CN108790321A - A kind of manufacturing method and cellular board of soldering cellular board - Google Patents
A kind of manufacturing method and cellular board of soldering cellular board Download PDFInfo
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- CN108790321A CN108790321A CN201710297666.1A CN201710297666A CN108790321A CN 108790321 A CN108790321 A CN 108790321A CN 201710297666 A CN201710297666 A CN 201710297666A CN 108790321 A CN108790321 A CN 108790321A
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- honeycomb core
- aluminium
- aluminium honeycomb
- aluminum foil
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- 230000001413 cellular effect Effects 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000005476 soldering Methods 0.000 title claims abstract description 42
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 119
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 117
- 239000004411 aluminium Substances 0.000 claims abstract description 75
- 239000011888 foil Substances 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 35
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 23
- 238000000465 moulding Methods 0.000 claims abstract description 13
- 239000005030 aluminium foil Substances 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 33
- 238000005219 brazing Methods 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000002390 adhesive tape Substances 0.000 claims description 21
- 230000004907 flux Effects 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 15
- 230000007246 mechanism Effects 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 10
- 238000005336 cracking Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 210000004907 gland Anatomy 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- SKFYTVYMYJCRET-UHFFFAOYSA-J potassium;tetrafluoroalumanuide Chemical compound [F-].[F-].[F-].[F-].[Al+3].[K+] SKFYTVYMYJCRET-UHFFFAOYSA-J 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 210000001161 mammalian embryo Anatomy 0.000 claims description 2
- -1 phenolic aldehyde Chemical class 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000011162 core material Substances 0.000 abstract description 56
- 238000005265 energy consumption Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 238000004590 computer program Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 208000020442 loss of weight Diseases 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/10—Properties of the layers or laminate having particular acoustical properties
- B32B2307/102—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
Landscapes
- Laminated Bodies (AREA)
Abstract
A kind of manufacturing method of soldering cellular board is provided in the embodiment of the present application, the step of this method includes：Advance gluing stacking is cohered into the molding clad aluminum foil with solder layer and is drawn into cellular aluminium honeycomb core；Aluminium honeycomb core is fixed between two blocks of embryonic plates with solder layer and carries out soldering processing, obtains cellular board.Glued aluminium foil is drawn into cellular by the application using pulling method, then is directly once brazed with aluminium sheet, is made between honeycomb core material, complete metallurgical binding between core material and aluminium sheet, efficiently, low energy consumption.
Description
Technical field
This application involves field of track traffic, and in particular, to a kind of manufacturing method and cellular board of soldering cellular board.
Background technology
Floor, the top plate etc. used in field of track traffic, such as in the vehicular traffics such as subway, city rail vehicle be mostly
Ceramsite sand and gluing aluminum honeycomb material.Loss of weight requirement of the ceramsite sand due to cannot be satisfied design, is gradually eliminated.And gluing aluminium bee
Nest plate between honeycomb core, between honeycomb core and aluminium sheet with the mode being glued due to connecting, it is easy to by ambient enviroment and gluing
The restriction of agent self performance.For example it is easy the limitations such as degumming, drum, unrepairable in altitude environment.
For example, application number：200910094562.6 patent application in disclose a kind of system of soldering formula metal honeycomb plate
The preparation of Preparation Method, aluminium honeycomb core is all cellular using being assembled into after roll-forming, and honeycomb core assembly precision is difficult to meet
And efficiency is low, is difficult to realize industrialized production.
For example, application number：A kind of no glue composite plate and its manufacture work are disclosed in 201410796743.7 patent application
Skill, although referring to the present invention be similar welding procedure, mention it is cellular use fin machine roll-forming, do not mention bee
The manufacturing process of nest shape.
For example, application number：201210177885.3 patent application in disclose a kind of aluminum honeycomb core material and cellular board
Preparation method be after vacuum brazing using pulling method prepare soldering aluminium honeycomb core, later again with aluminium sheet vacuum welding.Vacuum pricker
Weldering energy consumption, low production efficiency and secondary welding greatly increase production cost.
