CN108728633A - A kind of laser shock peening method and device - Google Patents
A kind of laser shock peening method and device Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
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- C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
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Abstract
本发明公开了一种激光冲击强化方法及装置。本发明提供了一种激光冲击强化方法，根据加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度，在相同的预置能量密度和脉冲宽度的条件下通过改变待加工工件的各个待加工区域吸收层厚度达到不同的加工强度。改变吸收层厚度操作简单，不需要改变激光冲击设备的脉冲激光参数，解决了当前对于复杂形状的零件进行区域不等强度的激光冲击强化时，需要调节不同区域的脉冲激光参数，编程复杂，激光冲击强化的实用性和操作效率低的技术问题。
The invention discloses a laser shock strengthening method and device. The invention provides a laser shock peening method. According to the relationship between the processing intensity and the thickness of the absorbing layer, the processing intensity of each area to be processed of the workpiece to be processed is substituted into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the corresponding Under the same preset energy density and pulse width conditions, different processing intensities can be achieved by changing the thickness of the absorbing layer in each area of the workpiece to be processed. Changing the thickness of the absorbing layer is simple and does not need to change the pulse laser parameters of the laser shock equipment, which solves the problem of adjusting the pulse laser parameters of different regions when performing laser shock strengthening with different intensities on parts with complex shapes. The programming is complicated and the laser The practicality of impact strengthening and the technical problems of low operational efficiency.
Description
技术领域technical field
本发明涉及材料表面处理技术领域，尤其涉及一种激光冲击强化方法及装置。The invention relates to the technical field of material surface treatment, in particular to a laser shock strengthening method and device.
背景技术Background technique
随着科技的发展，激光开始被人们广泛使用。激光冲击是一种利用强激光诱导的冲击波来强化金属的新技术，能够大幅度增强金属材料的耐久性。由于激光具有较好的可达性，能精确定位，因此激光冲击强化技术能够处理一些传统表面强化工艺不能处理的部位，特别适合对小孔、倒角、焊缝和沟槽等结构进行强化。With the development of technology, lasers have been widely used by people. Laser shock is a new technology that uses strong laser-induced shock waves to strengthen metals, which can greatly enhance the durability of metal materials. Because the laser has good accessibility and can be precisely positioned, the laser shock peening technology can treat some parts that cannot be treated by the traditional surface strengthening process, and is especially suitable for strengthening structures such as small holes, chamfers, welds and grooves.
但是，对于复杂型面结构的零件往往在不同的区域具有不同的形状特征和失效形式，不同的区域要求对应不同的激光冲击加工强度，以使零件获得整体综合性能的提高。However, parts with complex surface structures often have different shape features and failure modes in different regions, and different regions require different laser shock processing intensities to improve the overall comprehensive performance of the parts.
以往对形状复杂的零件进行分区域不等强度的激光冲击强化处理时，一般通过调节脉冲激光参数来实现不同区域的不同加工强度。但是脉冲激光参数的调节对激光冲击设备的性能要求较高，且不同激光参数在不同区域的编程设定复杂，严重影响了不等强度激光冲击强化加工的实用性和操作效率。In the past, when performing laser shock peening treatment with different intensities in different regions on parts with complex shapes, it is generally achieved by adjusting the pulse laser parameters to achieve different processing intensities in different regions. However, the adjustment of pulse laser parameters has high requirements on the performance of laser shock equipment, and the programming of different laser parameters in different regions is complicated, which seriously affects the practicability and operation efficiency of laser shock peening with different intensities.
因此，导致了当前对于复杂形状的零件进行区域不等强度的激光冲击强化时，需要调节不同区域的脉冲激光参数，编程复杂，激光冲击强化的实用性和操作效率低的技术问题。Therefore, when performing laser shock peening with different intensities in different regions for parts with complex shapes, it is necessary to adjust the pulse laser parameters in different regions, complex programming, low practicality and low operating efficiency of laser shock peening.
