CN108761999A - Mask plate and preparation method thereof, array substrate and preparation method thereof, display device - Google Patents
Mask plate and preparation method thereof, array substrate and preparation method thereof, display device Download PDFInfo
- Publication number
- CN108761999A CN108761999A CN201810819376.3A CN201810819376A CN108761999A CN 108761999 A CN108761999 A CN 108761999A CN 201810819376 A CN201810819376 A CN 201810819376A CN 108761999 A CN108761999 A CN 108761999A
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- Prior art keywords
- transparent
- light
- mask plate
- film layer
- spirte
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- 239000000758 substrate Substances 0.000 title claims abstract description 132
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 230000035699 permeability Effects 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims description 73
- 238000004519 manufacturing process Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 18
- 125000006850 spacer group Chemical group 0.000 claims description 16
- 238000009738 saturating Methods 0.000 claims description 9
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 7
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 239000010408 film Substances 0.000 claims 13
- 230000003287 optical effect Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 238000010586 diagram Methods 0.000 description 10
- 238000000151 deposition Methods 0.000 description 6
- 230000014759 maintenance of location Effects 0.000 description 6
- 101001117317 Homo sapiens Programmed cell death 1 ligand 1 Proteins 0.000 description 4
- 102100024216 Programmed cell death 1 ligand 1 Human genes 0.000 description 4
- 101001117312 Homo sapiens Programmed cell death 1 ligand 2 Proteins 0.000 description 3
- 102100024213 Programmed cell death 1 ligand 2 Human genes 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
Abstract
The present invention discloses a kind of mask plate and preparation method thereof, array substrate and preparation method thereof, display device, is related to display technology field, and the angle of gradient to solve the problems, such as film layer in the display device made of the prior art is larger.The mask plate includes the partial light permeability figure of light-transparent substrate and at least three kinds different transmitances being arranged in the light-transparent substrate, and the partial light permeability figure of described at least three kinds different transmitances is arranged in order according to transmitance size.Mask plate provided by the invention is for making film layer.
Description
Technical field
The present invention relates to display technology field more particularly to a kind of mask plate and preparation method thereof, array substrate and its systems
Make method, display device.
Background technology
With the continuous development of display technology, the type of display device is more and more, wherein active matrix organic light-emitting two
Polar body (English：Active-matrix organic light emitting diode, hereinafter referred to as：AMOLED) display device
With its self-luminous, reaction is fast, visual angle is wide, brightness is high the advantages that receive the extensive concern of people.
Displayer part includes mainly luminescence unit part and back plane circuitry part, and this two parts includes stacking
The stratified film of setting.Currently, the prior art is in each film layer in making displayer part, it is generally hardened using mask
Patterning processes are closed to make, but the film layer angle of gradient produced is larger, when leading to the film layer continued after manufacturing, subsequent film layer
Difficulty is connected at the angle of gradient, is easy to happen fracture, product yield is caused to reduce.
Invention content
The purpose of the present invention is to provide a kind of mask plate and preparation method thereof, array substrate and preparation method thereof, displays
Device, the angle of gradient for solving the problems, such as film layer in the display device using prior art making are larger.
To achieve the goals above, the present invention provides the following technical solutions：
The first aspect of the present invention provides a kind of mask plate, including light-transparent substrate and is arranged in the light-transparent substrate extremely
The partial light permeability figure of few three kinds of different transmitances, the partial light permeability figure of described at least three kinds different transmitances is according to transmitance
Size is arranged in order.
Further, the partial light permeability figure of described at least three kinds different transmitances includes first part's transparent figure, the
The transmitance of two partial light permeability figures and Part III transparent figure, first part's transparent figure is more than the second part
The transmitance of transparent figure, the transmitance of the second part transparent figure are more than the transmission of the Part III transparent figure
Rate；
In first part's transparent figure, the second part transparent figure and the Part III transparent figure extremely
Few one limits open region, and first part's transparent figure, the second part light transmission figure in the light-transparent substrate
Shape and the Part III transparent figure are arranged in order along close to the open region to the direction far from the open region.
Further, first part's transparent figure, the second part transparent figure and the Part III light transmission
The material identical of figure, and first part's transparent figure is less than institute in the thickness on the direction of the light-transparent substrate
Second part transparent figure is stated in the thickness on the direction of the light-transparent substrate, the second part transparent figure is being hung down
Directly it is less than the Part III transparent figure perpendicular to the light-transparent substrate in the thickness on the direction of the light-transparent substrate
Thickness on direction.
Further, first part's transparent figure, the second part transparent figure and the Part III light transmission
Figure prepares material including chromium oxide.
Further, the Part III transparent figure is described in the thickness on the direction of the light-transparent substrate
First part's transparent figure is being hung down in the thickness on the direction of the light-transparent substrate with the second part transparent figure
Directly in the sum of the thickness on the direction of the light-transparent substrate.
Further, for the transmitance of first part's transparent figure between 40%~60%, the second part is saturating
For the transmitance of light figure between 3%~7%, the transmitance of the Part III transparent figure is first part's light transmission figure
The product of the transmitance of shape and the transmitance of the second part transparent figure.
Based on the technical solution of above-mentioned mask plate, the second aspect of the present invention provides a kind of production method of mask plate, uses
In the above-mentioned mask plate of making, the production method includes：
The partial light permeability figure of at least three kinds different transmitances, described at least three kinds different transmissions are formed in light-transparent substrate
The partial light permeability figure of rate is arranged in order according to transmitance size.