For example, application number：201310003242.1 patent application in disclose a kind of metal beehive core material and honeycomb three
The preparation method of Mingzhi's plate.Although referring to prepare honeycomb core with pulling method, non-composite aluminium foil is coated in sizing material or solder
On directly welded with the aluminium sheet for having applied solder, such process with sizing material do not ensure that honeycomb core between metallurgical connect.Use pricker
It redraws into cellular after material, belongs to secondary soldering, efficiency is low, energy consumption.
In conclusion the shortcomings of the prior art is：
1, gluing aluminum honeycomb is influenced by environment and operating condition, is easy degumming.Using being assembled into honeycomb after roll-forming
Shape, honeycomb core assembly precision is difficult satisfaction and efficiency is low, is difficult to realize industrialized production；
2, using pulling method prepare soldering aluminium honeycomb core, after vacuum brazing after again with aluminium sheet vacuum or atmosphere slice
Weldering.Vacuum brazing energy consumption, low production efficiency and secondary welding increase energy consumption and improve production cost.
Invention content
A kind of manufacturing method and cellular board of soldering cellular board are provided in the embodiment of the present application, to solve in the prior art
Gluing aluminum honeycomb is easy degumming, and honeycomb core assembly precision is low；It is of high cost to be brazed aluminium honeycomb core, the low problem of efficiency.
The present invention provides a kind of manufacturing method of soldering cellular board, the step of this method, includes：
Advance gluing stacking is cohered into the molding clad aluminum foil with solder layer and is drawn into cellular aluminium honeycomb core；
Aluminium honeycomb core is fixed between two blocks of embryonic plates with solder layer and carries out soldering processing, obtains cellular board.
It is a kind of to utilize cellular board made of gone up the method.
Beneficial effects of the present invention are as follows：
Compared with prior art, by coating technique aluminum honeycomb shape is made in two-sided clad aluminum foil by the present invention, by honeycomb
Shape and the soldering of single side clad aluminium, welding only need the metallurgical junction between cellular and clad aluminium spraying brazing flux, postwelding core material
Conjunction is not influenced completely by gluing, between core material, the cellular metallurgical binding between plank, intensity is high, light-weight, sound insulation, fire prevention,
It is environmentally friendly, solderable, can recycle completely.Both the shortcomings that having overcome the method for forming to prepare low honeycomb core efficiency of assembling and energy consumption, also overcomes
Vacuum brazing or secondary soldering prepare the deficiency that aluminum honeycomb energy consumption is high, efficiency is low.The cellular assembly precision of brazed aluminum of the present invention is high,
It is easy to operate, production efficiency can be greatly improved, industrialized production is suitble to.
Description of the drawings
Attached drawing described herein is used for providing further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please do not constitute the improper restriction to the application for explaining the application.In the accompanying drawings：
Fig. 1 is a kind of schematic diagram of the manufacturing method of soldering cellular board of the present invention；
Fig. 2 is the schematic diagram of single adhesive tape glue-printing roller of the present invention；
Fig. 3 is the schematic diagram of double adhesive tape glue-printing rollers of the present invention；
Fig. 4 is the schematic diagram for the section that single adhesive tape tenaplate of the present invention stacks；
Fig. 5 is the schematic diagram for the section that double adhesive tape tenaplates of the present invention stack；
Fig. 6 is the schematic diagram that plate body of the present invention assembles device；
Fig. 7 is the schematic diagram that plate body of the present invention assembles hold-down mechanism in device；
Fig. 8 is the exploded perspective view that plate body of the present invention assembles that rear plate body assembles device；
Fig. 9 is the process flow chart that single adhesive tape of the present invention is brazed cellular board；
Figure 10 is the process flow chart that double adhesive tape of the present invention are brazed cellular board；.
1, tooling platform, 2, hold-down mechanism, 3, mold plate, 4, stratiform embryonic plate；
21, swivel nut, 22, bolt, 23, pressure head, 24, holddown spring.
Specific implementation mode
In order to make technical solution in the embodiment of the present application and advantage be more clearly understood, below in conjunction with attached drawing to the application
Exemplary embodiment be described in more detail, it is clear that described embodiment be only the application a part implement
Example, rather than the exhaustion of all embodiments.It should be noted that in the absence of conflict, the embodiment in the application and reality
The feature applied in example can be combined with each other.
