CN108735841A - A kind of solar cell package plate and preparation method thereof, solar cell - Google Patents
A kind of solar cell package plate and preparation method thereof, solar cell Download PDFInfo
- Publication number
- CN108735841A CN108735841A CN201810514636.6A CN201810514636A CN108735841A CN 108735841 A CN108735841 A CN 108735841A CN 201810514636 A CN201810514636 A CN 201810514636A CN 108735841 A CN108735841 A CN 108735841A
- Authority
- CN
- China
- Prior art keywords
- coating
- layer
- solar cell
- equal
- cell package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 131
- 239000011248 coating agent Substances 0.000 claims abstract description 114
- 230000004888 barrier function Effects 0.000 claims abstract description 51
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011737 fluorine Substances 0.000 claims abstract description 34
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 238000002834 transmittance Methods 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 28
- 239000000741 silica gel Substances 0.000 claims description 25
- 229910002027 silica gel Inorganic materials 0.000 claims description 25
- 239000011259 mixed solution Substances 0.000 claims description 14
- 229920000728 polyester Polymers 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 8
- 238000010422 painting Methods 0.000 claims description 8
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- 238000007761 roller coating Methods 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 125000004429 atom Chemical group 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052681 coesite Inorganic materials 0.000 claims description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims description 4
- 238000005137 deposition process Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229910001120 nichrome Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229910052682 stishovite Inorganic materials 0.000 claims description 4
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 229910052905 tridymite Inorganic materials 0.000 claims description 4
- 239000002033 PVDF binder Substances 0.000 claims description 3
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 claims description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 150000002221 fluorine Chemical class 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000003522 acrylic cement Substances 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 16
- 238000004140 cleaning Methods 0.000 abstract description 7
- 230000007613 environmental effect Effects 0.000 abstract description 7
- 238000012536 packaging technology Methods 0.000 abstract description 7
- 230000010354 integration Effects 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 135
- 239000003795 chemical substances by application Substances 0.000 description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- -1 ethylene-tetrafluoroethylene Chemical group 0.000 description 9
- 239000002131 composite material Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229940018564 m-phenylenediamine Drugs 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 230000003678 scratch resistant effect Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical compound C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
This application provides a kind of solar cell package plate and preparation method thereof, solar cells, wherein solar cell package plate, it can increase the adhesive force of barrier layer by the way that first coating is arranged, make solar cell package plate that there is higher block-water performance by the way that barrier layer is arranged；By second coating be bonded fluorine film layer, so that the light transmittance of solar cell package plate and ageing-resistant effect is improved, at the same more wear-resisting, scratch resistance and have self-cleaning function；By the way that encapsulated layer is arranged, the light transmittance and ageing-resistant effect that can make solar cell package plate further increase, it can be ageing-resistant up to 25 years or more, it is easier to storage, is laminated, safety and environmental protection, packaging technology is simple, product integration is realized simultaneously, it is easy to use, make subsequent encapsulating process time-saving and efficiency, lower cost.
Description
Technical field
The present invention relates to technical field of solar, more particularly to a kind of solar cell package plate and preparation method thereof,
Solar cell.
Background technology
A new varieties of the flexible thin-film solar cell as solar cell, technologically advanced, function admirable, purposes are wide
It is general, increasingly it is valued by people.Due to the application environment particularity of flexible thin-film solar component, it is desirable that solar cell
Package board has certain translucency, resistance to ag(e)ing, insulating properties, self-cleaning, anti-flammability, reelability, simultaneously because certain thin-film electros
Pond (such as CIGS hull cell) is more sensitive to moisture, and flexible solar battery package board will also have high block-water performance.
Flexible solar battery package board is mainly using a kind of composite membrane in the prior art, including etfe film, UV
Obstruct membrane, the film that blocks water, PET film etc., however the water vapor rejection effect of existing product is poor, and meanwhile it is not ageing-resistant, service life is short, envelope
It fills complex process to take, translucent effect is also difficult to further be promoted, and influences the reliability of solar cell.
Invention content
A kind of solar cell package plate of present invention offer and preparation method thereof, solar cell, to improve solar-electricity
The reliability in pond.
To solve the above-mentioned problems, the invention discloses a kind of solar cell package plate, the solar cell packages
Plate includes：
Substrate layer, the substrate layer have the first surface and second surface being oppositely arranged；
First coating, barrier layer, second coating and the fluorine film layer being cascading on the first surface, described
One coating is arranged close to the substrate layer；
And the encapsulated layer on the second surface is set.