发明内容Contents of the invention
本发明提供了一种激光冲击强化方法及装置，解决了当前对于复杂形状的零件进行区域不等强度的激光冲击强化时，需要调节不同区域的脉冲激光参数，编程复杂，激光冲击强化的实用性和操作效率低的技术问题。The invention provides a laser shock strengthening method and device, which solves the need to adjust the pulse laser parameters in different regions when performing laser shock strengthening of parts with complex shapes with different intensities, complicated programming, and practicality of laser shock strengthening. and technical problems of low operating efficiency.
本发明提供了一种激光冲击强化方法，包括：The invention provides a laser shock strengthening method, comprising:
S1：获取与预置能量密度及脉冲宽度对应的加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度；S1: Obtain the relationship between the processing intensity and the thickness of the absorbing layer corresponding to the preset energy density and pulse width, and substitute the processing intensity of each area to be processed into the relationship between the processing intensity and the thickness of the absorbing layer to obtain each area to be processed The corresponding thickness of the absorbing layer;
S2：在待加工工件的各个待加工区域覆盖对应的吸收层厚度的吸收层，以预置能量密度和脉冲宽度的激光参数对待加工工件的各个待加工区域进行激光冲击强化。S2: Cover each area of the workpiece to be processed with an absorbing layer corresponding to the thickness of the absorbing layer, and perform laser shock strengthening on each area of the workpiece to be processed with the laser parameters of preset energy density and pulse width.
优选地，步骤S1具体包括：Preferably, step S1 specifically includes:
S11：获取预置能量密度、脉冲宽度、待加工工件的最大加工强度和最小加工强度；S11: Obtain preset energy density, pulse width, maximum processing intensity and minimum processing intensity of the workpiece to be processed;
S12：在预置能量密度和脉冲宽度的条件下进行测试，得到最大加工强度对应的第一吸收层厚度；S12: Test under the conditions of preset energy density and pulse width to obtain the thickness of the first absorbing layer corresponding to the maximum processing intensity;
S13：在预置能量密度和脉冲宽度的条件下进行测试，得到最小加工强度对应的第二吸收层厚度；S13: Test under the conditions of preset energy density and pulse width to obtain the thickness of the second absorbing layer corresponding to the minimum processing intensity;
S14：根据最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度拟合得到加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度。S14: According to the maximum processing intensity, the minimum processing intensity, the thickness of the first absorption layer and the thickness of the second absorption layer, the relationship between the processing intensity and the thickness of the absorption layer is obtained, and the processing intensity of each area to be processed of the workpiece to be processed is substituted into the processing intensity The relationship with the thickness of the absorbing layer yields the thickness of the absorbing layer corresponding to each area to be processed.
优选地，步骤S14具体包括：Preferably, step S14 specifically includes:
S141：构建加工强度和吸收层厚度的一次函数模型，将最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度代入一次函数模型得到加工强度与吸收层厚度的关系式；S141: Construct a linear function model of the processing intensity and the thickness of the absorbing layer, and substitute the maximum processing intensity, the minimum processing intensity, the thickness of the first absorbing layer, and the thickness of the second absorbing layer into the linear function model to obtain a relational expression between the processing intensity and the thickness of the absorbing layer;
S142：将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度。S142: Substituting the processing intensity of each area to be processed of the workpiece to be processed into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed.
本发明提供了一种激光冲击强化装置，包括：The invention provides a laser shock peening device, comprising:
厚度计算单元，用于获取与预置能量密度及脉冲宽度对应的加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度；The thickness calculation unit is used to obtain the relationship between the processing intensity and the thickness of the absorbing layer corresponding to the preset energy density and pulse width, and substitute the processing intensity of each area to be processed of the workpiece to be processed into the relationship between the processing intensity and the thickness of the absorbing layer to obtain The thickness of the absorbing layer corresponding to each area to be processed;
覆盖加工单元，用于在待加工工件的各个待加工区域覆盖对应的吸收层厚度的吸收层，以预置能量密度和脉冲宽度的激光参数对待加工工件的各个待加工区域进行激光冲击强化。The covering processing unit is used to cover each area of the workpiece to be processed with an absorbing layer corresponding to the thickness of the absorbing layer, and perform laser shock strengthening on each area of the workpiece to be processed with laser parameters of preset energy density and pulse width.
