CN108770201A - A kind of microwave circuit flush type pcb - Google Patents
A kind of microwave circuit flush type pcb Download PDFInfo
- Publication number
- CN108770201A CN108770201A CN201810892441.5A CN201810892441A CN108770201A CN 108770201 A CN108770201 A CN 108770201A CN 201810892441 A CN201810892441 A CN 201810892441A CN 108770201 A CN108770201 A CN 108770201A
- Authority
- CN
- China
- Prior art keywords
- transmission line
- mainboard
- signal transmission
- ground via
- flush type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Connection Structure (AREA)
Abstract
The present invention relates to microwave radio circuit design technique is belonged to, more particularly to a kind of microwave circuit flush type pcb.Microwave circuit flush type pcb includes：Has reeded mainboard, inside grooves are provided with the first component group；First signal transmission via, is vertically opened on the mainboard of groove side；First ground via is located at signal transmission via side；Subplate is stacked on mainboard upper surface, and the second component group is provided in plate face；Second signal transmits via；Second ground via, extends vertically through subplate；First plants ball point, is located at the top of the first signal transmission via；Metallic ground part is arranged between mainboard and subplate.The microwave circuit flush type pcb of the present invention, complex conditions when LTCC can be avoided to process, realize that element device or more lamination is put in existing pcb technical foundation, effectively reduce circuit size, and realize circuit function module device, radio circuit design efficiency is improved, can be widely applied in microwave radio circuit design.
Description
Technical field
The present invention relates to microwave radio circuit design technique is belonged to, more particularly to a kind of microwave circuit flush type pcb.
Background technology
Flush type pcb technologies are that traditional circuit element device plane figure is changed into refracting films layout up and down, can be with
Effectively reduce circuit size.Simultaneously in pcb manufacturing process, combined circuit encapsulation plant ball technique, it can be achieved that circuit function mould
Block device has important value to micro-system development.
LTCC technology has been widely used in miniaturization, and structure is similar to multilayer pcb, need to be by multi-layer green ceramic
Band is formed in 800~900 DEG C of high temperature sinterings, and major function includes high density interconnection wiring, integrative packaging and passive device
It is integrated.The matching of cofiring material is the hot issue of LTCC, is influenced by the shrinking percentage and coefficient of thermal expansion of material, LTCC productions
Product size should not be too large, and have certain limitation with upper in micro-system.
Invention content
The object of the present invention is to provide a kind of microwave circuit flush type pcb, can be widely used in micro-system.
The technical scheme is that：
A kind of microwave circuit flush type pcb, including：
Mainboard, is molded in plate face fluted, and the inside grooves are provided with the first component group, first component
Group has coupled the first input transmission line and the first output transmission line；
Most two the first signal transmission vias, are vertically opened on the mainboard of the groove side；When the letter
Number transmission number of vias be one when, connect with first input transmission line or the first output transmission line；When the signal passes
When defeated number of vias is two, it is connect respectively with first input transmission line or the first output transmission line；
First ground via extends vertically through the mainboard of the groove side, and is located at signal transmission via side
Face；
Subplate, is stacked on the mainboard upper surface, in plate face be provided with second yuan at the groove opposite position
Device group, the second component group have coupled the second input transmission line and the second output transmission line；
Second signal transmits via, and quantity and position are corresponding with the first signal transmission via, and with described second
Input transmission line or the connection of the second output transmission line；
Second ground via extends vertically through the subplate, and is electrically connected with first ground via,
First plants ball point, is located at the top of the first signal transmission via, for by planting ball technique by corresponding position
The first signal transmission via and second signal transmission via be attached；
Metallic ground part is arranged between the mainboard and the subplate, for connecting second ground via and institute
State the first ground via.
Optionally, the quantity of the first signal transmission via is two, one of them and first input transmission line
Connection, another connect with the first output transmission line；
The quantity of second signal transmission via and position are corresponding with the first signal transmission via, and one and
The second input transmission line connection, another connect with the second output transmission line.
