CN108822670A - A kind of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material and preparation method thereof - Google Patents

A kind of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material and preparation method thereof Download PDF

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Publication number
CN108822670A
CN108822670A CN201810483952.1A CN201810483952A CN108822670A CN 108822670 A CN108822670 A CN 108822670A CN 201810483952 A CN201810483952 A CN 201810483952A CN 108822670 A CN108822670 A CN 108822670A
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China
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circuit board
kettle
pcb circuit
reaction kettle
added
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CN201810483952.1A
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Inventor
郑文改
王川
王士元
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WEICHIDUAN TRAFFIC FACILITY ENGINEERING Co Ltd BAODING
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WEICHIDUAN TRAFFIC FACILITY ENGINEERING Co Ltd BAODING
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Priority to CN201810483952.1A priority Critical patent/CN108822670A/en
Publication of CN108822670A publication Critical patent/CN108822670A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09D133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/12—Polymerisation in non-solvents
    • C08F2/16—Aqueous medium
    • C08F2/22—Emulsion polymerisation
    • C08F2/24—Emulsion polymerisation with the aid of emulsifying agents
    • C08F2/26—Emulsion polymerisation with the aid of emulsifying agents anionic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02—Anionic compounds
    • C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
    • C11D1/14—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aliphatic hydrocarbons or mono-alcohols
    • C11D1/146—Sulfuric acid esters
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C11D3/2079—Monocarboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2093—Esters; Carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/373—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds containing silicones
    • C11D3/3734—Cyclic silicones
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3749—Polyolefins; Halogenated polyolefins; Natural or synthetic rubber; Polyarylolefins or halogenated polyarylolefins
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3945—Organic per-compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The invention discloses a kind of PCB circuit board welding ultrasonic wave antistatic on-line cleaning materials and preparation method thereof; it is to be applied to electronic component and PC circuit board in continuous wave soldering device, the proprietary material that soldered PCB circuit board is integrally cleaned and protected in end process by supersonic wave cleaning machine.The material includes following components：Deionized water, methyl acrylate, methyl methacrylate, ethyl acrylate, butyl acrylate, methacrylic acid, acrylic acid, lauryl sodium sulfate, ethylene oxide, polyethylene wax, azo two fourth hydrogen, benzoyl peroxide, X 2-1401, the aqueous solution containing ammonia.It is a kind of low volatilization using cleaning material prepared by the present invention, it is pollution-free, low emission, reusable emulsifying PCB circuit board welds cleaning material, fouling problem is left in the welding being not only able in the PCB circuit board after the completion of removing well, reduce rosin joint rate, PCB circuit board is had moisture-proof using the cleaned drying rear surface meeting self-assembling formation of the material simultaneously, the transparency protected membrane coat of antistatic, institute's cleaning circuit panel products can be can be realized moisture-proof, it destatics, it is anticreep, corrosion-resisting function, reach the ultrasonic cleaning to the PCB circuit board after the completion of welding, coating protection, antistatic can be completed once simultaneously.

Description

A kind of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material and its preparation Method
Technical field
The invention belongs to fine chemistry industry manufacturing fields.Specifically a kind of PCB circuit board welding ultrasonic wave antistatic exists Line cleaning material, the invention further relates to the preparation methods of the cleaning material.
