CN108811356A - A kind of low-melting-point metal printer and Method of printing - Google Patents
A kind of low-melting-point metal printer and Method of printing Download PDFInfo
- Publication number
- CN108811356A CN108811356A CN201810979492.1A CN201810979492A CN108811356A CN 108811356 A CN108811356 A CN 108811356A CN 201810979492 A CN201810979492 A CN 201810979492A CN 108811356 A CN108811356 A CN 108811356A
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- China
- Prior art keywords
- melting
- low
- point metal
- ion
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of low-melting-point metal printer of present invention offer and Method of printing, are related to printing technique field.Low-melting-point metal printer provided by the invention includes printing chamber, ion implanting chamber, package cavity and vacuum pump, it is provided with printing equipment and print platform in the print chamber room, ion implantation apparatus and injection platform are provided in the ion implanting chamber, it is provided with packaging system and package platforms in the package cavity, the vacuum pump and the ion implanting chamber, for being vacuumized to the ion implanting chamber.Technical scheme of the present invention can be modified the low-melting-point metal circuit printed.
Description
Technical field
The present invention relates to printing technique field more particularly to a kind of low-melting-point metal printers and Method of printing.
Background technology
A key factor for restricting printing electronic technology development is to print the development of electronic material, traditional conductive ink
Water has carbon series conductive material, conducting polymer, metal nano material and low-melting-point metal.Wherein, low-melting-point metal has both metal
Property and fluid properties, compared with other conductive inks, low-melting-point metal has cost relatively low, and physicochemical properties are stablized, and lead
Electric rate is relatively high, and the advantages of being formed without post-processing of conducting wire.
But inventor has found, low-melting-point metal circuit is being printed using low-melting-point metal printer in the prior art
In the process, the property of the low-melting-point metal circuit printed is fixed, can not be adjusted, cannot be satisfied according to actual needs
A variety of demands of user.
Invention content
The present invention provides a kind of low-melting-point metal printer and Method of printing, can be to the low-melting-point metal circuit that prints
It is modified.
In a first aspect, the present invention provides a kind of low-melting-point metal printer, adopt the following technical scheme that：
The low-melting-point metal printer includes printing chamber, ion implanting chamber, package cavity and vacuum pump, described to beat
It is provided with printing equipment and print platform in print chamber, ion implantation apparatus is provided in the ion implanting chamber and injection is flat
Platform is provided with packaging system and package platforms, the vacuum pump and the ion implanting chamber in the package cavity, uses
It is vacuumized in the ion implanting chamber.
Optionally, the printing equipment includes print cartridge, pen tube, pen tip, first movement mechanism and air pump, and the print cartridge is used for
Low-melting-point metal ink is stored, the pen tube is connected to the print cartridge bottom, and the pen tip is connected to the pen tube bottom, described
Print cartridge is fixed in the first movement mechanism, and the first movement mechanism is for driving the print cartridge along the print platform institute
In planar movement, the air pump is connected at the top of the print cartridge, for provide negative pressure inside the print cartridge.
Optionally, it is additionally provided with the second mobile mechanism in the ion implanting chamber, the ion implantation apparatus is fixed on
In second mobile mechanism, second mobile mechanism is for driving the ion implantation apparatus where the injection platform
Planar movement.
Optionally, it is additionally provided with barometer in the ion implanting chamber.
Optionally, the ion implantation apparatus includes the ion source set gradually, accelerator, mass analyzer, focuses thoroughly
Mirror and beam scanning device.
Optionally, the packaging system includes at least one packaging plastic loader, at least one nozzle and at least one envelope
Adhesive curing device is filled, third mobile mechanism is additionally provided in the package cavity, the packaging system is fixed on the third and moves
On motivation structure, the third mobile mechanism is for driving the packaging system along planar movement where the package platforms.
Optionally, the low-melting-point metal printer further includes transmission device, and the transmission device is used for the printing
Base material is sequentially delivered to the print platform, the injection platform and the package platforms.
