CN108807593B - Water balance supply system for solar cell panel processing technology - Google Patents
Water balance supply system for solar cell panel processing technology Download PDFInfo
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- CN108807593B CN108807593B CN201810603660.7A CN201810603660A CN108807593B CN 108807593 B CN108807593 B CN 108807593B CN 201810603660 A CN201810603660 A CN 201810603660A CN 108807593 B CN108807593 B CN 108807593B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a water balance supply system for a solar cell panel processing technology, which comprises: a recovery pipeline group; a centralized liquid storage tank; a recycling pipeline group; a filter assembly; a heat exchange assembly; a flow monitoring component; water replenishing assembly and pressurizing assembly. Through reasonable configuration of pipelines and treatment unit components, closed-loop large circulation of process water is basically realized, the aim of near zero emission is realized, and meanwhile, environmental protection indexes and economic indexes are improved.
Description
Technical Field
The invention relates to the field of solar energy, in particular to solar panel processing and manufacturing, and particularly relates to a water balance supply system for a solar panel processing technology.
Background
At present, the world energy structure is developing towards a definite direction, although the current mainly takes non-renewable resources such as petroleum, coal, natural gas and the like as main resources, with the social and economic development, the new energy technology development and the transformation of the concept of people, the application of novel renewable resources is increasingly emphasized, wherein the solar energy has the advantages of cleanness and no pollution, and can be used as energy which can be developed almost infinitely, so that the solar energy has the greatest development potential.
At the present stage, the main utilization mode of solar energy is to convert solar energy into heat energy by a heat collection mode or convert solar energy into electric energy by utilizing a photovoltaic effect.
With the development and change of the photovoltaic solar market in recent years, solar cells are continuously developed to high efficiency and low cost. The polycrystalline silicon is used as a suitable semiconductor material and has wide application in the photovoltaic solar power generation industry. The polycrystalline silicon block is cut into silicon wafers having a predetermined thickness by a dicing machine as needed. Due to the high hardness of polysilicon, in view of the expansion of the industrial scale and the pressure of cost increase in silicon wafers, silicon wafer cutting methods with high efficiency and low cost are continuously sought in the industry for cutting large-sized polysilicon.
At present, the international photovoltaic industry mainly has two cutting modes of crystal silicon wafers.
One is mortar cutting, that is, a plurality of stainless steel thin Steel Wire (SW) wires coated with silicon carbide and oil slurry are wound on a driving wheel and a tension wheel to rotate at a high speed, grinding slurry taking silicon carbide micro powder as a main body is brought into a cutting area at a high speed and loads are applied to grinding materials, and the grinding materials grind and cut silicon materials.
The other is Diamond Wire (DW) slicing, namely, diamond particles are embedded on a stainless steel wire by adopting an electroplating or resin fixing method, and the stainless steel wire runs at a high speed and carries out grinding cutting on a silicon material under certain pressure. Compared with a battery manufacturing process, the mortar cutting has severe friction fracture damage to the surface of the silicon wafer, so that a plurality of small and irregular pits appear on the surface of the silicon wafer, the subsequent cleaning and texturing process is easy to be complex and unstable to control, the pyramid textured surface has a large variation range, the single pyramid textured surface has poor uniformity and the nucleation rate is low.
After diamond wire cutting, the surface of the silicon wafer has light surface friction fracture damage and smooth cutting lines formed by plastic grinding cutting, the surface of the silicon wafer has a mixed morphology of plastic smooth lines and brittle fracture slight pits, and the surface of the silicon wafer is not easy to corrode into a pyramid. But from the section technology relatively, compare in that mortar cutting processing cost is high, cutting efficiency is low, the waste mortar's after the cutting discharge pollution shortcoming such as big, diamond wire-electrode cutting does not use the mortar that expensive and difficult to handle, easy operation, and cutting speed can be fast 2 to 3 times, and the production rate that promotes exceeds 1.5 times, and silicon chip surface damage is lighter simultaneously, and the monolithic consumptive material is far less than the mortar cutting. Therefore, the diamond wire cutting technology has gradually become an alternative technology for mortar wire cutting due to the characteristics of high efficiency, environmental protection and high quality.
However, for silicon wafer cutting by using the diamond wire technology, a special cutting fluid is used, and the cutting fluid used for diamond wire cutting is a water-soluble cooling fluid, for example, the commonly used cutting fluid mainly comprises a nonionic surfactant, polyethylene glycol, an alcohol penetrant and an antirust agent, and is a water-based mixture. Is a water-based mixture, has better hydrophilicity, plays the roles of dispersing silicon powder and cooling, and ensures that slag is discharged and the temperature is reduced in the cutting process. The silicon powder can be quickly and uniformly dissolved in water, has good emulsibility, has certain functions of cleaning, lubricating and preventing rust, can effectively prevent the silicon wafer from brittle bursting or scratching in the cutting process, can clean the surface of the cut silicon wafer, reduces the rusting of a machine table, lowers the temperature of a cutting area in an express way, and can effectively suspend the cut silicon powder without generating precipitation; and the cooling liquid is not easy to volatilize, so that the cutting machine is relatively easy to clean.