Optionally, the first ground via quantity is multiple, is circle with its corresponding described first signal transmission via
The heart, it is annular in shape to be distributed；
The quantity and distribution mode of second ground via are identical as first ground via；
The metallic ground part is in ring-type identical with the first ground via distributing position, for connecting described second
Ground via and first ground via.
Optionally, first input transmission line and the first output transmission line include the micro-strip being located in the groove
Line and the strip line inside the mainboard.
Optionally, second input transmission line and the second output transmission line are microstrip line.
Optionally, the microwave circuit flush type pcb, it is characterised in that further include：
Second plants ball point, is arranged on the mainboard of the groove vicinity, for by planting ball technique by the mainboard
It is packaged with subplate；
Third ground via, on the mainboard for being opened in the groove surrounding.
Invention effect：
The microwave circuit flush type pcb of the present invention, complex conditions when LTCC can be avoided to process, in existing pcb technologies base
Realize that element device up and down put by lamination, effectively reduces circuit size, and realize circuit function module device, carries on plinth
High radio circuit design efficiency, can be widely applied in microwave radio circuit design.
Description of the drawings
Fig. 1 is the structural schematic diagram of the microwave circuit flush type pcb of the present invention.
Fig. 2 be the present invention microwave circuit flush type pcb in mainboard side view.
Fig. 3 be the present invention microwave circuit flush type pcb in mainboard vertical view.
Fig. 4 be the present invention microwave circuit flush type pcb in subplate side view.
Fig. 5 be the present invention microwave circuit flush type pcb in subplate vertical view；
Fig. 6 is the reflectance factor that broadband signal transmits via structure.
Fig. 7 be the present invention microwave circuit flush type pcb in one embodiment intermediate frequency motherboard layout figure.
Fig. 8 be the present invention microwave circuit flush type pcb in one embodiment radio frequency subplate layout.
Specific implementation mode
To keep the purpose, technical scheme and advantage that the present invention is implemented clearer, below in conjunction in the embodiment of the present invention
Attached drawing, technical solution in the embodiment of the present invention is further described in more detail.In the accompanying drawings, identical from beginning to end or class
As label indicate same or similar element or element with the same or similar functions.Described embodiment is the present invention
A part of the embodiment, instead of all the embodiments.The embodiments described below with reference to the accompanying drawings are exemplary, it is intended to use
It is of the invention in explaining, and be not considered as limiting the invention.Based on the embodiments of the present invention, ordinary skill people
The every other embodiment that member is obtained without creative efforts, shall fall within the protection scope of the present invention.Under
Face is described in detail the embodiment of the present invention in conjunction with attached drawing.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, and does not indicate or imply the indicated dress
It sets or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as protecting the present invention
The limitation of range.
Flush type pcb technologies of the present invention are mainly used for the high density layouts of radio frequency link component, and what is inside buried is integrated core
The packagings such as piece, capacitance, inductance, and it is not size-limited, the utilization in terms of micro-system has huge advantage compared to LTCC.
Flush type pcb is dramatically different with LTCC in manufacture craft simultaneously, and the high temperature resistance of common component can not bear LTCC and add
The high temperature in working hour, and this limitation is not present in flush type pcb.It can be seen that flush type pcb technologies circuit size minimize with
And it is with a wide range of applications in terms of the function module device of circuit.
1 to Fig. 8 the microwave circuit flush type pcb of the present invention is described in further details below in conjunction with the accompanying drawings.
The present invention provides a kind of microwave circuit flush type pcb, including mainboard 1, the first signal transmission via 9,10, first
Ground via 11, subplate 2, second signal transmission via 15,16, the second ground via 17, first plant ball point 3 and metallic ground
Part.
