CN108724431A - A kind of ceramic powders bonding printer - Google Patents
A kind of ceramic powders bonding printer Download PDFInfo
- Publication number
- CN108724431A CN108724431A CN201810746649.6A CN201810746649A CN108724431A CN 108724431 A CN108724431 A CN 108724431A CN 201810746649 A CN201810746649 A CN 201810746649A CN 108724431 A CN108724431 A CN 108724431A
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- Prior art keywords
- trays
- delivery pipe
- mixing chamber
- heating device
- ceramic
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- 239000000919 ceramic Substances 0.000 title claims abstract description 74
- 239000000843 powder Substances 0.000 title claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000000178 monomer Substances 0.000 claims abstract description 33
- 239000004593 Epoxy Substances 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 31
- 239000007767 bonding agent Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 239000004575 stone Substances 0.000 claims abstract description 8
- 238000007711 solidification Methods 0.000 claims abstract description 7
- 230000008023 solidification Effects 0.000 claims abstract description 7
- -1 trays Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 12
- 238000001723 curing Methods 0.000 description 29
- 238000000034 method Methods 0.000 description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 9
- 239000004615 ingredient Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 8
- 229910010271 silicon carbide Inorganic materials 0.000 description 8
- 238000005245 sintering Methods 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 125000000320 amidine group Chemical group 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 238000003746 solid phase reaction Methods 0.000 description 3
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N p-hydroxyphenylamine Natural products NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000010671 solid-state reaction Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- UDRBBAAFDWCADW-UHFFFAOYSA-N [Fe]C1C=CC=C1.CC(C)c1ccccc1 Chemical compound [Fe]C1C=CC=C1.CC(C)c1ccccc1 UDRBBAAFDWCADW-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000004482 other powder Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of ceramic powders bonding printer, including：Rack, carry the feed tray of the ceramic powders as raw material, trays, stone scraper plate, feed tray and trays can move up and down, the raw ceramic materials powder that stone scraper plate is used to will be above rack rushes at trays, it is set to form one layer of uniform material layer to be printed on trays, it is characterized in that, it further include curing agent delivery pipe, epoxy monomer delivery pipe, mixing chamber, nozzle and heating device, curing agent delivery pipe and epoxy monomer delivery pipe are connected to mixing chamber, nozzle is used to the thermosetting resin bonding agent obtained being injected in the region of every layer of specified needs bonding on trays after mixing chamber mixes according to control program；Heating device makes its temperature be higher than the solidification temperature of thermosetting resin for heating work pallet and its material layer to be printed of carrying.Efficient, high-precision, high intensity, high-purity, high compactness increasing material manufacturing may be implemented in the present invention.
Description
Technical field
The present invention relates to a kind of forming methods of ceramic material, more particularly to one kind is based on additional manufacturing technology, i.e., three-dimensional
The ceramic material increasing material manufacturing equipment of article manufacturing technology.
Background technology
Ceramic material has many advantages, such as low-density, high rigidity, high heat-resisting, high abrasion, has in extensive industrial circle
Fabulous application prospect, such as heat-insulated, heat proof material, ceramic bearing etc..Traditional ceramic forming material method is by ceramic log
Material, usually powder or slurry be put into mold carry out high temperature sintering formed blank, reuse machine cut, grinding method into
Row finishing, to obtain final product.But due to ceramic material high-melting-point, hard crisp unmanageable characteristic, tradition molding
Method is needed using expensive mold and machine tool, grinding tool, and production technology is complicated, and the process-cycle is long.
Increases material manufacturing technology uses computer program using the thought for successively adding manufacture, by the part model to be manufactured
Layered shaping is carried out, is needed the X-Y scheme printed from level to level, then successively printed by 3D printer, stack these two dimensions
Figure ultimately forms 3 d part entity.This material manufacture technology can be to avoid using mold and subsequent mechanical processing
Process, to realize the quick manufacture of part.
There are several disclosed ceramic material increasing material manufacturing methods at present, has had the main of certain correlation with the application
Have：
United States Patent (USP) 5,204,055 is spread on the table from level to level using previously prepared ceramic powders, and is successively used
Bonding agent is ejected into selection area by injector head, is made the powder bonding in the region, is successively accumulated in this way, ultimately form part at
Product.This technology does not include the solid-phase sintering of ceramics, only the fixation between bonding agent realization material powder, therefore final part
Intensity is very low.
