CN108789989A - The integrated molding preparation process of copper alloy and phenoplasts - Google Patents
The integrated molding preparation process of copper alloy and phenoplasts Download PDFInfo
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- CN108789989A CN108789989A CN201810570258.3A CN201810570258A CN108789989A CN 108789989 A CN108789989 A CN 108789989A CN 201810570258 A CN201810570258 A CN 201810570258A CN 108789989 A CN108789989 A CN 108789989A
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- copper alloy
- solution
- alloy substrate
- sulfuric acid
- jig
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/071—Preforms or parisons characterised by their configuration, e.g. geometry, dimensions or physical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/14—Making preforms characterised by structure or composition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2949/00—Indexing scheme relating to blow-moulding
- B29C2949/07—Preforms or parisons characterised by their configuration
- B29C2949/0715—Preforms or parisons characterised by their configuration the preform having one end closed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2061/00—Use of condensation polymers of aldehydes or ketones or derivatives thereof, as moulding material
- B29K2061/04—Phenoplasts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to the integrated molding preparation processes of an Albatra metal and phenoplasts to form several nano-pores, phenoplasts is then injected on nano-pore, keep phenoplasts fully compound with copper alloy substrate in the processing of copper alloy substrate surface micropore.The beneficial effects of the present invention are：Compared with prior art, it is simple for process it is at low cost, be tightly combined durable feature.
Description
Technical field
The present invention relates to materials processing technology fields, more particularly to the integrated molding system of an Albatra metal and phenoplasts
Standby technique.
Background technology
Nanometer forming technique (Nano Molding Technology, NMT), is that metal is combined with plastic cement with nanotechnology
Engineering method, first by metal surface after nanosizing is handled, plastic cement direct injection allows metal can with plastic cement in metal surface
With integrally formed, be not only able to take into account metal appearance texture, the design of product construction part can also be simplified, allow product it is lighter, it is thin,
It is short, small and more cost effective compared with CNC engineering methods.After NMT technologies can remove rust, the grease of thin metal surface, transmission is special
Solution is surface-treated, and therefore metal material has aperture, then metal material is put into mold and carries out injection molding, makes tree
Fat, which enters in aperture, to be cured, and achievees the purpose that strong engagement.Metallic surface is corroded with the means of chemistry or electrochemistry
Go out nano aperture, by selecting special etching liquid, metal surface is made the micro-nano porous structure similar to coral reef shape occur.
Then processed metalwork is put into mold, Inset ejection molding is carried out, directly by plastic cement component injection to metal
Surface simultaneously solidifies, and by the mechanical locking action of micro-nano porous structure, plastic cement and metal surface are bound tightly together.
Finally, all modifications in metal surface can be carried out by the moulding taken out in mould to process, such micro-nano is passed through in metal surface
The bonding process of metal and plastic cement is omitted, it can be achieved that the plane of metal and plastic cement bonding in rice processing.
However, the gap that current technique plastic cement and metal combine is bigger, although micron order, for some precisions
It is for part and fatal.
Invention content
The present invention be directed to many defects present in background technology, solve by following technical solution.
The present invention provides the integrated molding preparation process of an Albatra metal and phenoplasts, micro- in copper alloy surface first
Hole is handled, and forms several nano-pores, phenoplasts are injected on nano-pore, technique includes：
Feeding presses to copper alloy substrate above mold by jig；
It feeds intake, bakelite powder cake is launched and is put among mold into mold, again by the jig plate equipped with copper alloy substrate
Position；
Compression molding opens board, extrusion die and jig, bakelite powder cake is made fully to be combined with copper alloy substrate；
Jig is taken out, after extrusion forming, takes out jig；
The jig taken out out of mold is put on blanking pressing machine and squeezes out the good copper alloy substrate of die casting by blanking.
Wherein, in compression molding, mould temperature is 150 DEG C -160 DEG C, mold pressure force 20MPa-25MPa, mold pressing week
Phase is -250 seconds 240 seconds.
Preferably, the material of the copper alloy substrate is yellow gold or red copper.The composition of the bakelite powder cake is phenol
Urea formaldehyde, phenolic resin include PG8652, the models such as PM6430 PM6830CN6850 PG6552 WH6551 PM6545.