In addition, the procedures of degumming, cleaning, cooling and the like are required, the water consumption is high, so that a water source needs to be prepared in advance, the process water needs to be kept sufficiently supplied for a long time, and the quality of a finally obtained product can be ensured only in this way. However, under the current situation that water resources are in short supply, the existing processing mode not only causes a large amount of water resource waste, but also cannot guarantee the supply of good water resources for a long time in a factory building in processing under many conditions, so that the water supply amount cannot be safely and effectively guaranteed in the processing process, and the processed products have poor quality and low processing efficiency. At present, the water used in each step generally has poor water quality after being used, so that the sewage is directly discharged through a drainage pipeline after the existing equipment is treated in the step, thereby not only causing the waste of water resources, but also causing a great amount of water pollution by randomly discharging the sewage.
Therefore, although the solar energy in the industry at present is clean energy, the solar elements can cause pollution in the manufacturing process, especially, a large amount of water resources are consumed, and waste water discharge is generated. The environment-friendly cutting fluid has the advantages that the environment-friendly industry is not environment-friendly, the pollution at the front end of the industry is a problem which needs to be avoided, the cutting fluid and other process water can be recycled in the industry, the dependence on water sources is reduced, the consumption of water resources is reduced, the external emission is reduced, and the environment-friendly index is improved.
Disclosure of Invention
In order to solve the above problems, the present invention provides a water balance supply system for solar panel processing technology, which basically realizes closed cycle of process water, achieves the purpose of near zero emission, and improves environmental protection indexes and economic indexes.
In order to achieve the above purpose, one of the technical solutions adopted by the present invention is:
the utility model provides a solar cell panel processing technology water balance supply system which characterized in that includes:
a recovery pipeline group; a centralized liquid storage tank; a recycling pipeline group; a filter assembly; a heat exchange assembly; a flow monitoring component; the liquid supplementing component and the pressurizing component;
the recovery pipeline group comprises a degumming liquid recovery pipe, a cleaning liquid recovery pipe, a cooling liquid recovery pipe and a cutting liquid recovery pipe, wherein the degumming liquid recovery pipe is used for recovering waste liquid generated in a degumming process, a cleaning process and a cooling process in the processing process of the solar cell panel to the centralized liquid storage tank;
the filtering component is used for filtering, separating and recovering impurities of the waste liquid flowing in the pipeline group;
the heat exchange assembly is used for carrying out heat exchange on the waste liquid flowing in the recovery pipeline group and the recycling liquid flowing in the recycling pipeline group;
the flow monitoring assembly is used for monitoring the flow of the fluid in the recovery pipeline set and the recycling pipeline set and controlling the liquid replenishing assembly to replenish water according to the flow of the fluid in the recovery pipeline set and the recycling pipeline set;
the pressurizing unit is used for driving the fluid to circulate in the recovery pipeline group and the recycling pipeline group;
the liquid-removing agent recovery pipe and the cleaning agent recovery pipe are internally communicated with a liquid storage tank;
the concentrated liquid storage tank comprises a liquid inlet tank and a clarification tank which are sequentially communicated, and a cooling liquid recovery pipe is communicated with the top flow or overflow of the clarification tank.
Preferably, the recycling line set includes:
conveying the filter pressing clear liquid of the filter pressing separation equipment to a cutting liquid recycling pipe of the silicon wafer cutting process;
and the liquid in the concentrated liquid storage tank is conveyed to a degumming liquid recycling pipe, a cleaning liquid recycling pipe and a cooling liquid recycling pipe of the degumming process, the cleaning process and the cooling process.
Preferably, the filter assembly comprises:
the first filtering unit is arranged on the cutting fluid recovery pipe;
the second filtering unit is arranged on a pipeline for communicating the premixing tank with the concentrated liquid storage tank;
and the third filtering unit is arranged on the cooling liquid recovery pipe.
Preferably, the filter medium of the first filter unit is a filter wire net, and the filter medium of the second filter unit and the filter medium of the third filter unit are activated carbon.
Preferably, the fluid infusion assembly comprises:
a water replenishing pipe communicated with the concentrated liquid storage tank and replenishing pure water or deionized water or tap water;
and a cutting fluid replenishing pipe for replenishing cutting fluid to the silicon wafer cutting process.