Optionally, the substrate layer is thermoplastic poly ester film.
Optionally, the first coating include in acrylic compounds film layer, polyurethanes film layer and polyesters film layer at least
It is a kind of.
Optionally, the thickness of the first coating is greater than or equal to 1 μm, and is less than or equal to 15 μm.
Optionally, the water vapor transmittance of the barrier layer is less than 5*10-3g/m2·day。
Optionally, the material of the barrier layer includes Ti, Ni, Cr, NiCr, TiN, ZnO, TiO2、SnO2、SiO2、Nb2O5、
Ta2O5And Si3N4At least one of.
Optionally, the thickness of the barrier layer is greater than or equal to 1 μm, and is less than or equal to 30 μm.
Optionally, the material of the second coating includes adhesive for polyurethane, acrylic resin adhesive, epoxide-resin glue
Glutinous at least one of agent and polyester adhesive.
Optionally, the thickness of the second coating is greater than or equal to 5 μm, and is less than or equal to 15 μm.
Optionally, the fluorine film layer includes polyvinyl fluoride film layer, PVDF membrane layer, ethylene-tetrafluoroethylene copolymerization
At least one of one chlorotrifluoroethylene film layer of object film layer and ethylene.
Optionally, the thickness of the fluorine film layer is greater than or equal to 25 μm, and is less than or equal to 50 μm.
Optionally, the encapsulated layer is layer of silica gel.
To solve the above-mentioned problems, the invention also discloses a kind of solar cell, including solar battery chip and upper
Any one of them solar cell package plate is stated, the solar battery chip is fixed on the solar cell package plate
On.
To solve the above-mentioned problems, the invention also discloses a kind of preparation method of solar cell package plate, the systems
Preparation Method includes：
Substrate layer is provided, the substrate layer has the first surface and second surface being oppositely arranged；
First coating, barrier layer, second coating and fluorine film layer are sequentially formed on the first surface；
Encapsulated layer is formed on the second surface.
Optionally, first coating, the step of barrier layer, second coating and fluorine film layer are sequentially formed on the first surface
Suddenly, including：
First coating mixed solution is provided；
The first coating mixed solution is coated on the first surface by coating method, it is wet to form first coating
Film；
The first specified duration of processing is dried to the first coating wet film under the first assigned temperature, obtains described the
One coating.
Optionally, first assigned temperature is greater than or equal to 50 DEG C, and is less than or equal to 70 DEG C；It is described first it is specified when
It is long to be greater than or equal to 1 minute, and be less than or equal to 5 minutes.
Optionally, first coating, the step of barrier layer, second coating and fluorine film layer are sequentially formed on the first surface
Suddenly, including：
By atom layer deposition process or magnetron sputtering technique, deviate from the side of the substrate layer in the first coating
Form the barrier layer.
Optionally, first coating, the step of barrier layer, second coating and fluorine film layer are sequentially formed on the first surface
Suddenly, including：
Second coating mixed solution is provided；
The second coating mixed solution is coated on the barrier layer away from the one of the substrate layer by coating method
Side surface forms second coating wet film；
The second specified duration of processing is dried to the second coating wet film under the second assigned temperature, obtains described the
Two coatings.
Optionally, second assigned temperature is greater than or equal to 50 DEG C, and is less than or equal to 100 DEG C；Described second is specified
Duration is greater than or equal to 1 minute, and is less than or equal to 5 minutes.
Optionally, first coating, the step of barrier layer, second coating and fluorine film layer are sequentially formed on the first surface
Suddenly, including：
By laminar way, deviate from the laminated fluorine film layer in side of the substrate layer in the second coating.
Optionally, the step of forming encapsulated layer on the second surface, including：
Silica gel mixed liquor is provided；
The silica gel mixed liquor is coated on the second surface by coating method and forms silica gel wet film；
Processing third is dried to the silica gel wet film under third assigned temperature and specifies duration, obtains layer of silica gel.
Optionally, the third assigned temperature is greater than or equal to 50 DEG C, and is less than or equal to 120 DEG C；The third is specified
Duration is greater than or equal to 1 minute, and is less than or equal to 5 minutes.
Optionally, the coating method includes at least one of slit painting, roller coating, blade coating, spraying and spin coating.
