CN108734071A - The forming method of imaging sensor - Google Patents
The forming method of imaging sensor Download PDFInfo
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- CN108734071A CN108734071A CN201710270595.6A CN201710270595A CN108734071A CN 108734071 A CN108734071 A CN 108734071A CN 201710270595 A CN201710270595 A CN 201710270595A CN 108734071 A CN108734071 A CN 108734071A
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- Prior art keywords
- forming method
- pel array
- supporting layer
- thickness
- protective layer
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
Abstract
A kind of forming method of imaging sensor, including：Laminated base plate is provided, the laminated base plate includes supporting layer and the base on the supporting layer；Pel array is formed in the base；Protective layer is formed on the pel array；The supporting layer is removed, described image sensor is obtained.Technical solution of the present invention can effectively reduce the thickness of formed imaging sensor, be conducive to the thickness for reducing the fingerprint imaging module.
Description
Technical field
The present invention relates to fingerprint imaging field, more particularly to a kind of forming method of imaging sensor.
Background technology
Fingerprint identification technology collects the fingerprint image of human body by fingerprint imaging module, then in fingerprint recognition system
Have fingerprint imaging information to be compared, to realize identification.Due to the use of convenience and somatic fingerprint it is unique
Property, fingerprint identification technology have been widely used in every field, such as：The field of safety check such as public security bureau, customs, the gate inhibition system of building
System and the consumer product areas such as PC and mobile phone etc..
The imaging mode of imaging modules employed in fingerprint identification technology has optical profile type, condenser type, ultrasonic type etc. a variety of
Technology.One of which is that the fingerprint image of human body is acquired by optical imagery module.The work of optical fingerprint imaging modules is former
Reason：The finger of people presses when on the cover sheet of optical fingerprint imaging modules, and the light that light source is sent out forms incident light；It is incident
Light through after imaging sensor (Sensor) and cover sheet to the interface for projecting cover sheet and finger, in finger and protection
Reflection and refraction occur at the position that cover board is in contact；The reflected light is acquired by imaging sensor, by the reflected light
Optical signal is converted to electric signal, and the fingerprint image of finger is can be obtained after processing.
But there are module thickness is larger for fingerprint imaging module in the prior art, it is difficult to the problem of improving integrated level.
Invention content
Problems solved by the invention is to provide a kind of forming method of imaging sensor, and to reduce module thickness, raising is set
Standby integrated level.
To solve the above problems, the present invention provides a kind of forming method of imaging sensor, including：
Laminated base plate is provided, the laminated base plate includes supporting layer and the base on the supporting layer；In the base
Pel array is formed on layer；Protective layer is formed on the pel array；The supporting layer is removed, described image sensing is obtained
Device.
Optionally, the material of the laminated base plate is glass.
Optionally, the thickness of the supporting layer is more than the thickness of the base.
Optionally, the thickness of the base is less than or equal to 0.1mm；The thickness of the supporting layer is greater than or equal to 0.4mm.
Optionally, the step of removing the supporting layer include：By the base and the branch by way of laser treatment
Layer separation is supportted, to remove the supporting layer.
Optionally, the step of forming the protective layer include：Upper cover plate is provided；The upper cover plate is fitted in into the pixel
Array surface.
Optionally, the upper cover plate is fibre faceplate.
Optionally, the thickness of the upper cover plate is greater than or equal to 0.6mm.
Optionally, the step of forming the protective layer include：Liquid precursor is formed on the pel array surface；To institute
It states liquid precursor and carries out curing process, to form the protective layer.
Optionally, the liquid precursor is liquid glass.
Optionally, include the step of the pel array surface forms liquid precursor：In institute by way of spraying
It states pel array surface and forms the liquid precursor.
Optionally, include to the step of liquid precursor progress curing process：Institute is carried out by way of UV irradiations
State curing process.
Optionally, the thickness of the protective layer is less than or equal to 0.01mm.
Optionally, after removing the supporting layer, the protective layer is formed.