Preferably, the heat exchange assembly comprises:
the first heat exchanger is used for carrying out heat exchange on the circulating liquid in the cutting liquid recovery pipe and the circulating liquid in the degumming recycling pipe;
and the second heat exchanger is used for carrying out heat exchange on the liquid flowing in the water replenishing pipe and the liquid flowing in the cooling liquid recycling pipe.
Preferably, the pressure boost assembly comprises:
the first booster pump is arranged on the cutting fluid recovery pipe;
the second booster pump is arranged on the degumming liquid recycling pipe;
the third booster pump is arranged on a pipeline for communicating the premixing tank with the concentrated liquid storage tank;
the fourth booster pump is arranged on the cleaning liquid recycling pipe;
a fifth booster pump arranged on the cooling liquid recovery pipe;
and the sixth booster pump is arranged on the cooling liquid recycling pipe.
According to the technical scheme, the flow path of the cutting fluid and the process water flow path used in auxiliary processes such as degumming, cleaning and cooling form a closed-loop large circulation, so that the circular application of the cutting fluid and the process water is realized, and the consumption of the cutting fluid and water resources is reduced; and simultaneously reduces the energy consumption required by preheating of part of the process and the medium consumption required by cooling of part of the process. In addition, the filter pressing device can protect the related filter pressing equipment from being deformed or corroded due to high temperature, and the internal elements of the booster pump can be protected, so that the risk of corrosion due to high temperature is reduced. Therefore, the method can simultaneously improve the environmental protection, energy saving and economy of the silicon chip cutting process by adopting the diamond wire, and has greater popularization value.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic diagram illustrating an arrangement structure of a water balance supply system for a solar panel processing technology according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a first heat exchanger according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first filtering unit according to an embodiment of the present invention.
Detailed Description
In order to more clearly explain the overall concept of the invention, the following detailed description is given by way of example in conjunction with the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
In addition, in the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate orientations and positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The invention aims to provide a technical scheme for reasonably recycling and reusing cutting fluid used for cutting silicon wafers (particularly polysilicon) and other relevant process water.
As shown in fig. 1, in an embodiment, there is provided a water balance supply system for solar panel processing, including: a recovery pipeline group; a centralized liquid storage tank; a recycling pipeline group; a filter assembly; a heat exchange assembly; a flow monitoring component; the liquid supplementing component and the pressurizing component;
the recovery pipeline group comprises a degumming liquid recovery pipe 1002, a cleaning liquid recovery pipe 1003 and a cooling liquid recovery pipe 1004, which are used for recovering waste liquid generated in a degumming process, a cleaning process and a cooling process in the processing process of the solar cell panel to a centralized liquid storage tank, and a cutting liquid recovery pipe 1001, which is used for recovering waste liquid generated in a silicon wafer cutting process in the processing process of the solar cell panel and conveying the waste liquid to a filter-pressing separation device;
the filtering component is used for filtering, separating and recovering impurities of the waste liquid flowing in the pipeline group;
the heat exchange assembly is used for carrying out heat exchange on waste liquid flowing in the recovery pipeline group and/or the liquid supplementing assembly and recycling liquid flowing in the recycling pipeline group;
the flow monitoring assembly (not shown) is used for monitoring the fluid flow in the recovery pipeline set and the recycling pipeline set and controlling the liquid replenishing assembly to replenish water according to the fluid flow;
the pressurizing unit is used for driving the fluid to circulate in the recovery pipeline group and the recycling pipeline group;
the device also comprises a premixing tank, wherein the circulating waste liquid in the degumming solution recycling pipe 1002 and the cleaning solution recycling pipe 1003 is mixed in the premixing tank and then flows to the concentrated liquid storage tank. Because the degumming liquid is acidic, the cleaning liquid is alkaline, the degumming liquid and the cleaning liquid directly generate neutralization reaction, and then the degumming liquid can be directly recycled after simple treatment (flocculation, precipitation and the like).
With reference to the accompanying drawings, the recycling pipeline set comprises:
conveying the filter pressing clear liquid of the filter pressing separation equipment to a cutting liquid recycling pipe 3001 of a silicon wafer cutting process;
the liquid in the concentrated liquid storage tank is conveyed to a degumming liquid recycling pipe 3002, a cleaning liquid recycling pipe 3003 and a cooling liquid recycling pipe 3004 in the degumming process, the cleaning process and the cooling process.
Preferably, the filter assembly comprises:
a first filter unit 4001 disposed on the cutting fluid recovery pipe;
the second filtering unit 4002 is arranged on a pipeline for communicating the premixing tank with the concentrated liquid storage tank;
and a third filter unit 4003 provided on the coolant recovery pipe.