Second aspect, the present invention provide a kind of Method of printing, adopt the following technical scheme that：
Low-melting-point metal printer described in the Method of printing application any of the above item, the Method of printing include：
Step S1, one print substrate is provided；
Step S2, the print substrate is positioned on the print platform；
Step S3, low-melting-point metal circuit is printed in the print substrate by the printing equipment；
Step S4, the print substrate for being printed with the low-melting-point metal circuit is positioned on the injection platform, is passed through
The vacuum pump vacuumizes the ion implanting chamber；
Step S5, ion note is carried out to the target location of the low-melting-point metal circuit by the ion implantation apparatus
Enter；
Step S6, the print substrate after injecting ions into is positioned in the package platforms；
Step S7, the low-melting-point metal circuit in the print substrate is packaged using packaging system.
Optionally, the low-melting-point metal ink in the printing equipment is gallium-indium alloy, and the ion implantation apparatus is to institute
State low-melting-point metal circuit target location injection ion be Sn ions, Zn ions, N ions, P ion, Cu ions, Ag from
One or more of son, Ga ions, In ions.
Optionally, the Method of printing further includes between step S5 and step S6, on the low-melting-point metal circuit
Attach electronic component.
A kind of low-melting-point metal printer and Method of printing provided by the invention, wherein the low-melting-point metal printer packet
It includes printing chamber, ion implanting chamber, package cavity and vacuum pump, print chamber and is provided with printing equipment and print platform in room,
It is provided with ion implantation apparatus and injection platform in ion implanting chamber, packaging system is provided in package cavity and encapsulation is flat
Platform during being printed using the low-melting-point metal printer, after printing low-melting-point metal circuit in print substrate, will be beaten
The print substrate for being printed on low-melting-point metal circuit is positioned on injection platform, is vacuumized to ion implanting chamber by vacuum pump,
Then ion implanting is carried out to the target location of low-melting-point metal circuit by ion implantation apparatus, you can to low-melting-point metal
The target location of circuit is modified, and makes have different property at the position, such as the target location is made to have difference
Fusing point, electric conductivity or hardness etc. so that the property of the low-melting-point metal circuit printed can be according to practical need
It is adjusted, to meet a variety of demands of user.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Some bright embodiments for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of low-melting-point metal printer provided in an embodiment of the present invention；
Fig. 2 is the flow chart of Method of printing provided in an embodiment of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
It should be noted that each technical characteristic in the embodiment of the present invention can be tied mutually in the absence of conflict
It closes.
An embodiment of the present invention provides a kind of low-melting-point metal printers, and specifically, as shown in FIG. 1, FIG. 1 is of the invention real
The structural schematic diagram of the low-melting-point metal printer of example offer is applied, which includes printing chamber 1, ion note
Enter chamber 2, package cavity 3 and vacuum pump 4,1 is provided with printing equipment 11 and print platform 12, ion implanting chamber in print chamber room
It is provided with ion implantation apparatus 21 and injection platform 22 in room 2, packaging system 31 and package platforms are provided in package cavity 3
32, vacuum pump 4 is connected to ion implanting chamber 2, for being vacuumized to ion implanting chamber 2.
During using the low-melting-point metal printer to print, printed in print substrate 5 low-melting-point metal circuit 6 it
Afterwards, the print substrate 5 for being printed with low-melting-point metal circuit 6 is positioned on injection platform 22, by vacuum pump 4 to ion implanting
Chamber 2 vacuumizes, and then carries out ion implanting to the target location of low-melting-point metal circuit 6 by ion implantation apparatus 21,
The target location of low-melting-point metal circuit 6 can be modified, make that there is different property at the position, such as make the mesh
There is different fusing points, electric conductivity or hardness etc., so that the property of the low-melting-point metal circuit 2 printed at cursor position
Matter can be adjusted according to actual needs, to meet a variety of demands of user.
Above-described ion implanting refers to when having a branch of one block of solid material of ion beam directive in the air surely, by solid
The resistance of material and speed slowly lowers, and eventually settle at the phenomenon in solid material.
Printing equipment 11, ion implantation apparatus 21 and the envelope that the embodiment of the present invention includes to low-melting-point metal printer below
The concrete structure of assembling device 31 is illustrated.