Core of the invention thinking is, the two-sided clad aluminum foil for having applied epoxy glue is drawn into using pulling method it is cellular,
It is directly once brazed with the single side clad aluminium for having applied solder again, between postwelding honeycomb core material, complete between core material and aluminium sheet
Full metallurgical binding achievees the purpose that efficient, low energy consumption.
As shown in Figure 1, the present invention provides a kind of manufacturing method of soldering cellular board, the main of this method includes following step
Suddenly：
Advance gluing stacking is cohered into the molding clad aluminum foil with solder layer and is drawn into cellular aluminium honeycomb core；
Aluminium honeycomb core is fixed between two blocks of embryonic plates with solder layer and carries out soldering processing, obtains cellular board.
The case where according to actual process, can select first degumming to be brazed again, or will be placed in by aluminium honeycomb core two blocks of embryonic plates it
Between the layer structure that is formed directly carry out soldering processing, obtain cellular board.The advantage for simplifying step is, can utilize soldering oven
In high temperature, while realize cracking aluminium honeycomb core on colloid and to being placed in the stratiform formed between two blocks of embryonic plates by aluminium honeycomb core
Structure is brazed, it is only necessary to control the opportunity of soldering and cracking.
In this example, the plate material of single-layer or multi-layer may be used in the embryonic plate, for example, clad aluminium, steel plate and steel aluminium
Composite plate etc..Two-sided clad aluminum foil may be used in the clad aluminum foil.Last layer can first be plated on the steel plate when using steel plate
Transition material is brazed by excess material and aluminium honeycomb core, ensures stability after brazing.When using Steel-aluminium composite board,
It is contacted with aluminium honeycomb core using aluminium charge level, in this way, good can realize the firm of grip block and honeycomb filler after brazing
Property.
In this example, the step of clad aluminum foil coheres molding, includes：It is coated in an array manner on the surface of clad aluminum foil
Adhesive；The clad aluminum foil at least two being coated with adhesive stacks fixation in a manner of making adhesive dislocation arrangement, is formed
Cohere molding clad aluminum foil；
This programme the method further includes：The surface with solder of aluminium honeycomb core and embryonic plate after degumming process
Upper sprinkling brazing flux.Wherein, the brazing flux is powdered or liquid state.Preferably, the brazing flux uses potassium aluminum fluoride flux.
In this example, the aluminium foil can select two-sided clad aluminum foil, thickness to ensure between 0.08 to 0.6 millimeter, multiple
Composition and division in a proportion is between 8% to 12%.The aluminium sheet can select multilayer or single layer clad aluminium, thickness to ensure in 1.0 millis
Rice is between 5 millimeters, and compound ratio is between 8% to 12%.
In the present solution, during in order to ensure the cohering, assemble, be brazed etc. of all material, not by the dirt of material surface
It influences, before honeycomb board manufacturing process, can first judge whether the material used is pre-processed.For example, in this example,
Embryonic plate selects clad aluminium, comb core material to use clad aluminum foil, then has oxidation film or greasy dirt due to being deposited on aluminium foil and aluminium sheet,
The oxidation film and greasy dirt for needing alkaline aqueous solution the removal clad aluminum foil and clad aluminium using tertiary sodium phosphate in advance, so as to these
Material will not influence to process during follow-up use due to dirt.
In this example, directly glue spreader can be used to handle the gluing tool on clad aluminum foil.The adhesive can
With using the adhesive of epoxy, phenolic aldehyde, rubber mix, such glue volatilizees cracking at 300 DEG C to 450 DEG C.For the technique of gluing
Single adhesive tape or double adhesive tape may be used.As shown in Fig. 2, the rubber roller width of single adhesive tape coating method is xL, rubber roller spacing be 4L into
Row coating, it is 2-80 ms/min that aluminium foil, which prints glue speed, it is preferable that print glue speed can be 8-40 ms/min, complete by glue is printed
Aluminium foil is dried within the scope of 150 DEG C of room temperature.As shown in figure 3, double adhesive tape rubber roller designs such as figure, according to required aluminum honeycomb shape length of side L
The overall width at the double adhesive tape rubber rollers of design, double adhesive tape and non-gluing position is xL, the shape at non-gluing position can designed, designed, width
≤ yxL, wherein coefficient y can take 0.8.Rubber roller spacing is 3L, and aluminium foil prints glue speed：2-80 ms/min, it is preferable that print glue speed
Degree can be 8-40 ms/min.Due to actual requirement of engineering, the structure for being drawn into honeycomb core may be non-regular hexagonal,
Therefore, it is the hexagonal configuration of changeable posterior drawing honeycomb core by adjusting the magnitude of x in above-mentioned rubber roller width, general x's
Value rule is：X < 1, cellular is flat hexagon；X=1, cellular is regular hexagon；X > 1, cellular is Long Hexagon.
