CN108728633A - A kind of laser shock peening method and device - Google Patents
A kind of laser shock peening method and device Download PDFInfo
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- CN108728633A CN108728633A CN201810663972.7A CN201810663972A CN108728633A CN 108728633 A CN108728633 A CN 108728633A CN 201810663972 A CN201810663972 A CN 201810663972A CN 108728633 A CN108728633 A CN 108728633A
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
- C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D11/00—Process control or regulation for heat treatments
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Abstract
The invention discloses a kind of laser shock peening method and devices.The present invention provides a kind of laser shock peening methods, according to the relational expression of processing intensity and absorber thickness, the processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and the relational expression of absorber thickness and obtains the corresponding absorber thickness in each region to be processed, reaches different processing intensity by changing each region absorber thickness to be processed of workpiece to be processed under conditions of identical preset energy density and pulse width.It is easy to operate to change absorber thickness, have no need to change the Pulsed Laser Parameters of laser-impact equipment, solve currently for complicated shape part carry out region variable strength it is laser impact intensified when, need the Pulsed Laser Parameters of adjusting different zones, programming is complicated, the low technical problem of laser impact intensified practicability and operating efficiency.
Description
Technical field
The present invention relates to technical field of material surface treatment more particularly to a kind of laser shock peening methods and device.
Background technology
With the development of science and technology, laser starts to be widely used by people.Laser-impact is a kind of using strong laser induced
Shock wave carrys out the new technology of reinforced metal, and the durability of metal material can be greatly enhanced.Preferably may be used since laser has
It up to property, can be accurately positioned, therefore reiforcing laser impact technology can handle the portion that some conventional surface reinforcement process cannot be handled
Position is particularly suitable for strengthening the structures such as aperture, chamfering, weld seam and groove.
But often there is different shape features and failure shape in different regions for the part of complex profile structure
Formula, different area requirements correspond to different laser shocking processing intensity, so that part obtains the raising of whole synthesis performance.
When carrying out the laser impact intensified processing of subregion variable strength to complex-shaped part in the past, generally pass through tune
Pulsed Laser Parameters are saved to realize the different processing intensity of different zones.But the adjusting of Pulsed Laser Parameters sets laser-impact
Standby performance requirement is higher, and different laser parameters set complexity in the programming of different zones, have seriously affected variable strength and have swashed
The practicability and operating efficiency of light shock peening processing.
Therefore, result in currently for complicated shape part carry out region variable strength it is laser impact intensified when, need
The Pulsed Laser Parameters of different zones are adjusted, programming is complicated, the low technology of laser impact intensified practicability and operating efficiency
Problem.
Invention content
The present invention provides a kind of laser shock peening method and device, solve part currently for complicated shape into
Row region variable strength it is laser impact intensified when, need the Pulsed Laser Parameters for adjusting different zones, programming is complicated, laser punching
Hit the practicability of reinforcing and the technical problem that operating efficiency is low.
The present invention provides a kind of laser shock peening methods, including：
S1：The relational expression for obtaining corresponding with preset energy density and pulse width processing intensity and absorber thickness, will
The processing intensity substitution processing intensity in each region to be processed of workpiece to be processed and the relational expression of absorber thickness obtain each
The corresponding absorber thickness in region to be processed；
S2：In the absorbed layer of the corresponding absorber thickness of each region overlay to be processed of workpiece to be processed, with preset energy
The laser parameter of metric density and pulse width carries out each region to be processed of workpiece to be processed laser impact intensified.
Preferably, step S1 is specifically included：
S11：Obtain preset energy density, pulse width, the maximum processing intensity of workpiece to be processed and minimum process intensity；
S12：It is tested under conditions of preset energy density and pulse width, obtains maximum processing intensity corresponding the
One absorber thickness；
S13：It is tested under conditions of preset energy density and pulse width, obtains minimum process intensity corresponding
Two absorber thickness；
S14：According to maximum processing intensity, minimum process intensity, the first absorber thickness and the fitting of the second absorber thickness
The relational expression of processing intensity and absorber thickness is obtained, the processing intensity in each region to be processed of workpiece to be processed is substituted into and is added
Work intensity and the relational expression of absorber thickness obtain the corresponding absorber thickness in each region to be processed.