Further, when the partial light permeability figure of described at least three kinds different transmitances include first part's transparent figure,
It is described that at least three kinds different transmitances are formed in light-transparent substrate when second part transparent figure and Part III transparent figure
The step of partial light permeability figure, specifically includes：
The deposition fraction translucent material in the light-transparent substrate；
Patterned process is carried out to the partial light permeability material, obtains first part's transparent figure, second described
Point transparent figure and the Part III transparent figure, first part's transparent figure, the second part transparent figure and
The Part III transparent figure is arranged in order according to thickness size.
Further, when the partial light permeability figure of described at least three kinds different transmitances include first part's transparent figure,
It is described that at least three kinds different transmitances are formed in light-transparent substrate when second part transparent figure and Part III transparent figure
The step of partial light permeability figure, specifically includes：
First part's translucent material is deposited in the light-transparent substrate；
First part's translucent material is patterned, the second spirte is formed；
Second part translucent material is deposited, the second part translucent material covers second spirte and the light transmission
The part not covered by second spirte in substrate；
The second part translucent material is patterned, the first spirte and third spirte are formed, wherein described the
One spirte is located at the surface of the light-transparent substrate, and is abutted with second spirte, and the third spirte is located at described
Second spirte is backwards to the one side of the light-transparent substrate, and orthographic projection and institute of the third spirte in the light-transparent substrate
Stating has pre-determined distance between orthographic projection of first spirte in the light-transparent substrate；
First part's transparent figure includes the first spirte, and the second part transparent figure includes second son
The part not covered by the third spirte in figure；The Part III transparent figure includes the third spirte and institute
State the part covered by the third spirte in the second spirte.
Based on the technical solution of above-mentioned mask plate, the third aspect of the present invention provides a kind of production method of array substrate,
The step of making the film layer in the array substrate including the use of above-mentioned mask plate, the film layer have at least three kinds of different thickness
Degree.
Further, the film layer in the array substrate includes pixel defining layer and spacer layer, when the mask plate packet
When including at least three partial light permeability figures, the pixel defining layer is made using the mask plate and the step of the spacer layer
It specifically includes：
Photosensitive film layer is formed using photosensitive material；
The photosensitive film layer is exposed using the mask plate, photosensitive film layer is formed and removes region and at least three
A photosensitive film layer partly retains region；
Develop to the photosensitive film layer after exposure, the photosensitive film layer in region will be removed positioned at the photosensitive film layer
It completely removes, the photosensitive film layer segment that region is retained positioned at least three photosensitive film layer half is removed, is formed at least
The photosensitive figure of three different-thickness, wherein most thick photosensitive figure removes the most thick sensitogram as the spacer layer
The remaining photosensitive figure is as the pixel defining layer except shape.
The technical solution of production method based on above-mentioned array substrate, the fourth aspect of the present invention provide a kind of array base
Plate is made of the production method of above-mentioned array substrate, and being formed in the array substrate has at least three kinds of different thickness
Film layer.
Further, the film layer with different thickness includes pixel defining layer, the pixel defining layer limit to
A few pixel region, from the close pixel region to the direction far from the pixel region, the pixel defining layer
Thickness gradually increases.
Based on the technical solution of above-mentioned array substrate, the fifth aspect of the present invention provides a kind of display device, including above-mentioned
Array substrate.
In technical solution provided by the invention, mask plate includes at least three kinds different transmitances being arranged in light-transparent substrate
Partial light permeability figure, and the partial light permeability figure of this at least three kinds different transmitances is arranged in order according to transmitance size.?
When making film layer using mask plate provided by the invention, made film layer can include at least three kinds of thickness, and thick in film layer
The stepped arrangement of different each sections is spent, it therefore, can be in film layer when making film layer using mask plate provided by the invention
The smaller angle of gradient is formed, to be avoided well when making other film layers in the film layer, other film layers are at the angle of gradient
The problem of connecting difficulty, being easy to happen fracture, preferably ensure that the production yield of product.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and constitutes the part of the present invention, this hair
Bright illustrative embodiments and their description are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is the first schematic diagram of mask plate provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram provided in an embodiment of the present invention that film layer is made using mask plate；
Fig. 3 is the second schematic diagram of mask plate provided in an embodiment of the present invention；
Fig. 4 a- Fig. 4 h are the production process schematic diagram of mask plate provided in an embodiment of the present invention；
Fig. 5 is the third schematic diagram of mask plate provided in an embodiment of the present invention；
Fig. 6 is the first schematic diagram provided in an embodiment of the present invention that PDL and PS is made of mask plate；
Fig. 7 is the second schematic diagram provided in an embodiment of the present invention that PDL and PS is made of mask plate；
Fig. 8 is the distribution schematic diagram of PDL provided in an embodiment of the present invention and PS；
Fig. 9 is the 4th schematic diagram of mask plate provided in an embodiment of the present invention；
Figure 10 is the 5th schematic diagram of mask plate provided in an embodiment of the present invention.
Reference numeral：
1- mask plates, 10 light-transparent substrates,
11- first parts transparent figure, 12- second part transparent figures,
13- Part III transparent figures, the first spirtes of 110-,
111- second part translucent materials, the second spirtes of 120-,
121- first parts translucent material, 130- third spirtes,
140- photoresists, 2- film layers,
PDL- pixel defining layers, PS- spacer layers,
3- pixel regions, 4- substrates,
The open regions 5-.
Specific implementation mode
Mask plate that embodiment provides in order to further illustrate the present invention and preparation method thereof, array substrate and its making side
Method, display device, are described in detail with reference to the accompanying drawings of the specification.
