CN108767484A - A kind of frequency-selective surfaces preparation process, the surface and the workpiece with the surface - Google Patents
A kind of frequency-selective surfaces preparation process, the surface and the workpiece with the surface Download PDFInfo
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- CN108767484A CN108767484A CN201810469016.5A CN201810469016A CN108767484A CN 108767484 A CN108767484 A CN 108767484A CN 201810469016 A CN201810469016 A CN 201810469016A CN 108767484 A CN108767484 A CN 108767484A
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- frequency
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- selective surfaces
- photoresist
- preparation process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention belongs to functional surface manufacture technology fields, and specifically disclose a kind of frequency-selective surfaces preparation process, the surface and the workpiece with the surface, coat a layer photoresist in the work surface of workpiece first；Then it presses preset pattern and laser direct-write photoetching processing is carried out to photoresist；Workpiece after laser direct-write photoetching is processed again is placed in developer solution, with the figure that develops；The workpiece for the figure that develops is placed in corrosive liquid again, to corrode exposed workpiece surface；Remaining photoresist is finally removed, required frequency-selective surfaces are obtained.The present invention can prepare frequency-selective surfaces on the workpiece of two and three dimensions, not have particular/special requirement to workpiece material and size, not need mask plate, and flexibility ratio is big, and producing efficiency is high, high-quality, and the frequency-selective surfaces performance of acquisition is good.
Description
Technical field
The invention belongs to functional surface manufacture technology fields, and work is prepared more particularly, to a kind of frequency-selective surfaces
Skill, the surface and the workpiece with the surface.
Background technology
Frequency-selective surfaces (Frequency Selective Surface, FSS), which are a kind of surfaces, has periodic pattern
Intelligence structure.It is generally attached in dielectric substrate material by Electricity conductive plaster or metal slit, and is in periodic arrangement, to reach
It is selective to the electromagnetic wave of special frequency channel.Study carefully its essence, FSS is a kind of spatial filter, according to demand, can be designed to
Selectively reflection, transmission or the electromagnetic wave for absorbing specific frequency.FSS can be widely applied to visible light, infrared light and other
Wave band, is particularly applicable to radar stealth technology and anti-interference aspect, and FSS possesses numerous advantages and remarkable performance.Such as：Profit
Radome is made with frequency-selective surfaces, the transmission and absorption of electromagnetic wave can be controlled, significantly reduce radar reflection
Section (RCS), has achieved the effect that stealthy；Meanwhile it also being improved because the unwanted electromagnetic wave other than working frequency range is shielded
Jamproof ability.Thus, FSS is increasingly valued by people.
Currently, preparing the frequency selecting surface technique comparative maturity of plane, mainly there is printed circuit board (PCB) technology, micro-
Straight writing technology, Computerized Numerical Control processing technology and laser direct etching technology.Frequency-selective surfaces are prepared using PCB technologies, are needed pre-
It first prepares mask plate, lacks flexibility and of high cost, the production cycle is long；Micro- straight writing technology needs accurate control nib and base material
Between distance, it is higher to the flatness requirement of base material, be difficult to realize Machining of Curved Surface；Computerized Numerical Control processing technology is accurate by controlling
Cutter processes the array pattern of frequency-selective surfaces in material surface direct etching, although this method can realize higher precision,
But processing efficiency is low, and complete equipment is expensive；Laser direct etching technology needs higher laser energy directly to peel off gold
Belong to layer formed figure, to the more demanding of laser, process velocity is generally relatively low, and graphics processing is of poor quality, machining accuracy compared with
Low and easy generated to internal insulating medium layer is damaged, and the electromagnetic performance of the FSS prepared is influenced.