Preferably, the filter medium of the first filter unit is a filter wire net, and the filter medium of the second filter unit and the filter medium of the third filter unit are activated carbon.
Preferably, the fluid infusion assembly comprises:
a water supply pipe 6001 for supplying pure water, deionized water or tap water to the concentrated liquid storage tank;
and a cutting fluid supply pipe 6002 for supplying a cutting fluid to the silicon wafer cutting step.
Preferably, the heat exchange assembly comprises:
a first heat exchanger 5001 for performing heat exchange between the flowing liquid in the cutting liquid recovery pipe and the flowing liquid in the degumming recycling pipe;
and a second heat exchanger 5002 for exchanging heat between the fluid flowing through the water replenishing pipe and the fluid flowing through the cooling fluid recycling pipe.
Preferably, the pressure boost assembly comprises:
a first booster pump 7001 disposed on the cutting fluid recovery pipe;
the second booster pump 7002 is arranged on the degumming liquid recycling pipe;
the third booster pump 7003 is arranged on a pipeline for communicating the premixing tank with the concentrated liquid storage tank;
a fourth booster pump 7004 disposed on the cleaning liquid recycling pipe;
a fifth booster pump 7005 provided on the coolant recovery pipe;
and a sixth booster pump 7006 disposed on the coolant recycling pipe.
The heat exchange and the recycling of the cutting fluid are the two main points of improvement of the invention in the whole circulation system, and are mainly based on the following considerations:
on the one hand, the cutting fluid mainly has the function of cooling when the diamond wire is used for cutting silicon wafers, the cutting speed is high, the temperature of the cutting fluid is inevitably greatly increased, and the cooling treatment of the cutting fluid is necessary for recycling the cutting fluid.
On the other hand, one of the main processes of recycling the cutting fluid is to filter-press and separate the silicon powder carried in the cutting fluid so as to recycle the silicon powder. The filter press can generate a lot of heat during the working process, so that the temperature is increased, and the filter press can be influenced by overhigh temperature.
The temperature has the greatest influence on the working state of the filter press is the temperature of the filtered liquid, the temperature of the filtered liquid directly influences the filtering efficiency of the filter press, and whether the filtering can normally run or not is judged. Taking a plate and frame filter press as an example, when the temperature of the filtered liquid exceeds the designed temperature of the filter press and exceeds the temperature of the filter plate, the deformation of the filter plate of the filter press can be directly caused, the acid and alkali resistance of the filter plate is reduced, or the deterioration of the filter plate is accelerated. Therefore, the temperature of the cutting fluid entering the filter press also needs to be controlled within a reasonable range.
On the other hand, because the silicon wafer needs to be degummed after being cut, the cutting fluid used in the degummed treatment can be normally used only when the temperature is ensured to be about 70 ℃; in order to ensure sufficient supply of the degumming solution used in the degumming treatment, a process related to heating the chemical solution is required, for example, the prepared degumming solution can be heated or the degumming solution can be directly prepared by using a heated solvent such as water.
Based on the consideration, the technical scheme provided by the invention provides a system for treating and recycling the used cutting fluid through filter-pressing separation, so that the cutting fluid can be recycled, only a small amount of supplement is needed, the consumption of the cutting fluid is reduced, the discharge capacity is basically realized, the cost of wastewater treatment is reduced, and the environmental protection index is improved. And the connected slicing process and degumming process are fully utilized, a heat exchange system is established, the heat generated by each process is fully utilized, the energy consumption for cooling or heating is reduced, the influence on the filter pressing equipment in the circulating process of the cutting fluid is fully considered, and the stable operation of the equipment is ensured. The following will specifically describe by way of examples.
As shown in fig. 2, the first heat exchanger 5001 is structurally composed of: a heat exchange chamber which is used for preparing a degumming solution solvent and is conveyed by a degumming solution recycling pipe 3002; a heat exchange tube 50012 completely immersed by a solvent, wherein the heat exchange tube 50012 is connected to a cutting fluid recovery tube 1001; an auxiliary heater 50011 may also be provided;
according to the structure depicted in the figure, in the first heat exchanger 5001, the heat exchange tubes are coils or tubes. The heat exchange chamber is made of materials with good heat insulation performance, for example, the heat exchange chamber can be made of a composite structure of multiple materials, the inner layer is made of metal materials such as stainless steel, and the outer layer is wrapped with a heat insulation layer such as heat insulation asbestos; or directly selecting various stable composite materials, such as carbon fiber composite materials, glass fiber reinforced plastic composite materials and the like, preparing the heat exchange chamber into a structure with an upper opening, or preparing the heat exchange chamber into a closed box structure, and then arranging a pipeline for solvent to flow.
