CN108778694A - The ultrasonic deposition device and ultrasonic deposition method of different materials flooring material - Google Patents
The ultrasonic deposition device and ultrasonic deposition method of different materials flooring material Download PDFInfo
- Publication number
- CN108778694A CN108778694A CN201680083521.5A CN201680083521A CN108778694A CN 108778694 A CN108778694 A CN 108778694A CN 201680083521 A CN201680083521 A CN 201680083521A CN 108778694 A CN108778694 A CN 108778694A
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- CN
- China
- Prior art keywords
- multiple deposition
- deposition object
- ultrasonic
- object objects
- different materials
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
Abstract
The present invention provides the ultrasonic deposition device and ultrasonic deposition method of different materials flooring material.The ultrasonic deposition device of different materials flooring material is used to manufacture flooring material, including anvil and soldering tip by making the multiple deposition object objects formed by different materials engagement.Anvil is used to support multiple deposition object objects, and transfers multiple deposition object objects to a direction.Soldering tip pressurizes to the multiple deposition object objects for being placed on anvil, and by applying ultrasonic activation to deposition object object, to make multiple deposition object objects engage.Also, the ultrasonic deposition method of different materials flooring material includes the steps that preparing multiple deposition object objects, the step of placing multiple deposition object objects on anvil and by applying ultrasonic activation come the step of making multiple deposition object objects engage.In the step of preparing multiple deposition object objects, prepare the multiple deposition object objects formed by different materials.In the step of placing multiple deposition object objects on anvil, multiple deposition object objects are placed on the anvil of rotation driving.It in by applying ultrasonic activation come the step of making multiple deposition object objects engage, pressurizes to the multiple deposition object objects being placed on anvil, and so that multiple deposition object objects is engaged by applying ultrasonic activation to multiple deposition object objects.
Description
Technical field
The present invention relates to for manufacturing flooring material by engaging the multiple deposition object objects formed by different materials
The ultrasonic deposition device (Ultrasonic deposition device) of different materials flooring material and ultrasonic deposition side
Method.
Background technology
In general, in the case of the flooring material that engagement is formed by different materials, in upper member and lower member
A kind of component is engaged after smearing binder, but this mode exists environmental pollution occurs according to the use of binder simultaneously
And bonding part also rough problem.
To solve this problem, the technology for making different materials flooring material engage using heat and pressure is developed, and
Without using binder.More specifically, after placing upper member and lower member on the plate for applying heat, by applying heat and pressure
Power manufactures different materials flooring material.
But this position that there is engagement may detach with the passing of time, and moisture or foreign matter inflow have divided
From part inside problem.Also, apply heat when only being concentrated in upside and downside come when engaging, there are flooring materials
Rough problem.
Invention content
The technical problem to be solved in the present invention
It is engageable in the case where not damaging different materials flooring material the purpose of the present invention is to provide a kind of improve
Different materials flooring material ultrasonic deposition device and ultrasonic deposition method.
Technical solution
To achieve the goals above, the ultrasonic deposition device of different materials flooring material of the invention is by engaging by not
Flooring material is manufactured with multiple deposition object objects of material formation, and includes anvil (Anvil) and soldering tip (Horn).Anvil is used
Multiple deposition object objects are transferred in the multiple deposition object objects of support, and to a direction.Soldering tip is to being placed on multiple depositions of anvil
Object pressurizes, and so that above-mentioned multiple deposition object objects is connect by applying ultrasonic activation to multiple deposition object objects
It closes.
Also, the ultrasonic deposition method of different materials flooring material include the steps that prepare multiple deposition object objects,
The step of multiple deposition object objects are placed on anvil and the step for making multiple deposition object object engagements by applying ultrasonic activation
Suddenly.In the step of preparing multiple deposition object objects, prepare the multiple deposition object objects formed by different materials.It is put on anvil
In the step of setting multiple deposition object objects, multiple deposition object objects are placed on the anvil of rotation driving.By applying ultrasound
Wave vibrated in the step of to make multiple deposition object objects engage, and pressurizeed to the multiple deposition object objects being placed on anvil,
And multiple deposition object objects are made to engage by applying ultrasonic activation to multiple deposition object objects.
Advantageous effect
In the present invention, using ultrasonic bonding multiple deposition object objects, therefore can be in the case of no binder
Engage multiple deposition object objects.As a result, even across the time, the position also engaged will not detach, therefore can wholesomely use.