Optionally, printing equipment 11 includes print cartridge, pen tube, pen tip, first movement mechanism and air pump in the embodiment of the present invention,
For print cartridge for storing low-melting-point metal ink, pen tube is connected to print cartridge bottom, and pen tip is connected to pen tube bottom, and print cartridge is fixed on the
In one mobile mechanism, for driving print cartridge along 12 place planar movement of print platform, air pump is connected to print cartridge for first movement mechanism
Top, for provide negative pressure inside print cartridge.In print procedure, air pump is to provide negative pressure inside print cartridge, in the effect of negative pressure
Under, the low-melting-point metal ink in print cartridge can be guided through pen tube to pen tip, to by pen tip by low-melting-point metal ink
In printing to print substrate 5, low-melting-point metal circuit 6 is formed.
Low-melting-point metal ink in print cartridge can be the gallium indium eutectic alloy being in a liquid state at room temperature.In addition, in print cartridge
Low-melting-point metal ink may be metal simple-substance or alloy that fusing point is slightly above room temperature, at this point, printing equipment 11 can be also
Including heating component, which can be located at around print cartridge, to be heated to the low-melting-point metal ink in print cartridge, make
Its temperature reaches fusing point or more, is in molten condition.
In addition, for the utilization rate and pen tip that improve low-melting-point metal ink fluency out of ink, in the embodiment of the present invention
Print cartridge inner wall on and pen tube inner wall on can be provided with the film layer of alienation low-melting-point metal ink and its oxide, and then make
Obtaining low-melting-point metal ink and its oxide will not be adhered on print cartridge inner wall and pen tube inner wall.Illustratively, above-mentioned alienation
The film layer of low-melting-point metal ink and its oxide can be paraffin layer.
Optionally, intermediate ion of embodiment of the present invention injection device 21 includes the ion source set gradually, accelerator, quality point
Parser, condenser lens and beam scanning device, the ion that ion source provides pass through accelerator, mass analyzer, focus thoroughly successively
Directive is positioned over the low-melting-point metal circuit 6 in the print substrate 5 on injection platform 22 after mirror and beam scanning device, to printing
Low-melting-point metal circuit 6 on base material 5 is modified.
Optionally, the second mobile mechanism is additionally provided in ion implanting chamber 2, ion implantation apparatus 21 is fixed on the second shifting
On motivation structure, the second mobile mechanism is used to drive ion implantation apparatus 21 along injection 22 place planar movement of platform, so that
The contraposition of ion implantation apparatus 21 and the target location on low-melting-point metal circuit 6 is easier realization, and ion implanting operates more
Simply.
Optionally, it is additionally provided with barometer in ion implanting chamber 2, so that can be in real time to ion by barometer
Vacuum degree in injecting chamber 2 is monitored.
Optionally, packaging system 31 includes at least one packaging plastic loader, at least one nozzle in the embodiment of the present invention
With at least one packaging plastic solidification equipment, third mobile mechanism is additionally provided in package cavity 3, packaging system 31 is fixed on third
In mobile mechanism, third mobile mechanism is for driving packaging system 31 along 32 place planar movement of package platforms.In encapsulation process
In, packaging plastic is provided to nozzle by packaging plastic loader, then under the drive of third mobile mechanism, equably by nozzle
Packaging plastic is sprayed into print substrate 5, the low-melting-point metal circuit 6 in print substrate 5 is packaged.
Wherein, packaging plastic loader may include multiple packaging plastic loaders, multiple nozzles and multiple encapsulation adhesive curings dress
It sets, wherein each packaging plastic loader can provide different packaging plastics respectively, and different nozzles is respectively connected to different encapsulation
Glue loader can to meet a variety of demands in encapsulation process, such as when being connected with electronic component on low-melting-point metal circuit
To first pass through a kind of packaging plastic to being packaged at the pin of electronic component and the link position of low-melting-point metal circuit, then again
Entire print substrate is packaged by another packaging plastic so that packaging effect is more preferable.
Since packaging plastic is usually thermohardening type packaging plastic or light-cured type packaging plastic, one is selected in the embodiment of the present invention
Partial encapsulation adhesive curing device is heating device, so that thermohardening type encapsulates adhesive curing, another part packaging plastic solidification equipment is
Ultraviolet lamp, so that light-cured type encapsulates adhesive curing so that the scope of application of packaging system 31 is wider.
