CN108773022A - The manufacturing method of shell, electronic device and shell - Google Patents
The manufacturing method of shell, electronic device and shell Download PDFInfo
- Publication number
- CN108773022A CN108773022A CN201810560750.2A CN201810560750A CN108773022A CN 108773022 A CN108773022 A CN 108773022A CN 201810560750 A CN201810560750 A CN 201810560750A CN 108773022 A CN108773022 A CN 108773022A
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- CN
- China
- Prior art keywords
- shell
- sidewall portion
- main part
- mainboard
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
- B29C70/34—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Telephone Set Structure (AREA)
Abstract
This application involves the manufacturing methods of a kind of shell, electronic device and shell, the shell includes main part and the side of sidewall portion positioned at main part edge, the main part includes mainboard and the reinforcing plate that is fitted on mainboard inner surface, the side of sidewall portion includes major side wall and the reinforced wall that is fitted on major side wall inner surface, the mainboard and major side wall are transparent configuration, the mainboard, major side wall inner surface be equipped with decorative layer after is combined respectively with reinforcing plate, reinforced wall, the thickness of the thickness of the side of sidewall portion more than the main part.Enhancement layer is set on the inner surface of above-mentioned shell, mainboard and major side wall, increases the drop resistant ability of shell；Decorative layer is set on mainboard and the inner surface of major side wall, and processing is simple, and so that shell is beautiful；The thickness of side of sidewall portion is more than main part, i.e., there are thickness differences between side of sidewall portion and main part so that the three-dimensional sense of shell is strong, promotes the aesthetic feeling and feel of shell.
Description
Technical field
This application involves technical field of electronic device, more particularly to the manufacturer of a kind of shell, electronic device and shell
Method.
Background technology
In order to promote the aesthetic feeling and feel of mobile phone, more and more mobile phones using with the integrally formed glass rear shell of center come
Assemble mobile phone.The current handset shell three-dimensional sense directly obtained by plate glass hot bending is not strong.
Invention content
The technical problem that the application one embodiment solves is how to provide that stereoscopic effect is good, appearance very attractive
Shell and the shell manufacturing method and electronic device with the shell.
A kind of shell, including main part and the side of sidewall portion positioned at main part edge, the main part include mainboard and fitting
Reinforcing plate on mainboard inner surface, the side of sidewall portion include major side wall and the reinforced wall that is fitted on major side wall inner surface, institute
It is transparent configuration to state mainboard and major side wall, the mainboard, major side wall inner surface be equipped with after decorative layer respectively with reinforcing plate plus
Strong wall combines, and the thickness of the side of sidewall portion is more than the thickness of the main part.
Enhancement layer is set on the inner surface of above-mentioned shell, mainboard and major side wall, increases the drop resistant ability of shell；Mainboard and master
Decorative layer is set on the inner surface of side wall, and processing is simple, and so that shell is beautiful；Side of sidewall portion and main part form opening-box,
Display screen, mainboard, battery lamp part in electronic device such as mobile phone are placed in shell, no longer need to that center is separately provided.Side
The thickness of wall portion is more than main part, i.e., there are thickness differences between side of sidewall portion and main part so that the three-dimensional sense of shell is strong, promotes shell
The aesthetic feeling and feel of body.
Include any one following scheme in one of the embodiments,：
The mainboard and major side wall are that epoxy resin is integrally formed component；
The reinforcing plate and reinforced wall are infiltrated the integral member obtained by epoxy resin cure, and the reinforcing plate by fiber cloth
It is identical with the thickness of reinforced wall.
The decorative layer is arranged by way of vapor deposition, spraying or printing in mainboard and master in one of the embodiments,
On the inner surface of side wall.
The decorative layer is combined fixation between reinforcing plate, reinforced wall by adhesive in one of the embodiments,.
In one of the embodiments, the main part and side of sidewall portion vertically or in obtuse angle, between main part and side of sidewall portion
It seamlessly transits.
In one of the embodiments, main part be tablet or arc-shaped curved surface plate, and/or, the side of sidewall portion be tablet or
Curved slab.
The thickness of the side of sidewall portion is uniform in one of the embodiments, alternatively, the side of sidewall portion is in uneven thickness,
And thickness is gradually increased by the direction far from plate.