优选地，厚度计算单元具体包括：Preferably, the thickness calculation unit specifically includes:
强度子单元，用于获取预置能量密度、脉冲宽度、待加工工件的最大加工强度和最小加工强度；The intensity subunit is used to obtain the preset energy density, pulse width, maximum processing intensity and minimum processing intensity of the workpiece to be processed;
最小子单元，用于在预置能量密度和脉冲宽度的条件下进行测试，得到最大加工强度对应的第一吸收层厚度；The smallest subunit is used for testing under the conditions of preset energy density and pulse width to obtain the thickness of the first absorbing layer corresponding to the maximum processing intensity;
最大子单元，用于在预置能量密度和脉冲宽度的条件下进行测试，得到最小加工强度对应的第二吸收层厚度；The largest subunit is used for testing under the conditions of preset energy density and pulse width to obtain the thickness of the second absorbing layer corresponding to the minimum processing intensity;
计算子单元，用于根据最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度拟合得到加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度。The calculation subunit is used to obtain the relationship between the processing intensity and the thickness of the absorbing layer according to the maximum processing intensity, the minimum processing intensity, the thickness of the first absorbing layer and the thickness of the second absorbing layer, and calculate the processing of each area to be processed of the workpiece to be processed Intensity is substituted into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed.
优选地，计算子单元具体包括：Preferably, the calculation subunit specifically includes:
拟合子单元，用于构建加工强度和吸收层厚度的一次函数模型，将最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度代入一次函数模型得到加工强度与吸收层厚度的关系式；The fitting subunit is used to construct the linear function model of processing intensity and thickness of the absorbing layer, and the maximum processing intensity, the minimum processing intensity, the thickness of the first absorbing layer and the thickness of the second absorbing layer are substituted into the linear function model to obtain the processing intensity and the thickness of the absorbing layer relational formula;
代入子单元，用于将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度。A subunit is used for substituting the processing intensity of each area to be processed of the workpiece to be processed into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed.
从以上技术方案可以看出，本发明具有以下优点：As can be seen from the above technical solutions, the present invention has the following advantages:
本发明提供了一种激光冲击强化方法，传统的激光在不同区域需要达到不同的加工强度需要调节脉冲激光参数，但是本发明提供的激光冲击强化方法根据加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度，在相同的预置能量密度和脉冲宽度的条件下通过改变待加工工件的各个待加工区域吸收层厚度达到不同的加工强度。改变吸收层厚度操作简单，不需要改变激光冲击设备的脉冲激光参数，解决了当前对于复杂形状的零件进行区域不等强度的激光冲击强化时，需要调节不同区域的脉冲激光参数，编程复杂，激光冲击强化的实用性和操作效率低的技术问题。The invention provides a laser shock peening method. Traditional lasers need to adjust pulse laser parameters to achieve different processing intensities in different regions. However, the laser shock peening method provided by the present invention is based on the relationship between processing intensity and thickness of the absorbing layer. The processing intensity of each area to be processed of the workpiece to be processed is substituted into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed. Under the same preset energy density and pulse width, by changing the workpiece to be processed The thickness of the absorbent layer in each area to be processed achieves different processing intensities. Changing the thickness of the absorbing layer is simple and does not need to change the pulse laser parameters of the laser shock equipment, which solves the problem of adjusting the pulse laser parameters of different regions when performing laser shock strengthening of parts with complex shapes with different intensities, and the programming is complicated. The practicality of impact strengthening and the technical problems of low operational efficiency.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings on the premise of not paying creative efforts.