By retrieval, mainly there is following frequencies that surface production program, patent document US5650249A is selected to disclose at present
A kind of method of precision manufactureing radome, this method utilize similar PCB by preparation and the conformal three-dimensional masking film plate of curved substrate
Technology, frequency-selective surfaces are prepared on curved surface, although this method can reach higher precision, it is for different
FSS array elements need to make specific mask plate, and of high cost, producing efficiency is low, and the production cycle is long.Patent document
CN103395205A discloses a kind of method making curved surface frequency-selective surfaces using 3D printing technique, and this method is first beaten with 3D
Print technology produces the bearing basement and bearing basement metallization protection shell of curved surface frequency-selective surfaces, then to bearing basement
Metallization, then bearing basement metallization protection shell is removed, final post-treated, the apparent efficiency of this method is low, and the period is long,
Waste of material is serious.Patent document CN104078762A discloses one kind and forming frequency-selective surfaces knot on not expandable curved face
The technological process of the method for structure, this method is：First with screen printing technique on PVA film the chromatography frequency-selective surfaces period
Then PVA film is laid on the water surface by array pattern, organic solvent is then sprayed on figure, so that it becomes oil film figure,
Not expandable curved face is directed at the center of oil film figure again and is slowly sunk, oil film figure is covered on not expandable curved face, shape
Screen printing forme is first made when this method utilizes screen printing technique chromatography figure at frequency-selective surfaces periodic array figure,
Including mask printing down, exposure, development, it is still desirable to make specific mask, lack flexibility and of high cost, production week
Phase is long.Patent document CN105161803A discloses a kind of graphene film frequency-selective surfaces, is replaced using graphene film
Substituting metal conductive layer obtains frequency-selective surfaces array pattern using laser ablation or Mechanical lithography or the method for 3D printing, but
It is graphene film to be attached to complex process on high-performance fiber reinforced resin base material, and cost is higher, in addition, laser ablation
The preparation speed of method is slow, and in the both sides of laser beam scan path there are larger heat affected area, remelted layer and burr, larger
Laser energy easily causes substrate damage；The processing efficiency of Mechanical lithography is low, there is processing dead angle for complex-curved；3D printing
Required graphene nano powder price is expensive, of high cost, and it is slow to prepare speed.
Invention content
For the disadvantages described above or Improvement requirement of the prior art, the present invention provides a kind of frequency-selective surfaces to prepare work
Skill, the surface and the workpiece with the surface directly prepare frequency selection by laser direct-write photoetching technology in workpiece surface
Surface is not necessarily to mask plate, has at low cost, and efficient, the advantages that processing quality is good, and precision is high is suitable for two dimensional surface frequency
The preparation for selecting surface, is particularly suitable for the preparation of the frequency-selective surfaces of three-dimension curved surface.
To achieve the above object, according to one aspect of the present invention, it is proposed that a kind of frequency-selective surfaces preparation process,
Include the following steps：
S1 coats a layer photoresist in the work surface of workpiece；
S2 carries out laser direct-write photoetching processing by preset pattern to photoresist；
Workpiece after S3 processes laser direct-write photoetching is placed in developer solution, with the figure that develops；
The workpiece for the figure that develops is placed in corrosive liquid by S4, to corrode exposed workpiece surface；
S5 removes remaining photoresist, obtains required frequency-selective surfaces.
As it is further preferred that the workpiece is made of metal conducting layer and insulating medium layer, the table to be processed of workpiece
Face is plane or curved surface.
As it is further preferred that the painting method of photoresist is spin-coating method, spray coating method, spread coating, sprinkles coating, lifting
Any one in method, infusion process, knife coating, silk screen print method, slot coated method, ink-jet printing, dotting glue method.
As it is further preferred that photoresist is one kind in positive photo glue or negative photoresist, the thickness of coating is excellent
It is selected as 1 μm~5 μm.
As it is further preferred that carrying out laser direct-write photoetching processing again after the photoresist drying of coating, drying temperature is excellent
70~100 DEG C are selected as, drying time is preferably 5min~20min.
As it is further preferred that carrying out laser direct-write photoetching processing, laser direct-writing light using laser direct-write photoetching equipment
The laser power for carving processing is preferably 200mW~800mW, and sweep speed is preferably 200mm/s~1500mm/s, and processing times are excellent
It is selected as 1~10 time.
As it is further preferred that developer solution and photoresist used are mating.
As it is further preferred that corrosive liquid is to erode metal conducting layer and to the undamaged liquid of insulating medium layer
Body.
It is another aspect of this invention to provide that a kind of frequency-selective surfaces are provided, by the frequency-selective surfaces system
It is prepared by standby technique.
It is another aspect of this invention to provide that providing a kind of workpiece, workpiece surface preparation has the frequency selection table
Face.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, mainly have below
Technological merit：
1. inventor it has been investigated that, in existing frequency-selective surfaces preparation process, be generally required to prepare mask plate,
It is there are of high cost, and producing efficiency is low, and the production cycle is long, the problem of lacking flexibility, the invention by laser direct-writing
Photoetching technique is applied in the preparation of frequency-selective surfaces, can effectively solve the problems, such as existing preparation process, has flexibility ratio big,
Producing efficiency is high, high-quality, the good advantage of the frequency-selective surfaces performance of acquisition.
