CN108761266A - Microminiature patch type leakage current sensor and its assemble method - Google Patents
Microminiature patch type leakage current sensor and its assemble method Download PDFInfo
- Publication number
- CN108761266A CN108761266A CN201810575586.2A CN201810575586A CN108761266A CN 108761266 A CN108761266 A CN 108761266A CN 201810575586 A CN201810575586 A CN 201810575586A CN 108761266 A CN108761266 A CN 108761266A
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- fixed plate
- leakage current
- microminiature
- current sensor
- carrying conductor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
Abstract
The invention discloses microminiature patch type leakage current sensor and its assemble methods, include the following steps.Step S1：Alloy material sheet material is punched to form fixed plate and the second plate body, while being punched to form through hole at the middle part of fixed plate.Step S2：The fixed plate of step S1 and the second plate body are stamped into flat plane plate respectively.Step S3：It slots on the inside of the through hole of fixed plate, coil is embedded in inside fixed plate.Step S4：It is mounted respectively to a few pad in the both sides of the lower surface of the second plate body.Step S5：The first end of current carrying conductor is connected with the pad positioned at side, the second end of current carrying conductor is connected with the pad positioned at the other side.Microminiature patch type leakage current sensor assemble method disclosed by the invention significantly reduces the size of leakage current sensor, the relative altitude of leakage current sensor is greatly reduced, to adapt to chip form.
Description
Technical field
The invention belongs to leakage current technical fields, and in particular to a kind of microminiature patch type leakage current sensor and its assembling
Method.
Background technology
Currently, the sensor application of different current classes is relatively broad.In leakage current test technical field, traditional electric leakage
Flow sensor, generally use spatial configuration have the defects of assembling process is cumbersome, space hold is larger.For example, application No. is
201420575861.8, subject name is the utility model patent of modularization leakage current sensor, in conjunction with Fig. 1 to Fig. 5 of attached drawing
It is found that technical solution disclosed in the utility model patent：Leakage current sensor (1) is fixedly mounted on the middle part of fixed plate (3), quilt
Survey the measured hole that conducting wire (2) passes through current sensor.Although above-mentioned technical proposal, which explicitly points out, can be used for leakage current monitoring or electricity
Flow measurement, but still do not break away from the general plotting that leakage current sensor solid is arranged.
Invention content
The present invention is directed to the situation of the prior art, overcomes drawbacks described above, provides a kind of microminiature patch type leakage current sensing
Device assemble method.
The present invention uses following technical scheme, and the microminiature patch type leakage current sensor assemble method includes following step
Suddenly：
Step S1：Alloy material sheet material is punched to form fixed plate and the second plate body, while being punched at the middle part of fixed plate
Form through hole；
Step S2：The fixed plate of step S1 and the second plate body are stamped into flat plane plate respectively；
Step S3：It slots on the inside of the through hole of fixed plate, coil is embedded in inside fixed plate；
Step S4：It is mounted respectively to a few pad in the both sides of the lower surface of the second plate body；
Step S5：The first end of current carrying conductor is connected with the pad positioned at side, by the second end of current carrying conductor
Connect with the pad positioned at the other side.
According to above-mentioned technical proposal, in step sl, the alloy material sheet material uses copper alloy sheet material.
According to above-mentioned technical proposal, in step s 2, the thickness of the fixed plate after punching press is 2mm~5mm.
According to above-mentioned technical proposal, in step s 5, the first end of the current carrying conductor is from the upper surface of fixed plate one
Body extends to the second end positioned at the lower surface of fixed plate.
Microminiature patch type leakage current sensor disclosed in present patent application, wherein：
Second plate body and the fixed plate for being built-in with coil, the fixed plate have through hole, the following table of second plate body
The both sides in face are respectively equipped at least one pad；
At least one current carrying conductor, the first end of the current carrying conductor run through fixed plate and with the weldering positioned at side
Disk connects, and the second end of the current carrying conductor connects with positioned at the pad of the other side, the first end of the current carrying conductor and
Second end is located at the two opposite sides of fixed plate.