Preferably, step S14 is specifically included：
S141：The linear function model of structure processing intensity and absorber thickness is strong by maximum processing intensity, minimum process
Degree, the first absorber thickness and the second absorber thickness substitute into linear function model and obtain the pass of processing intensity and absorber thickness
It is formula；
S142：The processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and absorber thickness
Relational expression obtains the corresponding absorber thickness in each region to be processed.
The present invention provides a kind of laser impact intensified devices, including：
Thickness calculation unit, for obtaining processing intensity corresponding with preset energy density and pulse width and absorbing thickness
The processing intensity in each region to be processed of workpiece to be processed is substituted into the pass of processing intensity and absorber thickness by the relational expression of degree
It is that formula obtains the corresponding absorber thickness in each region to be processed；
Covering processing unit, the suction for the corresponding absorber thickness of each region overlay to be processed in workpiece to be processed
Layer is received, laser punching is carried out to each region to be processed of workpiece to be processed with the laser parameter of preset energy density and pulse width
Hit reinforcing.
Preferably, thickness calculation unit specifically includes：
Intensity subelement, for obtaining preset energy density, pulse width, the maximum processing intensity of workpiece to be processed and most
Small processing intensity；
Minimum subelement obtains maximum processing for being tested under conditions of preset energy density and pulse width
Corresponding first absorber thickness of intensity；
Maximum subelement obtains minimum process for being tested under conditions of preset energy density and pulse width
Corresponding second absorber thickness of intensity；
Computation subunit, for being absorbed according to maximum processing intensity, minimum process intensity, the first absorber thickness and second
Layer thickness is fitted to obtain the relational expression of processing intensity and absorber thickness, by the processing in each region to be processed of workpiece to be processed
Intensity substitutes into processing intensity and the relational expression of absorber thickness and obtains the corresponding absorber thickness in each region to be processed.
Preferably, computation subunit specifically includes：
Be fitted subelement, the linear function model for build processing intensity and absorber thickness, by it is maximum process intensity,
Minimum process intensity, the first absorber thickness and the second absorber thickness substitute into linear function model and obtain processing intensity and absorb
The relational expression of layer thickness；
Subelement is substituted into, for substituting into processing intensity and inhaling the processing intensity in each region to be processed of workpiece to be processed
The relational expression for receiving layer thickness obtains the corresponding absorber thickness in each region to be processed.
As can be seen from the above technical solutions, the present invention has the following advantages：
The present invention provides a kind of laser shock peening method, traditional laser different zones need to reach it is different plus
Work intensity needs to adjust Pulsed Laser Parameters, but laser shock peening method provided by the invention is according to processing intensity and absorption
The processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and absorber thickness by the relational expression of layer thickness
Relational expression obtain the corresponding absorber thickness in each region to be processed, in the item of identical preset energy density and pulse width
Reach different processing intensity by changing each region absorber thickness to be processed of workpiece to be processed under part.Change absorbed layer
Thickness is easy to operate, haves no need to change the Pulsed Laser Parameters of laser-impact equipment, solves zero currently for complicated shape
Part carry out region variable strength it is laser impact intensified when, need the Pulsed Laser Parameters for adjusting different zones, programming is complicated, swashs
The low technical problem of the practicability and operating efficiency of light shock peening.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of flow diagram of one embodiment of laser shock peening method provided in an embodiment of the present invention；
Fig. 2 is a kind of flow signal of another embodiment of laser shock peening method provided in an embodiment of the present invention
Figure；
Fig. 3 is a kind of flow diagram of one embodiment of laser impact intensified device provided in an embodiment of the present invention.
Specific implementation mode
An embodiment of the present invention provides a kind of laser shock peening method and devices, solve currently for complicated shape
Part carry out region variable strength it is laser impact intensified when, need the Pulsed Laser Parameters for adjusting different zones, programming is complicated,
The low technical problem of laser impact intensified practicability and operating efficiency.