图1为本发明实施例提供的一种激光冲击强化方法的一个实施例的流程示意图；Fig. 1 is a schematic flow chart of an embodiment of a laser shock peening method provided by an embodiment of the present invention;
图2为本发明实施例提供的一种激光冲击强化方法的另一个实施例的流程示意图；Fig. 2 is a schematic flowchart of another embodiment of a laser shock peening method provided by an embodiment of the present invention;
图3为本发明实施例提供的一种激光冲击强化装置的一个实施例的流程示意图。Fig. 3 is a schematic flowchart of an embodiment of a laser shock peening device provided by an embodiment of the present invention.
具体实施方式Detailed ways
本发明实施例提供了一种激光冲击强化方法及装置，解决了当前对于复杂形状的零件进行区域不等强度的激光冲击强化时，需要调节不同区域的脉冲激光参数，编程复杂，激光冲击强化的实用性和操作效率低的技术问题。The embodiment of the present invention provides a laser shock peening method and device, which solves the problem of needing to adjust the pulse laser parameters in different regions when performing laser shock peening with different intensities on complex-shaped parts, complicated programming, and laser shock peening. Technical problems of practicality and low operational efficiency.
为使得本发明的发明目的、特征、优点能够更加的明显和易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，下面所描述的实施例仅仅是本发明一部分实施例，而非全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
请参阅图1，本发明实施例提供了一种激光冲击强化方法的一个实施例，包括：Please refer to Fig. 1, an embodiment of the present invention provides an embodiment of a laser shock peening method, including:
步骤101：获取与预置能量密度及脉冲宽度对应的加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度；Step 101: Obtain the relationship between the processing intensity and the thickness of the absorbing layer corresponding to the preset energy density and pulse width, and substitute the processing intensity of each area to be processed into the relationship between the processing intensity and the thickness of the absorbing layer to obtain each to-be-processed The thickness of the absorbing layer corresponding to the area;
需要说明的是，在进行激光冲击强化时，吸收层可以对待加工工件进行保护，避免待加工工件被激光烧灼。It should be noted that during laser shock peening, the absorbing layer can protect the workpiece to be processed and prevent the workpiece from being burned by the laser.
在相同的预置能量密度和脉冲宽度等激光参数下，待加工工件表面覆盖有不同的吸收层厚度时，激光冲击强化具有不同的加工强度。Under the same preset laser parameters such as energy density and pulse width, when the surface of the workpiece to be processed is covered with different thicknesses of the absorbing layer, laser shock peening has different processing intensities.
所以，首先确定激光能量密度和脉冲宽度，获取预置能量密度和脉冲宽度。Therefore, first determine the laser energy density and pulse width, and obtain the preset energy density and pulse width.
然后获取与预置能量密度及脉冲宽度对应的加工强度与吸收层厚度的关系式。Then obtain the relationship between the processing intensity and the thickness of the absorbing layer corresponding to the preset energy density and pulse width.
由于待加工工件的各个待加工区域所需的加工强度不同，所以将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式，从而计算得到各个待加工区域所需覆盖的吸收层厚度。Since the processing intensity required for each area to be processed of the workpiece to be processed is different, the processing intensity of each area to be processed of the workpiece to be processed is substituted into the relationship between the processing intensity and the thickness of the absorbing layer to calculate the required coverage of each area to be processed the thickness of the absorbing layer.
步骤102：在待加工工件的各个待加工区域覆盖对应的吸收层厚度的吸收层，以预置能量密度和脉冲宽度的激光参数对待加工工件的各个待加工区域进行激光冲击强化。Step 102: Cover each area of the workpiece to be processed with an absorbing layer corresponding to the thickness of the absorbing layer, and perform laser shock peening on each area of the workpiece to be processed with preset laser parameters of energy density and pulse width.
需要说明的是，在各个待加工区域覆盖对应的吸收层厚度的吸收层，以预置能量密度和脉冲宽度的激光参数对待加工工件的各个待加工区域进行激光冲击强化，即可实现在相同的预置的能量密度和脉冲宽度的条件下，在不同的待加工区域得到不同的加工强度。It should be noted that, covering each area to be processed with an absorbing layer with a corresponding thickness of the absorbing layer, and performing laser shock strengthening on each area to be processed of the workpiece with preset energy density and pulse width laser parameters, it can be achieved in the same Under the conditions of preset energy density and pulse width, different processing intensities can be obtained in different areas to be processed.