But it should be noted：Single adhesive tape is since aluminium foil contact surface is gluing position, and residue can influence after glue splits volatilization
To the soldering strength of contact position.Single entire contact surface of adhesive tape connects gluing, and metallurgical binding position has defect after soldering；Double adhesive tape
The then non-gluing between adhesive tape, residue influences contact position soldering after glue volatilization is also not present, and it is complete to be embodied as gluing position
Metallurgical binding improves the intensity of core contact surface.Therefore, the application preferably coats adhesive using double adhesive tape modes.
According to the difference of adhesive coating method, respectively according to such as Fig. 4 or mode shown in fig. 5, gluing will have been coated
Two clad aluminum foil stacked offsets of agent.Passing through respectively, hot pressing and slicing treatment, is obtaining aluminium honeycomb core.Wherein, hot pressing is wanted
It asks and needs to meet：Pressure 0.3-0.5Mpa, 170 DEG C -200 DEG C of solidification temperature, soaking time 2.5h-3h.The requirement of slice needs
Meet：Cutting accuracy≤0.05mm.
Adhesive is coated in an array manner by the surface in clad aluminum foil；The clad aluminum for being coated with adhesive by two
Foil stacks fixation in a manner of making adhesive dislocation arrangement, and molding clad aluminum foil is cohered in formation, in stretched, formation honeycomb
The aluminium honeycomb core of shape.
Next it can select to carry out degumming process to aluminium honeycomb core, the specific steps of degumming include：By the bee after stretching
Nest shape is put into continous way nitrogen protection stove, and waste gas recovering device, in-furnace temperature are arranged in stove：300-450 DEG C, protective atmosphere is
Nitrogen is 1.2 ms/min with speed and runs 5-80 minutes, it is preferable that run time is 10-20 minutes, after colloid volatilization cracking
It is removed from cooling system, core is removed when reaching predetermined temperature, at this point, core can keep firm connection status, be not necessarily to
It installs additional and fixes again.
Degumming tech is primarily to ensure that the honeycomb structure of aluminium honeycomb core can realize good weldering with clad aluminium
Effect is connect, and removes the smell of colloid cracking generation in advance by degumming, prevents colloid cracking volatilization sooting in welding process
Core, cellular board is beautiful securely after soldering.
After carrying out degumming process by cellular aluminium honeycomb core, the aluminium honeycomb core after degumming process and embryo can be selected
Brazing flux is sprayed on the surface with solder of plate.When spraying brazing flux, powdery or liquid brazing flux need to be sprayed onto cellular and clad aluminium
Solder layer it is upper.In this example, preferably by potassium aluminum fluoride flux as brazing flux.
In this example, aluminium honeycomb core is fixed between two blocks of embryonic plates and forms layer structure.In the prior art, obtain by
Aluminium honeycomb core can be carried out being brazed after being placed in the layer structure formed between two blocks of embryonic plates, still, due to the mistake in soldering
Cheng Zhong is to be carried out under nitrogen protection environment, while brazing temperature is higher, leads to the deformation of the layer structure, to influence most
Whole soldering final product quality reduces yield.Therefore, in the present solution, increasing the process that is loaded together before the brazing.Utilize such as Fig. 6
Shown in plate body assembly device aluminium honeycomb core and embryonic plate are assembled.Aluminium honeycomb core and upper and lower composite panel are consolidated with fixture
It is scheduled on tooling platform 1, ensures average force in 0.1-0.3bar after the compression of pressure head 23 of hold-down mechanism 2.In the present solution, being loaded
The specific steps are：
As shown in Figure 6 and shown in Fig. 8, tooling platform 1 will be first penetrated, the swivel nut 21 of hold-down mechanism 2 as shown in Figure 7 is passed through
On screw thread tentatively fastened with tooling, then the layer structure formed between two blocks of embryonic plates is placed in by aluminium honeycomb core by sprayed brazing flux
It assembles and is put into tooling platform 1, then fixation clip is slowly pressed on cellular board.4 bolts 22 for back-outing hold-down mechanism 2, make
The pressure head 23 for obtaining hold-down mechanism 2 is acted on by the heat safe holddown spring 24 of hold-down mechanism 2 on mold plate.Use die nut
The gland nut 21 of hold-down mechanism is turned, gland nut 21 is fastened with tooling so that holddown spring shrinks the work for generating bigger at this time
It firmly acts on mold plate 3.