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
All other embodiment that those of ordinary skill is obtained without making creative work, belongs to protection of the present invention
Range.
Referring to Fig. 1, an embodiment of the present invention provides a kind of one embodiment of laser shock peening method, including：
Step 101：Obtain the relationship of corresponding with preset energy density and pulse width processing intensity and absorber thickness
Formula, the relational expression that the processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and absorber thickness obtain
The corresponding absorber thickness in each region to be processed；
It should be noted that when carrying out laser impact intensified, absorbed layer can protect workpiece to be processed, avoid
Workpiece to be processed is by laser burn.
Under the laser parameters such as identical preset energy density and pulse width, workpiece to be processed surface is covered with different
It is laser impact intensified that there is different processing intensity when absorber thickness.
So, it is first determined laser energy density and pulse width obtain preset energy density and pulse width.
Then the relational expression of corresponding with preset energy density and pulse width processing intensity and absorber thickness is obtained.
Processing intensity needed for each region to be processed due to workpiece to be processed is different, so by each of workpiece to be processed
The processing intensity in a region to be processed substitutes into the relational expression of processing intensity and absorber thickness, each to be processed to be calculated
The absorber thickness covered needed for region.
Step 102：In the absorbed layer of the corresponding absorber thickness of each region overlay to be processed of workpiece to be processed, with pre-
The laser parameter for setting energy density and pulse width is laser impact intensified to each region progress to be processed of workpiece to be processed.
It should be noted that in the absorbed layer of the corresponding absorber thickness of each region overlay to be processed, with preset energy
The laser parameter of density and pulse width carries out each region to be processed of workpiece to be processed laser impact intensified, you can realizes
Under conditions of identical preset energy density and pulse width, it is strong to obtain different processing in different regions to be processed
Degree.
A kind of laser shock peening method is present embodiments provided, traditional laser needs to reach different in different zones
Processing intensity needs to adjust Pulsed Laser Parameters, but laser shock peening method provided by the invention is according to processing intensity and suction
The processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and absorbs thickness by the relational expression for receiving layer thickness
The relational expression of degree obtains the corresponding absorber thickness in each region to be processed, in identical preset energy density and pulse width
Under the conditions of by changing each region absorber thickness to be processed of workpiece to be processed reach different processing intensity, change and absorb
Layer thickness is easy to operate, haves no need to change the Pulsed Laser Parameters of laser-impact equipment, solves currently for complicated shape
Part carry out region variable strength it is laser impact intensified when, need the Pulsed Laser Parameters for adjusting different zones, programming is complicated,
The low technical problem of laser impact intensified practicability and operating efficiency.
It is above a kind of one embodiment of laser shock peening method provided in an embodiment of the present invention, is below the present invention
A kind of another embodiment for laser shock peening method that embodiment provides.
Referring to Fig. 2, an embodiment of the present invention provides a kind of another embodiments of laser shock peening method, including：
Step 201：Obtain preset energy density, pulse width, the maximum processing intensity of workpiece to be processed and minimum process
Intensity；
It should be noted that when carrying out laser impact intensified, it is necessary first to obtain preset energy density and pulse width.
It, can be by directly by true in a manner of consulting literatures and historical summary etc. after obtaining preset energy density and pulse width
Surely the relational expression of intensity and absorber thickness is processed, processing intensity can also be determined by the method for experiment test and absorbs thickness
The relational expression of degree.
After obtaining maximum processing intensity, multiple test blocks are set, the surface of each test block be covered with it is a series of not
The absorbed layer of stack pile carries out laser impact intensified until reaching maximum processing intensity, the material of test block to each test block
It is consistent with the material of workpiece to be processed.
When choosing different absorber thickness in experimentation, the choosing that following formula substantially determines absorber thickness can be first passed through
Take range：
Wherein, z is absorber thickness, and τ is pulse width, and v is absorbed layer gasification rate, and A is material surface laser absorption
Coefficient, I0For preset energy density, ρ is density of material, and L is heat of vaporization, and c is specific heat capacity, TbFor gasification temperature, T0For initial temperature
Degree.