Also, be not after configuring multiple deposition object objects between the plate heated as existing, crimped and engaged, and
It is to engage by frictional heat multiple deposition object objects by ultrasonic activation, it thus when engaged, can smooth landform
At the surface of multiple deposition object objects.
Also, form anvil and soldering tip in a manner of rotating and drive, therefore even if not additional transfer unit, it can also
It deposits and transfers multiple deposition object objects.
Description of the drawings
Fig. 1 is the side view of the structure of the ultrasonic deposition device for the different materials flooring material for showing one embodiment of the invention
Figure.
Fig. 2 is the side view for another embodiment for showing soldering tip in Fig. 1.
Fig. 3 is the mistake for the ultrasonic deposition method for showing the different materials flooring material for illustrating one embodiment of the invention
The block diagram of journey.
Specific implementation mode
Hereinafter, with reference to attached drawing, the ultrasonic deposition device of the different materials flooring material of preferred embodiment is described in detail
And ultrasonic deposition method is then as follows.Wherein, to identical structure use identical reference numeral, and omit to repeated explanation,
The detailed description of the known function and structure of the gist of the invention can unnecessarily be obscured.Embodiments of the present invention be in order to
Those skilled in the art are more fully described below and provide.Therefore, in order to definitely illustrate to exaggerate
The form and dimension etc. of multiple elements in attached drawing.
Fig. 1 is the side of the structure of the ultrasonic deposition device for the different materials flooring material for showing one embodiment of the invention
View.
As shown in Figure 1, the ultrasonic deposition device 100 of different materials flooring material is used for through engagement by different materials shape
At multiple deposition object objects 10 manufacture flooring material, including anvil 110 and soldering tip 120.
Anvil 110 is used to support deposition object object 10, and transfers multiple deposition object objects 10 to a direction.More specifically,
Anvil 110 can be by being formed with rotating the roller that type of drive is formed.Like this, due to anvil 110 by rotate drive in a manner of shape
At therefore, not additional transfer means multiple deposition object objects 10 can depositing and transfer deposition object object 10.
Soldering tip 120 applies multiple deposition object objects 10 for pressurizeing to the deposition object object 10 for being placed on anvil 110
Add ultrasonic activation to make multiple deposition object objects 10 engage.More specifically, soldering tip 120 can be moved vertically, it can be right
Deposition object object 10 applies the ultrasonic activation of 16kHz~1GHz sizes.This is because if the size of ultrasonic activation is less than
16kHz, then the cohesive force of multiple deposition object objects 10 can decline, if more than 1GHz, then multiple deposition object objects 10 are because of frictional heat
And it is likely to occur deformation.
For this purpose, multiple deposition object objects 10 are crushed between anvil 110 and soldering tip 120, and soften by frictional heat or
At least one of multiple deposition object objects 10 are melted to be engaged.At this time, it is preferable that soldering tip 120 is to deposition object object 10
Apply 0.1kg/m2~20kg/m2The pressure of size.This is because if the size of pressure is less than 0.1kg/m2, then it is multiple deposition pair
As the cohesive force of object 10 is possible to decline, if more than 20kg/m2, then multiple deposition object objects 10 be possible to deform.
Soldering tip 120 is identical as anvil 110, can be by being formed with rotating the roller that type of drive is formed.To in soldering tip
In the case of configuring deposition object object 10 between 120 and anvil 110, soldering tip 120 pressurizes deposition object object 10 and can be with anvil 110
Transfer deposition object object 10 together.
On the other hand, multiple protrusions 121 are configured as shown in Fig. 2, can be spaced one from the pressurized plane of soldering tip 120.Like this,
It can be in deposition object when ultrasonic bonding due to being spaced one from the multiple protrusions 121 of configuration in the pressurized plane of soldering tip 120
The one side of object 10 forms the pattern of concaveconvex shape.Wherein, the size and shape for being formed in the protrusion 121 of soldering tip 120 can be according to more
The thickness and material of a deposition object object 10 are diversely deformed, it is preferred that hemispherical shape.This is because working as soldering tip
120 carry out rotation driving when so that protrusion 121 can be easily disengaged from deposition object object 10.
Fig. 3 is the process of the ultrasonic deposition method of the different materials flooring material for illustrating one embodiment of the invention
Block diagram.