2. the present invention is applicable not only to prepare plan frequency selection surface, can be also used for preparing can not be launched into plane
Curved surface frequency-selective surfaces are not limited by preparation process, the shape and size of workpiece itself, it can be achieved that Three-dimension process.
3. the preparation process of the present invention is applied to the preparation of curved surface frequency-selective surfaces, can directly it be processed on curved surface
Type prepares and is spliced without fragment, and producing efficiency is high, good product quality.
4. the present invention is not necessarily to mask, processing cost is reduced, and preset pattern, flexibility ratio can be changed at any time as needed
Height, convenient and efficient, preparation efficiency is high.
5. the coating thickness due to photoresist has a great influence to the quality of product after photoetching, the present invention to its thickness into
It has gone and has studied repeatedly, it is 1~5 μm to finally determine optimal thickness, under the thickness parameter, on the one hand may make preset pattern
It can be quickly obtained, graph outline is clear, ensures graphics shape and quality, is on the other hand convenient for the fast and effective of remaining photoresist
Removal ensures the final quality of frequency-selective surfaces.
6. the present invention is also studied and has been designed to the stoving process of photoresist, the stoving process and the light finally coated
Photoresist performance is closely bound up, and the present invention is by having determined optimum process so that drying temperature is preferably 70~100 DEG C, is dried
The dry time is preferably 5min~20min, ensures the photoresist film layer needed for obtaining, and then ensures the final matter of frequency-selective surfaces
Amount.
7. the present invention is also studied and designed to laser direct-write photoetching processing technology, which prepares with final
Frequency-selective surfaces performance it is closely bound up, the present invention is by having determined optimum process so that laser power 200mW
~800mW, sweep speed are 200mm/s~1500mm/s, ensure the matter of the frequency-selective surfaces finally prepared under this technique
Amount and performance.
Description of the drawings
Fig. 1 is the flow chart of the frequency-selective surfaces preparation process of the present invention；
Fig. 2 is plan frequency selection surface prepared by the embodiment of the present invention 1；
Fig. 3 is hemispheric curved surface frequency-selective surfaces prepared by the embodiment of the present invention 5；
The array pattern of the sides of being Fig. 4 ring frequency-selective surfaces；
Fig. 5 a-d are the microscopic appearance comparison diagrams for the frequency-selective surfaces that embodiment 1 is prepared with comparative example 1.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
It does not constitute a conflict with each other and can be combined with each other.
The existing method for being used to prepare frequency-selective surfaces (FSS) needs to make specific mask plate, of high cost, system
It is low to make efficiency, the production cycle is long, and lacks flexibility, it is difficult to realize Machining of Curved Surface.Numerous studies have been carried out based on the invention people,
A kind of new frequency-selective surfaces preparation process is sought to, fundamentally to abandon mask plate, and then is fundamentally overcome existing
There is inevitable defect caused by the presence in method due to mask plate.Laser writing technology (laser direct-write photoetching technology)
As processing technology more common at present, have the advantages that at low cost, efficient, processing quality is good, is mainly used for making flat
Face calculates full figure, mask, lenticule, microlens array, Fresnel lenticules, Fresnel zone plates, continuous position phase embossment
Glitter optical element etc., but does not find that someone is applied in the preparation of frequency-selective surfaces, the present inventor's examination
The property visited is studied, and attempts to use it in frequency-selective surfaces, finds that the technology is applicable in very much in continuous attempt
In the processing of frequency-selective surfaces, and following technique effect can be obtained：Table is selected into line frequency using laser direct-write photoetching technology
When face processes, it is not necessary that mask plate is arranged, it can fundamentally solve the problems, such as that existing preparation method exists, while using the work
Skill, can also be high to curved surface progress other than it can carry out high-precision to plane and process without particular requirement to the surface shape of workpiece
Precision is processed, and the defect of existing preparation process is effectively overcome.Although laser direct-write photoetching technology is more mature technology,
It is applied in the preparation of frequency-selective surfaces and is obtained the unexpected discovery for the first time for having the technical effect that the present invention, it is this
It was found that making frequency-selective surfaces can be used to be different from the completely new technique of existing preparation process and prepare, have that flexibility ratio is high,
Convenient and efficient, preparation efficiency is high, at low cost, it can be achieved that the advantages that Three-dimension process.