Background technique
Traditional PCB electronic circuit board after the completion of the welding equipments such as continuous wave crest carry out ultrasonic cleaning during, Used cleaning agent material is substantially the low boiling point solvent class organic washing formed with alcohols or benzene class and its mixture Agent, or using alkalinity, the compound cleaning material of acidic cleaner composition, although above-mentioned cleaning agent compares to a certain extent The residues such as scaling powder, the residual welding slag in PCB circuit board are substantially removed from, the significant cleaning effect of comparison can be received, but It is to have the shortcomings that many serious and hidden danger in actual operation using such cleaning agent material：
If when 1, using class alcohols or benzene class organic ultrasonic wave cleaning agent, due to the high-frequency arteries and veins of supersonic wave cleaning machine generation Punching can have the rising of higher temperature to cleaning agent itself, since the component part inside cleaning agent uses low boiling point organic molten substantially Agent is prepared, and the danger of kindling and explosion is had when temperature rises to certain temperature, while such cleaning agent has strongly Volatility and certain toxic, can health to user of service and environmental protection cause to seriously affect, it is a large amount of to volatilize Organic solvent can reduce the actual cleaning effect of cleaning agent, with the work of cleaning circuit plate need constantly supplementing it is new Cleaning agent, while some organic solvents in cleaning agent can have corrosion or dissolubility to make to part electronic component encapsulating material With；
If existed when 2, using the compound cleaning agent that alkaline surfactant is main material composition using such cleaning material After cleaning soldered PCB circuit board in supersonic wave cleaning machine, it is also necessary to will be in PCB circuit board using a large amount of deionized waters It after cleaning agent residue rinses repeatedly, then is handled by removing moisture stoving process etc., the surfactant in such cleaning agent Can all there be certain corrosivity with auxiliary material, be not thorough once PCB circuit board is rinsed or dried using deionized water, it will Corrosivity and other serious hidden danger of quality are brought to PCB circuit board, while its waste liquid is cleaned using this kind of complex cleaning and washing agent The influence discharged to environment is equally extremely serious；
3, using above-mentioned two types of material as cleaning agent to PCB circuit board cleaning after the completion of, PCB circuit board surface only It can accomplish to clean the dirts such as welding slag, the solder of remaining, not have antistatic performance and insulation protection performance, it is necessary to According to the manufacturing process requirement of PCB circuit board, corresponding antistatic process and spraying are carried out with moisture-proof and exhausted to the circuit board The protective coating of edge performance, traditional mode then are exercised and are applied with the protection of organic synthesis class using after removal electrostatic treatment Material carries out secondary spraying to PCB circuit board, not only will increase the production process and manufacturing cost of product in spraying process, equally It can be because using sprayed protection material of the coatings of organic synthesis class as circuit board, the harmful organic solvent in coating It volatilizees to the harm of the health of operator and further bad influence is caused to social environment.
Summary of the invention
In view of the above-mentioned problems of the prior art, the present invention provides a kind of PCB circuit board welding ultrasonic wave antistatic and exists Line cleaning material and preparation method thereof, for thoroughly solving to use low boiling point organic solvent as cleaning material and using surface living Property the compound cleaning agent of agent brought by volatility, risk and the physical and mental health of operator is impacted, and use Surfactant material needs a large amount of secondary rinsings and bring environmental impact issues, while avoiding the PCB completed to cleaning The secondary spray insulation coating of wiring board negatively affects environment bring.
The advantages of present invention utilizes the excellent film forming of acrylic ester polymerization monomer, resistance to ag(e)ing and insulating properties, passes through It carries out emulsion copolymerization with other industrial chemicals to react, the emulsifying cleaning for preparing formation can be to the PCB route after the completion of welding Welding slag, film of flux residue of plate remaining etc. can removing rapidly and efficiently, by the way that the PCB circuit board after cleaning is dried Or spontaneously dry, after the deionized water material in its cleaning material is vapored away, polymerizable acrylic monomer object is in PCB circuit board table Face is capable of forming the transparent firm protective film with a thickness of 10 microns -30 microns, forms antistatic, damp-proof protective coating, Also have the effect of simultaneously nontoxic, fire-retardant.
In order to solve the above technical problems, the technical solution adopted in the present invention is as follows：
A kind of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material, the component including following proportion number：Deionized water 56%-62%, methyl acrylate 9%-11%, methyl methacrylate 6%-8.5%, ethyl acrylate 3.5%-5.5%, butyl acrylate 3.6%-5.2%, methacrylic acid 1.5%-1.8%, acrylic acid 1.0%-1.2%, lauryl sodium sulfate 0.3%-0.5%, epoxy second Alkane 0,2%-0.3%, polyethylene wax 0.15%-0.21%, azo two fourth hydrogen 0.08%-0.9%, benzoyl peroxide 0.05%- 0.06%, the aqueous solution 0.012%-0.015% of X 2-1401 0.02%-0.03%, the 18%-20% containing ammonia.