As shown in figure 3, the ultrasonic deposition method 200 of different materials flooring material includes preparing multiple deposition object objects
Step 210, the step 220 that multiple deposition object objects are placed on anvil and by apply ultrasonic activation come make it is multiple deposition pair
The step 230 engaged as object.
In the step 210 for preparing multiple deposition object objects, prepare the multiple deposition object objects 10 formed by different materials.Its
In, multiple deposition object objects 10 can be selected from glass fibre, polyvinyl chloride (PVC：Polyvinyl Chloride), polyolefin
(Polyolefin), polyethylene (PE：Polyethylene), polyethylene terephthalate (PET：Polyethylene
Terephthalate), polyethylene terephthalate (PETG：Polyethylene terephthalate glycol),
Acronitrile-butadiene-styrene (ABS：Acrylonitrile butadiene styrene), makrolon (PC：
Polycarbonate), styrene acrylonitrile copolymer (SAN：Styrene acrylonitrile copolymers), poly- first
Base methyl acrylate (PMMA：Polymethylmethacrylate), polyacrylate (Polyacrylate), polystyrene
(Polystyrene), two or more in nylon (Nylon).
For example, it is also possible to which it is saturating to stack gradually glass fiber sheets, polyvinyl chloride white tiles, polyvinyl chloride on polyvinyl chloride base material
Ultrasonic deposition is carried out after bright film, and glass fiber sheets can also be stacked gradually on polyvinyl chloride base material, polyvinyl chloride white tiles, are gathered
After ethylene hyaline membrane, ultrasonic deposition is carried out.Furthermore, it is also possible to stack gradually glass fiber sheets on polyvinyl chloride base material, gather
After ethylene white tiles, polyethylene hyaline membrane, ultrasonic deposition is carried out, polyethylene hyaline membrane can also be folded on polyethylene base material upper layer
Afterwards, ultrasonic deposition is carried out.That is, not limiting the quantity and allocation position of multiple deposition object objects 10, you can according to implementation personnel
Needs and it is different.
In the step 220 for placing multiple deposition object objects on anvil, it is multiple heavy to be placed on the anvil 110 of rotation driving
Product object 10.More specifically, anvil 110 can be formed by the roller being connected with rotary actuator.Like this, to rotate driving
Mode form anvil 110, deposited not additional transfer means and transfer multiple deposition object objects 10.
On the other hand, it is preferable that multiple deposition object objects 10 were transferred with 1~400m/ minutes speed, if this is because
The screen of multiple deposition object objects 10 was less than 1m/ minutes, then multiple deposition object objects 10 are likely to occur because of frictional heat
Deformation, if the screen of multiple deposition object objects 10 is more than 400m/ minutes, the cohesive force of multiple deposition object objects 10 has can
It can decline.
In the step 230 for applying ultrasonic activation to make multiple deposition object object engagements, by being placed on anvil 110
Multiple deposition object objects 10 pressurize, and to multiple deposition object objects 10 apply ultrasonic activation, come make it is multiple deposition pair
As object 10 engages.At this point, multiple deposition object objects 10 can be pressurizeed and be engaged by rotating the soldering tip 120 of driving.Like this, with
The mode of rotation driving forms soldering tip 120, therefore the feelings of multiple deposition object objects 10 are configured between soldering tip 120 and anvil 110
Under condition, soldering tip 120 pressurizes and multiple deposition object objects 10 and can transfer deposition object object 10 together with anvil 110.
In the step 230 for applying ultrasonic activation to make multiple deposition object object engagements, deposition object object 10 can be applied
The ultrasonic activation of 16kHz~1GHz sizes.Multiple deposition object objects 10 are crushed between anvil 110 and soldering tip 120 as a result,
It is softened or melted at least one of multiple deposition object objects 10 by frictional heat and is engaged.At this point, can be to deposition object
Object 10 applies 0.1~20kg/m2The pressure of size.This is because if pressure size is less than 0.1kg/m2, then multiple deposition objects
The cohesive force of object 10 is possible to decline, if more than 20kg/m2, then multiple deposition object objects 10 be possible to change.