Compared with prior art, the present invention includes following advantages：
This application provides a kind of solar cell package plate and preparation method thereof, solar cells, wherein solar-electricity
Pond package board includes substrate layer, and the substrate layer has the first surface and second surface being oppositely arranged；It is cascading
First coating, barrier layer, second coating and fluorine film layer, the first coating on the first surface are set close to the substrate layer
It sets；And the encapsulated layer on the second surface is set；It can increase the adhesive force of barrier layer by the way that first coating is arranged, lead to
Crossing setting barrier layer makes solar cell package plate have higher block-water performance；It is bonded fluorine film layer by second coating, is made too
It is positive can cell package plate light transmittance and ageing-resistant effect be improved, while more wear-resisting, scratch resistance and there is automatically cleaning work(
Energy；By the way that encapsulated layer is arranged, the light transmittance of solar cell package plate and ageing-resistant effect can be made to further increase, be resistant to old
Change up to 25 years or more, it is easier to store, be laminated, safety and environmental protection, packaging technology is simple, while realizing product integration, user
Just, make subsequent encapsulating process time-saving and efficiency, lower cost.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 shows a kind of cross-sectional view for solar cell package plate that one embodiment of the application provides；
Fig. 2 shows a kind of step flows of the preparation method of solar cell package plate of one embodiment of the application offer
Schematic diagram；
Fig. 3, which is shown, prepares the in the preparation method of solar cell package plate that another embodiment of the application provides a kind of
The step flow diagram of one coating；
Fig. 4, which is shown, prepares the in the preparation method of solar cell package plate that the another embodiment of the application provides a kind of
The step flow diagram of two coatings；
Fig. 5, which is shown in the preparation method of solar cell package plate that the another embodiment of the application provides a kind of, prepares envelope
Fill the step flow diagram of layer.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is described in further detail.
One embodiment of the application provides a kind of solar cell package plate, and referring to Fig.1, which can
To include substrate layer 11, substrate layer 11 is with the first surface 111 and second surface 112 being oppositely arranged；It is cascading
First coating 12, barrier layer 13, second coating 14 on first surface 111 and fluorine film layer 15, first coating 12 is close to substrate layer
11 settings；And the encapsulated layer 16 being arranged on second surface 112.
Solar cell package plate provided in this embodiment can increase the attachment of barrier layer by the way that first coating is arranged
Power makes solar cell package plate have higher block-water performance by the way that barrier layer is arranged；It is bonded fluorine film layer by second coating,
The light transmittance and ageing-resistant effect for making solar cell package plate are improved, while more wear-resisting, scratch resistance and with from clear
Clean function；By setting encapsulated layer, the light transmittance of solar cell package plate and ageing-resistant effect can be made to further increase, it can
It is ageing-resistant up to 25 years or more, it is easier to store, be laminated, safety and environmental protection, packaging technology is simple, while realize product integration, make
With conveniently, make subsequent encapsulating process time-saving and efficiency, lower cost.
In practical applications, substrate layer 11 can be thermoplastic polyester film, can specifically include to poly- ethylene
At least one of materials such as diol ester, polyethylene naphthalate and polybutylene terephthalate.The thickness of substrate layer 11
Degree can be greater than or equal to 100 μm, and be less than or equal to 200 μm, such as 150 μm.Wherein substrate layer 11 can be it is transparent or
Colored.In order to improve the transmitance of solar cell package plate, the transmitance of substrate layer 11 is preferably greater than or equal to 90%.
The material of first coating 12 can be one or more of the materials such as polyester, polyurethane and acrylic acid mixture.
The thickness of first coating 12 can be greater than or equal to 1 μm, and be less than or equal to 15 μm, such as 10 μm.It is coated on substrate layer 11
After first coating 12, the attaching surface of barrier layer 13 can be made more wear-resisting scratch-resistant, while surface is smooth continuous, roughness compared with
It is low.The setting of first coating 12 can improve the adhesive force of barrier layer 13.
The thickness of barrier layer 13 can be greater than or equal to 1 μm, and be less than or equal to 30 μm, such as 20 μm.Barrier layer 13
Material can there are many, such as Ti, Ni, Cr, NiCr, TiN, ZnO, TiO2、SnO2、SiO2、Nb2O5、Ta2O5And Si3N4In equal materials
One or more of mixtures, but the application is not limited in above-mentioned material, and every translucent material that can obstruct steam is all
Within the protection domain of the present embodiment.In order to meet the needs of CIGS hull cell, the steam of preferably barrier layer 13 is saturating
It crosses rate and is less than 5*10-3g/m2·day.The manufacture craft of barrier layer 13 can be determining according to specific material and structure etc., such as
It is prepared by techniques such as atomic layer deposition, magnetron sputterings.