The heat exchange tube 50012 is made into a curved tube, a spiral coil without being limited to one layer or a parallel-connected tube array structure, and aims to prolong the stroke of the heat exchange tube 50012 as much as possible, increase the heat exchange contact area and the heat exchange contact time of the cutting fluid entering the heat exchange tube and the solvent, and fully perform heat exchange. In the embodiment, the solvent is directly heated and then conveyed for configuring degumming liquid used in degumming processes, and heat exchange is performed between adjacent upstream and downstream processes, so that the heat radiation loss of medium transmission is reduced, and the path of a pipeline is shortened. Of course, in another embodiment, the solvent may be transferred to other processes for heating, and when the external environment temperature is low, the solvent may be used as one of the heating sources.
In addition, the auxiliary heater 50011 is used for auxiliary heating when the heat provided by the cutting fluid is not enough to bring the solvent to a suitable temperature.
As a further preferred implementation manner of the above embodiment, the flow rate of the cutting fluid in the heat exchange tube can be adjusted as required; a temperature sensing unit (not shown) and a controller for receiving and processing a sensing signal sent by the temperature sensing unit are respectively arranged in the heat exchange chamber and on a pipeline communicated with an outlet of the heat exchange tube, and the controller controls the power of the first booster pump 7001 according to the sensing signal, so that the flow rate of the cutting fluid is adjusted. For example, according to the temperature parameter that the temperature sensor gathered according to the demand combines, if need the rapid heating when monitoring the temperature in the heat exchange chamber in real time, then increase cutting fluid flow and increase heat exchange rate, and simultaneously with the auxiliary heating. If the temperature of the cutting fluid needs to be fully reduced, the flow of the cutting fluid is controlled to be reduced, the heat exchange speed is reduced, and the cutting fluid flows out of the heat exchange tube after the temperature of the cutting fluid is fully reduced.
Taking the currently and generally adopted diamond wire silicon wafer cutting production line as an example, as long as reasonable process configuration is adopted, the productivity is reasonably allocated, and basically, the heat absorbed by the degumming solution in the preheating link can fully cool the cutting solution to a temperature range meeting the recycling requirement.
The degumming liquid can be normally used after being heated to a certain temperature, so that the heat is not consumed, the cutting liquid is utilized for heat exchange, the integral technological requirement of a silicon wafer cutting production line is met, the heat loss of fluid medium transmission can be reduced, the cutting liquid is subjected to heat exchange and temperature reduction after being collected, the damage of high temperature to subsequent processing equipment can be avoided, for example, the cutting liquid can enter a booster pump at a lower temperature, and for example, the cutting liquid can enter a filter press at a lower temperature.
In addition, the filter-pressing separation equipment can be selected to be a plate-and-frame filter press or a belt filter press according to the production scale and other requirements. And the silicon powder mixed in the cutting liquid is subjected to filter-pressing separation and then is recycled in multiple purposes, and the clear liquid obtained after filter-pressing directly enters a circulating system and returns to the cutting liquid supply unit. After the operation reaches the balance and stability, the cutting fluid amount needing to be supplemented is greatly reduced.
In addition, the invention also makes important improvement on the filtration of the cutting fluid.
With particular reference to fig. 3, the first filtering unit 4001 comprises:
a first collection chamber 40011; a second collection chamber 40017 in fluid communication with the underflow of the first collection chamber 40011.
As shown, the same bottom can define the bottoms of both the first collecting chamber 40011 and the second collecting chamber 40017, in other words, the first collecting chamber 40011 and the second collecting chamber 40017 are formed by an integral box body with partition walls, the edges of both sides of the first partition wall 40012 are connected with the side walls of the box body, and the edge of the lower end is spaced from the bottom of the box body to form an underflow passage 40013 for the fluid in the first collecting chamber 40011 to pass through; the edges of the two sides of the second clapboard 40014 are connected with the side wall of the box body, meanwhile, the edge of the lower end of the second clapboard 40014 is connected with the bottom of the box body, so that the inner space of the box body is partitioned, and the height of the second clapboard 40014 is smaller than that of the side wall of the box body, so that the fluid in the channel surrounded by the first clapboard 40013, the second clapboard 40014 and the side wall of the box body can flow into the second collection chamber 40017 in an overflowing manner.
The collected slurry is treated in two stages by providing two collection chambers, and after the cutting fluid is accumulated in the first collection chamber, the slurry is introduced into the second collection chamber in an overflow manner, and the flow path of the cutting fluid is extended in a limited space, so that the cutting fluid can be treated in stages, for example, by stirring the cutting fluid in the first collection chamber to make the cutting fluid in a relatively uniform state, and then, the cutting fluid is introduced into the second collection chamber, filtered in the second collection chamber, and then introduced into the discharge pipe.