Referring to Fig. 1, the embodiment of the present invention provides a kind of mask plate 1, including light-transparent substrate 10 and setting in light-transparent substrate
The partial light permeability figure of at least three kinds different transmitances on 10, the partial light permeability figure of at least three kinds different transmitances is according to saturating
The rate size of mistake is arranged in order.
Specifically, the transmitance for the partial light permeability figure that above-mentioned mask plate 1 includes can be arranged according to actual needs, when setting
Set partial light permeability figure transmitance it is larger when, the intensity being exposed to material layer by the partial light permeability figure is larger, when
When the transmitance of setting unit transparent figure is smaller, the intensity being exposed to material layer by the partial light permeability figure is smaller.
As shown in Fig. 2, when making film layer 2 using above-mentioned mask plate 1, the first making material layer on corresponding substrate 4 is (such as
Photosensitive material), then mask plate 1 is aligned with the substrate 4 for being formed with material layer, it is then right by the mask plate 1
Material layer is exposed (broad arrow direction represents direction of illumination in Fig. 2), due to including at least three kinds different transmissions on mask plate 1
The partial light permeability figure of rate, and the partial light permeability figure of at least three kinds different transmitances is arranged in order according to transmitance size, because
This, material layer forms the different region of at least three depth of exposure, and at least three exposure journeys after being exposed by mask plate 1
Different regions is spent to be arranged in order according to the size of depth of exposure.After being exposed technique, using developer solution to exposure after
Material layer is cleaned, to form the film layer 2 at least three kinds thickness.
According to the concrete structure of above-mentioned mask plate 1, and using the mask plate 1 make film layer 2 detailed process it is found that by
In mask plate 1 provided in an embodiment of the present invention, include the portion of be arranged in light-transparent substrate 10 at least three kinds different transmitances
Divide transparent figure, and the partial light permeability figure of this at least three kinds different transmitances is arranged in order according to transmitance size so that
When making film layer 2 using mask plate 1 provided in an embodiment of the present invention, made film layer 2 can include at least three kinds of thickness, and
Therefore the stepped arrangement of the different each section of thickness in film layer 2 makes film using mask plate 1 provided in an embodiment of the present invention
When layer 2, the smaller angle of gradient can be formed in film layer 2, and other film layers 2 are made in the film layer 2 to avoid well
When, other film layers 2 connect difficulty at the angle of gradient, the problem of being easy to happen fracture, preferably ensure that the production yield of product.
It is noted that the quantity for the partial light permeability figure with different transmitances that above-mentioned mask plate 1 includes can root
It is arranged according to actual needs, partial light permeability figure (such as Fig. 1 of three kinds of different transmitances can illustratively, on above-mentioned mask plate 1 be set
It is shown), i.e. first part's transparent figure 11, second part transparent figure 12 and Part III transparent figure 13, below with mask
It is arranged on plate 1 for the partial light permeability figure of three kinds of different transmitances, the concrete structure of mask plate 1 is illustrated.
Further, the partial light permeability figure for at least three kinds different transmitances that above-mentioned mask plate 1 includes includes first
Partial light permeability figure 11, second part transparent figure 12 and Part III transparent figure 13, first part's transparent figure 11 it is saturating
The transmitance that rate is more than second part transparent figure 12 is crossed, the transmitance of second part transparent figure 12 is more than Part III light transmission
The transmitance of figure 13；In first part's transparent figure 11, second part transparent figure 12 and Part III transparent figure 13
It is at least one that open region 5, and first part's transparent figure 11,12 and of second part transparent figure are limited in light-transparent substrate 10
Part III transparent figure 13 is arranged in order along close to open region 5 to the direction far from open region 5.
Specifically, when the partial light permeability figure of above-mentioned three kinds different transmitances is arranged in order according to transmitance size, including
A variety of specific distribution modes are set forth below two kinds of specific distribution modes, but are not limited only to this.
First way, as shown in Figure 1, first part's transparent figure 11 is that can limit opening in light-transparent substrate 10
The closed figure in area 5, second part transparent figure 12 surround first part's transparent figure 11, and Part III transparent figure 13 is surrounded
Second part transparent figure 12, and second part transparent figure 12 is contacted with first part transparent figure 11, Part III light transmission
Figure 13 is contacted with second part transparent figure 12.
The second way, as shown in figure 9, first part's transparent figure 11 is that can limit opening in light-transparent substrate 10
The closed figure in area 5, second part transparent figure 12 surround first part's transparent figure 11, and Part III transparent figure 13 is arranged
In side of the second part transparent figure 12 far from first part's transparent figure 11, and Part III transparent figure 13 does not surround
Two partial light permeability figures 12.
The third mode, as shown in figure 3, first part's transparent figure 11, second part transparent figure 12 and Part III
Transparent figure 13 limits open region 5 jointly, and first part's transparent figure 11 is located at open region and the second part light transmission
Between figure 12, first part's transparent figure 11 and second part transparent figure 12 can not individually limit open region 5.
4th kind of mode, as shown in Figure 10, first part's transparent figure 11 are that can be limited open in light-transparent substrate 10
The closed figure of mouth region 5, second part transparent figure 12 do not surround first part's transparent figure 11, Part III transparent figure 13
It is arranged in side of the second part transparent figure 12 far from first part's transparent figure 11, and Part III transparent figure 13 is not wrapped
Enclose second part transparent figure 12.
For above-mentioned various ways, as shown in Fig. 2, foring first area 6 corresponding with open region 5, position on substrate 4
Prolong the direction far from first area 6 in the ladder-like of rising, to preferably in the thickness of the film layer 2 on 6 periphery of first area
Reduce the angle of gradient of the film layer 2 positioned at 6 periphery of first area so that the other film layers for the cover layer 2 being subsequently formed can
It is preferably connected at the angle of gradient, to ensure that the production yield of product.