The material of second coating 14 may include at least one of following gluing agent material：Transparent polyurethane adhesive,
Transparent acrylic resin adhesive, transparent epoxy resin adhesive and transparent polyester adhesive etc..The thickness of second coating 14 can
To be greater than or equal to 5 μm, and it is less than or equal to 15 μm, such as 10 μm.It is higher resistance in order to make solar cell package plate have
Imparted energy, can also be by adding anti-UV agent, such as carbon black, iron oxide red, zinc oxide, benzophenone in second coating 14
Class or benzotriazole compound etc..Certainly, suitable curing agent, such as ethylene can also be according to circumstances added in second coating 14
Base triamine, aminoethyl piperazine or m-phenylene diamine (MPD) etc..
Fluorine film layer 15 may include polyvinyl fluoride film layer, PVDF membrane layer, ethylene-tetrafluoroethylene copolymer film layer
At least one of with the fluorine-contained films class material such as one chlorotrifluoroethylene film layer of ethylene.The thickness of fluorine film layer 15 can be big
In or be equal to 25 μm, and be less than or equal to 50 μm, such as 40 μm.In order to improve the transmitance of solar cell package plate, preferably
The light transmittance of fluorine film layer 15 is greater than or equal to 93%.It is bonded fluorine film layer 15 by second coating 14, solar cell can be improved
The ageing-resistant effect of package board, at the same more wear-resisting, scratch resistance and have self-cleaning function.
Encapsulated layer 16 can be layer of silica gel.Since the transmitance of layer of silica gel is generally higher than 97%, relative in prior art
The transparent enclosure film made of the encapsulation adhesives such as EVA, PVB, POE, the sun can be further increased using layer of silica gel
The light transmittance of energy cell package plate, and the manufacture craft of layer of silica gel is simpler, and yield rate is higher, to reduce cost.When
So, encapsulated layer 16 can also be the transparent enclosures such as polyolefin film, ethene-vinyl acetate film or polyvinyl butyral film
Material.
By making layer of silica gel, the light transmittance for further increasing solar cell package plate can be improved, solar-electricity is made
The light transmittance of pond package board is up to 95% or more, and ageing-resistant effect was up to 25 years or more, it is easier to and it stores, be laminated, safety and environmental protection,
Packaging technology is simple, while realizing product integration, easy to use, keeps subsequent encapsulating process time-saving and efficiency, cost relatively low.
In another embodiment of the application, a kind of solar cell is additionally provided, may include solar battery chip and upper
The solar cell package plate described in any embodiment is stated, wherein solar battery chip is fixed on solar cell package plate
On.
In another embodiment of the application, a kind of preparation method of solar cell package plate is additionally provided, it, should with reference to Fig. 2
Preparation method may include：
Step 201：Substrate layer is provided, substrate layer has the first surface and second surface being oppositely arranged.
Specifically, the step may include the process being cleaned and dried to substrate layer, the wherein material of substrate layer can be with
Include in the base materials such as polyethylene terephthalate, polyethylene naphthalate and polybutylene terephthalate at least
It is a kind of.The thickness of substrate layer can determine according to actual needs, such as can be greater than or equal to 100 μm, and be less than or equal to 200
μm。
Step 202：First coating, barrier layer, second coating and fluorine film layer are sequentially formed on the first surface.
Specifically, first coating, barrier layer, second coating and fluorine film layer generation type there are many, such as can lead to
It crosses coating method and forms first coating, barrier layer is formed by atom layer deposition process or magnetron sputtering technique, passes through coating
Mode forms second coating, is bonded fluorine film layer by laminar way, laminar way includes but not limited to squeeze out again in the present embodiment
It is legal, it is coextruded composite algorithm, solvent-free composite algorithm, dry type composite algorithm and wet type composite algorithm.
Step 203：Encapsulated layer is formed on a second surface.
Specifically, the generation type of encapsulated layer also there are many, such as can pass through be coated with etc. modes, formed layer of silica gel
The solar cell package plate that the preparation method provided through this embodiment obtains, by forming on substrate layer
One coating increases the adhesive force of barrier layer, so that solar cell package plate is had higher water preventing ability by forming barrier layer
Energy；It is bonded fluorine film layer by second coating, so that the light transmittance of solar cell package plate and ageing-resistant effect is improved, simultaneously
More wear-resisting, scratch resistance simultaneously has self-cleaning function；By forming encapsulated layer, the light transmittance of solar cell package plate can be made
It is further increased with ageing-resistant effect, it can be ageing-resistant up to 25 years or more, it is easier to it stores, be laminated, safety and environmental protection, packaging technology letter
It is single, while realizing product integration, it is easy to use, make subsequent encapsulating process time-saving and efficiency, lower cost.