Formula (1) is absorber thickness and energy density and the relational expression of pulse width, is absorbed it is possible thereby to substantially determine
The selection range of layer thickness.
Step 202：It is tested under conditions of preset energy density and pulse width, obtains maximum processing intensity and correspond to
The first absorber thickness；
It should be noted that impacted to avoid high temperature from treating quality of work piece surface, it is incomplete with absorbed layer
Subject to calcination, minimal absorption layer thickness when obtaining maximum processing intensity is determined by actual tests, and be defined as the first absorption
Layer thickness.
It is worth noting that, if reaching maximum processing intensity under the conditions of presetting pulse laser parameter can not ensure to absorb
Layer then requires technical staff to readjust the coherent pulse laser parameter in step 201 not by complete calcination.
Step 203：It is tested under conditions of preset energy density and pulse width, obtains minimum process intensity correspondence
The second absorber thickness；
It should be noted that when using the method for experiment test, there are maximum processing intensity and the first absorber thickness,
Also need to another set data as reference, so can be tested under conditions of preset energy density and pulse width,
Record corresponding second absorber thickness of minimum process intensity.
Step 204：The linear function model for building processing intensity and absorber thickness adds maximum processing intensity, minimum
Work intensity, the first absorber thickness and the second absorber thickness substitute into linear function model and obtain processing intensity and absorber thickness
Relational expression；
It should be noted that because acquiescence processing intensity and the relational expression of absorber thickness are close to primary in the present embodiment
Linear relationship, so being fitted using linear function model, the linear function model of structure processing intensity and absorber thickness.
Maximum processing intensity, minimum process intensity, the first absorber thickness and the second absorber thickness are substituted into linear function model meter
Slope and intercept are calculated, to obtain the relational expression of processing intensity and absorber thickness.
Processing intensity and the relational expression of absorber thickness are represented by：
Wherein, zmidFor absorber thickness to be asked, zminFor the first absorber thickness, zmaxFor the second absorber thickness,
ImidFor the processing intensity in region to be processed, ImaxIntensity, I are processed for maximumminFor minimum process intensity.
Step 205：The processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and absorbs thickness
The relational expression of degree obtains the corresponding absorber thickness in each region to be processed；
It should be noted that after processing intensity and the relational expression of absorber thickness is determined, so that it may with by work to be processed
The processing intensity in each region to be processed of part substitutes into processing intensity and the relational expression of absorber thickness obtains each work area to be added
The corresponding absorber thickness in domain.
Step 206：In the absorbed layer of the corresponding absorber thickness of each region overlay to be processed of workpiece to be processed, with pre-
The laser parameter for setting energy density and pulse width is laser impact intensified to each region progress to be processed of workpiece to be processed.
It should be noted that in the absorbed layer of the corresponding absorber thickness of each region overlay to be processed, with preset energy
The laser parameter of density and pulse width carries out each region to be processed of workpiece to be processed laser impact intensified, you can realizes
Under conditions of identical preset energy density and pulse width, different processing intensity is obtained in different regions to be processed.
Present embodiments provide a kind of laser shock peening method, according to processing intensity and absorber thickness relational expression,
The relational expression that the processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and absorber thickness obtains respectively
The corresponding absorber thickness in a region to be processed, is waited under conditions of identical preset energy density and pulse width by changing
Each region absorber thickness to be processed of workpieces processing reaches different processing intensity, and change absorber thickness is easy to operate,
The Pulsed Laser Parameters of laser-impact equipment are had no need to change, realize that workpiece to be processed strengthens whole the one of effect and service demand
The matching of cause property achievees the purpose that control accurate part integrates military service performance, and simple process is easy, and a variety of impact strengths can be improved and want
The technique of workpiece is asked to choose efficiency, variable strength processing more targetedly carries out subregion performance optimization to workpiece, is suitable for
The laser impact intensified processing of the labyrinths workpiece such as blade of aviation engine.