The side of sidewall portion is the frame-shaped construction for enclosing the edge for setting main part in one of the embodiments, alternatively, the side
Wall portion is to be symmetricly set on the strip structure at main part edge.
The thickness of the main part is 0.6mm~1.0mm in one of the embodiments, and/or, the side of sidewall portion
Thickness is 1.5mm~3.5mm.
A kind of electronic device, the electronic device include display screen component and shell, the display screen component and shell
Side of sidewall portion sets the main part with closing lid and side of sidewall portion encloses the space set.
The rear shell of above-mentioned electronic device is the shell, and the display screen component, which connect and covered with shell, sets the interior of shell
Chamber, the shell substitution back shroud and center so that the structure of electronic device is simple and is easily assembled.
A kind of manufacturing method of shell, includes the following steps：
Step a obtains mainboard and the integral structure of major side wall using the transparent polymer material of melting by injection molding；
Step b cures strengthened plate and reinforced wall using fiber cloth infiltration transparent polymer material；
Decorative layer is arranged on mainboard and the inner surface of major side wall in step c；
Step d, reinforcing plate and the mainboard equipped with decorative layer are combined together to form main part, reinforced wall and are equipped with decorative layer
Major side wall be combined together to form side of sidewall portion, main part and side of sidewall portion form shell together, wherein the thickness of side of sidewall portion is more than
The thickness of main part.
The manufacturing method of above-mentioned shell, by the inner surface of mainboard, major side wall be arranged decorative layer after with reinforcing plate, plus
Strong wall, which combines, obtains shell, and easy to operate, shell is beautiful, and drop resistant ability increases.The thickness of side of sidewall portion is more than main part, i.e. side
There are thickness differences between wall portion and main part so that the three-dimensional sense of shell is strong, promotes the aesthetic feeling and feel of shell.
Description of the drawings
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the schematic rear view for the electronic device that an embodiment provides；
Fig. 2 is the schematic three dimensional views of the shell at the back of electronic device shown in Fig. 1；
Fig. 3 is the A-A of electronic device shown in Fig. 1 to schematic cross-sectional view；
Fig. 4 be Fig. 1 shown in electronic device A-A to schematic cross-sectional view, wherein display screen component is removed；
Fig. 5 is the enlarged diagram of the profile of the portions the A structure of shell shown in Fig. 4；
Fig. 6 is the exploded perspective view of structure shown in Fig. 5；
Fig. 7 is the A-A of electronic device shown in corresponding diagram 1 in another embodiment to schematic cross-sectional view, wherein display screen component
It is removed；
Fig. 8 is the A-A of electronic device shown in corresponding diagram 1 in another embodiment to schematic cross-sectional view, wherein display screen component
It is removed；
Fig. 9 is the A-A of electronic device shown in corresponding diagram 1 in another embodiment to schematic cross-sectional view, wherein display screen component
It is removed.
Specific implementation mode
For the ease of understanding the application, the application is described more fully below with reference to relevant drawings.In attached drawing
Give the preferred embodiment of the application.But the application can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to present disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the application
The normally understood meaning of technical staff is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that in limitation the application.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
As " electronic device " as used herein include, but are not limited to be configured to via Wireline connection (such as via
Public Switched Telephone Network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection and/or another number
According to connection/network) and/or via (for example, for the number of cellular network, WLAN (WLAN), such as DVB-H networks
TV network, satellite network, AM-FM broadcasting transmitter and/or another electronic device) wireless interface reception/transmission communication
The device of signal.The example of electronic device includes, but are not limited to satellite or cellular phone；Can with combination cellular radio telephone with
PCS Personal Communications System (PCS) terminal of data processing, fax and communication ability；May include radio telephone, paging
Machine, the Internet/intranet access, Web browser, memo pad, calendar and/or global positioning system (GPS) receiver
PDA；And conventional laptop and/or palmtop receiver or other electronic devices including radiotelephone transceiver.
Referring to figs. 1 to Fig. 3, in one embodiment, electronic device is mobile phone, and electronic device includes shell 10 and display screen group
Part 600, rear shell of the shell 10 as electronic device.In the following description, it is illustrated so that shell 10 is the rear shell of mobile phone as an example.