On the other hand, the step 230 of multiple deposition object object engagements is made to may additionally include by applying ultrasonic activation
Multiple deposition object objects 10 form the process of the pattern of concaveconvex shape.For this purpose, configuration can be spaced one from the pressurized plane of soldering tip 120
Multiple protrusions 121.As a result, soldering tip 120 to multiple deposition object objects 10 under pressure, come in multiple deposition objects by pressure
The pattern of concaveconvex shape is formed in object 10.Wherein, the concave-convex size and shape for being formed in multiple deposition object objects 10 can basis
The thickness and material of multiple deposition object objects 10 diversely change, it is preferred that being semi-spherical shape.This is because working as soldering tip
When 120 rotation driving so that protrusion 121 can be easily disengaged from deposition object object 10.
As described above, engage multiple deposition object objects 10 using ultrasonic wave, therefore no binder can also engage
Multiple deposition object objects 10.As a result, even across a period of time, the position also engaged will not detach, therefore can wholesomely use.
Also, it is not after configuring multiple deposition object objects 10 between the plate of heating such as existing, row is crimped and is engaged, and
It is to engage by frictional heat multiple deposition object objects 10 by ultrasonic activation, it thus when engaged, can be smoothly
Form the surface of multiple deposition object objects 10.
Meanwhile forming anvil 110 and soldering tip 120 in a manner of being driven by rotation, therefore even if not additional transfer
Unit can also deposit and transfer multiple deposition object objects 10.
With reference to Fig. 3, illustrate that the ultrasonic deposition method 200 of different materials flooring material is then as follows.
First, prepare selected from glass fibre, polyvinyl chloride, polyolefin, polyethylene, polyethylene terephthalate, poly- pair
Ethylene terephthalate, acronitrile-butadiene-styrene, makrolon, styrene acrylonitrile copolymer, polymethylacrylic acid
Two or more in methyl esters, polyacrylate, polystyrene, nylon are laminated.
Moreover, placing multiple deposition object objects 10 of stacking on the anvil 110 of rotation driving.So, soldering tip 120 with
0.1~20kg/m2The multiple deposition object objects 10 of pressure crimping of size, and apply the ultrasonic activation of 16kHz~1GHz sizes.
For this purpose, multiple deposition object objects 10 are crushed between anvil 110 and soldering tip 120, and soften by frictional heat or
At least one of multiple deposition object objects 10 are melted to be engaged.At this point, in order to be formed in multiple deposition object objects 10
The pattern of concaveconvex shape can also be spaced one from the pressurized plane of soldering tip 120 and configure multiple protrusions 121.
The present invention is illustrated with reference to the embodiment being shown in the accompanying drawings, but this is only illustrated, this technology neck
The those of ordinary skill in domain is appreciated that it is possible thereby to make various deformation and equivalent another embodiment.Therefore, of the invention
Should range only be claimed by appended invention to determine in real protection domain.
Claims (8)
1. a kind of ultrasonic deposition device of different materials flooring material, by engaging the multiple depositions pair formed by different materials
Flooring material is manufactured as object, which is characterized in that including：
Anvil is used to support above-mentioned multiple deposition object objects, and above-mentioned multiple deposition object objects are transferred to a direction；And
Soldering tip, multiple deposition object objects to being placed on above-mentioned anvil pressurize, and by above-mentioned multiple deposition objects
Object applies ultrasonic activation, to make above-mentioned multiple deposition object object engagements.
2. the ultrasonic deposition device of different materials flooring material according to claim 1, which is characterized in that in above-mentioned weldering
The pressurized plane of head is spaced one from configured with multiple protrusions.
3. the ultrasonic deposition device of different materials flooring material according to claim 2, which is characterized in that above-mentioned protrusion
Hemispherical shape.
4. a kind of ultrasonic deposition method of different materials flooring material, which is characterized in that including：
The step of preparing the multiple deposition object objects formed by different materials；
In the step of placing above-mentioned multiple deposition object objects on the anvil for carrying out rotation driving；And
It pressurizes to the multiple deposition object objects being placed on above-mentioned anvil, and by being applied to above-mentioned multiple deposition object objects
Add ultrasonic activation, the step of to make above-mentioned multiple deposition object objects engagement.
5. the ultrasonic deposition method of different materials flooring material according to claim 4, which is characterized in that above by
Apply ultrasonic activation further include the step of so that multiple deposition object objects is engaged formed in above-mentioned multiple deposition object objects it is recessed
The process of the pattern of convex form.
6. the ultrasonic deposition method of different materials flooring material according to claim 4, which is characterized in that above-mentioned logical
In the step of application ultrasonic activation is crossed to make multiple deposition object objects engage, to above-mentioned deposition object object apply 16kHz~
The ultrasonic activation of 1GHz sizes.