In conclusion laser shock peening method provided in this embodiment solve the part currently for complicated shape into
Row region variable strength it is laser impact intensified when, need the Pulsed Laser Parameters for adjusting different zones, programming is complicated, laser punching
Hit the practicability of reinforcing and the technical problem that operating efficiency is low.
It is above a kind of another embodiment of laser shock peening method provided in an embodiment of the present invention, is below this hair
A kind of one embodiment for laser impact intensified device that bright embodiment provides.
Referring to Fig. 3, an embodiment of the present invention provides a kind of one embodiment of laser impact intensified device, including：
Thickness calculation unit 301, for obtaining processing intensity corresponding with preset energy density and pulse width and absorbing
The processing intensity in each region to be processed of workpiece to be processed is substituted into processing intensity and absorber thickness by the relational expression of layer thickness
Relational expression obtain the corresponding absorber thickness in each region to be processed；
Covering processing unit 302, for the corresponding absorber thickness of each region overlay to be processed in workpiece to be processed
Absorbed layer, each region to be processed of workpiece to be processed is swashed with the laser parameter of preset energy density and pulse width
Light shock peening.
Further, thickness calculation unit 301 specifically includes：
Intensity subelement 3011, for obtaining preset energy density, pulse width, the maximum processing intensity of workpiece to be processed
With minimum process intensity；
Minimum subelement 3012 obtains maximum for being tested under conditions of preset energy density and pulse width
Process corresponding first absorber thickness of intensity；
Maximum subelement 3013 obtains minimum for being tested under conditions of preset energy density and pulse width
Process corresponding second absorber thickness of intensity；
Computation subunit 3014, for according to maximum processing intensity, minimum process intensity, the first absorber thickness and second
Absorber thickness is fitted to obtain the relational expression of processing intensity and absorber thickness, by each region to be processed of workpiece to be processed
Processing intensity substitutes into processing intensity and the relational expression of absorber thickness and obtains the corresponding absorber thickness in each region to be processed.
Further, computation subunit 3014 specifically includes：
It is fitted subelement 30141, the linear function model for building processing intensity and absorber thickness processes maximum
Intensity, minimum process intensity, the first absorber thickness and the second absorber thickness substitute into linear function model and obtain processing intensity
With the relational expression of absorber thickness；
Subelement 30142 is substituted into, it is strong for the processing intensity in each region to be processed of workpiece to be processed to be substituted into processing
Degree obtains the corresponding absorber thickness in each region to be processed with the relational expression of absorber thickness.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed system, device and method can be with
It realizes by another way.For example, the apparatus embodiments described above are merely exemplary, for example, the unit
It divides, only a kind of division of logic function, formula that in actual implementation, there may be another division manner, such as multiple units or component
It can be combined or can be integrated into another system, or some features can be ignored or not executed.Another point, it is shown or
The mutual coupling, direct-coupling or communication connection discussed can be the indirect coupling by some interfaces, device or unit
It closes or communicates to connect, can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, you can be located at a place, or may be distributed over multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, it can also
It is that each unit physically exists alone, it can also be during two or more units be integrated in one unit.Above-mentioned integrated list
The form that hardware had both may be used in member is realized, can also be realized in the form of SFU software functional unit.
If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product
When, it can be stored in a computer read/write memory medium.Based on this understanding, technical scheme of the present invention is substantially
The all or part of the part that contributes to existing technology or the technical solution can be in the form of software products in other words
It embodies, which is stored in a storage medium, including some instructions are used so that a computer
Equipment (can be personal computer, server or the network equipment etc.) executes the complete of each embodiment the method for the present invention
Portion or part steps.And storage medium above-mentioned includes：USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various can store journey
The medium of sequence code.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (6)
1. a kind of laser shock peening method, which is characterized in that including：
S1：The relational expression for obtaining corresponding with preset energy density and pulse width processing intensity and absorber thickness, will be to be added
The processing intensity substitution processing intensity in each region to be processed of work workpiece and the relational expression of absorber thickness obtain each to be added
The corresponding absorber thickness in work area domain；
S2：It is close with preset energy in the absorbed layer of the corresponding absorber thickness of each region overlay to be processed of workpiece to be processed
Degree and the laser parameter of pulse width carry out each region to be processed of workpiece to be processed laser impact intensified.