本实施例提供了一种激光冲击强化方法，传统的激光在不同区域需要达到不同的加工强度需要调节脉冲激光参数，但是本发明提供的激光冲击强化方法根据加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度，在相同的预置能量密度和脉冲宽度的条件下通过改变待加工工件的各个待加工区域吸收层厚度达到不同的加工强度，改变吸收层厚度操作简单，不需要改变激光冲击设备的脉冲激光参数，解决了当前对于复杂形状的零件进行区域不等强度的激光冲击强化时，需要调节不同区域的脉冲激光参数，编程复杂，激光冲击强化的实用性和操作效率低的技术问题。This embodiment provides a laser shock peening method. Traditional lasers need to achieve different processing intensities in different regions and need to adjust pulse laser parameters. However, the laser shock peening method provided by the present invention is based on the relationship between processing intensity and thickness of the absorbing layer. Substituting the processing intensity of each area to be processed into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed, under the same preset energy density and pulse width, by changing the The thickness of the absorbing layer in each area to be processed of the workpiece reaches different processing strengths. Changing the thickness of the absorbing layer is simple and does not need to change the pulse laser parameters of the laser shock equipment. At the same time, it is necessary to adjust the pulse laser parameters in different regions, the programming is complicated, the practicality of laser shock peening and the technical problems of low operating efficiency.
以上为本发明实施例提供的一种激光冲击强化方法的一个实施例，以下为本发明实施例提供的一种激光冲击强化方法的另一个实施例。The above is an embodiment of a laser shock peening method provided by an embodiment of the present invention, and the following is another embodiment of a laser shock peening method provided by an embodiment of the present invention.
请参阅图2，本发明实施例提供了一种激光冲击强化方法的另一个实施例，包括：Please refer to Fig. 2, the embodiment of the present invention provides another embodiment of a laser shock peening method, including:
步骤201：获取预置能量密度、脉冲宽度、待加工工件的最大加工强度和最小加工强度；Step 201: Obtain preset energy density, pulse width, maximum processing intensity and minimum processing intensity of the workpiece to be processed;
需要说明的是，在进行激光冲击强化时，首先需要获取预置能量密度和脉冲宽度。It should be noted that when performing laser shock peening, it is first necessary to obtain a preset energy density and pulse width.
得到预置能量密度和脉冲宽度之后，可以直接通过查阅文献和历史资料等方式确定加工强度与吸收层厚度的关系式，也可以通过实验测试的方法确定加工强度与吸收层厚度的关系式。After obtaining the preset energy density and pulse width, you can directly determine the relationship between the processing intensity and the thickness of the absorbing layer by consulting literature and historical data, or determine the relationship between the processing intensity and the thickness of the absorbing layer through experimental testing.
获取最大加工强度之后，设置多个测试件，在各个测试件的表面覆盖有一系列不同厚度的吸收层，对各个测试件进行激光冲击强化直至达到最大加工强度，测试件的材料与待加工工件的材料一致。After the maximum processing strength is obtained, multiple test pieces are set, and the surface of each test piece is covered with a series of absorbing layers of different thicknesses, and each test piece is subjected to laser shock strengthening until the maximum processing strength is reached. The material is consistent.
实验过程中选取不同的吸收层厚度时，可以先通过下式大致确定吸收层厚度的选取范围：When selecting different absorbing layer thicknesses during the experiment, the selection range of the absorbing layer thickness can be roughly determined by the following formula:
其中，z为吸收层厚度，τ为脉冲宽度，v为吸收层气化速度，A为材料表面激光吸收系数，I0为预置能量密度，ρ为材料密度，L为汽化热，c为比热容，Tb为气化温度，T0为初始温度。Among them, z is the thickness of the absorbing layer, τ is the pulse width, v is the gasification velocity of the absorbing layer, A is the laser absorption coefficient of the material surface, I 0 is the preset energy density, ρ is the material density, L is the heat of vaporization, and c is the specific heat capacity , T b is the gasification temperature, and T 0 is the initial temperature.