According to above-mentioned technical proposal, the first end of the current carrying conductor is located at the upper surface of fixed plate, and the current-carrying is led
The second end of line is located at the lower surface of fixed plate.
According to above-mentioned technical proposal, the first end of the current carrying conductor is integrally extended to from the upper surface of fixed plate to be located at
The second end of the lower surface of fixed plate.
Microminiature patch type leakage current sensor disclosed by the invention and its assemble method, advantage be, significantly
Ground reduces the size of leakage current sensor, the relative altitude of leakage current sensor is greatly reduced, to adapt to chip form.
Description of the drawings
Fig. 1 is the structural schematic diagram of the microminiature patch type leakage current sensor of the preferred embodiment of the present invention.
Fig. 2 is the front view of Fig. 1.
Reference numeral includes：10- fixed plates；11- through holes；12- pads；20- current carrying conductors；The second plate bodys of 30-.
Specific implementation mode
The invention discloses a kind of microminiature patch type leakage current sensor and its assemble methods, with reference to preferred implementation
Example is further described the specific implementation mode of the present invention.
Referring to Figure 1 of the drawings and Fig. 2, Fig. 1 and Fig. 2 respectively illustrate the specific knot of microminiature patch type leakage current sensor
Structure.
Preferably, the microminiature patch type leakage current sensor, including：
Second plate body 30 and the fixed plate 10 for being built-in with coil, the fixed plate 10 have through hole 11, second plate
The both sides of the lower surface of body 30 are respectively equipped at least one pad 12；
At least one current carrying conductor 20, the first end of the current carrying conductor 20 run through fixed plate 10 and with positioned at one
The pad 12 of side connects, and the second end of the current carrying conductor 20 connects with the pad 12 positioned at the other side, the current carrying conductor
20 first end and second end are located at the two opposite sides of fixed plate 10.
Wherein, the first end of the current carrying conductor 20 is located at the upper surface of fixed plate 10, and the of the current carrying conductor 20
Two ends are located at the lower surface of fixed plate 10.
Wherein, the first end of the current carrying conductor 20 is integrally extended to from the upper surface of fixed plate 10 positioned at fixed plate 10
Lower surface second end.
It is noted that microminiature patch type leakage current sensor disclosed in present patent application, stands from common
Body configuration is to plane configuration evolution so that and the relative altitude of the sensor is greatly reduced,
Microminiature patch type leakage current sensor assemble method, includes the following steps disclosed in the preferred embodiment of the present invention：
Step S1：Alloy material sheet material is punched to form fixed plate and the second disk body, while being punched at the middle part of fixed plate
Form through hole；
Step S2：The fixed plate of step S1 and the second plate body are stamped into flat plane plate；
Step S3：It slots on the inside of the through hole of fixed plate, coil is embedded in inside fixed plate；
Step S4：It is mounted respectively to a few pad in the both sides of the lower surface of the second plate body；
Step S5：The first end of current carrying conductor is connected with the pad positioned at side, by the second end of current carrying conductor
Connect with the pad positioned at the other side.
Wherein, in step s 5, the first end of the current carrying conductor integrally extends to from the upper surface of fixed plate and is located at
The second end of the lower surface of fixed plate.
Wherein, in step s 2, the thickness of the fixed plate after punching press is grade, is preferred with 2mm~5mm.
Wherein, in step sl, the alloy material sheet material preferably uses copper alloy sheet material.
For a person skilled in the art, the technical solution recorded in foregoing embodiments can still be repaiied
Change or equivalent replacement of some of the technical features, all within the spirits and principles of the present invention, made by any repair
Change, equivalent replacement, improvement etc., should be included in protection scope of the present invention.