Fluted 12 are molded in the plate face of mainboard 1, inside grooves are provided with the first component group 5 (on circuit board)；First
Component group 5 has coupled the first input transmission line 6 and the first output transmission line 7.Wherein, the first input transmission line 6
Belong to transition strip line, the first output transmission line 7 belongs to transition microstrip line, the first input transmission line 6 and the first output transmission line 7
Include being located at the microstrip line in groove and the strip line inside mainboard 1.It should also be noted that, in the side of mainboard 1
Third component group 8 can also be set.
The height that 1 thickness of mainboard in the present invention regards embedment device with 12 height of groove determines, need to ensure that device can be completely
It is embedded in 12 cavity of groove.The component put in cavity should be main body circuit, i.e., with a variety of secondary modular circuits can
The circuit matched ensures its versatility.
The quantity of first signal transmission via 9,10 is most two, is vertically opened on the mainboard 1 of groove side.Its
In, when 9,10 quantity of the first signal transmission via is one, it is connect with the first input transmission line or the first output transmission line；When
When first signal transmission via, 9,10 quantity is two, it is connect respectively with the first input transmission line 6 or the first output transmission line 7.
First ground via 11 extends vertically through the mainboard 1 of groove side, and is located at 9,10 side of the first signal transmission via.
Subplate 2 is stacked on 1 upper surface of mainboard, in plate face be provided with the second component group at 12 opposite position of groove
18, the second component group 18 has coupled the second input transmission line 13 and the second output transmission line 14.Wherein, preferably
Ground, the second input transmission line 13 and the second output transmission line 14 are microstrip line.
Second signal transmits 15,16 quantity of via and position and the first signal transmission via 9, and 10 is corresponding, and with second
Input transmission line 6 or the connection of the second output transmission line 7.
Second ground via 17 extends vertically through subplate 2, and is electrically connected with the first ground via 11.
First plant ball point 3 (prior art is previously used for component package) is located at 9,10 top of the first signal transmission via,
For the first signal transmission via 9,10 and second signal of corresponding position to be transmitted the progress of via 15,16 by planting ball technique
Connection；
Metallic ground part is arranged between the mainboard 1 and the subplate 2, for connecting second ground via 17
With first ground via 11.
Preferably, the quantity of the first signal transmission via 9,10 is two, one of them connects with the first input transmission line 6
It connects, another connect with the first output transmission line 7；Second signal transmits one and the second input transmission line 13 of via 15,16
Connection, another connect with the second output transmission line 14.Further, 11 quantity of preferably the first ground via is multiple, right with its
The the first signal transmission via 9,10 answered is the center of circle, annular in shape to be distributed；The quantity and distribution mode of second ground via 17 and the
One ground via 11 is identical.In addition, for the setting of adaptation cyclic annular first ground via 11 and the second ground via 17, can also wrap
Include auxiliary welding annulus 4.Metallic ground part is in ring-type identical with 11 distributing position of the first ground via, is connect for connecting second
Ground via 17 and the first ground via 11.
Further, microwave circuit flush type pcb of the invention further includes the second plant ball point 19 and third ground via 20.
On the mainboard 1 that second plant ball point 19 is arranged around groove 12, for by planting ball technique by mainboard 1 and subplate 2
It is packaged；Third ground via 20, which runs through to be opened on the mainboard 1 of 12 surrounding of groove, (plays buffer action).
Fig. 6 is the reflectance factor that broadband signal transmits via structure.Subplate 2 can be according to index as independent pcb
It realizes the different function under different frequency range, that is, realizes different function module, but just because of the not true of modular circuit working frequency range
It is qualitative, the performance requirement of signal transmission via is got higher.A kind of signal transmission via structure that the present invention designs is in 2~18GHz
All remain good reflection characteristic, respectively less than -20dB in wide-band.Wherein via diameter is 0.35mm, ground via away from
It is 1.2mm with a distance from signal transmission via, the inner and outer diameter of auxiliary welding annulus 4 is 1.8mm, 3.2mm.