Optionally, include the step of forming pel array in the base：Multiple pictures are formed in the base
Pixel array has dicing lane between adjacent pixel arrays；It is formed after the pel array, before removing the supporting layer, institute
Stating forming method further includes：The laminated base plate is cut along the dicing lane, to obtain imaging sensor small pieces；In described image
The pel array side of sensor die forms control chip；Form the electricity being connected with the control chip and the pel array
Road connector.
Optionally, the multiple pel array is being formed, the laminated base plate is cut along the dicing lane, is forming the control
The protective layer is formed between any two step of coremaking piece, the formation circuit connecting unit and the removal supporting layer.
Compared with prior art, technical scheme of the present invention has the following advantages：
Offer includes supporting layer and the laminated base plate of base；The pel array is formed in the base, is removed later
The supporting layer, to obtain the smaller imaging sensor of thickness.The supporting layer can provide sufficiently strong in technical process
The mechanical support of degree；The supporting layer is removed, the thickness of formed imaging sensor can be effectively reduced, be conducive to described in reduction
The thickness of fingerprint imaging module.
In alternative of the present invention, by the base and the support layer separation by way of laser treatment, to go
Except the supporting layer；Compared with carrying out thinned technical solution by chemical etching or mechanical lapping, the technique of laser treatment
Difficulty is smaller, and technology controlling and process precision is higher, can effectively reduce the yield loss in technical process, is conducive to improve image sensing
The making yield of device.
In alternative of the present invention, by forming liquid precursor on the pel array surface and to the liquid forerunner
Body carries out curing process to form the protective layer.Liquid precursor solidification is formed by protective layer hardness larger, thickness
It is smaller, it can effectively reduce the thickness of described image sensor, be conducive to the reduction of the fingerprint imaging module thickness；And
Since the protective layer is formed by liquid precursor solidification, spray coating liquor again can be passed through after the protective layer breakage
State presoma is repaired, so the loss in forming process can be reduced effectively, is conducive to the yield for improving imaging sensor.
In alternative of the present invention, the forming method further includes：In the pel array one of the element sensor small pieces
Side forms control chip；And form the circuit connecting unit being connected with the pel array and the control chip；The protection
Being formed on the multiple pel array, the laminated base plate is cut along the dicing lane, forming the control chip of layer,
It is formed between any two step of the circuit connecting unit and the removal supporting layer；Therefore the protective layer is in removal institute
It is formed before stating supporting layer, the protective layer can play the role of mechanical support, this way after removing the supporting layer
The yield that subsequent process steps can be effectively improved advantageously ensures that the performance for being formed by imaging sensor.
Description of the drawings
Fig. 1 is a kind of cross-sectional view of fingerprint imaging module；
Fig. 2 is the cross-sectional view of another fingerprint imaging module；
Fig. 3 to Fig. 6 is the cross-section structure corresponding to each step of imaging sensor forming method first embodiment of the present invention
Schematic diagram；
Fig. 7 and Fig. 8 is the cross-section structure corresponding to each step of imaging sensor forming method second embodiment of the present invention
Schematic diagram.
Specific implementation mode
By background technology it is found that fingerprint imaging module in the prior art there are module thickness problems of too.In conjunction with one
The reason of its module thickness problems of too of structural analysis of kind fingerprint imaging module：
Optical fingerprint imaging modules include mainly：Cover sheet, optical sensor, integrated chip (IC), flexible circuit
Electronic device (including light source led), light guide plate, upper protection shell on plate (FPC) and flexible PCB and lower protection shell
Equal critical pieces.Wherein optical sensor is to utilize amorphous silicon film transistor (a-Si TFT), low-temperature polysilicon film crystal
The semiconductor process techniques such as (LTPS TFT) or oxide semiconductor thin-film transistor (OS TFT) are managed, are made on the glass substrate
's；Later encapsulation is realized by processes such as cutting, dispensing, bondings.
With reference to figure 1, a kind of cross-sectional view of fingerprint imaging module is shown.