式(1)为吸收层厚度与能量密度以及脉冲宽度的关系式，由此可以大致确定吸收层厚度的选取范围。Equation (1) is the relationship between the thickness of the absorbing layer and the energy density and pulse width, from which the selection range of the thickness of the absorbing layer can be roughly determined.
步骤202：在预置能量密度和脉冲宽度的条件下进行测试，得到最大加工强度对应的第一吸收层厚度；Step 202: Test under the conditions of preset energy density and pulse width to obtain the thickness of the first absorbing layer corresponding to the maximum processing intensity;
需要说明的是，为避免高温对待加工零件表面质量造成影响，以吸收层不被完全灼烧为准，通过实际试验确定获得最大加工强度时的最小吸收层厚度，并定义为第一吸收层厚度。It should be noted that, in order to avoid the influence of high temperature on the surface quality of the parts to be processed, the minimum thickness of the absorption layer when the maximum processing strength is obtained is determined through actual experiments, and is defined as the thickness of the first absorption layer. .
值得注意的是，如果在预置脉冲激光参数条件下达到最大加工强度无法保证吸收层不被完全灼烧，则要求技术人员重新调整步骤201中的相关脉冲激光参数。It is worth noting that if the maximum processing intensity cannot be guaranteed to prevent the absorbing layer from being completely burnt under the condition of preset pulse laser parameters, technicians are required to readjust the relevant pulse laser parameters in step 201 .
步骤203：在预置能量密度和脉冲宽度的条件下进行测试，得到最小加工强度对应的第二吸收层厚度；Step 203: Test under the preset energy density and pulse width conditions to obtain the thickness of the second absorbing layer corresponding to the minimum processing intensity;
需要说明的是，当采用实验测试的方法时，有了最大加工强度和第一吸收层厚度，还需要另外一组数据作为参考，所以可在预置的能量密度和脉冲宽度的条件下进行测试，记录最小加工强度对应的第二吸收层厚度。It should be noted that when using the experimental test method, with the maximum processing strength and the thickness of the first absorbing layer, another set of data is needed as a reference, so the test can be carried out under the conditions of preset energy density and pulse width , record the thickness of the second absorbing layer corresponding to the minimum processing intensity.
步骤204：构建加工强度和吸收层厚度的一次函数模型，将最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度代入一次函数模型得到加工强度与吸收层厚度的关系式；Step 204: Construct a linear function model of the processing intensity and the thickness of the absorbent layer, and substitute the maximum processing intensity, the minimum processing intensity, the thickness of the first absorbent layer and the thickness of the second absorbent layer into the linear function model to obtain the relationship between the processing intensity and the thickness of the absorbent layer;
需要说明的是，因为本实施例中默认加工强度和吸收层厚度的关系式接近于一次线性关系，所以采用一次函数模型进行拟合，构建加工强度和吸收层厚度的一次函数模型。将最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度代入一次函数模型计算斜率和截距，从而得到加工强度与吸收层厚度的关系式。It should be noted that since the default relationship between the processing intensity and the thickness of the absorbent layer in this embodiment is close to a linear relationship, a linear function model is used for fitting to construct a linear function model of the processing intensity and the thickness of the absorbent layer. The maximum processing intensity, the minimum processing intensity, the thickness of the first absorbing layer and the thickness of the second absorbing layer were substituted into the linear function model to calculate the slope and intercept, so as to obtain the relationship between the processing intensity and the thickness of the absorbing layer.
加工强度与吸收层厚度的关系式可表示为：The relationship between the processing strength and the thickness of the absorbing layer can be expressed as:
其中，zmid为待求的吸收层厚度，zmin为第一吸收层厚度，zmax为第二吸收层厚度，Imid为待加工区域的加工强度，Imax为最大加工强度，Imin为最小加工强度。Among them, z mid is the thickness of the absorbing layer to be sought, z min is the thickness of the first absorbing layer, z max is the thickness of the second absorbing layer, I mid is the processing intensity of the area to be processed, I max is the maximum processing intensity, and I min is Minimal processing strength.