In addition, the setting of intercommunication passageway still lets first collection room and second to a certain extent collect the room relatively independent, influence that can not each other, and when the cutting fluid in first collection room did not reach the top flow liquid level that the room was collected to the second, the cutting fluid can not flow into the second and collect the room, and at this moment, the room is collected to the second to the convenience and clears up or maintains.
Of course, the figures are only schematic of preferred constructions, and in other embodiments not shown, the above technical idea can be implemented in other ways, for example, the first collecting chamber and the second collecting chamber are respectively provided with relatively independent tanks, and then the underflow of the first collecting chamber and the overflow of the second collecting chamber are communicated through a pipeline.
In a preferred embodiment, the cross-sectional area of the communicating channel can be set to gradually increase along the fluid flow direction, for example, by arranging the first partition plate to be inclined, and the included angle β between the inclined first partition plate and the second partition plate is selected from 5 ° to 20 °, so as to achieve better filtering effect, in the first collecting chamber, the cutting fluid flow field is expected to uniformly and disorderly carry silicon powder particles generated by diamond wire cutting silicon chips, so as to avoid accumulation of solid substances in the first collecting chamber, and in the second collecting chamber, the flow field is expected to be more stable, so as to perform filtering separation treatment, and the gradually enlarged aperture of the fluid passage can play a role in reducing the flow speed and stabilizing the flow field.
In the aforementioned embodiment that the underflow of the first collection chamber and the overflow of the second collection chamber are communicated through the pipe, for example, the purpose of slowing down and stabilizing the flow field of the fluid in the pipe can be achieved by gradually changing the caliber of the pipe.
In addition, the underflow of the second collection chamber 40017 is in fluid communication with a cutting fluid recovery line 1001, and there may be a valve on the cutting fluid recovery line 1001, which may be a shut-off valve and/or a regulating valve. And the connection of cutting fluid recovery pipe 1001 to the underflow of second collection chamber 40017 is provided at the lower end of the side wall of second collection chamber 40017 opposite second partition 40014, or alternatively, the connection of the discharge conduit to the underflow of the second collection chamber is provided at the bottom of the second collection chamber. This arrangement avoids pooling at the bottom of the second collection chamber and provides a driving force to the discharge conduit by the pressure of the fluid itself.
Before the fluid enters the discharge pipeline, impurities, foreign matters and other substances in the fluid which are not expected to enter the discharge pipeline and a subsequent treatment device can be preliminarily separated, a filtering separation mode as depicted in the figure can be adopted to realize the separation, specifically, a filter screen 40016 which divides the second collection chamber 40017 into a first chamber and a second chamber is arranged in the second collection chamber 40017, the filter screen 40016 is provided with a filter hole, and the underflow of the second collection chamber 40017 which is in fluid communication with the cutting fluid recovery pipe 1001 is arranged in the first cavity. As shown in the figure, the first cavity has a triangular or approximately triangular section, and the fluid flows through the filtering holes of the filtering unit uniformly, separates the foreign matters and flows to the bottom flow of the second collecting chamber 40017. Wherein, the aperture of the filtration pore of filter screen 40016 can be set according to the needs of operational environment, and the consideration factor has, the particle diameter that probably produces in the course of working, the particle diameter of the foreign matter that probably gets into first collection chamber by external processing environment, the tolerance requirement of follow-up equipment to the foreign matter etc..
As mentioned above, the filter screen can separate the substance which is not expected to enter the discharge pipeline and the subsequent treatment device, and after the filter screen is used for a period of time, the filter screen inevitably adheres to the separated foreign matter, the filtering effect is influenced after a long time, so the filter screen has the requirement of regular cleaning or replacement, and the filter screen is set to be detachable in order to facilitate the cleaning or replacement of the filter screen. An opening is formed in the side wall of the second collecting chamber 40017, the lower end of the filter screen 40016 is stopped by a protrusion 1202 arranged on the bottom wall of the second collecting chamber 40017 to stop the movement tendency of the lower end of the filter screen 40016 to be far away from the opening, and the upper end of the filter screen 40016 is overlapped or connected to the lower edge of the opening. In this way, the filter screen can be drawn away from the second collection chamber through the opening.
In order to ensure normal work, the opening is provided with a sealing component 40018 which can be opened or closed, when the opening is opened, the opening is communicated with the outside, and the filtering unit can be taken out from the second collecting chamber through the opening; when closed, the seal assembly forms a portion of the outer wall of the second collection chamber, isolating the opening from communication with the outside.