In a kind of realization method of the present embodiment, with reference to Fig. 3, above-mentioned steps 202 may further include：
Step 301：First coating mixed solution is provided.
Specifically, the material of the first coating mixed solution may include the materials such as acrylic compounds, polyurethanes and polyesters
At least one of material.
Step 302：First coating mixed solution is coated on first surface by coating method, it is wet to form first coating
Film.
Specifically, one or more of mutually knots in the coating methods such as slit painting, roller coating, blade coating, spraying or spin coating may be used
It closes.
Step 303：The first specified duration of processing is dried to first coating wet film under the first assigned temperature, obtains the
One coating.
Specifically, above-mentioned first coating wet film forms first coating, first coating after drying process at a certain temperature
Surface it is more wear-resisting scratch-resistant, while surface is smooth continuous, and roughness is relatively low.The thickness of first coating can be greater than or equal to 1 μ
M, and it is less than or equal to 15 μm, specifically it can carry out process control according to structural requirement.In practical applications, the first assigned temperature
50 DEG C can be greater than or equal to, and be less than or equal to 70 DEG C；First specified duration can be greater than or equal to 1 minute, and be less than or
Equal to 5 minutes.It should be noted that the preparation process of first coating and not only limiting a kind of this realization method, work is specifically prepared
Skill can determine that the application is not construed as limiting this according to factors such as the material of first coating and structures.
In a kind of realization method of the present embodiment, above-mentioned steps 202 can further include：
By atom layer deposition process or magnetron sputtering technique, barrier is formed away from the side of substrate layer in first coating
Layer.
Specifically, the material of barrier layer can there are many, such as Ti, Ni, Cr, NiCr, TiN, ZnO, TiO2、SnO2、SiO2、
Nb2O5、Ta2O5And Si3N4Deng one or more of mixing, thickness can be greater than or equal to 1 μm, and be less than or equal to 30 μ
m.In order to meet the needs of CIGS hull cell, the preferably water vapor transmittance of barrier layer is less than 5*10-3g/m2·day.It needs
It should be noted that the preparation process of barrier layer and not only limiting a kind of this realization method, specific preparation process can be according to barrier
The factors such as the material of layer and structure determine that the application is not construed as limiting this.
In a kind of realization method of the present embodiment, with reference to Fig. 4, above-mentioned steps 202 can further include：
Step 401：Second coating mixed solution is provided.
Specifically, anti-UV agent, adhesive major ingredient and curing agent can be added in stirring container, homogenizer 2000
Turn/min stirrings, obtains second coating mixed solution after mixing and be added in coating machine reservoir.Wherein adhesive major ingredient
It may include at least one of following gluing agent material：It is transparent polyurethane adhesive, transparent acrylic resin adhesive, transparent
Epoxy resin adhesive and transparent polyester adhesive etc..The UV agent of its moderate resistance is higher in order to make solar cell package plate have
UV resistant performance, anti-UV agent can be carbon black, iron oxide red, zinc oxide, benzophenone or benzotriazole compound etc..
Wherein curing agent can be added according to circumstances in right amount, and curing agent can be vinyl triamine, aminoethyl piperazine or m-phenylene diamine (MPD) etc..
Step 402：Second coating mixed solution is coated on the side table that barrier layer deviates from substrate layer by coating method
Face forms second coating wet film.
Specifically, one or more of mutually knots in the coating methods such as slit painting, roller coating, blade coating, spraying or spin coating may be used
It closes.
Step 403：The second specified duration of processing is dried to second coating wet film under the second assigned temperature, obtains the
Two coatings.
Specifically, the thickness of second coating can be greater than or equal to 5 μm, and it is less than or equal to 15 μm, specific thickness, technique
Parameter and material etc. can carry out process control according to the requirement of adhesion strength.In practical applications, the second assigned temperature
50 DEG C can be greater than or equal to, and be less than or equal to 100 DEG C；Second specified duration can be greater than or equal to 1 minute, and be less than or
Equal to 5 minutes.