步骤205：将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度；Step 205: substituting the processing intensity of each area to be processed of the workpiece to be processed into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed;
需要说明的是，确定了加工强度与吸收层厚度的关系式之后，就可以将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度。It should be noted that after the relationship between the processing intensity and the thickness of the absorbing layer is determined, the processing intensity of each area to be processed of the workpiece to be processed can be substituted into the relationship between the processing intensity and the thickness of the absorbing layer to obtain the corresponding absorption of each area to be processed. layer thickness.
步骤206：在待加工工件的各个待加工区域覆盖对应的吸收层厚度的吸收层，以预置能量密度和脉冲宽度的激光参数对待加工工件的各个待加工区域进行激光冲击强化。Step 206: Cover each area of the workpiece to be processed with an absorbing layer corresponding to the thickness of the absorbing layer, and perform laser shock peening on each area of the workpiece to be processed with laser parameters of preset energy density and pulse width.
需要说明的是，在各个待加工区域覆盖对应的吸收层厚度的吸收层，以预置能量密度和脉冲宽度的激光参数对待加工工件的各个待加工区域进行激光冲击强化，即可实现在相同的预置能量密度和脉冲宽度的条件下，在不同的待加工区域得到不同的加工强度。It should be noted that, covering each area to be processed with an absorbing layer with a corresponding thickness of the absorbing layer, and performing laser shock strengthening on each area to be processed of the workpiece with preset energy density and pulse width laser parameters, it can be achieved in the same Under the condition of preset energy density and pulse width, different processing intensities can be obtained in different areas to be processed.
本实施例提供了一种激光冲击强化方法，根据加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度，在相同的预置能量密度和脉冲宽度的条件下通过改变待加工工件的各个待加工区域吸收层厚度达到不同的加工强度，改变吸收层厚度操作简单，不需要改变激光冲击设备的脉冲激光参数，实现待加工工件强化效果与服役要求的整体一致性匹配，达到精准调控零件综合服役性能的目的，工艺简便易行，可提高多种冲击强度要求工件的工艺选取效率，不等强度加工更有针对性地对工件进行分区域性能优化，适用于航空发动机叶片等复杂结构工件的激光冲击强化处理。This embodiment provides a laser shock peening method. According to the relationship between the processing intensity and the thickness of the absorbing layer, the processing intensity of each area to be processed of the workpiece to be processed is substituted into the relationship between the processing intensity and the thickness of the absorbing layer to obtain each area to be processed The thickness of the corresponding absorbing layer, under the same preset energy density and pulse width, can achieve different processing intensities by changing the thickness of the absorbing layer in each area of the workpiece to be processed. Changing the thickness of the absorbing layer is easy to operate without changing the laser shock The pulse laser parameters of the equipment can realize the overall consistency matching between the strengthening effect of the workpiece to be processed and the service requirements, and achieve the purpose of accurately regulating the comprehensive service performance of the parts. The process is simple and easy, and can improve the process selection efficiency of workpieces with various impact strength requirements. Equal strength processing is more targeted to optimize the performance of workpieces in different regions, and is suitable for laser shock strengthening treatment of complex structural workpieces such as aero-engine blades.
综上所述，本实施例提供的激光冲击强化方法解决了当前对于复杂形状的零件进行区域不等强度的激光冲击强化时，需要调节不同区域的脉冲激光参数，编程复杂，激光冲击强化的实用性和操作效率低的技术问题。To sum up, the laser shock peening method provided in this embodiment solves the problem of adjusting the pulse laser parameters in different regions when performing laser shock peening with different intensities on parts with complex shapes. The programming is complicated and the laser shock peening is practical. technical issues of sex and operational inefficiency.
以上为本发明实施例提供的一种激光冲击强化方法的另一个实施例，以下为本发明实施例提供的一种激光冲击强化装置的一个实施例。The above is another embodiment of a laser shock peening method provided by an embodiment of the present invention, and the following is an embodiment of a laser shock peening device provided by an embodiment of the present invention.