1, the component of the preferably following proportion number of the present invention：Deionized water（200,000 ohm/cm of resistivity）66.475%, Methyl acrylate 11%, methyl methacrylate 8.5%, ethyl acrylate 5.2%, butyl acrylate 5.1%, methacrylic acid 1.6%, acrylic acid 1.1%, lauryl sodium sulfate 0.36%, ethylene oxide 0.3%, polyethylene wax 0.18%, azo two fourth hydrogen 0.08%, the aqueous solution 0.015% of benzoyl peroxide 0.06%, X 2-1401 0.03%, the 18%-20% containing ammonia.
A kind of preparation method of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material, includes the following steps：
（1）The 50%-52% of deionized water total amount is added in ingredient mulser, is warming up to 30 °C to 35 °C, starts electric stirring Device is kept stirring device high speed rotation, and revolving speed is 620 revs/min, and the emulsifier sodium lauryl sulfate of total amount 60%-65% is added, Methyl acrylate 9%-11%, methyl methacrylate 6%-8.5%, ethyl acrylate 3.5%- are sequentially added with 6L/ minutes rates 5.5%, methacrylic acid 1.5%-1.8%, acrylic acid 1.0%-1.2%, ethylene oxide 0.2%-0.3%, polyethylene wax 0.15%- 0.21%, azo two fourth hydrogen 0.03%-0.05%, X 2-1401 0.02%-0.03% continues with revolving speed as 620 Revs/min high-speed stirred 60 minutes, 30 revs/min are reduced to the thorough emulsifying agitator of monomer, is passed through after continuing stirring 30 minutes The pre-emulsification mix monomer pump piping is delivered in coppers after filter filtering, keeps the temperature in coppers at 35 °C Between to 38 °C and anchor agitator revolving speed is 30 revs/min；
（2）The 20%-26% of remaining deionized water total amount is added in reaction kettle, while remaining emulsifier dodecyl sulphate is added Sodium, kettle are warming up to 56 °C, and the cooling water source for opening condenser keeps condenser cooling water reflux temperature between 16 °C to 22 °C, Start electric mixer, being kept stirring device revolving speed is 60 revs/min, opens pan feeding valve, puts into the benzoyl peroxide first of whole total amounts Acyl 0.02%-0.026%, reaction kettle kettle is warming up to 86 °C to 89 °C after continuing stirring and dissolving, charging flowmeter is opened, with 12L/ points The pre-emulsification monomer of the 16%-18% of coppers is added in reaction kettle and carries out pre-reaction process by the rate of clock, keeps stable anti- It answers kettle temperature degree at 86 °C to 89 °C, keeps between 88 °C to 93 °C of condenser monomers flow back temperature, after above-mentioned temperature is stablized, beat The flowmeter of coppers is opened, charging was continued into reaction kettle with 3.3L/ minutes normal speeds, it will be above-mentioned pre- in coppers After the completion of emulsified monomer feeds within 5.5 hours to 6.2 hours, the remaining deionized water of total amount is added in mulser, warp It crosses filter and pump piping to wash away pre-emulsification monomer remaining in above equipment into coppers, then row opens charging flow The above-mentioned deionized water containing remaining pre-emulsification monomer is added in reaction kettle with 5.3L/ minutes rates for meter, will be continued with anti- It answers 86 °C to 89 °C of kettle temperature degree, 88 °C to 93 °C of condenser monomers flow back temperature, agitator speed to be 60 revs/min and keeps 2.2 Hour, device monomers flow back temperature to be condensed closed condenser cooling water source after being reduced to 25 °C to 30 °C to 2.5 hours；
（3）Normal 15 °C to 36 °C D temperature in the kettle are kept in attached material kettle, in the water for the 18%-20% containing ammonia that total amount is wherein added Solution opens attached material charging flowmeter, and the tune that ammonium hydroxide carries out the pH value of lotion is added into reaction kettle with 1.6L/ minutes rates Whole, blender continues to be kept stirring revolving speed to be 60 revs/min in reaction kettle, contains ammonia solution and object to be sufficiently mixed in attached material kettle Material is sufficiently mixed, and by the pH value of copolymer emulsion in PH acidometer close observation reaction kettle, to the lotion in reaction kettle PH value is stablized when PH7.8 is between PH7.95, closes the flowmeter of attached material kettle charging, stops the addition of ammonium hydroxide, continue to keep The speed of agitator of reactor agitator is 60 revs/min, after material is sufficiently stirred 30 minutes in kettle, to cool down 25 °C in reaction kettle When to 27 °C, the operating of reactor agitator is closed, opens baiting valve, the acrylic ester copolymer cream of completion will be prepared in reaction kettle Liquid turns filter progress；
（4）Start lotion material vacuum filter, adjusts to filter medium and preparation is filtered with the fineness of 260 mesh to 280 mesh The acrylate copolymer emulsion lotion of completion, then will filtering complete lotion finished product weighing be vacuum-packed, be finally completed for It is prepared by the product of the PCB circuit board ultrasonic wave on-line cleaning material with anti-static function.