Further, above-mentioned first part's transparent figure 11, second part transparent figure 12 and Part III transparent figure
13 material identical, and first part's transparent figure 11 is less than second part in the thickness on the direction of light-transparent substrate 10
Transparent figure 12 is in the thickness on the direction of light-transparent substrate 10, and second part transparent figure 12 is perpendicular to light-transparent substrate
Thickness on 10 direction is less than Part III transparent figure 13 in the thickness on the direction of light-transparent substrate 10.
Specifically, when making above-mentioned mask plate 1, the partial light permeability figure on identical material making mask plate 1 can be used
Shape, and the thickness by the way that each section transparent figure is arranged is different, to limit respective transmitance.In more detail, when using phase
When same material makes first part's transparent figure 11, second part transparent figure 12 and Part III transparent figure 13, it can set
The thickness for setting first part's transparent figure 11 is less than the thickness of second part transparent figure 12, the thickness of second part transparent figure 12
Degree is less than the thickness of Part III transparent figure 13, and the transmitance to meet first part's transparent figure 11 is more than second part
The transmitance of transparent figure 12, the transmitance of second part transparent figure 12 are more than the transmitance of Part III transparent figure 13.
Partial light permeability figure in mask plate 1 is made using identical material, enables to the manufacturing process of mask plate 1 more
Add simply, to preferably save the cost of manufacture of mask plate 1.
Further, the making material of above-mentioned partial light permeability figure is varied, illustratively, using chromium oxide (CrOx)
Make each section transparent figure on mask plate 1.In more detail, when above-mentioned mask plate 1 include first part's transparent figure 11,
When second part transparent figure 12 and Part III transparent figure 13, first part's transparent figure 11, second part transparent figure
12 and Part III transparent figure 13 to prepare material include chromium oxide, i.e. first part's transparent figure 11, second part be saturating
Light figure 12 and Part III transparent figure 13 are chromium oxide figure.
It is noted that when making part transparent figure using chromium oxide, the thickness of the partial light permeability figure of making is
When left and right, the transmitance of corresponding partial light permeability figure is in 50% or so, the thickness of the partial light permeability figure of making
When left and right, the transmitance of corresponding partial light permeability figure is 5% or so.
Further, Part III transparent figure 13 can be arranged is in the thickness on the direction of light-transparent substrate 10：
First part's transparent figure 11 is in the thickness on the direction of light-transparent substrate 10 with second part transparent figure 12 vertical
In the sum of the thickness on the direction of the light-transparent substrate 10；In this way when first part's transparent figure 11, second part transparent figure
12 and Part III transparent figure 13 when being all made of identical material and making, the transmitance of Part III transparent figure 13 is first
The product of the transmitance of partial light permeability figure 11 and the transmitance of second part transparent figure 12.
In more detail, the transmitance for each section transparent figure that above-mentioned mask plate 1 includes can be set according to actual needs
It sets, illustratively, when above-mentioned mask plate 1 includes first part's transparent figure 11, second part transparent figure 12 and Part III
When transparent figure 13, the transmitance of first part's transparent figure 11 can be set between 40%~60%, second part light transmission figure
For the transmitance of shape 12 between 3%~7%, the transmitance of Part III transparent figure 13 is the saturating of first part's transparent figure 11
Cross the product of rate and the transmitance of second part transparent figure 12.
Specifically, the transmitance of first part's transparent figure 11 in mask plate 1 is set between 40%~60%, second
Divide the transmitance of transparent figure 12 between 3%~7%, the transmitance of Part III transparent figure 13 is first part's light transmission figure
The product of the transmitance of shape 11 and the transmitance of second part transparent figure 12 enables to the film made using the mask plate 1
Layer 2 has the smaller angle of gradient, is more advantageous to the production yield of product.
The present invention also provides a kind of production method of mask plate, the mask plate for making above-described embodiment offer should
Production method includes：
The partial light permeability figure of at least three kinds different transmitances, described at least three kinds different transmissions are formed in light-transparent substrate
The partial light permeability figure of rate is arranged in order according to transmitance size.
Specifically, the transmitance of the partial light permeability figure made in light-transparent substrate can be arranged according to actual needs, when setting
Set partial light permeability figure transmitance it is larger when, the intensity being exposed to material layer by the partial light permeability figure is larger, when
When the transmitance of setting unit transparent figure is smaller, the intensity being exposed to material layer by the partial light permeability figure is smaller.
When the mask plate 1 made using production method provided in an embodiment of the present invention makes film layer 2, first in corresponding base
Then making material layer (such as photosensitive material) on plate aligns mask plate 1 with the substrate for being formed with material layer, then
Material layer is exposed by the mask plate, due to including the partial light permeability figure of at least three kinds different transmitances on mask plate
Shape, and the partial light permeability figure of at least three kinds different transmitances is arranged in order according to transmitance size, therefore, material layer is passing through
After mask plate 1 exposes, form the different region of at least three depth of exposure, and the different region of at least three depth of exposure according to
The size of depth of exposure is arranged in order.After being exposed technique, the material layer after exposure is cleaned using developer solution, from
And the film layer at least three kinds thickness is formed, and the stepped arrangement of the different each section of thickness in film layer.
It therefore, can be in film layer when making film layer using the mask plate that production method provided in an embodiment of the present invention makes
Middle to form the smaller angle of gradient, to be avoided well when making other film layers in the film layer, other film layers are in the angle of gradient
The problem of locating connection difficulty, being easy to happen fracture, preferably ensure that the production yield of product.