Specifically, the present invention coats a layer photoresist in workpiece surface, using focusing laser beam according to being pre-designed
The array pattern of frequency-selective surfaces, the workpiece to being covered with photoresist carry out direct-write photoetching processing, and then developed, burn into is gone
Glue obtains final frequency-selective surfaces.The technology can directly prepare frequency-selective surfaces on the workpiece of two and three dimensions,
There is no particular/special requirement to workpiece material and size, you can selected again in workpiece surface direct forming frequency after the completion to be prepared in workpiece
Select surface, need not rely upon the preparation process of workpiece, the shape and size of workpiece itself, be different from it is existing need to be in workpiece
Frequency-selective surfaces are shaped in preparation process, and existing preparation method needs to prepare mask plate, there are of high cost, producing efficiency
The problem of low, the production cycle is long, shortage flexibility, the present invention is not necessarily to mask plate, can be directly needed for the preparation of arbitrary workpiece surface
Frequency-selective surfaces, flexibility ratio is big, and producing efficiency is high, high-quality, and the frequency-selective surfaces performance of acquisition is good, the array of acquisition
Lines in figure are smooth, and line edge is straight and precipitous, and graph outline is clear.As shown in figure 4, the square ring frequency selection prepared
Surface, by it with to band logical mode filter, the transmitance at 7GHz frequencies has very wide -3dB bands up to 97% or more
It is wide.
As shown in Figure 1, a kind of frequency-selective surfaces preparation process provided in an embodiment of the present invention, includes the following steps：
S1 coats a layer photoresist in the work surface of workpiece；
Workpiece is usually the composite structure being made of metal conducting layer and insulating medium layer, wherein metal conducting layer packet
Gold, silver, copper or aluminium etc. are included but are not limited to, insulating medium layer includes but not limited to epoxy glass fiber composite material, organic glass, carbon fiber
Tie up composite material or polyethylene glycol phthalate etc.；The surface that processes needed for workpiece can also be either plane
Curved surface, which refers to the surface of metal conducting layer, which includes tablet, hemispherical, elliposoidal, circular cone
Shape, cylinder or circular ring shape etc., workpiece size is not construed as limiting；Specifically, spin-coating method, spraying can be used in the painting method of photoresist
Method, sprinkles coating, czochralski method, infusion process, knife coating, silk screen print method, slot coated method, ink-jet printing, dotting glue method at spread coating
In any one；Photoresist is one kind in positive photo glue or negative photoresist, and the thickness of coating is preferably 1 μm~5 μ
m。
S2 carries out laser direct-write photoetching processing by preset pattern to photoresist；
Photoresist is dried first, then by clamping workpiece in laser direct-write photoetching equipment, through being accurately positioned and being arranged conjunction
Suitable laser processing parameter, it refers to determining that the work surface of workpiece is placed in laser focal plane using laser range finder to be accurately positioned
Place, precision is up to 10 μm.By the progress direct-write photoetching processing of preset line pattern, needed for the frequency-selective surfaces of the figure and preparation
Figure correspond to, such as slot type square loop, the gap inward flange length of side is 6.45mm, and the outer edge length of side is 7.05mm, gap
Width is 300 μm, period 8mm, as shown in Figure 4.Slot type square loop frequency-selective surfaces have the filtering characteristic of band logical,
Transmitance at 7GHz is up to 97% or more, and-three dB bandwidth is 3.04GHz (5.48GHz~8.52GHz)；Specifically, drying
Temperature is preferably 70 DEG C~100 DEG C, and drying time is preferably 5min~20min；Specifically, using existing laser direct-write photoetching
The laser direct-write photoetching of the present invention can be realized in equipment, and general laser direct-write photoetching equipment includes laser, scanning galvanometer, gathers
Burnt mirror and x-y-z three-shaft linkage numerical control table, NC tables, wherein laser is used as exposure light source；Scanning galvanometer is poly- for quickly manipulating
The position of burnt hot spot；Dynamic focusing mirror is applied not only to focused laser beam, and can control the position of focal plane；X-y-z tri-
Axis linkage numerical control workbench coordinates scanning galvanometer and dynamic focusing mirror to realize large scale and curve surface work pieces for controlling workpiece movement
Processing.It is preferably 200mW~800mW (milliwatt) that the machined parameters of laser direct-write photoetching processing, which are preferably laser power, scanning
Speed is preferably 200mm/s~1500mm/s, and processing times are preferably 1~10 time.