In one embodiment, shell 10 includes mainboard 110 and major side wall 210 and side of sidewall portion 200.Side of sidewall portion 200 is by mainboard
110 and major side wall 210 edge bending extend, form opening-box together with mainboard 110 and major side wall 210.The side
The thickness of wall portion 200 is more than the thickness of mainboard 110 and major side wall 210.The mainboard 110 and major side wall 210 include 110 He of mainboard
The reinforcing plate 120 being fitted on 110 inner surface of mainboard.The side of sidewall portion 200 includes major side wall 210 and is fitted in major side wall 210
Reinforced wall 220 on inner surface.The transparent epoxy member that the mainboard 110 and major side wall 210 are integrally formed, and it is main
The thickness of side wall 210 is more than the thickness of mainboard 110；The reinforcing plate 120 and reinforced wall 220 are glass fabric or carbon cloth
The integral member obtained by transparent epoxy resin cure is infiltrated, and reinforcing plate 120 is identical with the thickness of reinforced wall 220.
Specifically, in conjunction with fig. 4 to fig. 6, mainboard 110 includes outer plate surface 111, inner plate surface 112.Major side wall 210 includes outer wall
Face 221, internal face 222.Outside wall surface 221 is connect with outer plate surface 111, and internal face 222 is connect with inner plate surface 112.111 He of outer plate surface
Outside wall surface 221 forms the outer surface of shell 10, and inner plate surface 112 and internal face 222 form the interior table of transparent epoxy member
Face.
It is identical that the shape of the reinforcing plate 120 and reinforced wall 220 with internal face 222 and inner plate surface 112 is formed by shape.
It is understood that reinforcing plate 120 and reinforced wall 220 are only to slightly increase the thickness of mainboard 110 and major side wall 210, no
Change the shape of mainboard 110 and major side wall 210.Reinforcing plate 120 includes outer surface and inner surface, the appearance face paste of reinforcing plate 120
It closes on inner plate surface 112；Reinforced wall 220 includes outer surface and inner surface, and the outer surface of reinforced wall 220 is fitted in internal face 222
On.The inner surface of reinforcing plate 120 and the inner surface of reinforced wall 220 form the inner surface of shell 10 together.Reinforcing plate 120 and reinforcement
Wall 220 increases the intensity of shell 10, even if by firmly if mainboard 110 and major side wall 210 rupture fragment after being clashed
It is fixed in reinforcing plate 120 and reinforced wall 220, not will produce disintegrating slag, and do not influence the use of shell 10.
Inner plate surface 112 and internal face 222 are equipped with decorative layer 300.In one embodiment, including can be by way of vapor deposition
A tunic is formed on plate face 112 and internal face 222, using as decorative layer.It, can be in inner plate surface in other alternate embodiments
112 and internal face 222 on spraying ink to form decorative layer.Inner plate surface 112 and internal face 222 divide after being equipped with decorative layer 300
It is not combined with reinforcing plate 120, reinforced wall 220, it can be understood as, by being deposited or spraying on inner plate surface 112 and internal face 222
Etc. modes decorative layer 300 is set, the dispensing on the outer surface of reinforcing plate 120 and reinforced wall 220 later, with inner plate surface 112 and interior
Decorative layer 300 on wall surface 222 is bonded so that inner plate surface 112, internal face 222 are Nian Jie with reinforcing plate 120, reinforced wall 220 respectively
Securely, it is not easy to be torn.
As shown in Figures 4 to 6, in one embodiment, the decorative layer 300 includes first surface 310 and second surface
320.The first surface 310 is fixed on inner plate surface 112 and internal face 222, the second surface 320 and reinforcing plate 120 and
Reinforced wall 220 contacts.In one embodiment, the decorative layer 300 is arranged by modes such as vapor deposition, spraying or printings in inner plate surface
112 and internal face 222 on, the first surface 310 is identical as second surface 320, there is pattern.The pattern of first surface 310
Show that the pattern of second surface 320 is reinforced plate 120 and reinforced wall 220 across transparent mainboard 110 and major side wall 210
It hides.The pattern of first surface 310 shows across transparent mainboard 110 and major side wall 210, second surface 320 with reinforce
Plate 120 and reinforced wall 220 contact.The decorative layer 300 is relatively thin, and when measuring the thickness of shell 10, the thickness of decorative layer 300 can be with
It ignores.The pattern of the decorative layer 300 can be the pattern with curve of colour, enhance the aesthetics of mobile phone battery cover.