PCB circuit board prepared by the present invention welds ultrasonic wave antistatic on-line cleaning material, and there is following main performance to refer to Mark：
One main performance index of table
Due to using the above matching method and preparation process, technological progress obtained by the present invention is as follows：
PCB circuit board prepared by the present invention welds ultrasonic wave antistatic on-line cleaning material, using acrylic resin it is good at Membrane property forms emulsion type cleaner product with acrylic monomers co-polymer, maintains and do not burn, no noxious volatile object Matter can exempt and carry out secondary rinsing with deionized water to the PCB circuit board after cleaning, while have unharmful substance discharge, The reusable advantage of cleaning agent reaches the ultrasonic cleaning to the PCB circuit board after the completion of welding, coating is protected, it is quiet to prevent Electric disposable completion.The cleaning agent be not only adapted to the high-frequency of supersonic wave cleaning machine, high-temperature continuous work environment under It uses, applies also for other cleaning equipments and mode to the cleaning of PCB circuit board, antistatic and the anticreep guarantor of moisture proof Shield.
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be described in further detail.
Deionized water（200,000 ohm/cm of resistivity）, total amount 56%-62%, methyl acrylate 9%-11%, metering system Sour methyl esters 6%-8.5%, ethyl acrylate 3.5%-5.5%, methacrylic acid 1.5%-1.8%, acrylic acid 1.0%-1.2%, epoxy second Alkane 0.2%-0.3%, polyethylene wax 0.15%-0.21%, azo two fourth hydrogen 0.03%-0.05%, benzoyl peroxide 0.02%- 0.026%, the aqueous solution 0.012%- of X 2-1401 0.02%-0.03%, 0.016%-0.018%, the 18%-20% containing ammonia 0.015%。
Embodiment 1
A kind of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material, is weighted according to the following proportion raw material：
Deionized water（200,000 ohm/cm of resistivity）66.475%, methyl acrylate 11%, methyl methacrylate 8.5%, third Olefin(e) acid ethyl ester 5.2%, butyl acrylate 5.1%, methacrylic acid 1.6%, acrylic acid 1.1%, lauryl sodium sulfate 0.36%, ring Oxidative ethane 0.3%, polyethylene wax 0.18%, azo two fourth hydrogen 0.08%, benzoyl peroxide 0.06%, cyclic polydimethyl silicon oxygen The aqueous solution 0.015% of alkane 0.03%, the 18%-20% containing ammonia.