It is noted, that major and minor partitioned signal via is connected using ball technique is planted, it can be in surrounding in addition to auxiliary circle boxing disk
It places suitable second and plants ball point 19, it is more steady and secured when subplate 2 being made to be cascaded with mainboard 1, such plant is illustrated in Fig. 7
Ball point.
Below using S-band radio frequency reception channel as embodiment, pcb domains are made, briefly explain the advantage and use of the present invention
On the way.Mainboard includes intermediate-frequency circuit and power circuit, and subplate includes S-band radio circuit.
Fig. 7 is the intermediate frequency motherboard layout figure of embodiment, size 50mm*41mm.Due to the multiple-plate attributes of pcb, usually
Each component is connected by the way of multilayer wiring, therefore need to avoid fluting cavity portion when being connected up on mainboard, when necessary may be used
Fluting cavity is isolated with placing suitable ground via, as two row close to cavity in Fig. 7 connect third ground via 20.
Fig. 8 is the radio frequency subplate layout of embodiment, size 30mm*16mm.It is defeated comprising local oscillator and radio frequency on the block plate
Enter end, is directly connect with the microstrip line on mainboard with common via.It is to be connect with mainboard fluting cavity at printed board label spot
Third signal transmission via 21, be the medium frequency output end mouth of frequency mixer, the signal transmission via designed through the invention and master
Plate connects.The subplate occupied area is exactly that can also be replaced this module using the saved space of flush type pcb design methods
It is changed to the module of other frequency ranges, facilitates replacement.
The microwave circuit flush type pcb of the present invention, complex conditions when LTCC can be avoided to process, in existing pcb technologies base
Realize that element device up and down put by lamination, effectively reduces circuit size, and realize circuit function module device, carries on plinth
High radio circuit design efficiency, can be widely applied in microwave radio circuit design, in radio circuit miniaturization and function mould
There is obvious advantage in block device direction, therefore has very strong practicability and competitiveness.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, all answer by the change or replacement that can be readily occurred in
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of the claims
It is accurate.
Claims (6)
1. a kind of microwave circuit flush type pcb, which is characterized in that including：
Mainboard (1) is molded fluted (12) in plate face, and the inside grooves are provided with the first component group (5), and described first
Component group (5) has coupled the first input transmission line (6) and the first output transmission line (7)；
Most two the first signal transmission vias (9,10), are vertically opened on the mainboard (1) of the groove side；Work as institute
State first signal transmission via (9,10) quantity be one when, with first input transmission line (6) or the first output transmission line
(7) it connects；When the first signal transmission via (9,10) quantity be two when, respectively with first input transmission line (6)
Or first output transmission line (7) connection；
First ground via (11) extends vertically through the mainboard (1) of the groove side, and is located at the signal transmission via
(9,10) side；
Subplate (2), is stacked on the mainboard (1) upper surface, in plate face be provided at the groove (12) opposite position
Second component group (18), the second component group (18) are defeated with coupled the second input transmission line (13) and second
Go out transmission line (14)；
Second signal transmit via (15,16), quantity and position are corresponding with the first signal transmission via (9), and with institute
State the second input transmission line (13) or the second output transmission line (14) connection；
Second ground via (17) extends vertically through the subplate (2), and is electrically connected with first ground via (11)；
First plants ball point (3), is located at the top of the first signal transmission via (9,10), and being used for will corresponding position by planting ball technique
The the first signal transmission via (9,10) and second signal transmission via (15,16) for setting place are attached；
Metallic ground part is arranged between the mainboard (1) and the subplate (2), for connecting second ground via
(17) with first ground via (11).
2. microwave circuit flush type pcb according to claim 1, which is characterized in that the first signal transmission via (9,
10) quantity is two, one of them connect with first input transmission line (6), another and the first output transmission line (7)
Connection；
The quantity of the second signal transmission via (15,16) and position are opposite with the first signal transmission via (9,10)
It answers, and one connect with second input transmission line (13), another connect with the second output transmission line (14).
