cylinder；
The pressurizing device includes：
Side upper plate is located above negative pressure outer cylinder right side, and the side upper plate is equipped with internal thread hole；
External screw thread cylinder is screwed onto the internal thread hole of side upper plate；
Inserted link is slided, is slidably plugged in external screw thread cylinder；
Following is crimped, the sliding inserted link lower end is located at；
Heat-insulated lantern ring is set on the sliding inserted link, and the heat-insulated lantern ring is resisted against crimping following upper surface；
Compressed spring, solderless wrapped connection is on the sliding inserted link, and the compressed spring upper end is abutted with external screw thread cylinder, the compression
Lower spring end is abutted with heat-insulated lantern ring；
The heating device includes the heating tape being located on the crimping following outer wall and is located on the heating tape
Temperature sensor, the temperature sensor are electrically connected with temperature control equipment, and the temperature control equipment connects power supply.
Further, the temperature control equipment is XH-W1315 type high-temperature digital temperature controller.
Further, the heat-insulated lantern ring is made of high-temperature resistance plastice or refractory ceramics is made.
Further, the ring part of the soft sucker is fixed on the negative pressure outer tube inner wall, the annular by being glued
Portion is also circumferentially evenly equipped with the screw being spirally connected with negative pressure outer tube inner wall.
Beneficial effects of the present invention：
Epoxy resin of the present invention heats pressurizing device, to carry out heating pressurization to epoxy resin, so that
Epoxy resin reaches optimal adhesive effect.Further, the best adhesive effect of the epoxy resin is generally 150 ° of temperature, pressure
Strong 4MPa.
Epoxy resin of the present invention heats pressurizing device, can be completed by magneticaction or suction-operated solid
It is fixed：
Fixation device of the invention is placed on installation foundation, then open magnet base switch can by magnetic force into
Row is fixed；
Alternatively,
Fixation device of the invention is placed on installation foundation, the soft sucker is fitted closely with installation foundation.So
After rotate the rotating cylinder, driving nut, the driving nut drives the external thread rod, piston only uplink, described to bear
It presses air pressure below outer cylinder to reduce, and then is fixed on installation foundation.
Epoxy resin of the present invention heats pressurizing device, and epoxy resin is coated in crimping following lower end surface in advance,
The compressed spring drives downwards the heat-insulated lantern ring, crimping following, generates pressure to the epoxy resin；Further rotate institute
It states external screw thread cylinder and then adjusts the compression degree and elastic force of the compressed spring, adjust the pressure of the epoxy resin.
Epoxy resin of the present invention heats pressurizing device, is heated by heating device to epoxy resin, described
Temperature sensor detection heating tape temperature simultaneously passes to temperature control equipment, the temperature control equipment control temperature height.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is a kind of front view of embodiment of the heating pressurizing device.
Fig. 2 is the portion A enlarged section schematic diagram in Fig. 1.
In figure:
1. fixed device, 11. magnet bases, 12. negative pressure adsorption equipments, 12a. negative pressure outer cylinder, the soft sucker of 12b., 12c. are living
Plug body, 12d. external thread rod, 12e. axial direction jack, 12f. limit inserted link, and 12h. drives nut, 12i. rotating cylinder；
2. pressurizing device, 21. side upper plates, 22. external screw thread cylinders, 23. sliding inserted links, 24. crimping followings, 25. collets
Ring, 26. compressed springs；
3. heating device, 31. heating tapes, 32. temperature sensors.
Specific embodiment
Below in conjunction with attached drawing, the present invention is described in further detail.