As shown in Figure 1, the fingerprint imaging module is super-thin optical fingerprint imaging modules.The fingerprint imaging module
Be by photoelectricity transformation principle realize fingerprint imaging, including：Light source 11, the optics area array sensor on the light source 11
12 and the sensing face 13 on the optics area array sensor 12.
When acquiring fingerprint, finger 10 presses in sensing face 13；The incident light that light source 11 generates is projected to sensing face 13
On, reflection and refraction occur at the position that finger 10 is contacted with the sensing face 13, is formed by reflected light projects to optics
On area array sensor 12；Optics area array sensor 12 acquires the reflected light, and carries out opto-electronic conversion and signal processing, and realization refers to
The acquisition of print image.
Under normal conditions, the light source 11 be area source, including light emitting diode and be located at the light emitting diode side
Light guide plate.Initial light caused by the light emitting diode is projected into the light guide plate, is reflected to form through the light guide plate
The incident light of light distribution evenly.
With reference to figure 2, the cross-sectional view of another fingerprint imaging module is shown.
In the fingerprint imaging module, the use of light guide plate is eliminated, the light emitting diode 21 is set to the optics
The side of area array sensor 22, to achieve the purpose that reduce module thickness, so the thickness of the fingerprint imaging module and institute
The thickness for stating optics area array sensor 22 is close.
But the optics area array sensor 22 is made on glass substrate, in order to provide sufficient intensity in the production process
Mechanical support, the thickness of the glass substrate is at least 0.5mm, therefore the optics area array sensor thickness is larger.
So even if eliminating the use of backlight, the thickness of the fingerprint imaging module is not still small.
In order to further decrease module thickness, a kind of method is to reduce glass by way of chemical etching or mechanical lapping
The thickness of glass substrate, but the technology difficulty of this way is higher, and larger loss is will appear in technical process, to cause
The problem of yield reduces.
To solve the technical problem, the present invention provides a kind of forming method of imaging sensor, by by pel array
It is formed in base；The supporting layer is removed later, to obtain the smaller imaging sensor of thickness.
To make the above purposes, features and advantages of the invention more obvious and understandable, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
With reference to figure 3 to Fig. 6, show corresponding to each step of imaging sensor forming method first embodiment of the present invention
Cross-sectional view.
With reference to figure 3, laminated base plate 110 is provided, the laminated base plate 110 is including supporting layer 111 and is located at the supporting layer
Base 112 on 111.
The laminated base plate 110 is used to provide Process ba- sis for the formation of described image sensor, also in formation process mistake
Play the role of mechanical support in journey.Wherein, 111 mechanical strength of the supporting layer is larger, therefore the supporting layer 111 is for being
The formation of described image sensor provides mechanical support；The base 112 is used to carry for the formation process of described image sensor
For operating surface.
It is realized and is connected by van der waals force in the present embodiment, between the supporting layer 111 and the base 112.Tool
Body, the supporting layer 111 has the first binding face being oppositely arranged and bottom surface；The base 112 has the behaviour being oppositely arranged
Make face and the second binding face, the first binding face of the supporting layer 111 and the opposite fitting of the second binding face of the base 112.
The flatness of first binding face of the supporting layer 111 and the second binding face of the base 112 is higher, therefore described first
There is stronger van der waals force, so the supporting layer 111 and the base between binding face and second binding face
It is realized and is connected by the van der waals force between first binding face and second binding face between 112.
The laminated base plate 110 is set to include the way of supporting layer 111 and the base 112, it can be by removing the branch
The way of support layer 111 reduces the thickness of the laminated base plate 110, to reach the mesh for reducing institute's formation imaging sensor thickness
's.
In the present embodiment, the thickness of the supporting layer 111 is more than the thickness of the base 112.The thickness of the supporting layer 112
Spend larger, therefore the supporting layer 111 can provide the mechanical support of sufficient intensity for the formation of the fingerprint imaging module；Institute
The thickness for stating base 112 is smaller, therefore after removing the supporting layer 111, can be compared with the formed image biography of the reduction of limits
The thickness of sensor is conducive to the reduction of module thickness.
Specifically, the thickness of the supporting layer 111 should not be too small.