The pattern of decorative layer 300 may be the face of the single not lines of color, such as can decorative layer 300 be arranged to black, avoided
See reinforcing plate 120 and reinforced wall 220 through shell 10, while making the more integrated vision effect of major side wall 210 and mainboard 110
Fruit.Specific restriction is not done to the pattern of decorative layer 300 herein.
As shown in figure 4, in one embodiment, being seamlessly transitted between main part 100 and side of sidewall portion 200.It is to be understood that interior
Seamlessly transitted between plate face 112 and internal face 222 and/or outside wall surface 221 and outer plate surface 111 between seamlessly transit.It can keep away in this way
There are corner angle in the edge for exempting from mainboard 110, ensures the fairness of major side wall 210 and 110 corner of mainboard, makes from the outside of shell 10
When internally watching, visual effect is more preferable, and promotes the feel of user.
As shown in figure 4, in one embodiment, it is vertical between main part 100 and side of sidewall portion 200.It is to be understood that outside wall surface
221 perpendicular to outer plate surface 111, and is not limited between inner plate surface 112 and internal face 222, i.e. inner plate surface 112 and internal face
It can vertically or in obtuse angle between 222.As shown in fig. 7, in another embodiment, in blunt between mainboard 110 and major side wall 210
Angle.It is to be understood that between outside wall surface 221 and outer plate surface 111 in obtuse angle, and do not done between inner plate surface 112 and internal face 222
Limitation, i.e., can vertically or in obtuse angle between inner plate surface 112 and internal face 222.
As shown in figure 4, in one embodiment, main part 100 is tablet.In another embodiment, as shown in figure 8, main body
Portion 100 is arc-shaped curved surface plate, i.e., mainboard 110 is arc-shaped curved surface plate, it can be understood as, outer plate surface 111 is arc-shaped curved surface, inner plate surface
112 shape is identical as outer plate surface 111, and outer plate surface 111 is parallel with inner plate surface 112.In other embodiments, main part 100
For arc-shaped curved surface plate, i.e. mainboard 110 is arc-shaped curved surface plate, it is understood that is that outer plate surface 111 is arcwall face, inner plate surface 112 is
Plane, thickness of the mainboard 110 at vertical central axis is maximum, and thickness is minimum at both sides.The outer plate surface of the arc of mainboard 110
111 together with the corner of 10 both sides of shell seamlessly transitted so that entirely shape in curved surface, entirety are suitable for the upper surface of shell 10
It is sliding, keep the shape of shell 10 more beautiful and there is preferable feel.
As shown in figure 4, in one embodiment, the outside wall surface 221 of major side wall 210 is plane, and the thickness of major side wall 210 is equal
It is even, it can be understood as the thickness of side of sidewall portion 200 is uniform.In another embodiment, as shown in figure 9, the outside wall surface 221 is song
Face, makes between outside wall surface 221 and outer plate surface 111 whole smooth, keeps the shape of shell 10 more beautiful and has preferable feel.
From mainboard 110, the thickness on the direction of the end of major side wall 210 gradually increases the thickness of major side wall 210 so that side of sidewall portion 200
Thickness gradually increases in this direction, increases the difference in thickness of main part 100 and side of sidewall portion 200, increases the vertical of shell 10
Body-sensing promotes the aesthetic feeling of shell 10.
It is described below to be illustrated so that main part 100 is the rectangular straight panel of a monoblock as an example.Side of sidewall portion 200 can be located at master
Two opposite long edge positions of body portion 100 can also be located at two opposite short sides of main part 100, to be symmetricly set on main part 100
The strip structure at edge, it can be achieved that shell 10 opening-box structure；Side of sidewall portion 200 may be additionally located at 100 surrounding of main part, i.e.,
Side of sidewall portion 200 is equipped at two long sides and two short sides, side of sidewall portion 200 is the frame-shaped construction for enclosing the edge for setting main part 100, can be real
The opening-box structure of existing shell 10.