A kind of epoxy resin heating pressurizing device, including fixed device 1, pressurizing device 2, heating device 3；
The fixed device 1 includes magnet base 11, further includes negative pressure adsorption equipment 12, and the negative pressure adsorption equipment 12 wraps
It includes：
Negative pressure outer cylinder 12a is located at 11 right side of magnet base, and the negative pressure outer cylinder 12a is in hollow cylinder tubular；
Soft sucker 12b, including being fixed on the ring part of negative pressure outer cylinder 12a inner wall lower end, being located at below the ring part
Up-narrow and down-wide tapered portion, the soft sucker 12b lower edge is lower than 11 lower edge of magnet base under normality；
Piston only 12c is closely plugged in the inner cavity negative pressure outer cylinder 12a；
External thread rod 12d is fixed on above the piston only 12c；
Axial direction jack 12e, edge are axially disposed on the external thread rod 12d；
Inserted link 12f is limited, is fixed on the inner cavity negative pressure outer cylinder 12a, the limit inserted link 12f is plugged in axial direction jack
In 12e；
Nut groove 12g is located above the negative pressure outer cylinder 12a inner wall, and the nut groove 12g is annular；
Nut 12h is driven, is rotatably located in the nut groove 12g；
Rotating cylinder 12i, is coaxially located at the upper surface the driving nut 12h, and the rotating cylinder 12i is set in described outer
On threaded rod 12e, the rotating cylinder 12i passes through the inner cavity negative pressure outer cylinder 12a and is emerging in above negative pressure outer cylinder 12a；
The pressurizing device 2 includes：
Side upper plate 21 is located above the right side negative pressure outer cylinder 12a, and the side upper plate 21 is equipped with internal thread hole；
External screw thread cylinder 22 is screwed onto the internal thread hole of side upper plate 21；
Inserted link 23 is slided, is slidably plugged in external screw thread cylinder 22；
Following 24 is crimped, 23 lower end of sliding inserted link is located at；
Heat-insulated lantern ring 25 is set on the sliding inserted link 24, and the heat-insulated lantern ring 25 is resisted against crimping 24 upper end of following
Face；
Compressed spring 26, on the sliding inserted link 23,26 upper end of compressed spring is abutted with external screw thread cylinder 22 for solderless wrapped connection,
26 lower end of compressed spring is abutted with heat-insulated lantern ring 25；
The heating device 3 includes the heating tape 31 being located on crimping 24 outer wall of following and is located at the heating tape
Temperature sensor 32 on 31, the temperature sensor 32 are electrically connected with temperature control equipment, the temperature control equipment connection
Power supply.
Further, the temperature control equipment is XH-W1315 type high-temperature digital temperature controller.
Further, the heat-insulated lantern ring 25 is made of high-temperature resistance plastice or refractory ceramics is made.
Further, the ring part of the soft sucker 12b is fixed on the negative pressure outer cylinder 12a inner wall, institute by being glued
It states ring part and is also circumferentially evenly equipped with the screw being spirally connected with negative pressure outer cylinder 12a inner wall.
Specifically used method：
Epoxy resin of the present invention heats pressurizing device, to carry out heating pressurization to epoxy resin, so that
Epoxy resin reaches optimal adhesive effect.Further, the best adhesive effect of the epoxy resin is generally 150 ° of temperature, pressure
Strong 4MPa.
Epoxy resin of the present invention heats pressurizing device, can be completed by magneticaction or suction-operated solid
It is fixed：
Fixation device 1 of the invention is placed on installation foundation, the switch for then opening magnet base 11 can pass through magnetic
Power is fixed；
Alternatively,
Fixation device 1 of the invention is placed on installation foundation, the soft sucker 12b is closely pasted with installation foundation
It closes.Then the rotating cylinder 12i is rotated, driving nut 12h, the driving nut 12h drive the external thread rod 12d, work
Plug body 12c uplink, the negative pressure outer cylinder 12a lower section air pressure reduces, and then is fixed on installation foundation.
Epoxy resin of the present invention heats pressurizing device, and epoxy resin is coated in crimping 24 lower end of following in advance
Face, the compressed spring 26 drive downwards the heat-insulated lantern ring 25, crimping following 24, generate pressure to the epoxy resin；Into
One step rotates the external screw thread cylinder 22 and then adjusts the compression degree and elastic force of the compressed spring 26, adjusts the epoxy resin
Pressure.
Epoxy resin of the present invention heats pressurizing device, is heated by heating device 3 to epoxy resin, described
Temperature sensor 32 detects 31 temperature of heating tape and passes to temperature control equipment, and the temperature control equipment control temperature is high
It is low.