It is possible to further form part transparent figure in light-transparent substrate by a variety of methods, below in light transmission base
For making first part's transparent figure, second part transparent figure and Part III transparent figure on bottom, two kinds are provided specifically
Making part transparent figure method.
First method, as shown in Figure 1, forming the partial light permeability figure of at least three kinds different transmitances in light-transparent substrate 10
The step of shape, specifically includes：
The deposition fraction translucent material in light-transparent substrate 10；
Patterned process is carried out to partial light permeability material, obtains first part's transparent figure 11, second part transparent figure
12 and Part III transparent figure 13, first part's transparent figure 11, second part transparent figure 12 and Part III light transmission figure
Shape 13 is arranged in order according to thickness size.
Specifically, the partial light permeability material for making part transparent figure is first deposited in light-transparent substrate 10, it is then right
The partial light permeability material of deposition is patterned, and first part's transparent figure 11, second part transparent figure 12 and third are formed
Partial light permeability figure 13, the wherein thickness of first part's transparent figure 11 be less than second part transparent figure 12 thickness, second
The thickness of partial light permeability figure 12 is less than the thickness of Part III transparent figure 13, and first part's transparent figure 11, second
Point transparent figure 12 and Part III transparent figure 13 are arranged in order according to thickness size.
Second method forms the part of at least three kinds different transmitances in light-transparent substrate 10 as shown in Figure 5 and Figure 6
The step of transparent figure, specifically includes：
First part's translucent material is deposited in light-transparent substrate 10；
First part's translucent material is patterned, the second spirte 120 is formed；
Second part translucent material is deposited, second part translucent material covers in the second spirte 120 and light-transparent substrate 10
The part not covered by the second spirte 120；
Second part translucent material is patterned, the first spirte 110 and third spirte 130 are formed, wherein first
Spirte 110 is located at the surface of light-transparent substrate 10, and is abutted with the second spirte 120, and third spirte 130 is located at the second subgraph
Shape 120 is backwards to the one side of light-transparent substrate 10, and orthographic projection of the third spirte 130 in light-transparent substrate 10 and the first spirte
There is pre-determined distance (H in such as Fig. 5) between 110 orthographic projection in light-transparent substrate 10；
First part's transparent figure 11 includes the first spirte 110, and second part transparent figure 12 includes the second spirte
The part not covered by third spirte 130 in 120；Part III transparent figure 13 includes third spirte 130 and the second son
The part covered by third spirte 130 in figure 120.
Specifically, as shown in fig. 4 a, first part's translucent material 121 is first deposited in light-transparent substrate 10, as shown in Figure 4 b,
Photoresist 140 is formed in first part's translucent material 121 to be exposed photoresist 140 as illustrated in fig. 4 c, develop, and is formed
Photoresist retention area and photoresist remove region, and wherein photoresist retention area corresponds to 120 region of the second spirte, light
The region that photoresist removal region corresponds in addition to the second spirte 120 will be located at photoresist using etching technics as shown in figure 4d
The first part's translucent material 121 for removing region removes, and then again removes the photoresist of photoresist retention area 140, is formed
Second spirte 120.
As shown in fig 4e, deposition second part translucent material 111, second part translucent material 111 covers the second spirte
120 and light-transparent substrate 10 in the part that is not covered by the second spirte 120；As shown in fig. 4f, in second part translucent material 111
Upper formation photoresist 140 is exposed photoresist 140, develops as shown in figure 4g, forms photoresist retention area and photoetching
Glue removes region, and wherein photoresist retention area corresponds to the first spirte 110 and third spirte 130, and photoresist removes region
The corresponding region in addition to the first spirte 110 and third spirte 130 will be located at light using etching technics as shown in figure 4h
The second part translucent material 111 that photoresist removes region removes, and then again removes the photoresist of photoresist retention area 140,
Form the first spirte 110 and third spirte 130.It is worth noting that, when making mask plate using above-mentioned second method,
The structure of mask plate also can be as shown in Figure 5.
As it can be seen that as shown in Fig. 4 h and Fig. 5, in the mask plate 1 made of above-mentioned second method, when above-mentioned first part
The transmitance of transparent figure 11 is T1, when the transmitance of second part transparent figure 12 is T2, Part III transparent figure 13
Transmitance is T1 × T2, and by first part's transparent figure 11, second part transparent figure 12 and Part III transparent figure
The transmitance of 13 open regions 5 limited is close to 100%, and therefore, mask plate 1 can realize four kinds of transmitances.
Shown in as shown in Fig. 6, Fig. 7 and Fig. 8, when making pixel defining layer PDL and spacer layer PS using the mask plate 1,
The pixel region 3 (being used to form anode and luminous material layer) that the correspondence of open region 5 is limited by pixel defining layer PDL, first
Point transparent figure 11 and 12 respective pixel of second part transparent figure define a layer PDL (including PDL1 and PDL2), and Part III is saturating
Light figure 13 corresponds to spacer layer PS.Therefore, the pixel defining layer PDL tool made using above-mentioned mask plate 1 there are two types of thickness, from
And preferably reduce pixel defining layer PDL 3 periphery of pixel region the angle of gradient.
It is noted that since the transmitance of Part III transparent figure 13 is T1 × T2, spacer layer PS is also required to
It can be formed by developing process, it therefore, can when depositing the material for making pixel defining layer PDL and spacer layer PS
The corresponding deposition thickness for increasing material.In addition, the regional extent that above-mentioned pixel region 3 includes actually is by pixel defining layer PDL
The region that the most thick part of middle thickness limits, i.e. above-mentioned pixel region 3 further include the region above PDL1.