If 111 thickness of the supporting layer is too small, the mechanical strength of the supporting layer 111 is smaller, can not be in the figure
As sensor formation process in play the role of mechanical support, the yield in described image sensor forming process may be will increase
Loss.In the present embodiment, the thickness of the supporting layer 111 is greater than or equal to 0.4mm.
The thickness of the base 112 should not be too big.
If 112 thickness of the base is too big, after subsequently removing the supporting layer 111, the remaining laminated base plate
110 thickness is still larger, is unfavorable for the reduction of formed imaging sensor thickness, is unfavorable for reducing the thickness of fingerprint imaging module
Degree.In the present embodiment, the thickness of the base 112 is less than or equal to 0.1mm.
It should be noted that in the present embodiment, described image sensor is applied in ultra-thin fingerprint imaging module, therefore light
Line needs to transmit described image sensor to carry out the acquisition of finger print information；So the laminated base plate 110 is transparent substrate, tool
Body, the material of the laminated base plate 110 is glass, i.e., the material of the described supporting layer 111 and the base 112 is glass.
With reference to figure 4, pel array 120 is formed in the base 112.
The pel array 120 is for acquiring light and the optical signal of acquired light being converted to electric signal to obtain figure
Picture.In the present embodiment, formed image sensor application is in fingerprint imaging module, so the pel array 120 is for adopting
Collection carries the light of finger print information, to obtain fingerprint image.
The pel array 120 includes into multiple pixel units (not indicated in figure) of array arrangement.The pixel unit
Including sensor devices (not shown), for acquiring optical signal and the optical signal being converted to electric signal.Specifically, described
Sensor devices can be light sensitive diode.
The pel array can also include interconnection structure (not shown), and the interconnection structure is for realizing the sense
Being electrically connected between optical device and between the sensor devices and external circuit.
As shown in figure 4, the pel array 120 further includes encapsulated layer (not indicated in figure), described in the encapsulated layer covering
Pixel unit.The encapsulated layer is isolated for realizing the pixel unit and external environment, to avoid the sensor devices
It is influenced by external environment with the interconnection structure and performance degradation occurs, the stabilization of formation imaging sensor to improve
Property.Specifically, the material of the encapsulated layer can be the materials such as UV glue or transparent silica gel, or silica, silicon nitride
Or the materials such as silicon oxynitride.
Specifically, including the step of forming pel array 120 in the base 112：By semiconductor technology described
The surface of base 112 forms the pel array 120.So the step of forming the pel array 120 includes a series of film layers
Deposition and graphically equal semiconductor fabrication process step, same as the prior art, details are not described herein by the present invention.
With reference to figure 5, protective layer 140 is formed on the pel array 120.
The protective layer 140 protects the pel array for realizing the isolation of the pel array 120 and external environment
120, avoid the pel array 120 from being damaged.
In the present embodiment, 120 surface of the pel array is the encapsulated layer for covering the pixel unit, so the protection
The setting of layer 140 can play the encapsulation layer surface protection and rent, and can effectively improve the scratch resistant of the encapsulation layer surface
Ability can effectively reduce the appearance of the encapsulated layer damaged phenomenon.
In addition, in the present embodiment, described image sensor is applied in fingerprint imaging module, 140 surface of the protective layer
It is additionally operable to receive to touch to carry out the acquisition of fingerprint image.So the protective layer 140 also provides for the fingerprint imaging mould
The sensing face of group.
In the present embodiment, the step of forming the protective layer 140, includes：Upper cover plate is provided；The upper cover plate is fitted in
120 surface of the pel array.
The upper cover plate in described image sensor for protecting the pel array 120 and other hardware；In addition,
The upper cover plate is additionally operable to provide sensing face to be formed by fingerprint imaging module.
Specifically, the upper cover plate is fibre faceplate (Fiber Optics Plates, FOP).Fibre faceplate is by a large amount of
Optical fiber is regularly arranged and is formed, therefore the spies such as, interstage coupling loss small, high resolution, zero optical thickness big with numerical aperture
Point can transmit HD image without distortions.So using fibre faceplate as the upper cover plate, can make the fingerprint at
Light as in module, transmiting the upper cover plate is improved the fingerprint by the collimating effect of the fibre faceplate to reach
The purpose of imaging modules image quality.