It should be noted that the preparation process of second coating and not only limiting a kind of this realization method, specific preparation process
It can determine that the application is not construed as limiting this according to factors such as the material of second coating and structures.
In a kind of realization method of the present embodiment, above-mentioned steps 202 can further include：
By laminar way, fluorine film layer is bonded away from the side of substrate layer in second coating.
Specifically, fluorine film layer can be bonded rapidly using laminar way away from the side of substrate layer in second coating, it is compound
Roll temperature can be arranged at 25-80 DEG C, and pressure can be 3-8 kilograms.Fluorine film layer is bonded on barrier layer by second coating,
The ageing-resistant effect that solar cell package plate can be improved makes its more wear-resisting, scratch resistance and has self-cleaning function.
In a kind of realization method of the present embodiment, with reference to Fig. 5, above-mentioned steps 203 may further include：
Step 501：Silica gel mixed liquor is provided.
Specifically, this step includes stirring evenly silica gel mixed liquor.
Step 502：Silica gel mixed liquor is coated on the second surface by coating method and forms silica gel wet film.
Specifically, in the modes such as second surface use spray, slit painting, roller coating, blade coating, spraying or the spin coating of substrate layer
One or more combination prepare silica gel wet film.
Step 503：Processing third is dried to silica gel wet film under third assigned temperature and specifies duration, obtains silica gel
Layer.
Specifically, third assigned temperature can be greater than or equal to 50 DEG C, and it is less than or equal to 120 DEG C；Third specifies duration
It can be greater than or equal to 1 minute, and be less than or equal to 5 minutes.
The solar cell package plate that the preparation method provided by above-described embodiment obtains, overall thickness can pass through technique tune
Control, for light transmittance up to 95% or more, water vapor transmittance is less than 5*10-3g/m2Day, ageing-resistant effect were more easy to up to 25 years or more
In storage, lamination, safety and environmental protection, packaging technology is simple, and cost is relatively low.
The embodiment of the present application provides a kind of solar cell package plate and preparation method thereof, solar cell, wherein too
Positive energy cell package plate includes substrate layer, and the substrate layer has the first surface and second surface being oppositely arranged；It stacks gradually
First coating, barrier layer, second coating and fluorine film layer on the first surface is set, and the first coating is close to the base
Material layer is arranged；And the encapsulated layer on the second surface is set；It can increase the attached of barrier layer by the way that first coating is arranged
Put forth effort, makes solar cell package plate that there is higher block-water performance by the way that barrier layer is arranged；It is bonded fluorine film by second coating
Layer, so that the light transmittance of solar cell package plate and ageing-resistant effect is improved, while more wear-resisting, scratch resistance and with from
Cleaning function；By setting encapsulated layer, the light transmittance of solar cell package plate and ageing-resistant effect can be made to further increase,
It can be ageing-resistant up to 25 years or more, it is easier to it stores, be laminated, safety and environmental protection, packaging technology is simple, while realizing product integration,
It is easy to use, make subsequent encapsulating process time-saving and efficiency, lower cost.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiment, the same or similar parts between the embodiments can be referred to each other.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, commodity or equipment including a series of elements include not only that
A little elements, but also include other elements that are not explicitly listed, or further include for this process, method, commodity or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in process, method, commodity or the equipment including the element.
A kind of solar cell package plate provided by the present invention and preparation method thereof, solar cell are carried out above
It is discussed in detail, principle and implementation of the present invention are described for specific case used herein, above example
Illustrate the method and its core concept for being merely used to help understand the present invention；Meanwhile for those of ordinary skill in the art, according to
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification
It should not be construed as limiting the invention.
Claims (23)
1. a kind of solar cell package plate, which is characterized in that including：
Substrate layer, the substrate layer have the first surface and second surface being oppositely arranged；
First coating, barrier layer, second coating and the fluorine film layer being cascading on the first surface, described first applies
Layer is arranged close to the substrate layer；
And the encapsulated layer on the second surface is set.
2. solar cell package plate according to claim 1, which is characterized in that the substrate layer is that thermoplastic polyester is thin
Film.
3. solar cell package plate according to claim 1, which is characterized in that the first coating includes acrylic compounds
At least one of film layer, polyurethanes film layer and polyesters film layer.
4. solar cell package plate according to claim 1, which is characterized in that the thickness of the first coating be more than or
Equal to 1 μm, and it is less than or equal to 15 μm.