Optionally, the low-melting-point metal printer in the embodiment of the present invention further includes transmission device, and transmission device is used for will
Print substrate is sequentially delivered to print platform 12, injection platform 22 and package platforms 32.The concrete structure of transmission device can root
It is designed according to actual needs, is no longer repeated herein.
In addition, an embodiment of the present invention provides a kind of Method of printing, it is low described in the Method of printing application any of the above item
Melting point metals printer, specifically, as shown in Fig. 2, Fig. 2 is the flow chart of Method of printing provided in an embodiment of the present invention, this dozen
Impression method includes：
Step S1, one print substrate is provided；
Step S2, print substrate is positioned on print platform；
Step S3, low-melting-point metal circuit is printed in print substrate by printing equipment；
Step S4, the print substrate for being printed with low-melting-point metal circuit is positioned on injection platform, passes through vacuum pump pair
Ion implanting chamber vacuumizes；
The indoor vacuum degree of ion implanting chamber can be monitored in real time by barometer during vacuumizing.
Step S5, ion implanting is carried out to the target location of low-melting-point metal circuit by ion implantation apparatus：
Optionally, the low-melting-point metal ink in printing equipment is gallium-indium alloy, and ion implantation apparatus is to low-melting-point metal
The ion of the target location injection of circuit is Sn ions, Zn ions, N ions, P ion, Cu ions, Ag ions, Ga ions, In
One or more of ion etc..Wherein, a certain amount of Sn ions, Zn ions, Ga ions, In ions are injected into gallium-indium alloy
One or more of can change low-melting-point metal circuit target location fusing point, inject a certain amount of N ions, P ion
One or more of can make low-melting-point metal circuit target location have characteristic of semiconductor, inject a certain amount of Cu from
One or more of son, Ag ions can improve the electric conductivity of the target location of low-melting-point metal circuit.
Optionally, Method of printing further includes attaching electronics on low-melting-point metal circuit between step S5 and step S6
Element occurs to avoid the problem of making ion implanting have an impact electronic component because attaching electronic component too early, and
It avoids that electronic component is prevented to occur from effectively packed problem because attaching electronic component too late.
Step S6, the print substrate after injecting ions into, is positioned in package platforms；
Step S7, the low-melting-point metal circuit in print substrate is packaged using packaging system.
When being pasted with electronic component on low-melting-point metal circuit,
A kind of low-melting-point metal printer and Method of printing provided by the invention, wherein the low-melting-point metal printer packet
It includes printing chamber, ion implanting chamber, package cavity and vacuum pump, print chamber and is provided with printing equipment and print platform in room,
It is provided with ion implantation apparatus and injection platform in ion implanting chamber, packaging system is provided in package cavity and encapsulation is flat
Platform during being printed using the low-melting-point metal printer, after printing low-melting-point metal circuit in print substrate, will be beaten
The print substrate for being printed on low-melting-point metal circuit is positioned on injection platform, is vacuumized to ion implanting chamber by vacuum pump,
Then ion implanting is carried out to the target location of low-melting-point metal circuit by ion implantation apparatus, you can to low-melting-point metal
The target location of circuit is modified, and makes have different property at the position, such as the target location is made to have difference
Fusing point, electric conductivity or hardness etc. so that the property of the low-melting-point metal circuit printed can be according to practical need
It is adjusted, to meet a variety of demands of user.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of low-melting-point metal printer, which is characterized in that the low-melting-point metal printer includes printing chamber, ion note
Enter chamber, package cavity and vacuum pump, printing equipment and print platform, the ion implanting chamber are provided in the print chamber room
Interior is provided with ion implantation apparatus and injection platform, and packaging system and package platforms are provided in the package cavity, described
Vacuum pump and the ion implanting chamber, for being vacuumized to the ion implanting chamber.
2. low-melting-point metal printer according to claim 1, which is characterized in that the printing equipment includes print cartridge, pen
Pipe, pen tip, first movement mechanism and air pump, the print cartridge are connected to described for storing low-melting-point metal ink, the pen tube
Print cartridge bottom, the pen tip are connected to the pen tube bottom, and the print cartridge is fixed in the first movement mechanism, and described first
For driving the print cartridge along planar movement where the print platform, the air pump is connected to the print cartridge top for mobile mechanism
Portion, for provide negative pressure inside the print cartridge.