The layer structure formed between two blocks of embryonic plates is placed in by aluminium honeycomb core to molding assembly and carries out soldering processing.This reality
In example, the specific steps of soldering include：The layer structure being made of aluminium honeycomb core and two blocks of embryonic plates assembled, which is placed in, to be had
In the soldering oven of nitrogen, the soldering oven is intermittent or continous way inert atmosphere soldering oven, and brazing temperature is 600 DEG C to 650
DEG C degree Celsius, it is preferable that brazing temperature control at 615 DEG C to 640 DEG C.The soldering furnace cooling mode uses inert gas air-cooled,
Cooling section is 640 DEG C to 250 DEG C.
By final cooling, takes out and be used to support or the cellular board of load-bearing from cooling zone.
As shown in Figure 9 and Figure 10, the soldering cellular board manufacturing process under respectively single adhesive tape and double adhesive tape coating methods.
This programme is described further below by one group of example：
This programme designs a kind of manufacturing method of soldering cellular board, specific steps are as follows：
1)：Clad aluminum foil, clad aluminium surface preparation, remove oxide film dissolving and greasy dirt；
The clad aluminum foil is two-sided compound, and thickness is 0.08 to 0.6 millimeter, and inner layer is 3 line aluminium alloys, solder layer 4
Line aluminium alloy, it is compound than being 8%-12%.The clad aluminium is that single side is compound, and thickness is 1.0 millimeters to 5 millimeters, solder layer
It is compound than being 8%-12% for 4 line aluminium alloys.The alkaline aqueous solution of deoxidation film and greasy dirt tertiary sodium phosphate cleans plus a little table
Face activating agent.
2)：Clad aluminum foil enters glue spreader, is coated according to certain spacing；
The glue is resinae, and hot pressing temperature 150 to 200 is spent, and resinae glue is in 250 to 450 degree drying cracking volatilizations, institute
It is two-sided compound to state clad aluminum foil, and thickness is 0.08 to 0.6 millimeter, and inner layer is 3 line aluminium alloys, and solder layer is 4 line aluminium alloys, multiple
Composition and division in a proportion is 8%-12%.
3)：By the aluminium foil stacked offset of gluing；
4)：The aluminium foil of heap poststack is placed on hot press and carries out hot pressing, and temperature is 150 DEG C -200 DEG C；
5)：It is cut according to cellular thickness after hot pressing；
6)：Cut post-tensioning be stretched into it is cellular
After stretching it is cellular be hexagon, the length of side be 3 to 35 millimeters.
7)：Powdery or liquid brazing flux are sprayed onto cellular and had on the clad aluminium in face of solder；
The brazing flux is potassium aluminum fluoride flux.
8)：It is fixed cellular with upper and lower clad aluminium that is having sprayed brazing flux face with fixture；
9)：Drying.
The resinae glue is in 250 to 450 degree drying cracking volatilizations.
10)：The aluminum honeycomb panel clamped is sent and is welded into stove by furnace brazing；
The soldering oven is intermittent or continous way inert atmosphere soldering oven, and temperature is 615 to 640 degree.
11)：It is cooling
It is 640 to 250 degree that the type of cooling of the soldering cellular board, which uses inert gas air-cooled, cooling section,.
Cellular board made of scheme described in this programme can ensure between honeycomb core, between honeycomb core and aluminium sheet be metallurgical junction
It closes, overcomes adhesive adhesive strength deficiency easily affected by environment, not by environmental constraints, there is peel strength height, resistance to compression, ring
Protect, many excellent performances such as recyclable, while improving the positioning accuracy of honeycomb core, reduce processing cost, rail traffic,
The fields such as aerospace, ship, building have a extensive future.