5. solar cell package plate according to claim 1, which is characterized in that the water vapor transmittance of the barrier layer is small
In 5*10-3g/m2·day。
6. solar cell package plate according to claim 1, which is characterized in that the material of the barrier layer include Ti,
Ni、Cr、NiCr、TiN、ZnO、TiO2、SnO2、SiO2、Nb2O5、Ta2O5And Si3N4At least one of.
7. solar cell package plate according to claim 1, which is characterized in that the thickness of the barrier layer is more than or waits
In 1 μm, and it is less than or equal to 30 μm.
8. solar cell package plate according to claim 1, which is characterized in that the material of the second coating includes poly-
At least one of urethane adhesive, acrylic resin adhesive, epoxy resin adhesive and polyester adhesive.
9. solar cell package plate according to claim 1, which is characterized in that the thickness of the second coating be more than or
Equal to 5 μm, and it is less than or equal to 15 μm.
10. solar cell package plate according to claim 1, which is characterized in that the fluorine film layer includes polyvinyl fluoride
In film layer, one chlorotrifluoroethylene film layer of PVDF membrane layer, ethylene-tetrafluoroethylene copolymer film layer and ethylene
It is at least one.
11. solar cell package plate according to claim 1, which is characterized in that the thickness of the fluorine film layer be more than or
Equal to 25 μm, and it is less than or equal to 50 μm.
12. solar cell package plate according to claim 1, which is characterized in that the encapsulated layer is layer of silica gel.
13. a kind of solar cell, which is characterized in that described in solar battery chip and any one of claim 1 to 12
Solar cell package plate, the solar battery chip is fixed on the solar cell package plate.
14. a kind of preparation method of solar cell package plate, which is characterized in that the preparation method includes：
Substrate layer is provided, the substrate layer has the first surface and second surface being oppositely arranged；
First coating, barrier layer, second coating and fluorine film layer are sequentially formed on the first surface；
Encapsulated layer is formed on the second surface.
15. preparation method according to claim 14, which is characterized in that sequentially form the first painting on the first surface
The step of layer, barrier layer, second coating and fluorine film layer, including：
First coating mixed solution is provided；
The first coating mixed solution is coated on the first surface by coating method, forms first coating wet film；
The first specified duration of processing is dried to the first coating wet film under the first assigned temperature, described first is obtained and applies
Layer.
16. preparation method according to claim 15, which is characterized in that first assigned temperature is greater than or equal to 50
DEG C, and it is less than or equal to 70 DEG C；The first specified duration is greater than or equal to 1 minute, and is less than or equal to 5 minutes.
17. preparation method according to claim 14, which is characterized in that sequentially form the first painting on the first surface
The step of layer, barrier layer, second coating and fluorine film layer, including：
By atom layer deposition process or magnetron sputtering technique, formed away from the side of the substrate layer in the first coating
The barrier layer.
18. preparation method according to claim 14, which is characterized in that sequentially form the first painting on the first surface
The step of layer, barrier layer, second coating and fluorine film layer, including：
Second coating mixed solution is provided；
The second coating mixed solution is coated on the side table that the barrier layer deviates from the substrate layer by coating method
Face forms second coating wet film；
The second specified duration of processing is dried to the second coating wet film under the second assigned temperature, described second is obtained and applies
Layer.
19. preparation method according to claim 18, which is characterized in that second assigned temperature is greater than or equal to 50
DEG C, and it is less than or equal to 100 DEG C；The second specified duration is greater than or equal to 1 minute, and is less than or equal to 5 minutes.
20. preparation method according to claim 14, which is characterized in that sequentially form the first painting on the first surface
The step of layer, barrier layer, second coating and fluorine film layer, including：
By laminar way, deviate from the laminated fluorine film layer in side of the substrate layer in the second coating.
21. preparation method according to claim 14, which is characterized in that form the step of encapsulated layer on the second surface
Suddenly, including：
Silica gel mixed liquor is provided；
The silica gel mixed liquor is coated on the second surface by coating method and forms silica gel wet film；
Processing third is dried to the silica gel wet film under third assigned temperature and specifies duration, obtains layer of silica gel.
22. preparation method according to claim 21, which is characterized in that the third assigned temperature is greater than or equal to 50
DEG C, and it is less than or equal to 120 DEG C；The third specifies duration to be greater than or equal to 1 minute, and is less than or equal to 5 minutes.