Shell 10 is set to be in opening-box by the way that side of sidewall portion 200 is arranged, when assembling mobile phone using shell 10, the battery of mobile phone
The components such as (not shown), mainboard (not shown) and display screen component 600 can be put into the opening-box knot of shell 10
In structure, no longer need to that center is separately provided.Wherein, on the direction of main part 100, side of sidewall portion 200 is far from main part 100
The distance between the inner surface of one end and shell 10 H be 3.5mm~8.5mm.Above-mentioned H indicates the shell of opening-box structure
10 depth by making shell 10 have suitable depth, and then guarantee battery, mainboard and the display screen component of accommodating mobile phone
600 equal components.Wherein, 200 smooth connection of side of sidewall portion of display screen component 600 and shell 10.
As shown in Figures 4 to 7, the thickness of main part 100 is more than the thickness of side of sidewall portion 200.Relative to the shell 10 of uniform thickness,
I.e. the thickness of main part 100 is equal with the thickness of side of sidewall portion 200, and the moulding of the application middle casing 10 can be relatively more rich, has
Higher identification.Wherein, 100 thickness L2 ranges of main part can be 0.6mm~1.0mm, and the thickness L1 ranges of side of sidewall portion 200 can
For 1.5mm~3.5mm.It is understood that the thickness of side of sidewall portion 200 refers to the integral thickness of side of sidewall portion 200, such as can be side
The average thickness of wall portion 200.The thickness of side of sidewall portion 200 everywhere can be inconsistent, can also be identical.As shown in figure 4, side wall
The thickness in portion 200 is uniform；As shown in figure 9, the thickness of side of sidewall portion 200 can gradually increase on the direction far from main part 100.?
In the application, the variation pattern of 200 thickness of side of sidewall portion is not specifically limited.
The thickness of side of sidewall portion 200 is relatively thick, can be arranged and mainboard, display screen in the inside of the end face of side of sidewall portion 200
600 matched structure of component, makes mainboard and display screen component 600 be directly mounted on side of sidewall portion 200, makes handset structure more
Succinctly.Also, thicker side of sidewall portion 200 is convenient for being arranged various moulding, such as each not phase of shape of the side of sidewall portion 200 in Fig. 4, Fig. 9
Together.The thickness of main part 100 is very thin, and the main region on shell 10 is main part 100, can make shell 10 in this way
Weight is relatively light, and it is very fast to radiate.
As shown in figures 1 and 3, in one embodiment, the application also provides a kind of electronic device, after the electronic device
Shell is the shell 10, and the display screen component 600 is connect with the side of sidewall portion 200 of shell 10, and the lid of display screen component 600 sets side wall
Portion 200 and main part 100 enclose the space set.The shell 10 replaces back shroud and center so that the structure of electronic device is simple
And it is easily assembled.
A kind of manufacturing method of shell, includes the following steps：
Step a obtains the integral structure of mainboard 110 and major side wall 210 using the epoxy resin of melting by injection molding；
Step b is strengthened plate 120 and reinforced wall 220 using fiber cloth infiltration epoxy resin cure；
Decorative layer 300 is arranged in step c on mainboard 110 and the inner surface of major side wall 210；
Step d, reinforcing plate 120 and mainboard 110 are combined together to form main part 100, reinforced wall 220 and major side wall 210
It is combined together to form side of sidewall portion 200, main part 100 and side of sidewall portion 200 form shell 10 together, wherein the thickness of side of sidewall portion 200
Thickness of the degree more than main part 100.
In one embodiment, mold is manufactured, the mold includes punch-pin and cavity plate.After the mold clamping, in mold
Shape, the size of cavity are identical as the shape of mainboard 110 and major side wall 210, size.The epoxy resin of molten state is injected into mold
In, transparent mainboard 110 and major side wall 210 is made, the thickness of the major side wall 210 is more than the thickness of mainboard 110.