It should be understood by those skilled in the art that, embodiments herein can be provided as method, system or computer program
Product.Therefore, complete hardware embodiment, complete software embodiment or reality combining software and hardware aspects can be used in the application
Apply the form of example.Moreover, the application can be used in one or more wherein include computer usable program code computer
The computer program production implemented in usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
The application is with reference to method, the flow of equipment (system) and computer program product according to the embodiment of the present application
Figure and/or block diagram describe.It should be understood that can be realized by computer program instructions every first-class in flowchart and/or the block diagram
The combination of flow and/or box in journey and/or box and flowchart and/or the block diagram.These computer programs can be provided
Instruct the processor of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce
A raw machine so that the instruction executed by computer or the processor of other programmable data processing devices is generated for real
The device for the function of being specified in present one flow of flow chart or one box of multiple flows and/or block diagram or multiple boxes.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that instruction generation stored in the computer readable memory includes referring to
Enable the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one box of block diagram or
The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device so that count
Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, in computer or
The instruction executed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in a box or multiple boxes.
Although the preferred embodiment of the application has been described, created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out the application essence of the various modification and variations without departing from the application
God and range.In this way, if these modifications and variations of the application belong to the range of the application claim and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (21)
1. a kind of manufacturing method of soldering cellular board, which is characterized in that the step of this method includes：
Advance gluing stacking is cohered into the molding clad aluminum foil with solder layer and is drawn into cellular aluminium honeycomb core；
Aluminium honeycomb core is fixed between two blocks of embryonic plates with solder layer and carries out soldering processing, obtains cellular board.
2. manufacturing method according to claim 1, which is characterized in that the embryonic plate uses single-layer or multi-layer clad aluminium；
Or,
Steel plate；Or,
Steel-aluminium composite board.
3. manufacturing method according to claim 1, which is characterized in that described cohere advance gluing stacking molding has
The previous step that the clad aluminum foil of solder layer is drawn into cellular aluminium honeycomb core includes：
Adhesive is coated in an array manner on the surface of clad aluminum foil；
The clad aluminum foil at least two being coated with adhesive stacks fixation in a manner of making adhesive dislocation arrangement, and formation is cohered
Molding clad aluminum foil.
4. manufacturing method according to claim 1, which is characterized in that this method further comprises：In aluminium honeycomb core and embryo
Brazing flux is sprayed on the surface with solder of plate.
5. manufacturing method according to claim 4, which is characterized in that the brazing flux is powdered or liquid state.
6. manufacturing method according to claim 4, which is characterized in that the brazing flux uses potassium aluminum fluoride flux.
7. manufacturing method according to claim 4, which is characterized in that it is described the surface of clad aluminum foil in an array manner
Coating adhesive previous step include：The dirt of clad aluminum foil and embryonic plate surface is pre-processed.
8. manufacturing method according to claim 7, which is characterized in that the pretreatment is the alkaline water using tertiary sodium phosphate
Solution removes the dirt on the clad aluminum foil and embryonic plate.
9. manufacturing method according to claim 3, which is characterized in that the coating method of adhesive is on the clad aluminum foil
Horizontal array or longitudinal array.
10. manufacturing method according to claim 3, which is characterized in that the adhesive is mixed using epoxy, phenolic aldehyde, rubber
The adhesive of conjunction.
11. manufacturing method according to claim 3, which is characterized in that the coating adhesive is using glue spreader to multiple
It closes aluminium foil and carries out adhesive coating processing.
12. manufacturing method according to claim 11, which is characterized in that the coating technique of the adhesive is using single adhesive tape
Or the mode of double adhesive tape coats.
13. manufacturing method according to claim 3, which is characterized in that the dislocation width of the adhesive dislocation arrangement is small
In or equal to 2 times of adhesive width.
14. manufacturing method according to claim 3, which is characterized in that described that advance gluing stacking is cohered molding tool
There is the latter step that the clad aluminum foil of solder layer is drawn into cellular aluminium honeycomb core to include：It is carried out to cohering molding clad aluminum foil
Hot pressing and slicing treatment.