The embodiment of the present invention additionally provides a kind of production method of array substrate, is covered including the use of what above-described embodiment provided
Diaphragm plate makes the step of film layer in array substrate, and the film layer has at least three kinds of different-thickness.
Specifically, as shown in Fig. 2, when making the film layer 2 in array substrate using the mask plate 1 that above-described embodiment provides,
Can first making material layer (such as photosensitive material) on corresponding substrate, then by mask plate 1 and the base for being formed with material layer
Plate is aligned, and is then exposed to material layer by the mask plate 1, due to including that at least three kinds of differences are saturating on mask plate 1
The partial light permeability figure of rate is crossed, and the partial light permeability figure of at least three kinds different transmitances is arranged in order according to transmitance size,
Therefore, material layer forms the different region of at least three depth of exposure, and at least three exposures after being exposed by mask plate 1
The different region of degree is arranged in order according to the size of depth of exposure.After being exposed technique, using developer solution to exposure after
Material layer cleaned, to form the film layer 2 at least three kinds thickness, and the different each section of thickness is in film layer 2
Arranged in step shape.
In the mask plate 1 provided due to above-described embodiment, including at least three kinds of differences being arranged in light-transparent substrate 10 are saturating
The partial light permeability figure of rate is crossed, and the partial light permeability figure of this at least three kinds different transmitances is arranged successively according to transmitance size
Row so that in the film layer 2 during the mask plate 1 provided using above-described embodiment makes array substrate, made film layer 2 can
Including at least three kinds of thickness, and the stepped arrangement of the different each section of thickness in film layer 2, therefore, the embodiment of the present invention provides
Array substrate production method in, include using above-described embodiment provide mask plate 1 make array substrate in film layer 2
Step so that the film layer 2 in made array substrate has different thickness, realizes the smaller angle of gradient, to very well
Avoid when making other film layers in the film layer 2, other film layers connect difficulty at the angle of gradient, are easy to happen asking for fracture
Topic, preferably ensure that the production yield of made array substrate.
Further, as Figure 6-Figure 8, the film layer in the array substrate that above-described embodiment provides includes pixel defining layer
PDL and spacer layer PS makes pixel circle when above-mentioned mask plate 1 includes at least three partial light permeability figure using mask plate 1
The step of given layer PDL and spacer layer PS, specifically includes：
Photosensitive film layer is formed using photosensitive material；
Photosensitive film layer is exposed using mask plate 1, forms photosensitive film layer removal region and at least three photosensitive
Film layer partly retains region；
Develop to the photosensitive film layer after exposure, the photosensitive film layer that region is removed positioned at photosensitive film layer is complete
The photosensitive film layer segment for retaining region positioned at least three photosensitive film layers half is removed, it is different to form at least three by removal
The photosensitive figure of thickness, wherein most thick photosensitive figure is as spacer layer PS, the remaining sense in addition to most thick photosensitive figure
Light figure is as pixel defining layer PDL.
Specifically, when using above-described embodiment provide mask plate 1 make array substrate in pixel defining layer PDL and every
It when underbed layer PS, can deposit to form photosensitive film layer first with photosensitive material, then utilize above-mentioned mask plate 1 to formation
Photosensitive film layer is exposed so that part corresponding with the open region 5 on mask plate 1 is formed as photosensitive thin in photosensitive film layer
Film layer removes region, in photosensitive film layer part corresponding at least three partial light permeability figures on mask plate 1 be formed as to
Few three photosensitive film layers partly retain region；Then develop to the photosensitive film layer after exposure, photosensitive film layer will be located at
The photosensitive film layer in removal region completely removes, and the photosensitive film layer portion in region will be retained positioned at least three photosensitive film layers half
Divide removal, form the photosensitive figure of at least three different-thickness, wherein most thick photosensitive figure removes most thick as spacer layer PS
Photosensitive figure except remaining photosensitive figure as pixel defining layer PDL.
In more detail, as shown in Fig. 4 h and Fig. 5, to be provided with first part's transparent figure 11, second on mask plate 1
Divide for transparent figure 12 and Part III transparent figure 13, as shown in Figure 6 and Figure 7, in the pixel made of the mask plate 1
Defining a layer PDL tools, there are two types of thickness, correspond respectively to PDL1 and PDL2, it is seen then that increased between PDL2 and pixel region 3
The PDL1 crossed, to preferably reduce pixel defining layer PDL 3 periphery of pixel region the angle of gradient.
The pixel defining layer PDL and spacer layer PS in array substrate are made of the mask plate 1 that above-described embodiment provides
When, pixel defining layer PDL and spacer layer PS can be made simultaneously by a patterning processes, preferably simplify array substrate
Manufacture craft, saved cost of manufacture.In addition, the pixel defining layer PDL made of the mask plate 1 that above-described embodiment provides
With at least two thickness, so that the angle of gradient of pixel defining layer PDL is smaller, pixel defining layer PDL is avoided well
Caused by the angle of gradient is larger the problems such as colour mixture, big visual angle colour cast, the making yield of array substrate is further improved.
The embodiment of the present invention additionally provides a kind of array substrate, using the making side for the array substrate that above-described embodiment provides
Method makes, and the film layer at least three kinds different thickness is formed in the array substrate.