3. low-melting-point metal printer according to claim 1, which is characterized in that also set up in the ion implanting chamber
There are the second mobile mechanism, the ion implantation apparatus to be fixed in second mobile mechanism, second mobile mechanism is used for
Drive the ion implantation apparatus along planar movement where the injection platform.
4. low-melting-point metal printer according to claim 1, which is characterized in that also set up in the ion implanting chamber
There is barometer.
5. low-melting-point metal printer according to claim 1, which is characterized in that the ion implantation apparatus includes successively
Ion source, accelerator, mass analyzer, condenser lens and the beam scanning device of setting.
6. low-melting-point metal printer according to claim 1, which is characterized in that the packaging system includes at least one
Packaging plastic loader, at least one nozzle and at least one packaging plastic solidification equipment are additionally provided with third in the package cavity
Mobile mechanism, the packaging system are fixed in the third mobile mechanism, and the third mobile mechanism is for driving the envelope
Assembling device is along planar movement where the package platforms.
7. low-melting-point metal printer according to claim 1, which is characterized in that further include transmission device, the transmission
Device is used to the print substrate being sequentially delivered to the print platform, the injection platform and the package platforms.
8. a kind of Method of printing, using such as claim 1~7 any one of them low-melting-point metal printer, which is characterized in that
Including：
Step S1, one print substrate is provided；
Step S2, the print substrate is positioned on the print platform；
Step S3, low-melting-point metal circuit is printed in the print substrate by the printing equipment；
Step S4, the print substrate for being printed with the low-melting-point metal circuit is positioned on the injection platform, by described
Vacuum pump vacuumizes the ion implanting chamber；
Step S5, ion implanting is carried out to the target location of the low-melting-point metal circuit by the ion implantation apparatus；
Step S6, the print substrate after injecting ions into is positioned in the package platforms；
Step S7, the low-melting-point metal circuit in the print substrate is packaged using packaging system.
9. Method of printing according to claim 8, which is characterized in that the low-melting-point metal ink in the printing equipment is
Gallium-indium alloy, the ion that the ion implantation apparatus is injected to the target location of the low-melting-point metal circuit be Sn ions,
One or more of Zn ions, N ions, P ion, Cu ions, Ag ions, Ga ions, In ions.
10. Method of printing according to claim 8, which is characterized in that further include between step S5 and step S6, in institute
It states and attaches electronic component on low-melting-point metal circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810979492.1A CN108811356A (en) | 2018-08-27 | 2018-08-27 | A kind of low-melting-point metal printer and Method of printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810979492.1A CN108811356A (en) | 2018-08-27 | 2018-08-27 | A kind of low-melting-point metal printer and Method of printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108811356A true CN108811356A (en) | 2018-11-13 |
Family
ID=64081273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810979492.1A Pending CN108811356A (en) | 2018-08-27 | 2018-08-27 | A kind of low-melting-point metal printer and Method of printing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108811356A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090173893A1 (en) * | 2004-08-23 | 2009-07-09 | Koichiro Tanaka | Semiconductor device and its manufacturing method |
| CN105734518A (en) * | 2016-03-14 | 2016-07-06 | 云南科威液态金属谷研发有限公司 | Liquid metal material gene editing method |
| CN105873370A (en) * | 2016-04-26 | 2016-08-17 | 北京梦之墨科技有限公司 | Printing method and device for inkjet and liquid metal mixed printing and product |
| CN209267865U (en) * | 2018-08-27 | 2019-08-16 | 北京梦之墨科技有限公司 | A kind of low-melting-point metal printer |
-
2018
- 2018-08-27 CN CN201810979492.1A patent/CN108811356A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090173893A1 (en) * | 2004-08-23 | 2009-07-09 | Koichiro Tanaka | Semiconductor device and its manufacturing method |
| CN105734518A (en) * | 2016-03-14 | 2016-07-06 | 云南科威液态金属谷研发有限公司 | Liquid metal material gene editing method |
| CN105873370A (en) * | 2016-04-26 | 2016-08-17 | 北京梦之墨科技有限公司 | Printing method and device for inkjet and liquid metal mixed printing and product |
| CN209267865U (en) * | 2018-08-27 | 2019-08-16 | 北京梦之墨科技有限公司 | A kind of low-melting-point metal printer |
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