Preparation method is as follows：
（1）The 50%-52% of deionized water total amount is added in ingredient mulser, is warming up to 30 °C to 35 °C, starts electric stirring Device is kept stirring device high speed rotation, and revolving speed is 620 revs/min, and the emulsifier sodium lauryl sulfate of total amount 60%-65% is added, Methyl acrylate 9%-11%, methyl methacrylate 6%-8.5%, ethyl acrylate 3.5%- are sequentially added with 6L/ minutes rates 5.5%, butyl acrylate 3.6%-5.2%, methacrylic acid 1.5%-1.8%, acrylic acid 1.0%-1.2%, ethylene oxide 0.2%- 0.3%, polyethylene wax 0.15%-0.21%, azo two fourth hydrogen 0.03%-0.05%, X 2-1401 0.02%- 0.03%, continue with revolving speed be 620 revs/min high-speed stirred 60 minutes, be reduced to 30 revs/min to the thorough emulsifying agitator of monomer The pre-emulsification mix monomer pump piping is delivered in coppers after filter filters by clock after continuing stirring 30 minutes, is protected The temperature in coppers is held between 35 °C to 38 °C and anchor agitator revolving speed is 30 revs/min；
（2）The 20%-26% of remaining deionized water total amount is added in reaction kettle, while remaining emulsifier dodecyl sulphate is added Sodium, kettle are warming up to 56 °C, and the cooling water source for opening condenser keeps condenser cooling water reflux temperature between 16 °C to 22 °C, Start electric mixer, being kept stirring device revolving speed is 60 revs/min, opens pan feeding valve, puts into the benzoyl peroxide first of whole total amounts Acyl 0.02%-0.026%, reaction kettle kettle is warming up to 86 °C to 89 °C after continuing stirring and dissolving, charging flowmeter is opened, with 12L/ points The pre-emulsification monomer of the 16%-18% of coppers is added in reaction kettle and carries out pre-reaction process by the rate of clock, keeps stable anti- It answers kettle temperature degree at 86 °C to 89 °C, keeps between 88 °C to 93 °C of condenser monomers flow back temperature, after above-mentioned temperature is stablized, beat The flowmeter of coppers is opened, charging was continued into reaction kettle with 3.3L/ minutes normal speeds, it will be above-mentioned pre- in coppers After the completion of emulsified monomer feeds within 5.5 hours to 6.2 hours, the remaining deionized water of total amount is added in mulser, warp It crosses filter and pump piping to wash away pre-emulsification monomer remaining in above equipment into coppers, then row opens charging flow The above-mentioned deionized water containing remaining pre-emulsification monomer is added in reaction kettle with 5.3L/ minutes rates for meter, will be continued with anti- It answers 86 °C to 89 °C of kettle temperature degree, 88 °C to 93 °C of condenser monomers flow back temperature, agitator speed to be 60 revs/min and keeps 2.2 Hour, device monomers flow back temperature to be condensed closed condenser cooling water source after being reduced to 25 °C to 30 °C to 2.5 hours；
（3）Bottom temperature in normal 15 °C to 36 ° kettles is kept in attached material kettle, is wherein being added the 18%-20%'s containing ammonia of total amount Aqueous solution opens attached material charging flowmeter, and the pH value of ammonium hydroxide progress lotion is added into reaction kettle with 1.6L/ minutes rates Adjustment, blender continues to be kept stirring revolving speed to be 60 revs/min in reaction kettle, be sufficiently mixed in attached material kettle containing ammonia solution and Material is sufficiently mixed, and by the pH value of copolymer emulsion in PH acidometer close observation reaction kettle, to the cream in reaction kettle Liquid pH value is stablized when PH7.8 is between PH7.95, closes the flowmeter of attached material kettle charging, stops the addition of ammonium hydroxide, after continuation of insurance The speed of agitator for holding reactor agitator is 60 revs/min, after material is sufficiently stirred 30 minutes in kettle, to cool down in reaction kettle At 25 °C to 27 °C, the operating of reactor agitator is closed, baiting valve is opened, the acrylate that completion is prepared in reaction kettle is total to Poly- lotion turns filter progress；
（4）Start lotion material vacuum filter, adjusts to filter medium and preparation is filtered with the fineness of 260 mesh to 280 mesh The acrylate copolymer emulsion lotion of completion, then will filtering complete lotion finished product weighing be vacuum-packed, be finally completed for It is prepared by the product of the PCB circuit board ultrasonic wave on-line cleaning material with anti-static function.
The material prepared using the present invention carries out in supersonic wave cleaning machine at cleaning soldered PCB circuit board Reason can make soldered PCB circuit board realize remaining welding slag solder cleaning, moisture-proof decontamination, antistatic process, insulation protection Coating is once completed, dry using water base Sodium Polyacrylate emulsion-type since the present invention is in preparing material and preparation process selection The acrylic monomers copolymeric material of dry film forming and the processing technology of emulsion copolymerization without toxic, harmful volatile substance and do not make With Corrosive Materia, keeps the cleaning agent prepared nonflammable explosive, the PCB circuit board after cleaning is not needed to use deionized water Or other materials carry out secondary rinse cycle, and corrosivity effect, while the present invention will not be generated to wiring board and electronic component Prepare material and energy saving technology environmental protection, can not only be recycled, and prevent because using the cleaning material containing harmful substance Expect the influence to user of service and natural environment.