It should be noted that the thickness of the upper cover plate should not it is too big also should not be too small.
If the thickness of the upper cover plate is too small, the isolation of the pel array 120 and external environment may be influenced,
The protective effect to the pel array 120 is influenced, the raising of described image sensor stability is unfavorable for；The upper cover plate
If thickness is too small, it is unfavorable for reducing the thickness of institute's formation imaging sensor, is unfavorable for reducing the fingerprint imaging module
Thickness.Specifically, in the present embodiment, the thickness of the upper cover plate is greater than or equal to 0.6mm.
With reference to figure 6, the supporting layer 111 is removed, obtains described image sensor.
The way for removing the supporting layer 111, the thickness for reducing the laminated base plate 110 reduce institute to reach
The purpose of imaging sensor thickness is formed, i.e., in 140 surface direction of the vertical protective layer, reduces institute's formation imaging sensor
Size.
In the present embodiment, pass through first binding face and described second between the supporting layer 111 and the base 112
Van der waals force between binding face, which is realized, to be connected, therefore when the model between first binding face and second binding face
When weakening or disappearing occur in De Waersili, separation can be realized in the supporting layer 111 and the base 112, so as to
Realize the removal of the supporting layer 111.
In the present embodiment, the step of removing the supporting layer 111, includes：By the base by way of laser treatment
112 and the supporting layer 111 detach, to remove the supporting layer 111.Pass through the first binding face described in laser irradiation and described
The position that two binding faces are in contact can apply the material between first binding face and second binding face and disturb,
So that van der waals force between the two is weakened or is disappeared, divides to make the supporting layer 111 and the base 112 realize
From.
Compared with carrying out thinned technical solution by chemical etching or mechanical lapping, the technology difficulty of laser treatment compared with
Small, technology controlling and process precision is higher, can effectively reduce the yield loss in technical process, is conducive to the system for improving imaging sensor
Make yield.
In the present embodiment, during so that the base 112 and the supporting layer 111 is detached by laser treatment, adopted
The ultraviolet laser that laser is 355nm, laser energy are greater than or equal to 40 micro- cokes.
It should be noted that including the step of forming pel array 120 in the base 112：In the base 112
Multiple pel arrays 120 are formed, there is dicing lane (not shown) between adjacent pixel arrays 120.
In the present embodiment, as shown in figure 5, formed after the pel array 120, before removing the supporting layer 111, institute
Stating forming method further includes：The laminated base plate 110 is cut along the dicing lane, to obtain imaging sensor small pieces；Described
120 side of pel array of imaging sensor small pieces forms control chip 130；Form circuit connecting unit (not shown), institute
Circuit connecting unit is stated with the control chip 130 and the pel array 120 to be connected.
Since the pel array 120 is formed by semiconductor technology, the step of forming the pel array 120, wraps
A series of film depositions and graphically equal semiconductor fabrication process step are included, therefore form multiple pixels in the base 112
The step of array 120, can effectively improve the efficiency and yield to form the pel array 120, be conducive to cost control.
The dicing lane is between adjacent pixel arrays 120, for realizing the isolation between adjacent pixel arrays 120.
The step of cutting the laminated base plate 110 is for separating multiple pel arrays 120 on the laminated base plate 110, to obtain
Obtain described image sensor small pieces.Specifically, in the present embodiment, there are one pel arrays 120 for each imaging sensor small pieces tool.
The control chip 130 is connected with the pel array 120, and electricity is formed for realizing the pel array 120
The reading of signal；The control chip 130 is also connected with external circuit, for realizing pixel unit in the pel array 120
Driving and realize the power supply of the pel array 120.