2. a kind of laser shock peening method according to claim 1, which is characterized in that step S1 is specifically included：
S11：Obtain preset energy density, pulse width, the maximum processing intensity of workpiece to be processed and minimum process intensity；
S12：It is tested under conditions of preset energy density and pulse width, obtains maximum processing intensity corresponding first and inhale
Receive layer thickness；
S13：It is tested under conditions of preset energy density and pulse width, obtains minimum process intensity corresponding second and inhale
Receive layer thickness；
S14：It is fitted to obtain according to maximum processing intensity, minimum process intensity, the first absorber thickness and the second absorber thickness
It is strong to be substituted into processing by the relational expression for processing intensity and absorber thickness for the processing intensity in each region to be processed of workpiece to be processed
Degree obtains the corresponding absorber thickness in each region to be processed with the relational expression of absorber thickness.
3. a kind of laser shock peening method according to claim 2, which is characterized in that step S14 is specifically included：
S141：Structure processing intensity and absorber thickness linear function model, by maximum processing intensity, minimum process intensity,
First absorber thickness and the second absorber thickness substitute into linear function model and obtain the relationship of processing intensity and absorber thickness
Formula；
S142：The processing intensity in each region to be processed of workpiece to be processed is substituted into the relationship of processing intensity and absorber thickness
Formula obtains the corresponding absorber thickness in each region to be processed.
4. a kind of laser impact intensified device, which is characterized in that including：
Thickness calculation unit, for obtaining intensity and the absorber thickness processed corresponding with preset energy density and pulse width
The processing intensity in each region to be processed of workpiece to be processed is substituted into the relational expression of processing intensity and absorber thickness by relational expression
Obtain the corresponding absorber thickness in each region to be processed；
Covering processing unit, the absorption for the corresponding absorber thickness of each region overlay to be processed in workpiece to be processed
Layer carries out laser-impact with the laser parameter of preset energy density and pulse width to each region to be processed of workpiece to be processed
Strengthen.
5. a kind of laser impact intensified device according to claim 4, which is characterized in that thickness calculation unit specifically wraps
It includes：
Intensity subelement adds for obtaining preset energy density, pulse width, the maximum processing intensity of workpiece to be processed and minimum
Work intensity；
Minimum subelement obtains maximum processing intensity for being tested under conditions of preset energy density and pulse width
Corresponding first absorber thickness；
Maximum subelement obtains minimum process intensity for being tested under conditions of preset energy density and pulse width
Corresponding second absorber thickness；
Computation subunit, for absorbing thickness according to maximum processing intensity, minimum process intensity, the first absorber thickness and second
Degree fitting obtains the relational expression of processing intensity and absorber thickness, by the processing intensity in each region to be processed of workpiece to be processed
It substitutes into processing intensity and the relational expression of absorber thickness and obtains the corresponding absorber thickness in each region to be processed.
6. a kind of laser impact intensified device according to claim 5, which is characterized in that computation subunit specifically includes：
It is fitted subelement, the linear function model for building processing intensity and absorber thickness, by maximum processing intensity, minimum
Processing intensity, the first absorber thickness and the second absorber thickness substitute into linear function model and obtain processing intensity and absorb thickness
The relational expression of degree；
Subelement is substituted into, for the processing intensity in each region to be processed of workpiece to be processed to be substituted into processing intensity and absorbed layer
The relational expression of thickness obtains the corresponding absorber thickness in each region to be processed.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112779413A (en) * | 2020-12-24 | 2021-05-11 | 山东大学 | Load transfer type unequal-strength laser impact method |
| CN114473225A (en) * | 2022-02-15 | 2022-05-13 | 南京先进激光技术研究院 | Nondestructive laser impact marking device and marking method |
| US20240261905A1 (en) * | 2022-06-13 | 2024-08-08 | Jiangsu University | Laser peen forming device and method with adjustable absorbing layer |
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