In one embodiment, mold is manufactured, the mold includes punch-pin and cavity plate.After the mold clamping, in mold
Shape, the size of cavity are identical as the shape of reinforcing plate 120 and reinforced wall 220, size.Cut one piece of fiber cloth, the fiber
Cloth can be carbon cloth or glass fabric, and fiber cloth is layered on the punch-pin of mold, mold.It is understood that fine
Dimension cloth can be laid with one or more layers, can all meet the demand of the increase intensity of shell 10.The asphalt mixtures modified by epoxy resin of molten state is injected later
Fat, the material identical of the epoxy resin infiltrated and mainboard 110 and major side wall 210, fiber cloth is infiltrated, and is cooled and solidified later,
Obtain integrated reinforcing plate 120 and reinforced wall 220.In another embodiment, the fiber cloth is carbon fiber prepreg or glass
Fiber prepreg material, fiber cloth is pasted onto on the punch-pin of mold, is cut into suitable shape, is molded later, and high temperature and pressure is carried out
Molding, obtains integrated reinforcing plate 120 and reinforced wall 220.
Inner plate surface 112 and internal face 222 are equipped with decorative layer 300.In one embodiment, including can be by way of vapor deposition
A tunic is formed on plate face 112 and internal face 222, using as decorative layer.It, can be in inner plate surface in other alternate embodiments
112 and internal face 222 on spraying ink to form decorative layer.Inner plate surface 112 and internal face 222 divide after being equipped with decorative layer 300
It is not combined with reinforcing plate 120, reinforced wall 220, it can be understood as, by being deposited or spraying on inner plate surface 112 and internal face 222
Etc. modes decorative layer 300 is set, the dispensing on the outer surface of reinforcing plate 120 and reinforced wall 220 later, with inner plate surface 112 and interior
Decorative layer 300 on wall surface 222 is bonded so that inner plate surface 112, internal face 222 are Nian Jie with reinforcing plate 120, reinforced wall 220 respectively
Securely, it is not easy to be torn.
As shown in Figures 4 to 6, in one embodiment, the decorative layer 300 includes first surface 310 and second surface
320.The first surface 310 is fixed on inner plate surface 112 and internal face 222, the second surface 320 and reinforcing plate 120 and
Reinforced wall 220 contacts.In one embodiment, the decorative layer 300 is arranged by modes such as vapor deposition, spraying or printings in inner plate surface
112 and internal face 222 on, the first surface 310 is identical as second surface 320, there is pattern.The pattern of first surface 310
Show that the pattern of second surface 320 is reinforced plate 120 and reinforced wall 220 across transparent mainboard 110 and major side wall 210
It hides.The pattern of first surface 310 shows across transparent mainboard 110 and major side wall 210, second surface 320 with reinforce
Plate 120 and reinforced wall 220 contact.The decorative layer 300 is relatively thin, and when measuring the thickness of shell 10, the thickness of decorative layer 300 can be with
It ignores.The pattern of the decorative layer 300 can be the pattern with curve of colour, enhance the aesthetics of mobile phone battery cover.
The pattern of decorative layer 300 may be the face of the single not lines of color, such as can decorative layer 300 be arranged to black, avoided
See reinforcing plate 120 and reinforced wall 220 through shell 10, while making the more integrated vision effect of major side wall 210 and mainboard 110
Fruit.Specific restriction is not done to the pattern of decorative layer 300 herein.
In one embodiment, mainboard 110 and reinforcing plate 120 are combined together into main part 100, by major side wall 210
It is combined together into side of sidewall portion 200 with reinforced wall 220, main part 100 and side of sidewall portion 200 form shell 10 together.Reinforcing plate
120 and reinforced wall 220 inner surface on the transparent adhesive of spot printing, by inner plate surface 112 and reinforcing plate equipped with decorative layer 300
120 fittings, the internal face 222 equipped with decorative layer 300 are bonded with reinforced wall 220, clamping fastener, are made inner plate surface 112 and are reinforced
Plate 120 is securely attached together, and internal face 222 is securely attached together with reinforced wall 220, forms shell 10.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to claim therefore be interpreted as.It should be pointed out that coming for those of ordinary skill in the art
It says, under the premise of not departing from the application design, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the protection domain of the application patent should be determined by the appended claims.