Since array substrate provided in an embodiment of the present invention is the making side of the array substrate provided using above-described embodiment
Method makes, and therefore, array substrate provided in an embodiment of the present invention includes the film layer at least three kinds different-thickness, and the film
The different stepped arrangement of each section of thickness in layer.Therefore, the film layer in array substrate provided in an embodiment of the present invention has
Different thickness realizes the smaller angle of gradient, to be avoided well when making other film layers in the film layer, other films
Layer connects difficult, the problem of being easy to happen fracture at the angle of gradient, preferably ensure that the production of made array substrate is good
Rate.
Further, the film layer with different thickness 2 in array substrate as Figure 6-Figure 8 includes pixel defining layer
PDL, pixel defining layer PDL limit at least one pixel region 3, the direction from close to pixel region 3 to far from pixel region 3
On, the thickness of pixel defining layer PDL gradually increases.
Specifically, the pixel defining layer PDL being arranged in array substrate has different thickness, and from close to pixel region 3
Onto the direction far from pixel region 3, the thickness of pixel defining layer PDL gradually increases, not only so that pixel defining layer PDL has
The smaller angle of gradient, avoid well the pixel defining layer PDL angles of gradient it is larger caused by colour mixture, big visual angle colour cast the problems such as,
And also assure be subsequently formed on pixel defining layer PDL other film layers (such as：Cathode layer) it can be more at the angle of gradient
Good connection, to preferably ensure that the production yield of array substrate.
The embodiment of the present invention additionally provides a kind of display device, including the array substrate that above-described embodiment provides.
Since the above-mentioned array substrate for applying example offer includes film layer with different thickness so that array substrate has more
Good display effect and production yield, therefore, display device provided in an embodiment of the present invention is when including above-mentioned array substrate, together
Sample has said effect, and details are not described herein again.
Unless otherwise defined, the technical term or scientific terminology that the disclosure uses should be tool in fields of the present invention
There is the ordinary meaning that the personage of general technical ability is understood." first ", " second " and the similar word used in the disclosure is simultaneously
It does not indicate that any sequence, quantity or importance, and is used only to distinguish different component parts." comprising " or "comprising" etc.
Similar word means to occur the element before the word, and either object covers the element or object for appearing in the word presented hereinafter
And its it is equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or mechanical connection, but may include electrical connection, either directly or indirectly."upper", "lower",
"left", "right" etc. is only used for indicating relative position relation, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
In the description of the above embodiment, particular features, structures, materials, or characteristics can be at any one or more
It can be combined in any suitable manner in a embodiment or example.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (14)
1. a kind of mask plate, which is characterized in that different be arranged in the light-transparent substrate at least three kinds including light-transparent substrate
The partial light permeability figure of the partial light permeability figure of transmitance, described at least three kinds different transmitances is arranged successively according to transmitance size
Row.
2. mask plate according to claim 1, which is characterized in that the partial light permeability figure of described at least three kinds different transmitances
Shape includes first part's transparent figure, second part transparent figure and Part III transparent figure, first part's light transmission figure
The transmitance of shape is more than the transmitance of the second part transparent figure, and the transmitance of the second part transparent figure is more than institute
State the transmitance of Part III transparent figure；
At least one in first part's transparent figure, the second part transparent figure and the Part III transparent figure
It is a to limit open region in the light-transparent substrate, and first part's transparent figure, the second part transparent figure and
The Part III transparent figure is arranged in order along close to the open region to the direction far from the open region.
3. mask plate according to claim 2, which is characterized in that first part's transparent figure, the second part
The material identical of transparent figure and the Part III transparent figure, and first part's transparent figure is perpendicular to described
Thickness on the direction of light substrate is less than the second part transparent figure in the thickness on the direction of the light-transparent substrate
Degree, the second part transparent figure are less than the Part III light transmission in the thickness on the direction of the light-transparent substrate
Figure is in the thickness on the direction of the light-transparent substrate.
4. mask plate according to claim 3, which is characterized in that first part's transparent figure, the second part
Transparent figure and the Part III transparent figure to prepare material include chromium oxide.
5. mask plate according to claim 3 or 4, which is characterized in that the Part III transparent figure is perpendicular to institute
It is first part's transparent figure on the direction of the light-transparent substrate to state thickness on the direction of light-transparent substrate
Thickness and the second part transparent figure the thickness on the direction of the light-transparent substrate and.
6. mask plate according to claim 5, which is characterized in that the transmitance of first part's transparent figure is 40%
Between~60%, the transmitance of the second part transparent figure between 3%~7%, the Part III transparent figure
Transmitance is the product of the transmitance of first part's transparent figure and the transmitance of the second part transparent figure.
7. a kind of production method of mask plate, which is characterized in that for making such as claim 1~6 any one of them mask
Plate, the production method include：
The partial light permeability figure of at least three kinds different transmitances is formed in light-transparent substrate, at least three kinds differences transmitances
Partial light permeability figure is arranged in order according to transmitance size.
8. the production method of mask plate according to claim 7, which is characterized in that when described at least three kinds different transmitances
Partial light permeability figure when including first part's transparent figure, second part transparent figure and Part III transparent figure, it is described
It is specifically included in the step of forming the partial light permeability figure of at least three kinds different transmitances in light-transparent substrate：
The deposition fraction translucent material in the light-transparent substrate；
Patterned process is carried out to the partial light permeability material, it is saturating to obtain first part's transparent figure, the second part
Light figure and the Part III transparent figure, first part's transparent figure, the second part transparent figure and described
Part III transparent figure is arranged in order according to thickness size.