Embodiment described above is only that preferred embodiment of the invention is described, and is not carried out to the scope of the present invention It limits, under the basis for not departing from spirit of that invention, those of ordinary skill in the art can be done technical solution of the present invention Various modifications and improvements out should all be fallen into the protection scope that claims of the present invention determines.

Claims (3)

1. a kind of PCB circuit board welds ultrasonic wave antistatic on-line cleaning material, it is characterised in that including following proportion Component：Deionized water（200,000 ohm/cm of resistivity）56%-62%, methyl acrylate 9%-11%, methyl methacrylate 6%- 8.5%, ethyl acrylate 3.5%-5.5%, butyl acrylate 3.6%-5.2%, methacrylic acid 1.5%-1.8%, acrylic acid 1.0%- 1.2%, lauryl sodium sulfate 0.3%-0.5%, ethylene oxide 0.2%-0.3%, polyethylene wax 0.15%-0.21%, azo two fourth Hydrogen 0.08%-0.9%, benzoyl peroxide 0.05%-0.06%, X 2-1401 0.02%-0.03%, 18%- containing ammonia 20% aqueous solution 0.012%-0.015%.
2. a kind of PCB circuit board according to claim 1 welds ultrasonic wave antistatic on-line cleaning material, it is characterised in that The conducting wire includes the component of following preferred proportion number：Deionized water（200,000 ohm/cm of resistivity）66.475%, propylene Sour methyl esters 11%, methyl methacrylate 8.5%, ethyl acrylate 5.2%, butyl acrylate 5.1%, methacrylic acid 1.6%, third Olefin(e) acid 1.1%, lauryl sodium sulfate 0.36%, ethylene oxide 0.3%, polyethylene wax 0.18%, azo two fourth hydrogen 0.08%, mistake Benzoyl Oxide 0.06%, X 2-1401 0.03%, the 18%-20% containing ammonia aqueous solution 0.015%.
3. a kind of preparation side of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material according to claim 1 or 2 Method, it is characterised in that include the following steps：
（1）The 50%-52% of deionized water total amount is added in ingredient mulser, is warming up to 30 °C to 35 °C, starts electric stirring Device is kept stirring device high speed rotation, and revolving speed is 620 revs/min, and the emulsifier sodium lauryl sulfate of total amount 60%-65% is added, Methyl acrylate 9%-11%, methyl methacrylate 6%-8.5%, ethyl acrylate 3.5%- are sequentially added with 6L/ minutes rates 5.5%, butyl acrylate 3.6%-5.2%, methacrylic acid 1.5%-1.8%, acrylic acid 1.0%-1.2%, ethylene oxide 0.2%- 0.3%, polyethylene wax 0.15%-0.21%, azo two fourth hydrogen 0.03%-0.05%, X 2-1401 0.02%- 0.03%, continue with revolving speed be 620 revs/min high-speed stirred 60 minutes, be reduced to 30 revs/min to the thorough emulsifying agitator of monomer The pre-emulsification mix monomer pump piping is delivered in coppers after filter filters by clock after continuing stirring 30 minutes, is protected The temperature in coppers is held between 35 °C to 38 °C and anchor agitator revolving speed is 30 revs/min；
（2）The 20%-26% of remaining deionized water total amount is added in reaction kettle, while remaining emulsifier dodecyl sulphate is added Sodium, kettle are warming up to 56 °C, and the cooling water source for opening condenser keeps condenser cooling water reflux temperature between 16 °C to 22 °C, Start electric mixer, being kept stirring device revolving speed is 60 revs/min, opens pan feeding valve, puts into the benzoyl peroxide first of whole total amounts Acyl 0.02%-0.026%, reaction kettle kettle is warming up to 86 °C to 89 °C after continuing stirring and dissolving, charging flowmeter is opened, with 12L/ points The pre-emulsification monomer of the 16%-18% of coppers is added in reaction kettle and carries out pre-reaction process by the rate of clock, keeps stable anti- It answers kettle temperature degree at 86 °C to 89 °C, keeps between 88 °C to 93 °C of condenser monomers flow back temperature, after above-mentioned temperature is stablized, beat The flowmeter of coppers is opened, charging was continued into reaction