7. the ultrasonic deposition method of different materials flooring material according to claim 4, which is characterized in that above-mentioned logical
In the step of application ultrasonic activation is crossed to make multiple deposition object objects engage, 0.1~20kg/ is applied to above-mentioned deposition object object
m2The pressure of size.
8. the ultrasonic deposition method of different materials flooring material according to claim 4, which is characterized in that above-mentioned multiple
Deposition object object is selected from glass fibre, polyvinyl chloride, polyolefin, polyethylene, polyethylene terephthalate, poly terephthalic acid
Glycol ester, acronitrile-butadiene-styrene, makrolon, styrene acrylonitrile copolymer, polymethyl methacrylate, poly- third
It is two or more in olefin(e) acid ester, polystyrene, nylon.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160031295A KR20170108189A (en) | 2016-03-16 | 2016-03-16 | Ultrasonic wave welding device and ultrasonic wave welding method |
| KR10-2016-0031295 | 2016-03-16 | ||
| PCT/KR2016/014416 WO2017159966A1 (en) | 2016-03-16 | 2016-12-09 | Ultrasonic deposition device and ultrasonic deposition method for flooring made of different kinds of materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108778694A true CN108778694A (en) | 2018-11-09 |
Family
ID=59850348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680083521.5A Pending CN108778694A (en) | 2016-03-16 | 2016-12-09 | The ultrasonic deposition device and ultrasonic deposition method of different materials flooring material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019509921A (en) |
| KR (1) | KR20170108189A (en) |
| CN (1) | CN108778694A (en) |
| WO (1) | WO2017159966A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI810746B (en) | 2020-12-17 | 2023-08-01 | 日商花王股份有限公司 | Package and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101137494A (en) * | 2005-01-03 | 2008-03-05 | 3M创新有限公司 | An elastic laminate material, and method of making |
| CN102378675A (en) * | 2009-04-09 | 2012-03-14 | 罗伯特·博世有限公司 | Device for processing a packing material using ultrasound |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036571A (en) * | 1973-08-04 | 1975-04-05 | ||
| JPH06155577A (en) * | 1992-11-27 | 1994-06-03 | Toray Ind Inc | Bonding of antistatic sheet |
| JP3827273B2 (en) * | 1999-12-24 | 2006-09-27 | Ｙｋｋ株式会社 | Ultrasonic bonding method and apparatus |
| JP2004181969A (en) * | 2000-01-25 | 2004-07-02 | Hiraoka & Co Ltd | Thermal fusing method of surface treated sheet |
| JP2003062908A (en) * | 2001-08-28 | 2003-03-05 | Kureha Chem Ind Co Ltd | Ultrasonic horn and ultrasonic welding operation assembly having the same |
| JP3466175B2 (en) * | 2001-12-03 | 2003-11-10 | 三島 大二 | Ultrasonic vibration horn |
| KR100524404B1 (en) * | 2003-06-13 | 2005-11-02 | 주용규 | Fiber formed stuff and the manufacturing method thereof |
| FR2887800B1 (en) * | 2005-07-04 | 2011-02-11 | Eads Ccr Groupement Dinteret Economique | ULTRASONIC ASSEMBLY METHOD OF AT LEAST TWO RIGID PIECES |
| KR101466799B1 (en) * | 2013-12-18 | 2014-11-28 | 안동대학교 산학협력단 | Joining of HTS 2G coated conductor using ultrasonic welding method |
-
2016
- 2016-03-16 KR KR1020160031295A patent/KR20170108189A/en not_active Application Discontinuation
- 2016-12-09 CN CN201680083521.5A patent/CN108778694A/en active Pending
- 2016-12-09 WO PCT/KR2016/014416 patent/WO2017159966A1/en active Application Filing
- 2016-12-09 JP JP2018567552A patent/JP2019509921A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101137494A (en) * | 2005-01-03 | 2008-03-05 | 3M创新有限公司 | An elastic laminate material, and method of making |
| CN102378675A (en) * | 2009-04-09 | 2012-03-14 | 罗伯特·博世有限公司 | Device for processing a packing material using ultrasound |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017159966A1 (en) | 2017-09-21 |
| KR20170108189A (en) | 2017-09-27 |
| JP2019509921A (en) | 2019-04-11 |
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