The pel array 120 is formed in the surface of part base 112, so the control chip 130 is set to non-shape
At 112 surface of base of the pel array 120.Specifically, the laminated base plate 110 include acquisition zone (not indicated in figure) and
Non-acquired area's (not indicated in figure), the pel array 120 is set in the base 112 of the acquisition zone, so the control
Chip 130 is set in the base 112 in the non-acquired area.In the present embodiment, the control chip 130 is led by anisotropy
The mode of electric glue (Anisotropic Conductive Films, ACF) is set to 112 surface of the base.
The circuit connecting unit (not shown) for realizing being formed by the connection of imaging sensor and external circuit,
So the circuit connecting unit is connected with the control chip 130 and the pel array 120, it is used for the control chip
130 and the pel array 120 power supply is provided, be additionally operable to realize the control chip 130 and the pel array 120 and outside
The signal of circuit connects.
In the present embodiment, the circuit connecting unit is flexible PCB (Flexible Printed Circuit, FPC).
In other embodiments of the invention, the circuit connecting unit other can also can be realized for connecting wire or printed circuit board etc.
The interconnection architecture or component of electric connection.So the circuit connecting unit can be realized and the control by anisotropy conductiving glue
The electric connection of coremaking piece 130 and the pel array 120.
It in the present embodiment, is formed after the circuit connecting unit, before removing the supporting layer 111, in the pixel battle array
Form the protective layer 140 on row 120, i.e., the forming step for completing the control chip 130 and the circuit connecting unit it
Afterwards, the supporting layer 111 is removed.Since the forming step of the control chip 130 and the circuit connecting unit may be related to
Pressing, the action being bonded, therefore retain the way of the supporting layer 111 in the process, the laminated base plate 110 can be made
Thickness is larger, to have larger mechanical strength, can improve enough mechanical supports, can effectively reduce laminated base plate
The appearance of 110 damage phenomenons.
And the way of the supporting layer 111 is removed after forming the control chip 130 and the circuit connecting unit,
The smooth degree of the base 112 when control chip 130 and circuit connecting unit formation, Neng Gouwei may also enough be effectively improved
The formation of the control chip 130 and the circuit connecting unit provides smooth technological operation surface, is conducive to improve the control
The formation quality of coremaking piece 130 and the circuit connecting unit is conducive to the quality for improving institute's formation imaging sensor.
In other embodiments of the invention, the forming method further includes：In the multiple pel array of formation, along described stroke
Film channel cuts the laminated base plate, forms the control chip, forms the circuit connecting unit and remove the supporting layer
The protective layer is formed between any two step.That is, the protective layer can form the pel array, cutting
Laminated base plate, form control chip, form any two step of circuit connecting unit and the removal supporting layer between formed,
The protective layer can play the role of the protection pel array in technical process, can effectively improve yield, Er Qiesuo
Mechanical support can also be played the role of in technical process by stating protective layer, the phenomenon that laminated base plate deformation occur from reduction, can
Technology difficulty is effectively reduced, yield is improved and is formed by the performance of imaging sensor.
With reference to figure 7 to Fig. 8, show corresponding to each step of imaging sensor forming method second embodiment of the present invention
Cross-sectional view.
The present embodiment and previous embodiment something in common, details are not described herein by the present invention.The present embodiment and previous embodiment
The difference is that in the present embodiment, the protective layer is by being solidified to form liquid precursor.
In the present embodiment, the step of forming the protective layer 240 (as shown in Figure 8), includes：With reference to figure 7, in the pixel
220 surface of array forms liquid precursor 241；With reference to figure 8, the liquid precursor 241 (as shown in Figure 7) is carried out at solidification
Reason 242, to form the protective layer 240.
The liquid precursor 241 is used for after solidification to form the protective layer 240.It is formed by liquid precursor 241
The way of the protective layer 240 can effectively reduce the thickness of formed protective layer 240, be conducive to reduce formed image biography
The thickness of sensor.
And since the protective layer 240 is solidified to form by liquid precursor 241, in the protective layer
It can be repaired by forming the liquid precursor 241 again after 240 breakages, so can effectively reduce in forming process
Loss, be conducive to improve imaging sensor yield.