Claims (11)
1. a kind of shell, which is characterized in that the side of sidewall portion (200) including main part (100) and positioned at main part (100) edge,
The main part (100) includes mainboard (110) and the reinforcing plate (120) that is fitted on mainboard (110) inner surface, the side of sidewall portion
(200) reinforced wall (220) for including major side wall (210) and being fitted on major side wall (210) inner surface, the mainboard (110) and
Major side wall (210) be transparent configuration, the mainboard (110), major side wall (210) inner surface divide afterwards equipped with decorative layer (300)
It is not combined with reinforcing plate (120), reinforced wall (220), the thickness of the side of sidewall portion (200) is more than the thickness of the main part (100)
Degree.
2. shell according to claim 1, which is characterized in that including any one following scheme：
The mainboard (110) and major side wall (210) are that epoxy resin is integrally formed component；
The reinforcing plate (120) and reinforced wall (220) are infiltrated the integral member obtained by epoxy resin cure by fiber cloth, and described
Reinforcing plate (120) is identical with the thickness of reinforced wall (220).
3. shell according to claim 1, which is characterized in that the decorative layer (300) passes through vapor deposition, spraying or printing
Mode is arranged on mainboard (110) and the inner surface of major side wall (210).
4. shell according to claim 1, which is characterized in that the decorative layer (300) and reinforcing plate (120), reinforced wall
(220) it is combined and is fixed by adhesive between.
5. shell according to claim 1, which is characterized in that the main part (100) and side of sidewall portion (200) are vertical or are in
Obtuse angle seamlessly transits between main part (100) and side of sidewall portion (200).
6. shell according to claim 1, which is characterized in that main part (100) be tablet or arc-shaped curved surface plate, and/or,
The side of sidewall portion (200) is tablet or curved slab.
7. shell according to claim 1, which is characterized in that the thickness of the side of sidewall portion (200) is uniform, alternatively, described
Side of sidewall portion (200) it is in uneven thickness, and thickness far from the direction of plate (110) by gradually increasing.
8. shell according to claim 1, which is characterized in that the side of sidewall portion (200) is to enclose the side for setting main part (100)
The frame-shaped construction of edge, alternatively, the side of sidewall portion (200) is the strip structure for being symmetricly set on main part (100) edge.
9. shell according to claim 1, which is characterized in that the thickness of the main part (100) is 0.6mm~1.0mm,
And/or the thickness of the side of sidewall portion (200) is 1.5mm~3.5mm.
10. a kind of electronic device, which is characterized in that the electronic device includes display screen component and claim 1-9 any one
The side of sidewall portion (200) of shell in, the display screen component and shell sets the main part (100) and side of sidewall portion with closing lid
(200) space set is enclosed.
11. a kind of manufacturing method of shell, which is characterized in that include the following steps：
Step a obtains the one of mainboard (110) and major side wall (210) using the transparent polymer material of melting by injection molding
Body structure；
Step b cures strengthened plate (120) and reinforced wall (220) using fiber cloth infiltration transparent polymer material；
Decorative layer (300) is arranged in step c on mainboard (110) and the inner surface of major side wall (210)；
Step d, reinforcing plate (120) and the mainboard (110) equipped with decorative layer (300) are combined together to form main part (100), add
Strong wall (220) and the major side wall (210) equipped with decorative layer (300) are combined together to form side of sidewall portion (200), main part (100)
Shell is formed together with side of sidewall portion (200), wherein the thickness of side of sidewall portion (200) is more than the thickness of main part (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810560750.2A CN108773022A (en) | 2018-05-25 | 2018-05-25 | The manufacturing method of shell, electronic device and shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810560750.2A CN108773022A (en) | 2018-05-25 | 2018-05-25 | The manufacturing method of shell, electronic device and shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108773022A true CN108773022A (en) | 2018-11-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810560750.2A Pending CN108773022A (en) | 2018-05-25 | 2018-05-25 | The manufacturing method of shell, electronic device and shell |
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| Country | Link |
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| CN (1) | CN108773022A (en) |
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| CN110290253A (en) * | 2019-06-29 | 2019-09-27 | Oppo（重庆）智能科技有限公司 | Shell, electronic equipment and method for producing shell |
| CN110901110A (en) * | 2019-11-29 | 2020-03-24 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
| CN111355832A (en) * | 2020-04-14 | 2020-06-30 | Oppo广东移动通信有限公司 | Unequal-thickness shell, processing method thereof and terminal equipment |
| CN114899539A (en) * | 2022-04-29 | 2022-08-12 | 华为技术有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
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