Workpiece after S3 processes laser direct-write photoetching is placed in developer solution, with the figure that develops；Wherein, developer solution and institute
Photoresist is mating so that figure effectively develops, and after figure development, place corresponding with figure will on metal conducting layer at this time
It is exposed outside.
The workpiece for the figure that develops is placed in corrosive liquid by S4, and making exposed workpiece surface, (i.e. exposed metal is led
Electric layer) it is eroded completely；Wherein, corrosive liquid meets following condition：Metal conducting layer can be eroded and to insulating medium layer
Not damaged, etching time is preferably 5min.
S5 is last, removes remaining photoresist, you can obtains high quality, high performance frequency-selective surfaces.
It is specific embodiments of the present invention below：
Embodiment 1
Length is 200mm, width 200mm, inner dielectric layer are epoxy glass fiber composite material, outer conductive layers be gold
The flat panel workpieces surface for belonging to copper is coated with one layer of diazo naphthoquinone class positive photo glue using spin-coating method；
1min is dried at 100 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 40mW, scanning speed to be accurately positioned and laser power is arranged
500mm/s is spent, processing times 2 times carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in in the developer solution mating with above-mentioned photoresist the figure that develops；
Workpiece is placed in ferric trichloride corrosive liquid again and erodes exposed copper；
Finally remove remaining photoresist, you can obtain the frequency-selective surfaces of high quality, high performance plane, such as Fig. 2
It is shown.
Embodiment 2
Length is 250mm, width 150mm, inner dielectric layer are carbon fibre composite, outer conductive layers are metal
The flat panel workpieces surface of silver is coated with one layer of diazo naphthoquinone class positive photo glue using spray coating method；
5min is dried at 90 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 200mW, scanning speed to be accurately positioned and laser power is arranged
1000mm/s is spent, processing times 1 time carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in in the developer solution mating with above-mentioned photoresist the figure that develops；
Workpiece is placed in ferric trichloride corrosive liquid again and erodes exposed copper；
Finally remove remaining photoresist, you can obtain the frequency-selective surfaces of high quality, high performance plane.
Embodiment 3
In the tablet work that length is 350mm, width 150mm, inner dielectric layer are organic glass, conductive layer is metallic gold
Part surface is coated with one layer of cyclopentadiene negative photoresist using spray coating method；
10min is dried at 80 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 500mW, scanning speed to be accurately positioned and laser power is arranged
200mm/s is spent, processing times 1 time carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in in the developer solution mating with above-mentioned photoresist the figure that develops；
Workpiece is placed in ferric trichloride corrosive liquid again and erodes exposed copper；
Finally remove remaining photoresist, you can obtain the frequency-selective surfaces of high quality, high performance plane.
Embodiment 4
Length is 250mm, width 100mm, inner dielectric layer are polyethylene glycol phthalate, outer conductive layers
For the flat panel workpieces surface of metallic aluminium, one layer of cinnamate derivative negative photoresist is coated with using bold and vigorous coating；
20min is dried at 70 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 20mW, scanning speed to be accurately positioned and laser power is arranged
700mm/s is spent, processing times 2 times carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in the developer solution mating with above-mentioned photoresist, develop figure；
Workpiece is placed in ferric trichloride corrosive liquid again and erodes exposed copper；
Finally remove remaining photoresist, you can obtain the frequency-selective surfaces of high quality, high performance plane.
Embodiment 5
In the hemispherical workpiece table that a diameter of 150mm, inner dielectric layer are organic glass, outer conductive layers are metallic copper
Face is coated with one layer of diazo naphthoquinone class positive photo glue using czochralski method；
10min is dried at 80 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 40mW, scanning speed to be accurately positioned and laser power is arranged
400mm/s is spent, processing times 1 time carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in the developer solution mating with above-mentioned photoresist, develop figure；
Workpiece is placed in ferric trichloride corrosive liquid again and erodes exposed copper；
Finally remove remaining photoresist, you can high quality, high performance hemispheric curved surface frequency-selective surfaces are obtained,
As shown in Figure 3.