Before stating technique on the implementation, first in copper alloy substrate surface micropore processing method, including following processing step：
Step 1 starts the cleaning processing aluminium alloy base plate surface with cleaning solution；
Step 2, using stainless steel as anode, copper alloy substrate be cathode in lye electrolysis handle；
Step 3 pre-processes in the acid solution containing sulfuric acid；
Step 4, using graphite cake as cathode, copper alloy is put into the electricity containing sulfuric acid, copper sulphate and corrosion inhibiter as anode
The anodic etching method is carried out in solution liquid, copper alloy substrate surface corrosion is made to form nano-pore.
Further, be in the step A cleaning, specifically, by copper alloy substrate surface mass concentration be 45~
It is impregnated 5-8 minutes in the degreasing agent solution of the sodium phosphate of 55g/L, sodium carbonate and sodium pyrophosphate mixed solution, 50-60 DEG C of temperature.
Further, it is electrolysis processing in the step B, in NAOH solution, leads to constant current, 0.5A/cm2, temperature
30-50℃。
Further, the step C preprocess methods, copper alloy substrate is put into the sulfuric acid solution, a concentration of 50-
100g/L, time 1-2 minute, 20-30 DEG C of temperature.
Further, the step D, electrochemical corrosion processing, the sulfuric acid concentration are 50-100g/L, copper sulphate 10-
20g/L, corrosion inhibiter are in the solution of sodium stannate 1-5ml/L, and it is 0.3~0.6A/cm2 to be passed through current density.Temperature controls 30-60
℃。
Compared with existing processing method, copper alloy and plastic cement perfect adaptation to be realized, a basic step is in copper alloy base
Nano-pore is carried out on plate, then be molded completion combine, the beneficial effects of the present invention are, compared with prior art, it is simple for process at
Sheet is low, is tightly combined durable feature.
Specific implementation mode
Below in conjunction with the embodiment of the present invention, technical scheme of the present invention is clearly and completely described, it is clear that institute
The embodiment of description is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention,
Every other embodiment obtained by those of ordinary skill in the art without making creative efforts, belongs to this hair
The range of bright protection.
The technique of the embodiment of the present invention one is divided into two parts, is forming several nano-pores on copper alloy substrate surface first,
The unlimited shape of copper alloy substrate, is usually first processed into the semi-finished shape of product, then is processed.
First, in copper alloy substrate surface micropore processing method, include the following steps：
Step 1 starts the cleaning processing copper alloy surface with cleaning solution.
By copper alloy surface in sodium phosphate, sodium carbonate and the sodium pyrophosphate mixed solution that mass concentration is 45~55g/L
It is impregnated 5-8 minutes in degreasing agent solution, 50-60 DEG C of temperature.Mixed solution can make copper surface form one layer of sticky film, be conducive to
Electrolysis effectiveness is improved, keeps copper alloy surface smooth, finish is promoted.
Step 2, using stainless steel as anode, copper alloy be cathode in lye electrolysis handle.
In the step B, lye is a kind of NAOH (sodium hydroxide) solution, in solution by constant current be 0.5A/
Cm2,30-50 DEG C of solution temperature.The grease and dirt of copper alloy surface can be effectively removed.
Step 3 pre-processes in the acid solution containing sulfuric acid.
Copper alloy is put into the sulfuric acid solution, a concentration of 50-100g/L, time 1-2 minute, 20-30 DEG C of temperature, is located
The sticky film of surface of workpiece is further removed after reason.
Step 4, using graphite cake as cathode, copper alloy is put into the electricity containing sulfuric acid, copper sulphate and corrosion inhibiter as anode
The anodic etching method is carried out in solution liquid, copper alloy surface is made to corrode to form nano-pore.
Above-mentioned steps are that electrochemical corrosion is handled, sulfuric acid concentration 50-100g/L, copper sulphate 10-20g/L, and corrosion inhibiter is
In the solution of sodium stannate 1-5ml/L, it is 0.3~0.6A/cm2 to be passed through current density, and temperature controls 30-60 DEG C, is received by being formed
Metre hole can perform the injection molding operation of next step, plastics and metal in close combined.
Embodiment one：
In step 1, copper alloy surface is started the cleaning processing with cleaning solution.It is in mass concentration by copper alloy surface
It is impregnated 8 minutes in the degreasing agent solution of the sodium phosphate of 45g/L, sodium carbonate and sodium pyrophosphate mixed solution, temperature is controlled at 50 DEG C,
Using the mixed solution of above-mentioned concentration, and up to immersion in 8 minutes, surface can be made to aoxidize as early as possible, form one layer of sticky film.