23. according to the preparation method described in claim 15,18 or 21, which is characterized in that the coating method include slit apply,
At least one of roller coating, blade coating, spraying and spin coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810514636.6A CN108735841A (en) | 2018-05-25 | 2018-05-25 | A kind of solar cell package plate and preparation method thereof, solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810514636.6A CN108735841A (en) | 2018-05-25 | 2018-05-25 | A kind of solar cell package plate and preparation method thereof, solar cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108735841A true CN108735841A (en) | 2018-11-02 |
Family
ID=63935340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810514636.6A Pending CN108735841A (en) | 2018-05-25 | 2018-05-25 | A kind of solar cell package plate and preparation method thereof, solar cell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108735841A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116102987A (en) * | 2023-04-13 | 2023-05-12 | 合肥华晟光伏科技有限公司 | Solar cell module packaging adhesive film, preparation method thereof and solar cell module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016074134A (en) * | 2014-10-06 | 2016-05-12 | 凸版印刷株式会社 | Gas barrier laminate |
| CN105990459A (en) * | 2015-02-28 | 2016-10-05 | 汉能新材料科技有限公司 | Flexible package composite film and manufacturing method thereof |
| CN106992254A (en) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | Encapsulating structure, its preparation method and its apply |
-
2018
- 2018-05-25 CN CN201810514636.6A patent/CN108735841A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016074134A (en) * | 2014-10-06 | 2016-05-12 | 凸版印刷株式会社 | Gas barrier laminate |
| CN105990459A (en) * | 2015-02-28 | 2016-10-05 | 汉能新材料科技有限公司 | Flexible package composite film and manufacturing method thereof |
| CN106992254A (en) * | 2016-01-18 | 2017-07-28 | 张家港康得新光电材料有限公司 | Encapsulating structure, its preparation method and its apply |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116102987A (en) * | 2023-04-13 | 2023-05-12 | 合肥华晟光伏科技有限公司 | Solar cell module packaging adhesive film, preparation method thereof and solar cell module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6319596B1 (en) | Barrier laminate | |
| RU2438210C2 (en) | Using polymer composite to produce photovoltaic modules | |
| US20040202866A1 (en) | Bright white protective laminates | |
| CN101661962B (en) | Solar battery back film with high cohesiveness and processing process | |
| CN102870228B (en) | The backboard of solar module and manufacture method thereof | |
| CN106992255A (en) | Encapsulating structure, its preparation method and its apply | |
| CN207303123U (en) | A kind of high-barrier solar cell backboard | |
| CN102365759A (en) | Protective sheet for solar cell module, solar cell module and method of manufacturing solar cell module | |
| CN110205049A (en) | A kind of Anti-damp lamina structure and the signal protection device with it | |
| CN104159478B (en) | A kind of continuous multilayer film and its manufacture method | |
| KR101622994B1 (en) | Protective sheet for solar cell, method for manufacturing the same, back sheet member for solar cell, back sheet for solar cell and solar cell module | |
| CN108735841A (en) | A kind of solar cell package plate and preparation method thereof, solar cell | |
| KR20090085022A (en) | Sheet for sealing backside of solar cell and solar cell module | |
| CN203700255U (en) | Lamination film with double-sided adhesive layer | |
| CN108735842A (en) | A kind of solar cell package plate and preparation method thereof, solar cell | |
| CN102529259A (en) | High-cohesiveness back film of solar cell and processing technology thereof | |
| CN108682706B (en) | Solar cell packaging plate and preparation process thereof, and solar cell and packaging process thereof | |
| JP2012222227A (en) | Back sheet for solar cells, laminated body for the solar cells, solar cell module, and manufacturing methods of the back sheet, the laminated body, and the solar cell module | |
| EP2676297A2 (en) | Photovoltaic back sheet laminates, photovoltaic modules comprising photovoltaic back sheet laminates, and methods for making photovoltaic back sheet laminates | |
| CN102555377A (en) | EVA (Ethylene vinyl acetate) adhesive integrated solar cell back film and processing technology | |
| CN108767032A (en) | A kind of solar cell package plate preparation process, solar cell package plate and solar cell | |
| CN211182225U (en) | Photovoltaic backboard and photovoltaic module with weather-proof and flame-retardant effects | |
| JP6567066B2 (en) | Back film for solar modules | |
| CN111430500A (en) | Preparation process of solar composite packaging plate | |
| CN220429544U (en) | Transparent encapsulation front bezel and photovoltaic module that shocks resistance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181102 |
|
| WD01 | Invention patent application deemed withdrawn after publication |