请参阅图3，本发明实施例提供了一种激光冲击强化装置的一个实施例，包括：Please refer to Fig. 3, an embodiment of the present invention provides an embodiment of a laser shock peening device, including:
厚度计算单元301，用于获取与预置能量密度及脉冲宽度对应的加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度；The thickness calculation unit 301 is used to obtain the relationship between the processing intensity and the thickness of the absorbing layer corresponding to the preset energy density and pulse width, and substitute the processing intensity of each area to be processed of the workpiece to be processed into the relationship between the processing intensity and the thickness of the absorbing layer Obtain the thickness of the absorbing layer corresponding to each area to be processed;
覆盖加工单元302，用于在待加工工件的各个待加工区域覆盖对应的吸收层厚度的吸收层，以预置能量密度和脉冲宽度的激光参数对待加工工件的各个待加工区域进行激光冲击强化。The covering processing unit 302 is used to cover each area of the workpiece to be processed with an absorbing layer corresponding to the thickness of the absorbing layer, and perform laser shock peening on each area of the workpiece to be processed with laser parameters of preset energy density and pulse width.
进一步地，厚度计算单元301具体包括：Further, the thickness calculation unit 301 specifically includes:
强度子单元3011，用于获取预置能量密度、脉冲宽度、待加工工件的最大加工强度和最小加工强度；Intensity subunit 3011, used to obtain preset energy density, pulse width, maximum processing intensity and minimum processing intensity of the workpiece to be processed;
最小子单元3012，用于在预置能量密度和脉冲宽度的条件下进行测试，得到最大加工强度对应的第一吸收层厚度；The smallest subunit 3012 is used for testing under the conditions of preset energy density and pulse width to obtain the thickness of the first absorbing layer corresponding to the maximum processing intensity;
最大子单元3013，用于在预置能量密度和脉冲宽度的条件下进行测试，得到最小加工强度对应的第二吸收层厚度；The largest subunit 3013 is used to conduct tests under the conditions of preset energy density and pulse width to obtain the thickness of the second absorbing layer corresponding to the minimum processing intensity;
计算子单元3014，用于根据最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度拟合得到加工强度与吸收层厚度的关系式，将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度。The calculation subunit 3014 is used to obtain the relationship between the processing intensity and the thickness of the absorbing layer according to the maximum processing intensity, the minimum processing intensity, the thickness of the first absorbing layer and the thickness of the second absorbing layer, and calculate the The processing intensity is substituted into the relationship between processing intensity and the thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed.
进一步地，计算子单元3014具体包括：Further, the computing subunit 3014 specifically includes:
拟合子单元30141，用于构建加工强度和吸收层厚度的一次函数模型，将最大加工强度、最小加工强度、第一吸收层厚度和第二吸收层厚度代入一次函数模型得到加工强度与吸收层厚度的关系式；The fitting subunit 30141 is used to construct the linear function model of the processing intensity and the thickness of the absorbing layer, and substitute the maximum processing intensity, the minimum processing intensity, the thickness of the first absorbing layer and the thickness of the second absorbing layer into the linear function model to obtain the processing intensity and the absorbing layer The relation of thickness;
代入子单元30142，用于将待加工工件的各个待加工区域的加工强度代入加工强度与吸收层厚度的关系式得到各个待加工区域对应的吸收层厚度。Substitute into subunit 30142, for substituting the processing intensity of each area to be processed of the workpiece to be processed into the relationship between processing intensity and thickness of the absorbing layer to obtain the thickness of the absorbing layer corresponding to each area to be processed.
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。Those skilled in the art can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.
在本申请所提供的几个实施例中，应该理解到，所揭露的系统，装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or May be integrated into another system, or some features may be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
另外，在本发明各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本发明各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-OnlyMemory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。If the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the essence of the technical solution of the present invention or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-OnlyMemory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program codes.
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still understand the foregoing The technical solutions recorded in each embodiment are modified, or some of the technical features are replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.
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