3. microwave circuit flush type pcb according to claim 2, which is characterized in that the first ground via (11) number
Amount is multiple, annular in shape to be distributed with its corresponding described first signal transmission via (9,10) for the center of circle；
The quantity and distribution mode of second ground via (17) are identical as the first ground via (11)；
The metallic ground part is in ring-type identical with the first ground via (11) distributing position, for connecting described second
Ground via (17) and first ground via (11).
4. microwave circuit flush type pcb according to claim 3, which is characterized in that first input transmission line (6) and
First output transmission line (7) includes being located at the microstrip line in the groove and the strip line positioned at the mainboard (1) inside.
5. microwave circuit flush type pcb according to claim 3, which is characterized in that second input transmission line (13)
It is microstrip line with the second output transmission line (14).
6. according to claim 1-5 any one of them microwave circuit flush types pcb, which is characterized in that further include：
Second plants ball point (19), on the mainboard (1) being arranged around the groove (12), for by planting ball technique by institute
Mainboard (1) is stated to be packaged with subplate (2)；
Third ground via (20), on the mainboard (1) for being opened in the groove (12) surrounding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892441.5A CN108770201A (en) | 2018-08-07 | 2018-08-07 | A kind of microwave circuit flush type pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810892441.5A CN108770201A (en) | 2018-08-07 | 2018-08-07 | A kind of microwave circuit flush type pcb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108770201A true CN108770201A (en) | 2018-11-06 |
Family
ID=63969262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810892441.5A Pending CN108770201A (en) | 2018-08-07 | 2018-08-07 | A kind of microwave circuit flush type pcb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770201A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110636701A (en) * | 2019-10-29 | 2019-12-31 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
| CN111756028A (en) * | 2019-03-29 | 2020-10-09 | 北京小米移动软件有限公司 | Electronic device |
| CN118201207A (en) * | 2024-05-20 | 2024-06-14 | 成都智芯雷通微系统技术有限公司 | Miniaturized four-channel transceiving variable frequency SIP |
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| CN101529650A (en) * | 2006-08-22 | 2009-09-09 | 莫列斯公司 | Impedance matched circuit board |
| CN201345363Y (en) * | 2008-10-30 | 2009-11-11 | 欣兴电子股份有限公司 | Embedded circuit board structure |
| CN101907909A (en) * | 2009-06-05 | 2010-12-08 | 鸿富锦精密工业（深圳）有限公司 | Main board with fixing hole |
| US10008452B2 (en) * | 2012-09-24 | 2018-06-26 | Intel Corporation | Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
-
2018
- 2018-08-07 CN CN201810892441.5A patent/CN108770201A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101529650A (en) * | 2006-08-22 | 2009-09-09 | 莫列斯公司 | Impedance matched circuit board |
| CN201345363Y (en) * | 2008-10-30 | 2009-11-11 | 欣兴电子股份有限公司 | Embedded circuit board structure |
| CN101907909A (en) * | 2009-06-05 | 2010-12-08 | 鸿富锦精密工业（深圳）有限公司 | Main board with fixing hole |
| US10008452B2 (en) * | 2012-09-24 | 2018-06-26 | Intel Corporation | Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111756028A (en) * | 2019-03-29 | 2020-10-09 | 北京小米移动软件有限公司 | Electronic device |
| US11437811B2 (en) | 2019-03-29 | 2022-09-06 | Beijing Xiaomi Mobile Software Co., Ltd. | Electronic device |
| CN110636701A (en) * | 2019-10-29 | 2019-12-31 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
| CN118201207A (en) * | 2024-05-20 | 2024-06-14 | 成都智芯雷通微系统技术有限公司 | Miniaturized four-channel transceiving variable frequency SIP |
| CN118201207B (en) * | 2024-05-20 | 2024-07-19 | 成都智芯雷通微系统技术有限公司 | Miniaturized four-channel transceiving variable frequency SIP |
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Application publication date: 20181106 |