In step 2, using stainless steel as anode, copper alloy is that cathode electrolysis in sodium hydroxide solution is handled, in solution
By constant current be 0.5A/cm2,30 DEG C of solution temperature, the sticky film formed in step 1 keeps electrolysis effectiveness more preferable, was electrolysed
Cheng Zhong, makes some impurity in copper alloy precipitate into surface, these impurity are removed by buck.
It in step 3, is pre-processed in the acid solution containing sulfuric acid, copper alloy is put into sulfuric acid solution, a concentration of 50/L, when
Between 2 minutes, 20 DEG C of temperature further removes the sticky film of surface of workpiece after processing, can enter nano-pore corrosion process.
In step 4, using graphite cake as cathode, copper alloy is put into as anode containing sulfuric acid, copper sulphate and corrosion inhibiter
The anodic etching method is carried out in electrolyte, copper alloy surface is made to corrode to form nano-pore, wherein sulfuric acid concentration 50/L, sulphur
Sour copper 10/L, corrosion inhibiter are in the solution of sodium stannate 1ml/L, and it is 0.3/cm2 to be passed through current density, and temperature controls 30 DEG C, passes through
Nano-pore is formed, processing procedure under this environment can perform the injection molding operation of next step, plastics and metal are combined.
Embodiment two：
In step 1, copper alloy surface is started the cleaning processing with cleaning solution.It is in mass concentration by copper alloy surface
It is impregnated 5 minutes in the degreasing agent solution of the sodium phosphate of 55g/L, sodium carbonate and sodium pyrophosphate mixed solution, temperature is controlled at 60 DEG C,
Using the mixed solution of above-mentioned concentration, and up to immersion in 8 minutes, surface can be made to aoxidize as early as possible, form one layer of sticky film.
In step 2, using stainless steel as anode, copper alloy is that cathode electrolysis in sodium hydroxide solution is handled, in solution
By constant current be 0.5A/cm2,50 DEG C of solution temperature, the sticky film formed in step 1 keeps electrolysis effectiveness more preferable, was electrolysed
Cheng Zhong, makes some impurity in copper alloy precipitate into surface, these impurity are removed by buck.
It in step 3, is pre-processed in the acid solution containing sulfuric acid, copper alloy is put into sulfuric acid solution, a concentration of 100/L,
1 minute time, 30 DEG C of temperature further remove the sticky film of surface of workpiece after processing, can enter nano-pore corrosion process.
In step 4, using graphite cake as cathode, copper alloy is put into as anode containing sulfuric acid, copper sulphate and corrosion inhibiter
The anodic etching method is carried out in electrolyte, so that copper alloy substrate surface corrosion is formed nano-pore, wherein sulfuric acid concentration 100/
L, copper sulphate 20/L, corrosion inhibiter are in the solution of sodium stannate 5ml/L, and it is 0.6/cm2 to be passed through current density, and temperature controls 60 DEG C,
By forming nano-pore, processing procedure under this environment can perform the injection molding operation of next step, and plastics and metal are combined one
It rises.
Execute first technique by above-described embodiment, by surface be covered with the copper alloy substrate of nano-pore and phenoplasts into
Row combines, and phenoplasts are injected on nano-pore, by taking yellow gold as an example, are realized by following technique：
Feeding presses to yellow gold substrate above mold by jig；
It feeds intake, the bakelite powder cake containing phenolic resin is launched into mold, such as PG8652, yellow gold will be housed again
The jig plate of substrate is put into position among mold；
Board, extrusion die and jig are opened in compression molding, and control mould temperature is 150 DEG C, and pressure force 20MPa makes phenolic moulding powder
Material cake is fully combined with copper alloy substrate, and bonding cycle was controlled at 250 seconds；
Jig is taken out, after extrusion forming, takes out jig；
The jig taken out out of mold is put on blanking pressing machine and squeezes out the good yellow gold substrate of die casting by blanking.