kettle with 3.3L/ minutes normal speeds, it will be above-mentioned pre- in coppers After the completion of emulsified monomer feeds within 5.5 hours to 6.2 hours, the remaining deionized water of total amount is added in mulser, warp It crosses filter and pump piping to wash away pre-emulsification monomer remaining in above equipment into coppers, then row opens charging flow The above-mentioned deionized water containing remaining pre-emulsification monomer is added in reaction kettle with 5.3L/ minutes rates for meter, will be continued with anti- It answers 86 °C to 89 °C of kettle temperature degree, 88 °C to 93 °C of condenser monomers flow back temperature, agitator speed to be 60 revs/min and keeps 2.2 Hour, device monomers flow back temperature to be condensed closed condenser cooling water source after being reduced to 25 °C to 30 °C to 2.5 hours；
（3）Normal 15 °C to 36 °C D temperature in the kettle are kept in attached material kettle, in the water for the 18%-20% containing ammonia that total amount is wherein added Solution opens attached material charging flowmeter, and the tune that ammonium hydroxide carries out the pH value of lotion is added into reaction kettle with 1.6L/ minutes rates Whole, blender continues to be kept stirring revolving speed to be 60 revs/min in reaction kettle, contains ammonia solution and object to be sufficiently mixed in attached material kettle Material is sufficiently mixed, and by the pH value of copolymer emulsion in PH acidometer close observation reaction kettle, to the lotion in reaction kettle PH value is stablized when PH7.8 is between PH7.95, closes the flowmeter of attached material kettle charging, stops the addition of ammonium hydroxide, continue to keep The speed of agitator of reactor agitator is 60 revs/min, after material is sufficiently stirred 30 minutes in kettle, to cool down 25 °C in reaction kettle When to 27 °C, the operating of reactor agitator is closed, opens baiting valve, the acrylic ester copolymer cream of completion will be prepared in reaction kettle Liquid turns filter progress；
（4）Start lotion material filtering machine, adjusts to filter medium and preparation completion is filtered with the fineness of 260 mesh to 280 mesh Acrylate copolymer emulsion lotion, then will filtering complete lotion finished product weighing be vacuum-packed, be finally completed for It is prepared by the product of the PCB circuit board ultrasonic wave on-line cleaning material of anti-static function.
CN201810483952.1A 2018-05-19 2018-05-19 A kind of PCB circuit board welding ultrasonic wave antistatic on-line cleaning material and preparation method thereof Pending CN108822670A (en)

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CN114437876A (en) * 2022-02-15 2022-05-06 深圳市板明科技股份有限公司 Dry film developing tank cleaning solution for circuit board

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CN103074175A (en) * 2012-12-31 2013-05-01 深圳市力合材料有限公司 Polishing pad cleaning solution and use method thereof
CN103924758A (en) * 2014-03-31 2014-07-16 宋旭 Multifunctional wallpaper capable of shielding Wi-Fi signals and production method thereof

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WO1998036045A1 (en) * 1997-02-14 1998-08-20 Ekc Technology, Inc. Post clean treatment
CN1860556A (en) * 2002-05-09 2006-11-08 阿努维公司 Water-soluble electrically conductive composition, modifications, and applications thereof
CN103060831A (en) * 2005-07-21 2013-04-24 安集微电子（上海）有限公司 Cleaning liquid and application thereof
CN1982426B (en) * 2005-12-16 2011-08-03 安集微电子（上海）有限公司 Slow-releasing agent system for cleaning semiconductor chip
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114437876A (en) * 2022-02-15 2022-05-06 深圳市板明科技股份有限公司 Dry film developing tank cleaning solution for circuit board
CN114437876B (en) * 2022-02-15 2023-08-08 深圳市板明科技股份有限公司 Dry film developing and groove cleaning liquid for circuit board

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