Embodiment 6
It is 400mm, short axle 150mm, be highly 100mm, inner dielectric layer is carbon fibre composite, outside in long axis
The elliposoidal workpiece surface that conductive layer is formed by metallic silver layer is coated with one layer of diazo naphthoquinone class positive photo glue using spray coating method；
5min is dried at 90 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 100mW, scanning speed to be accurately positioned and laser power is arranged
1500mm/s is spent, processing times 1 time carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in the developer solution mating with above-mentioned photoresist, develop figure；
Workpiece is placed in nitric acid corrosive liquid again and erodes exposed silver；
Finally remove remaining photoresist, you can obtain the frequency-selective surfaces of high quality, high performance elliposoidal.
Embodiment 7
In a diameter of 75mm, highly be 120mm, inner dielectric layer is polyethylene glycol phthalate, outer conductive layers
In the conical workpieces formed by metallic aluminum, one layer of SU-8 class negative photoresist is coated with using czochralski method；
4min is dried at 100 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 800mW, scanning speed to be accurately positioned and laser power is arranged
1000mm/s is spent, processing times 2 times carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in the developer solution mating with above-mentioned photoresist, develop figure；
Workpiece is placed in again in the corrosive liquid being made of phosphoric acid and ethyl alcohol and erodes exposed aluminium；
Finally remove remaining photoresist, you can obtain high quality, high performance cone frequency-selective surfaces.
Embodiment 8
In a diameter of 150mm, highly be 280mm, inner dielectric layer is epoxy glass fiber composite material, outer conductive layers be gold
Belong to the cylindrical surface that layers of copper is formed, a strata acid imide negative photoresist is coated with using spread coating；
4min is dried at 100 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 200mW, scanning speed to be accurately positioned and laser power is arranged
200mm/s is spent, processing times 2 times carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in the developer solution mating with above-mentioned photoresist, develop figure；
Workpiece is placed in ferric trichloride corrosive liquid again and erodes exposed copper；
Finally remove remaining photoresist, you can obtain the frequency-selective surfaces of high quality, high performance cylinder.
Embodiment 9
Outer annular diameter is 300mm, inner ring be directly 100mm, inner dielectric layer is carbon fibre composite, external conductive
Layer is the annular workpiece surface that metal copper layer is formed, and one layer of diazo naphthoquinone class positive photo glue is coated with using czochralski method；
4min is dried at 100 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 200mW, scanning speed to be accurately positioned and laser power is arranged
300mm/s is spent, processing times 2 times carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in the developer solution mating with above-mentioned photoresist, develop figure；
Workpiece is placed in ferric trichloride corrosive liquid again and erodes exposed copper；
Finally remove remaining photoresist, you can obtain high quality, high performance circular ring shape frequency-selective surfaces.
Embodiment 10
In the hemispherical workpiece that a diameter of 150mm, inner dielectric layer are epoxy glass fiber composite material, outer conductive layers are gold
Surface is coated with one layer of diazo naphthoquinone class positive photo glue using spray coating method；
30min is dried at 80 DEG C, is including then laser, scanning galvanometer, focus lamp and x-y-z by clamping workpiece
In the laser direct-write photoetching equipment of three-shaft linkage numerical control table, NC table etc., it is 40mW, scanning speed to be accurately positioned and laser power is arranged
900mm/s is spent, processing times 2 times carry out direct-write photoetching processing using laser according to the figure being pre-designed；
Workpiece after direct-write photoetching is placed in the developer solution mating with above-mentioned photoresist, develop figure；
Workpiece is placed in chloroazotic acid corrosive liquid again and erodes exposed gold；
Finally remove remaining photoresist, you can obtain high quality, high performance hemispheric frequency-selective surfaces.
Comparative example 1
This comparative example is compared with embodiment 1, illustrates to prepare by laser direct-write photoetching technology and laser etching techniques
Frequency-selective surfaces difference, which includes the following steps：Select length for 200mm, width 200mm, internal Jie
Matter layer is epoxy glass fiber composite material, the flat panel workpieces that outer conductive layers are metallic copper, and workpiece is placed in three-shaft linkage numerical control work
Make on platform, it is 12W to be accurately positioned and laser power is arranged, and sweep speed 200mm/s, processing times 4 times, which is by pre-
The mcxst optimizing experimental parameters determined by standby orthogonal experiment, using laser according to the direct stripping metal layer of figure same as Example 1,
Obtain frequency-selective surfaces.