In copper alloy substrate and phenoplasts compound stage, compared with method in the prior art, the application is simple for process,
Entire technical process is at low cost, and the compound stage is not catalyzed by chemistry with agent, more environmentally friendly.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (9)
1. the integrated molding preparation process of copper alloy and phenoplasts is formed several first in the processing of copper alloy surface micropore
Nano-pore, which is characterized in that phenoplasts are injected on nano-pore, technique includes：
Feeding presses to copper alloy substrate above mold by jig；
It feeds intake, bakelite powder cake is launched and is put into position among mold into mold, again by the jig plate equipped with copper alloy substrate；
Compression molding opens board, extrusion die and jig, bakelite powder cake is made fully to be combined with copper alloy substrate；
Jig is taken out, after extrusion forming, takes out jig；
The jig taken out out of mold is put on blanking pressing machine and squeezes out the good copper alloy substrate of die casting by blanking.
2. technique according to claim 1, which is characterized in that in compression molding, mould temperature is 150 DEG C -160 DEG C, mold
Pressure force 20MPa-25MPa, mold bonding cycle are -250 seconds 240 seconds.
3. technique according to claim 1, which is characterized in that the material of the copper alloy substrate is yellow gold or purple
Copper.
4. technique according to claim 1, which is characterized in that the composition of bakelite powder cake is phenolic resin.
5. in preparation process according to claim 1, first in the processing of copper alloy substrate surface micropore, forming several nanometers
Hole, the method for forming nano-pore include following processing step：
Step 1 starts the cleaning processing copper alloy substrate surface with cleaning solution；
Step 2, using stainless steel as anode, copper alloy substrate be cathode in lye electrolysis handle；
Copper alloy substrate is placed in the acid solution containing sulfuric acid and pre-processes by step 3；
Step 4, using graphite cake as cathode, copper alloy is put into the electrolyte containing sulfuric acid, copper sulphate and corrosion inhibiter as anode
Middle carry out the anodic etching method makes copper alloy substrate surface corrosion form nano-pore.
6. according to the method described in claim 5, it is characterized in that, in the step A, cleaning step is specially by copper alloy base
Plate surface is placed in the degreasing agent solution that mass concentration is the sodium phosphate of 45~55g/L, sodium carbonate and sodium pyrophosphate mixed solution
Middle immersion 5-8 minutes, solution temperature are 50-60 DEG C.
7. according to the method described in claim 5, it is characterized in that, in the step B, lye is a kind of NAOH solution, solution
In by constant current be 0.5A/cm2,30-50 DEG C of solution temperature.
8. according to the method described in claim 5, it is characterized in that, in the step C, copper alloy substrate is put into the sulfuric acid
In solution, solution concentration 50-100g/L, standing time is 1-2 minutes, and the temperature of sulfuric acid solution is 20-30 DEG C.
9. according to the method described in claim 5, it is characterized in that, the sulfuric acid concentration of the sulfuric acid solution be 50-100g/L, sulphur
Sour copper 10-20g/L, corrosion inhibiter are sodium stannate 1-5ml/L, and it is 0.3~0.6A/cm2, solution temperature that when electrolysis, which is passed through current density,
Degree control is at 30-60 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810570258.3A CN108789989A (en) | 2018-06-05 | 2018-06-05 | The integrated molding preparation process of copper alloy and phenoplasts |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810570258.3A CN108789989A (en) | 2018-06-05 | 2018-06-05 | The integrated molding preparation process of copper alloy and phenoplasts |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113684510A (en) * | 2021-08-16 | 2021-11-23 | 深圳市纳明特科技发展有限公司 | T treatment method for copper metal surface |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101708643A (en) * | 2009-10-29 | 2010-05-19 | 陕西秦航机电有限责任公司 | Bonding technique of phenolic plastic powder with metal inserts in forming process |
| CN108000795A (en) * | 2017-12-03 | 2018-05-08 | 无锡市恒利弘实业有限公司 | A kind of preparation method and application of composite material for nanometer injection molding |
-
2018
- 2018-06-05 CN CN201810570258.3A patent/CN108789989A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101708643A (en) * | 2009-10-29 | 2010-05-19 | 陕西秦航机电有限责任公司 | Bonding technique of phenolic plastic powder with metal inserts in forming process |
| CN108000795A (en) * | 2017-12-03 | 2018-05-08 | 无锡市恒利弘实业有限公司 | A kind of preparation method and application of composite material for nanometer injection molding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113684510A (en) * | 2021-08-16 | 2021-11-23 | 深圳市纳明特科技发展有限公司 | T treatment method for copper metal surface |
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