Further, it is XH-W1315 type high-temperature digital temperature control that the temperature control equipment, which is the temperature control equipment,
Device, the model high-temperature digital temperature controller are first to have chicken to seem, market or even Taobao sell, and this will not be repeated here；Preferential,
It is heating mode that operating mode, which can be set, in the XH-W1315 type high-temperature digital temperature controller, and stopping temperature is 155 degrees Celsius, when
Heating tape temperature 31 stops heating when reaching 155 degrees Celsius；Return difference value is 10 degrees Celsius, i.e., when temperature is reduced to 145 degrees Celsius
It heats again；
Further, the temperature sensor 32 is K-type thermocouple.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (4)
1. a kind of epoxy resin heats pressurizing device, it is characterised in that:Including fixed device (1), pressurizing device (2), heating dress
Set (3)；
The fixed device (1) includes magnet base (11), further includes negative pressure adsorption equipment (12), the negative pressure adsorption equipment (12)
Including：
Negative pressure outer cylinder (12a) is located on the right side of the magnet base (11), and the negative pressure outer cylinder (12a) is in hollow cylinder tubular；
Soft sucker (12b), including being fixed on the ring part of negative pressure outer cylinder (12a) inner wall lower end, being located at below the ring part
Up-narrow and down-wide tapered portion, soft sucker (12b) lower edge is lower than the magnet base (11) lower edge under normality；
Piston only (12c) is closely plugged in negative pressure outer cylinder (12a) inner cavity；
External thread rod (12d) is fixed on above the piston only (12c)；
Axial direction jack (12e), edge are axially disposed on the external thread rod (12d)；
It limits inserted link (12f), is fixed on negative pressure outer cylinder (12a) inner cavity, the limit inserted link (12f) is plugged in axial direction jack
In (12e)；
Nut groove (12g) is located above negative pressure outer cylinder (12a) inner wall, and the nut groove (12g) is annular；
It drives nut (12h), is rotatably located in the nut groove (12g)；
Rotating cylinder (12i), is coaxially located at driving nut (12h) upper surface, and the rotating cylinder (12i) is set in described
On external thread rod (12e), the rotating cylinder (12i) passes through the negative pressure outer cylinder inner cavity (12a) and is emerging on negative pressure outer cylinder (12a)
Side；
The pressurizing device (2) includes：
Side upper plate (21) is located above negative pressure outer cylinder (12a) right side, and the side upper plate (21) is equipped with internal screw thread
Hole；
External screw thread cylinder (22), is screwed onto the internal thread hole of side upper plate (21)；
It slides inserted link (23), is slidably plugged in external screw thread cylinder (22)；
It crimps following (24), is located at sliding inserted link (23) lower end；
Heat-insulated lantern ring (25) is set on the sliding inserted link (24), and the heat-insulated lantern ring (25) is resisted against crimping following (24)
Upper surface；
Compressed spring (26), solderless wrapped connection is on the sliding inserted link (23), compressed spring (26) upper end and external screw thread cylinder (22)
It abuts, compressed spring (26) lower end is abutted with heat-insulated lantern ring (25)；
The heating device (3) includes the heating tape (31) being located on described crimping following (24) outer wall and is located at the heating
Temperature sensor (32) on band (31), the temperature sensor (32) are electrically connected with temperature control equipment, the temperature control
Device connects power supply.
2. a kind of epoxy resin according to claim 1 heats pressurizing device, it is characterised in that:The temperature control equipment
For XH-W1315 type high-temperature digital temperature controller.
3. a kind of epoxy resin according to claim 2 heats pressurizing device, it is characterised in that:The heat-insulated lantern ring (25)
It is made of high-temperature resistance plastice or refractory ceramics is made.
4. epoxy resin according to claim 1 to 3 heats pressurizing device, it is characterised in that:The soft sucker
The ring part of (12b) is fixed on negative pressure outer cylinder (12a) inner wall by being glued, and the ring part is also circumferentially evenly equipped with and negative pressure
The screw that outer cylinder (12a) inner wall is spirally connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810948915.3A CN108822749B (en) | 2018-08-20 | 2018-08-20 | Epoxy heating and pressurizing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810948915.3A CN108822749B (en) | 2018-08-20 | 2018-08-20 | Epoxy heating and pressurizing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108822749A true CN108822749A (en) | 2018-11-16 |
| CN108822749B CN108822749B (en) | 2023-10-20 |
Family
ID=64151183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810948915.3A Active CN108822749B (en) | 2018-08-20 | 2018-08-20 | Epoxy heating and pressurizing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108822749B (en) |
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| Publication number | Publication date |
|---|---|
| CN108822749B (en) | 2023-10-20 |
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