15. manufacturing method according to claim 3, which is characterized in that described that advance gluing stacking is cohered molding tool
There is the latter step that the clad aluminum foil of solder layer is drawn into cellular aluminium honeycomb core to include：Cellular aluminium honeycomb core is taken off
Glue processing.
16. manufacturing method according to claim 15, which is characterized in that the step of degumming process includes：
Cellular aluminium honeycomb core will be drawn into be placed in nitrogen；
Under conditions of maintaining the temperature at 300 DEG C to 450 DEG C, glue cracking processing is carried out with predetermined time and speed；
Cooling treatment is carried out to cracking treated aluminium honeycomb core, obtains the aluminium honeycomb core after degumming process.
17. manufacturing method according to claim 1, which is characterized in that the aluminium honeycomb core by after degumming process is fixed
At two pieces with solder layer embryonic plate between the step of include：
Between aluminium honeycomb core is placed in two embryonic plates, and it is fixed on tooling platform (1) by frock clamp；
The upper surface gland mold plate (3) of embryonic plate on upper layer；
Mold plate (3) is pressed in the layer structure being made of aluminium honeycomb core and two blocks of embryonic plates by hold-down mechanism (2), is shaped
Layered structure.
18. manufacturing method according to claim 17, which is characterized in that for fixing the aluminium honeycomb core after degumming process
At two pieces with solder layer embryonic plate between assembly device include：Tooling platform (1), hold-down mechanism (2) and mold plate (3)；
The tooling platform (1) is equipped with multiple support portions for being used to support hold-down mechanism (2)；
Two blocks of embryonic plates and aluminium honeycomb core are sequentially placed on tooling platform (1), and mold plate (3) gland is in upper layer embryonic plate
Mold plate (3) is pressed on the embryonic plate of upper layer by surface by hold-down mechanism (2).
19. manufacturing method according to claim 18, which is characterized in that the hold-down mechanism includes：Swivel nut (21), pressure head
(23) and holddown spring (24)；
The holddown spring (24) and pressure head (23) are sequentially placed into the swivel nut (21)；
It is further provided with pin hole on the jacket wall of the swivel nut (21), the pressure head (23) is limited by bolt (22).
20. manufacturing method according to claim 1, which is characterized in that the step of soldering includes：
It is placed in the layer structure formed between two blocks of embryonic plates is placed in by aluminium honeycomb core in nitrogen；
It maintains the temperature between 600 DEG C to 650 DEG C, is carried out to being placed in the layer structure formed between two blocks of embryonic plates by aluminium honeycomb core
Soldering；
Cooling treatment is carried out to the plate body after soldering, obtains cellular board.
21. a kind of utilizing cellular board made of claim 1 the method.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710297666.1A CN108790321A (en) | 2017-04-28 | 2017-04-28 | A kind of manufacturing method and cellular board of soldering cellular board |
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| CN201710297666.1A CN108790321A (en) | 2017-04-28 | 2017-04-28 | A kind of manufacturing method and cellular board of soldering cellular board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108788356A (en) * | 2017-04-28 | 2018-11-13 | 中车唐山机车车辆有限公司 | A kind of manufacturing method and cellular board of soldering cellular board |
| CN109605859A (en) * | 2018-12-28 | 2019-04-12 | 江苏龙禾轻型材料有限公司 | A kind of honeycomb core, cellular board and honeycomb core production method |
| CN115257128A (en) * | 2022-07-15 | 2022-11-01 | 南京工程学院 | Fiber-reinforced thermoplastic resin-based honeycomb core manufacturing device and method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108788356A (en) * | 2017-04-28 | 2018-11-13 | 中车唐山机车车辆有限公司 | A kind of manufacturing method and cellular board of soldering cellular board |
| CN109605859A (en) * | 2018-12-28 | 2019-04-12 | 江苏龙禾轻型材料有限公司 | A kind of honeycomb core, cellular board and honeycomb core production method |
| CN115257128A (en) * | 2022-07-15 | 2022-11-01 | 南京工程学院 | Fiber-reinforced thermoplastic resin-based honeycomb core manufacturing device and method |
| CN115257128B (en) * | 2022-07-15 | 2024-03-26 | 南京工程学院 | Device and method for manufacturing fiber reinforced thermoplastic resin matrix honeycomb core |
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Application publication date: 20181113 |