Claims (7)
1. a kind of microminiature patch type leakage current sensor assemble method, which is characterized in that include the following steps：
Step S1：Alloy material sheet material is punched to form fixed plate and the second plate body, while being punched to be formed at the middle part of fixed plate
Through hole；
Step S2：The fixed plate of step S1 and the second plate body are stamped into flat plane plate respectively；
Step S3：It slots on the inside of the through hole of fixed plate, coil is embedded in inside fixed plate；
Step S4：It is mounted respectively to a few pad in the both sides of the lower surface of the second plate body；
Step S5：The first end of current carrying conductor is connected with the pad positioned at side, by the second end of current carrying conductor and position
Pad in the other side connects.
2. microminiature patch type leakage current sensor assemble method according to claim 1, which is characterized in that in step S1
In, the alloy material sheet material uses copper alloy sheet material.
3. microminiature patch type leakage current sensor assemble method according to claim 1, which is characterized in that in step S2
In, the thickness of the fixed plate after punching press is 2mm~5mm.
4. microminiature patch type leakage current sensor assemble method according to claim 1, which is characterized in that in step S5
In, the first end of the current carrying conductor is integrally extended to from the upper surface of fixed plate positioned at the second end of the lower surface of fixed plate
End.
5. a kind of microminiature patch type leakage current sensor, which is characterized in that including：
Second plate body and the fixed plate for being built-in with coil, the fixed plate have through hole, the lower surface of second plate body
Both sides are respectively equipped at least one pad；
At least one current carrying conductor, the first end of the current carrying conductor run through fixed plate and with the pad phase positioned at side
It connects, the second end of the current carrying conductor connects with the pad positioned at the other side, the first end of the current carrying conductor and second
End is located at the two opposite sides of fixed plate.
6. microminiature patch type leakage current sensor according to claim 5, which is characterized in that the of the current carrying conductor
One end is located at the upper surface of fixed plate, and the second end of the current carrying conductor is located at the lower surface of fixed plate.
7. microminiature patch type leakage current sensor according to claim 6, which is characterized in that the of the current carrying conductor
One end integrally extends to the second end positioned at the lower surface of fixed plate from the upper surface of fixed plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810575586.2A CN108761266B (en) | 2018-06-06 | 2018-06-06 | Subminiature surface-mounted leakage current sensor and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810575586.2A CN108761266B (en) | 2018-06-06 | 2018-06-06 | Subminiature surface-mounted leakage current sensor and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108761266A true CN108761266A (en) | 2018-11-06 |
| CN108761266B CN108761266B (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810575586.2A Active CN108761266B (en) | 2018-06-06 | 2018-06-06 | Subminiature surface-mounted leakage current sensor and assembling method thereof |
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| CN106018917A (en) * | 2016-05-18 | 2016-10-12 | 中国科学院电子学研究所 | Passive-type current and voltage integrated sensor |
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2018
- 2018-06-06 CN CN201810575586.2A patent/CN108761266B/en active Active
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|---|---|---|---|---|
| US20030214313A1 (en) * | 2002-04-18 | 2003-11-20 | Kabushiki Kaisha Toshiba | Current detection equipment and semiconductor device |
| CN2636250Y (en) * | 2003-04-16 | 2004-08-25 | 大连理工大学 | Rogowski coil current sensor for printed circuit board |
| JP2005049311A (en) * | 2003-07-31 | 2005-02-24 | Nec Tokin Corp | Current sensor |
| CN102472777A (en) * | 2009-09-03 | 2012-05-23 | 株式会社普来马特 | Sensor for measuring electrical characteristics |
| JP2011209158A (en) * | 2010-03-30 | 2011-10-20 | Toyota Motor Corp | Current sensor assembly and method for assembling the same |
| CN201796075U (en) * | 2010-09-21 | 2011-04-13 | 上海昱恩科技有限公司 | Coil framework suit for current sensor |
| CN202815058U (en) * | 2012-08-28 | 2013-03-20 | 比亚迪股份有限公司 | Current sensor |
| CN102818924A (en) * | 2012-09-07 | 2012-12-12 | 天津市松正电动汽车技术股份有限公司 | Controller current sensor |
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| CN108761266B (en) | 2020-06-16 |
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