In the present embodiment, the liquid precursor 241 is liquid glass.The main component of liquid glass is silica,
Therefore the property of obtained film layer is close with glass after the liquid glass solidification.And the liquid glass after curing, surface
Hardness can reach 8H, therefore can effectively play a protective role.
Specifically, including the step of 220 surface of the pel array forms liquid precursor 241：Pass through the side of spraying
Formula forms the liquid precursor 241 on 220 surface of the pel array.Spraying method forms the liquid precursor 241
Way can effectively control the thickness of formed liquid precursor 241, control the uniformity of 241 thickness of the liquid precursor,
The quality for being conducive to improve formed protective layer 240, is conducive to the raising of formed image sensor performance.
The step of curing process is carried out to the liquid precursor 241, for making the liquid precursor 241 be formed by curing
Protective layer 240.
In the present embodiment, the liquid precursor 241 is liquid glass, so the curing process is for removing the liquid
Solvent in state glass forms the protective layer 240 to make bonding between the silicon dioxide molecules in the liquid glass.
Specifically, since the liquid precursor 241 is liquid glass, so consolidating to the liquid precursor 241
Changing the step of handling includes：The curing process is carried out by way of UV irradiations.UV irradiations can remove the liquid glass
In solvent, to make the liquid glass be formed by curing the protective layer 240.In the present embodiment, the UV irradiations are used
UV light be UV light that wavelength is 356nm, the energy of UV light is greater than or equal to 1000mW/cm2。
It should be noted that the thickness of the protective layer 240 should not it is too big also should not be too small.
If the thickness of the protective layer 240 is too big, it is unfavorable for the reduction of described image sensor thickness, is unfavorable for subtracting
The thickness of small formed fingerprint imaging module；If the thickness of the protective layer 240 is too small, technology difficulty is will increase, and
The uniformity of 240 thickness of formed protective layer may be influenced, the image quality of institute's formation imaging sensor can be influenced.Specifically
, in the present embodiment, the protective layer 240 is that liquid glass cures, therefore the thickness of the protective layer 240 is less than or waits
In 0.01mm.
It in the present embodiment, is formed after the circuit connecting unit, before removing the supporting layer 211, in the pixel battle array
The protective layer 240 is formed on row 220.But this way is only an example.In other embodiments of the invention, due to passing through liquid
The protective layer thickness that state presoma is solidified to form is often smaller, therefore the forming method can also include：Remove the branch
After supportting layer, the protective layer is formed.
The protective layer can be formed after removing the supporting layer on the pel array of imaging sensor small pieces,
It can also be formed on the pel array surface after described image sensor is encapsulated and is completed.Therefore the protective layer
Formation be not necessarily to do larger change to conventional images sensor production producing line and can be completed and manufacture, so additional without increasing
Process costs, be conducive to control cost.
To sum up, the laminated base plate including supporting layer and base is provided；The pel array is formed in the base, later
The supporting layer is removed, to obtain the smaller imaging sensor of thickness.The supporting layer can provide foot in technical process
The mechanical support of enough intensity；The supporting layer is removed, the thickness of formed imaging sensor can be effectively reduced, is conducive to reduce
The thickness of the fingerprint imaging module.Moreover, in alternative of the present invention, by the base and institute by way of laser treatment
Support layer separation is stated, to remove the supporting layer；Thinned technical solution is carried out with by chemical etching or mechanical lapping
It compares, the technology difficulty of laser treatment is smaller, and technology controlling and process precision is higher, can effectively reduce the yield damage in technical process
It loses, is conducive to the making yield for improving imaging sensor.In addition, in alternative of the present invention, by the pel array table
Face forms liquid precursor and carries out curing process to the liquid precursor to form the protective layer.Liquid precursor cures
It is formed by that protective layer hardness is larger, and thickness is smaller, can effectively reduce the thickness of described image sensor, be conducive to
The reduction of the fingerprint imaging module thickness；And formed since the protective layer is cured by liquid precursor, in institute
It can be repaired by spraying liquid precursor again after stating protective layer breakage, so can effectively reduce in forming process
Loss is conducive to the yield for improving imaging sensor.Also, in alternative of the present invention, the forming method further includes：Institute
The pel array side for stating element sensor small pieces forms control chip；And it is formed and the pel array and the control core
The connected circuit connecting unit of piece；The protective layer is formed on the multiple pel array, cuts institute along the dicing lane
Any two step for stating laminated base plate, forming the control chip, forming the circuit connecting unit and the removal supporting layer
Between rapid；Therefore the protective layer is formed before removing the supporting layer, and the protective layer can remove the supporting layer
Play the role of mechanical support later, this way can effectively improve the yield of subsequent process steps, advantageously ensure that be formed
Imaging sensor performance.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (16)
1. a kind of forming method of imaging sensor, which is characterized in that including：
Laminated base plate is provided, the laminated base plate includes supporting layer and the base on the supporting layer；
Pel array is formed in the base；
Protective layer is formed on the pel array；
The supporting layer is removed, described image sensor is obtained.