The seal assembly comprises a base and a cover, the base is arranged around the opening, the base is detachably connected with the cover, and the detachable mode is selected from flange connection, threaded connection, buckle connection and the like. When the filter unit needs to be pulled out of the second collection chamber, the cover body is detached from the connection of the base body, and then the filter unit is pulled out through the opening, so that the filter unit does not need to be pulled out of the second collection chamber through hands or a holding tool from an upper opening of the second collection chamber, and even if the second collection chamber has a higher height, the filter unit can still be conveniently detached, and the device is convenient to maintain.
The process of collecting fluid, such as cutting fluid, and passing through the two collection chambers respectively is as follows: only when the top flow level of the first collection chamber is higher than the top flow level of the second collection chamber is the fluid flowing in an overflow manner from the top flow of the second collection chamber through the communication channel. Then, if the fluid of the first collection chamber flows in such a manner all the time, the liquid level of the second collection chamber gradually rises until the liquid levels of the first collection chamber and the second collection chamber are leveled, and a stable fluid flow state is maintained. When the liquid level of the first collection chamber is lowered to be lower than the top flow liquid level of the second collection chamber, no fluid flows into the second collection chamber until emptying, and at the moment, the filter unit can be cleaned or replaced after being detached without emptying the first collection chamber.
Furthermore, as a further preference, in the embodiment not shown in the figures, the device construction is more flexible, it being possible to provide for the height of the second partition to be adjustable, by means of which the height of the second partition is adjusted, and thus the height of the top flow of the second collection chamber. Through controlling the height of apical flow, can realize different mode's switching, for example when needing to change the filter unit, can reduce the height of second baffle earlier, from this, reduce the liquid level of first collection room, then rise the height of second baffle again, can keep the unable second collection room that flows into of the interior fluid of first collection room in a period like this, realize the purpose of second collection room evacuation cutting fluid to conveniently carry out the dismantlement operation to the filter unit.
The second partition board can be arranged in various height-adjustable modes, for example, the second partition board is arranged to be inserted into the bottom of the box body from the opening with the seal, a corresponding retracting device is arranged, and then the height of the second partition board inserted into the box body is adjusted in a pulling mode. The second partition board can be arranged into a telescopic structure, or a foldable structure, or other structures capable of adjusting the vertical dimension. In another embodiment, the aforementioned technical concept can also be realized by forming through holes on the second partition plate, wherein the second partition plate is provided with a plurality of through holes along the vertical direction, the through holes are in a normally closed state, and the through holes can be opened as required when the liquid level in the first collection chamber is required to be reduced.
In addition, in order to uniformly mix the collected cutting fluid in the first collection chamber, without generating siltation, and facilitate subsequent treatment, a stirring unit, such as a stirring blade driven by a motor, may be disposed in the first collection chamber, and besides mechanical stirring, a stirring device, such as an aeration device, or other devices that disturb a fluid flow field to uniformly mix the fluid with the substances carried in the fluid may be employed.
In addition, in order to obtain more cooling effect, often need set up at the cooling process and spray the structure, in order to avoid spraying the structure, the coolant liquid retrieval and utilization pipeline is preferred to be linked together with the apical flow or the overflow of concentrating the liquid storage tank, can ensure that the backward flow liquid group that gets into the coolant water retrieval and utilization pipeline is clear enough, reduces the risk that the coolant liquid sprays the structure and blocks up. And the centralized liquid storage tank is divided into a liquid inlet tank and a clarification tank which are communicated in sequence, and each recycling pipeline is communicated with the supernatant layer of the clarification tank.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (7)
1. The utility model provides a solar cell panel processing technology water balance supply system which characterized in that includes:
a recovery pipeline group; a centralized liquid storage tank; a recycling pipeline group; a filter assembly; a heat exchange assembly; a flow monitoring component; the liquid supplementing component and the pressurizing component;
the recovery pipeline group comprises a degumming liquid recovery pipe, a cleaning liquid recovery pipe, a cooling liquid recovery pipe and a cutting liquid recovery pipe, wherein the degumming liquid recovery pipe is used for recovering waste liquid generated in a degumming process, a cleaning process and a cooling process in the processing process of the solar cell panel to the centralized liquid storage tank;
the filtering component is used for filtering, separating and recovering impurities of the waste liquid flowing in the pipeline group;
the heat exchange assembly is used for carrying out heat exchange on the waste liquid flowing in the recovery pipeline group and the recycling liquid flowing in the recycling pipeline group;
the flow monitoring assembly is used for monitoring the flow of the fluid in the recovery pipeline set and the recycling pipeline set and controlling the liquid replenishing assembly to replenish water according to the flow of the fluid in the recovery pipeline set and the recycling pipeline set;
the pressurizing assembly is used for driving the fluid to circulate in the recovery pipeline group and the recycling pipeline group;
the concentrated liquid storage tank comprises a liquid inlet tank and a clarification tank which are sequentially communicated, and a cooling liquid recovery pipe is communicated with the top flow or overflow of the clarification tank;
the filter assembly includes: the first filtering unit is arranged on the cutting fluid recovery pipe;
the first filter unit includes:
a tank separated by a first partition and a second partition into a first collection chamber and a second collection chamber, the underflow of the first collection chamber being in fluid communication with the overflow of the second collection chamber;
the edges of two sides of the first partition board are connected with the side wall of the box body, and the lower end of the first partition board forms an underflow channel for fluid in the first collection chamber to pass through; the edge of the both sides of second baffle is connected with the lateral wall of box, and simultaneously, the edge of the lower extreme of second baffle is connected with the bottom of box to the inner space of interval box, and the highly less than lateral wall of box of second baffle, thereby make the fluid accessible overflow's of the passageway that first baffle, second baffle and the lateral wall of box enclose the mode inflow second collection chamber.