9. the production method of mask plate according to claim 7, which is characterized in that when described at least three kinds different transmitances
Partial light permeability figure when including first part's transparent figure, second part transparent figure and Part III transparent figure, it is described
It is specifically included in the step of forming the partial light permeability figure of at least three kinds different transmitances in light-transparent substrate：
First part's translucent material is deposited in the light-transparent substrate；
First part's translucent material is patterned, the second spirte is formed；
Second part translucent material is deposited, the second part translucent material covers second spirte and the light-transparent substrate
In not by second spirte cover part；
The second part translucent material is patterned, the first spirte and third spirte are formed, wherein first son
Figure is located at the surface of the light-transparent substrate, and is abutted with second spirte, and the third spirte is located at described second
Spirte is backwards to the one side of the light-transparent substrate, and orthographic projection of the third spirte in the light-transparent substrate and described the
There is pre-determined distance between orthographic projection of one spirte in the light-transparent substrate；
First part's transparent figure includes the first spirte, and the second part transparent figure includes second spirte
In not by the third spirte cover part；The Part III transparent figure includes the third spirte and described
The part covered by the third spirte in two spirtes.
10. a kind of production method of array substrate, which is characterized in that covered including the use of such as claim 1~6 any one of them
Diaphragm plate makes the step of film layer in the array substrate, and the film layer has at least three kinds of different thickness.
11. the production method of array substrate according to claim 10, which is characterized in that the film layer in the array substrate
Including pixel defining layer and spacer layer the mask is utilized when the mask plate includes at least three partial light permeability figure
The step of plate making pixel defining layer and the spacer layer, specifically includes：
Photosensitive film layer is formed using photosensitive material；
The photosensitive film layer is exposed using the mask plate, forms photosensitive film layer removal region and at least three senses
Optical thin film layer partly retains region；
Develop to the photosensitive film layer after exposure, the photosensitive film layer that region is removed positioned at the photosensitive film layer is complete
The photosensitive film layer segment for retaining region positioned at least three photosensitive film layer half is removed, forms at least three by removal
The photosensitive figure of different-thickness, wherein most thick photosensitive figure is as the spacer layer, except the most thick photosensitive figure it
The outer remaining photosensitive figure is as the pixel defining layer.
12. a kind of array substrate, which is characterized in that using the production method system of the array substrate as described in claim 10 or 11
Make, the film layer at least three kinds different thickness is formed in the array substrate.
13. array substrate according to claim 12, which is characterized in that the film layer with different thickness includes pixel
Layer is defined, the pixel defining layer limits at least one pixel region, from close to the pixel region to the separate pixel
On the direction in region, the thickness of the pixel defining layer gradually increases.
14. a kind of display device, which is characterized in that including array substrate as described in claim 12 or 13.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810819376.3A CN108761999A (en) | 2018-07-24 | 2018-07-24 | Mask plate and preparation method thereof, array substrate and preparation method thereof, display device |
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|---|---|---|---|
| CN201810819376.3A CN108761999A (en) | 2018-07-24 | 2018-07-24 | Mask plate and preparation method thereof, array substrate and preparation method thereof, display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021218413A1 (en) * | 2020-04-30 | 2021-11-04 | 京东方科技集团股份有限公司 | Mask, display substrate and manufacturing method therefor, and display device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070101428A (en) * | 2006-04-10 | 2007-10-17 | 엘지마이크론 주식회사 | Half tone mask and method for manufactureing thereof |
| CN101359168A (en) * | 2007-07-30 | 2009-02-04 | Hoya株式会社 | Methof for producing graytone mask and graytone mask |
| WO2011030521A1 (en) * | 2009-09-09 | 2011-03-17 | Hoya株式会社 | Method for manufacturing mask blank, method for manufacturing mask for transfer, and method for manufacturing reflective mask |
| CN102460645A (en) * | 2009-05-21 | 2012-05-16 | Lg伊诺特有限公司 | Half tone mask and manufacturing method of the same |
| CN104597711A (en) * | 2015-02-13 | 2015-05-06 | 厦门天马微电子有限公司 | Photomask, method for making photomask and method for making substrate pattern |
| CN107068722A (en) * | 2017-04-20 | 2017-08-18 | 京东方科技集团股份有限公司 | A kind of array base palte, display panel and display device |
| CN208351242U (en) * | 2018-07-24 | 2019-01-08 | 京东方科技集团股份有限公司 | Mask plate, array substrate, display device |
-
2018
- 2018-07-24 CN CN201810819376.3A patent/CN108761999A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070101428A (en) * | 2006-04-10 | 2007-10-17 | 엘지마이크론 주식회사 | Half tone mask and method for manufactureing thereof |
| CN101359168A (en) * | 2007-07-30 | 2009-02-04 | Hoya株式会社 | Methof for producing graytone mask and graytone mask |
| CN102460645A (en) * | 2009-05-21 | 2012-05-16 | Lg伊诺特有限公司 | Half tone mask and manufacturing method of the same |
| WO2011030521A1 (en) * | 2009-09-09 | 2011-03-17 | Hoya株式会社 | Method for manufacturing mask blank, method for manufacturing mask for transfer, and method for manufacturing reflective mask |
| CN104597711A (en) * | 2015-02-13 | 2015-05-06 | 厦门天马微电子有限公司 | Photomask, method for making photomask and method for making substrate pattern |
| CN107068722A (en) * | 2017-04-20 | 2017-08-18 | 京东方科技集团股份有限公司 | A kind of array base palte, display panel and display device |
| CN208351242U (en) * | 2018-07-24 | 2019-01-08 | 京东方科技集团股份有限公司 | Mask plate, array substrate, display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021218413A1 (en) * | 2020-04-30 | 2021-11-04 | 京东方科技集团股份有限公司 | Mask, display substrate and manufacturing method therefor, and display device |
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