It measures and finds, macroscopically, the mismachining tolerances of the frequency-selective surfaces of comparative example 1 is 4.33%, and process time is
62min；And the mismachining tolerance of embodiment 1 is 2.67%, process time is only 8min.It can be seen that laser direct-write photoetching technology is not
Only mismachining tolerance is substantially better than laser etching techniques, and process time nearly shorten to the 1/8 of laser etching techniques.It is microcosmic
On, there are apparent heat affected areas for the frequency-selective surfaces slot edge of comparative example 1, there is many burrs and remelting impurity, seam
Gap edge is irregular, and base material thermal damage is serious, as shown in Fig. 5 c-d；And the frequency-selective surfaces slot edge of embodiment 1 is smooth,
It is neat and steep, to base material and not damaged, as shown in Fig. 5 a-b.In terms of electromagnetic performance, the frequency that two methods are obtained is selected
It selects surface and is applied to bandpass filter, the transmittance of wherein comparative example 1 is only 67.14%, and-three dB bandwidth is only 1.76GHz；And
The transmissivity for implementing 1 is up to 97.75%, and-three dB bandwidth is 3.04GHz, the frequency-selective surfaces that laser direct-write photoetching technology obtains
Electromagnetic performance be substantially better than laser etching techniques.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all within the spirits and principles of the present invention made by all any modification, equivalent and improvement etc., should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of frequency-selective surfaces preparation process, which is characterized in that include the following steps：
S1 coats a layer photoresist in the work surface of workpiece；
S2 carries out laser direct-write photoetching processing by preset pattern to photoresist；
Workpiece after S3 processes laser direct-write photoetching is placed in developer solution, with the figure that develops；
The workpiece for the figure that develops is placed in corrosive liquid by S4, to corrode exposed workpiece surface；
S5 removes remaining photoresist, obtains required frequency-selective surfaces.
2. frequency-selective surfaces preparation process as described in claim 1, which is characterized in that the workpiece by metal conducting layer and
Insulating medium layer is constituted, and the work surface of workpiece is plane or curved surface.
3. frequency-selective surfaces preparation process as described in claim 1, which is characterized in that the painting method of photoresist is spin coating
Method, spread coating, sprinkles coating, czochralski method, infusion process, knife coating, silk screen print method, slot coated method, inkjet printing at spray coating method
Any one in method, dotting glue method.
4. frequency-selective surfaces preparation process as described in claim 1, which is characterized in that photoresist is positive photo glue or bears
The thickness of one kind in type photoresist, coating is preferably 1 μm~5 μm.
5. frequency-selective surfaces preparation process as described in claim 1, which is characterized in that after the drying of the photoresist of coating again into
Row laser direct-write photoetching is processed, and drying temperature is preferably 70~100 DEG C, and drying time is preferably 5min~20min.
6. frequency-selective surfaces preparation process as described in claim 1, which is characterized in that using laser direct-write photoetching equipment into
Row laser direct-write photoetching is processed, and the laser power of laser direct-write photoetching processing is preferably 200mW~800mW, and sweep speed is preferred
For 200mm/s~1500mm/s, processing times are preferably 1~10 time.
7. frequency-selective surfaces preparation process as described in claim 1, which is characterized in that developer solution is matched with photoresist used
Set.
8. frequency-selective surfaces preparation process as described in claim 1, which is characterized in that corrosive liquid is by metal conducting layer corruption
Eating away and to the undamaged liquid of insulating medium layer.
9. a kind of frequency-selective surfaces, which is characterized in that prepare work by claim 1-8 any one of them frequency-selective surfaces
It is prepared by skill.
10. a kind of workpiece, which is characterized in that workpiece surface preparation has frequency-selective surfaces as claimed in claim 9.
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| CN110247192A (en) * | 2019-05-13 | 2019-09-17 | 华中科技大学 | A kind of flexible resistor film frequency-selective surfaces, preparation method and application |
| CN110824848A (en) * | 2018-08-09 | 2020-02-21 | 许铭案 | Curved substrate with surface groove structure and manufacturing method thereof |
| CN110034388B (en) * | 2019-04-18 | 2024-02-06 | 浙江清华柔性电子技术研究院 | Antenna preparation method and antenna with same |
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