2. forming method as described in claim 1, which is characterized in that the material of the laminated base plate is glass.
3. forming method as described in claim 1, which is characterized in that the thickness of the supporting layer is more than the thickness of the base
Degree.
4. the forming method as described in claim 1 or 3, which is characterized in that the thickness of the base is less than or equal to 0.1mm；
The thickness of the supporting layer is greater than or equal to 0.4mm.
5. forming method as described in claim 1, which is characterized in that the step of removing the supporting layer include：
By the base and the support layer separation by way of laser treatment, to remove the supporting layer.
6. forming method as described in claim 1, which is characterized in that the step of forming the protective layer include：
Upper cover plate is provided；
The upper cover plate is fitted in into the pel array surface.
7. forming method as claimed in claim 6, which is characterized in that the upper cover plate is fibre faceplate.
8. forming method as claimed in claims 6 or 7, which is characterized in that the thickness of the upper cover plate is greater than or equal to
0.6mm。
9. forming method as described in claim 1, which is characterized in that the step of forming the protective layer include：
Liquid precursor is formed on the pel array surface；
Curing process is carried out to the liquid precursor, to form the protective layer.
10. forming method as claimed in claim 9, which is characterized in that the liquid precursor is liquid glass.
11. the forming method as described in claim 9 or 10, which is characterized in that before the pel array surface forms liquid
Drive body the step of include：By way of spraying the liquid precursor is formed on the pel array surface.
12. the forming method as described in claim 9 or 10, which is characterized in that carry out curing process to the liquid precursor
The step of include：The curing process is carried out by way of UV irradiations.
13. the forming method as described in claim 9 or 10, which is characterized in that the thickness of the protective layer is less than or equal to
0.01mm。
14. forming method as claimed in claim 9, which is characterized in that after removing the supporting layer, form the protection
Layer.
15. forming method as described in claim 1, which is characterized in that wrapped in the step of forming pel array in the base
It includes：Multiple pel arrays are formed in the base, and there is dicing lane between adjacent pixel arrays；
It is formed after the pel array, before removing the supporting layer, the forming method further includes：It is cut along the dicing lane
The laminated base plate is cut, to obtain imaging sensor small pieces；
Control chip is formed in the pel array side of described image sensor small pieces；
Form the circuit connecting unit being connected with the control chip and the pel array.
16. forming method as claimed in claim 15, which is characterized in that in the multiple pel array of formation, along described stroke
Film channel cuts the laminated base plate, forms the control chip, forms the circuit connecting unit and remove the supporting layer
The protective layer is formed between any two step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270595.6A CN108734071A (en) | 2017-04-24 | 2017-04-24 | The forming method of imaging sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270595.6A CN108734071A (en) | 2017-04-24 | 2017-04-24 | The forming method of imaging sensor |
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| CN108734071A true CN108734071A (en) | 2018-11-02 |
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| CN201710270595.6A Pending CN108734071A (en) | 2017-04-24 | 2017-04-24 | The forming method of imaging sensor |
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Application publication date: 20181102 |