2. The solar panel processing technology water balance supply system of claim 1, wherein the recycling pipeline set comprises:
conveying the filter pressing clear liquid of the filter pressing separation equipment to a cutting liquid recycling pipe of the silicon wafer cutting process;
and the liquid in the concentrated liquid storage tank is conveyed to a degumming liquid recycling pipe, a cleaning liquid recycling pipe and a cooling liquid recycling pipe of the degumming process, the cleaning process and the cooling process.
3. The water balance supply system for the solar panel processing technology according to claim 1, further comprising a pre-mixing tank, wherein the waste liquid flowing through the degumming solution recovery pipe and the cleaning solution recovery pipe is mixed in the pre-mixing tank and then flows to the concentrated liquid storage tank;
the filter assembly further comprises:
the second filtering unit is arranged on a pipeline for communicating the premixing tank with the concentrated liquid storage tank;
and the third filtering unit is arranged on the cooling liquid recovery pipe.
4. The solar panel processing technology water balance supply system of claim 1, wherein the filter medium of the first filter unit is a filter screen, and the filter medium of the second filter unit and the third filter unit is activated carbon.
5. The solar panel processing water balance supply system of claim 1, wherein the fluid replacement assembly comprises:
a water replenishing pipe communicated with the concentrated liquid storage tank and replenishing pure water or deionized water or tap water;
and a cutting fluid replenishing pipe for replenishing cutting fluid to the silicon wafer cutting process.
6. The solar panel processing water balance supply system of claim 1, wherein the heat exchange assembly comprises:
the first heat exchanger is used for carrying out heat exchange on the circulating liquid in the cutting liquid recovery pipe and the circulating liquid in the degumming recycling pipe;
and the second heat exchanger is used for carrying out heat exchange on the liquid flowing in the water replenishing pipe and the liquid flowing in the cooling liquid recycling pipe.
7. The solar panel processing water balance supply system of claim 5, wherein the pressurization assembly comprises:
the first booster pump is arranged on the cutting fluid recovery pipe;
the second booster pump is arranged on the degumming liquid recycling pipe;
the third booster pump is arranged on a pipeline for communicating the premixing tank with the concentrated liquid storage tank;
the fourth booster pump is arranged on the cleaning liquid recycling pipe;
a fifth booster pump arranged on the cooling liquid recovery pipe;
and the sixth booster pump is arranged on the cooling liquid recycling pipe.
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| CN201810603660.7A CN108807593B (en) | 2018-06-12 | 2018-06-12 | Water balance supply system for solar cell panel processing technology |
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| US20030116174A1 (en) * | 2001-12-21 | 2003-06-26 | Park Jin-Goo | Semiconductor wafer cleaning apparatus and cleaning method using the same |
| CN201882932U (en) * | 2010-10-21 | 2011-06-29 | 高佳太阳能股份有限公司 | Device for reusing cleaning waste water of silicon chips |
| CN202058775U (en) * | 2011-03-30 | 2011-11-30 | 吉林庆达新能源电力股份有限公司 | Winter process water heat exchanging device of solar battery production |
| CN204074597U (en) * | 2014-09-05 | 2015-01-07 | 中卫市银阳新能源有限公司 | A kind of Wafer Cleaning wastewater recycling system |
| CN206066722U (en) * | 2016-08-22 | 2017-04-05 | 呼和浩特市欧通能源科技有限公司 | A kind of discarded cutting fluid recycling system |
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