8,568,649 B1 of United States Patent (USP) US are on the basis of the former, using polyvinyl alcohol as bonding agent, and in ceramics
After powder bonding molding, then carried out high temperature sintering.On the one hand the bonding agent ingredient in high temperature material removal is utilized；Another party
Face makes ceramic powders that high temperature solid state reaction occur, and forms the entity of consolidation, to improve part strength compared to the former.But by
It is very big (the preferred molecular weight of the patent is 9,000 to 10,000) in polyvinyl alcohol molecule amount, it is difficult to penetrate into small ceramic powder
Among last gap.Therefore ceramic powders grain size must be sufficiently large, so that bonding agent is penetrated into the gap for providing sufficient.In this way,
Contain many holes inside final finished material, be equivalent to the initial crack of material internal and concentrate stress point, reduces material
Expect the reliability of intensity and part.
Chinese patent CN 105601287 A, CN 03935036 A etc. disclose some and carried out using light-curing adhesive
Ceramic powders bond, to realize the technical method of three-dimensional manufacture.These methods use sodium metasilicate, magnesium fluosilicate etc. as solidification
Agent, hexafluorophosphate, 6- isopropylbenzene cyclopentadienyl iron etc. are used as initiator.This kind of bonding agent can pass through UV radiation curing, formation
The chemical bonds such as silica, fluosilicic, to realize the bonding of ceramic powders.The disadvantage is that introducing the impurity different from ceramic particle ingredient
Element, such as sodium, fluorine, phosphorus, iron to hinder the solid-phase crystallization reaction of ceramic particle, and then weaken Material Strength, Huo Zhezao
At the decline of other aspect performances.Simultaneously as these technologies need the method irradiated using ultraviolet light to consolidate bonding agent
Change, therefore cannot achieve the increasing material manufacturing of the absorbing materials such as silicon carbide or coloured ceramic powders.
Invention content
The present invention proposes that a kind of ceramic powders bond printer, may be implemented comprising including the microwave-absorbing ceramics materials such as silicon carbide
The efficient of most of ceramic materials, high-precision, high intensity, high-purity, high compactness increasing material manufacturing.The present invention is using as follows
Technical solution：
A kind of ceramic powders bonding printer, including：Rack, the feed tray for carrying ceramic powders as raw material,
Trays, stone scraper plate, feed tray and trays can move up and down, and stone scraper plate is used to will be above the raw material of rack
Ceramic powders rush at trays, it is made to form one layer of uniform material layer to be printed on trays, which is characterized in that
Further include curing agent delivery pipe, epoxy monomer delivery pipe, mixing chamber, nozzle and heating device, curing agent delivery pipe and ring
Oxygen resin monomer delivery pipe is connected to mixing chamber, nozzle for will the thermosetting resin bonding agent that be obtained after mixing chamber mixes by
The region of every layer of specified needs bonding on trays is injected according to control program；Heating device for heating work pallet and
Its material layer to be printed carried makes its temperature be higher than the solidification temperature of thermosetting resin.
Preferably, it is disposed with water cooling plant around nozzle and mixing chamber.The heating device can be to be arranged in work
The resistance heater for making pallet periphery can also be moveable or be fixed on the light source of printer other positions, heat radiation
Device or hot blow air heating device.
Compared with prior art, beneficial effects of the present invention are：
(1) present invention may apply to include the increasing of most ceramic materials including the microwave-absorbing ceramics material such as silicon carbide
Material manufactures, while not being influenced by ceramic powder color, has wide applicability；
(2) nozzle of the present invention can reach high-precision bonding agent spraying, while not need mold and machining
Ceramic material disposal molding may be implemented in cutter, to realize ceramic material efficiently, high-precision modeling；
(3) technical solution of the present invention only mixes epoxy monomer, curing agent, and under high temperature environment
Heating, resin adhesive just have solidification viscosity, and therefore, nozzle of the invention and bonding agent transfer pipeline will not block, to
No longer need nozzle and transfer pipeline clean and maintenance；
(4) solid particle is also not present in epoxy monomer and curing agent viscosity very little, even if jet velocity is quickly,
Prodigious impact force will not be caused to nozzle, therefore can improve the service life and reliability of nozzle, improve the printing of material
Efficiency；
Description of the drawings
Fig. 1 is the flow diagram for the increasing material manufacturing method that apparatus of the present invention are applicable in.
Fig. 2 is the principle schematic of apparatus of the present invention.
Specific implementation mode
Increasing material manufacturing method as shown in Figure 1 adopts the following technical scheme that：
1, using computer software, it would be desirable to which the ceramic part model of printing is layered, and determines that every layer needs bonding
Region, and generate printer control program；
2, one layer of very thin ceramic powders are laid on trays；
3, epoxy monomer and hardener mixture are sprayed on the region that this layer needs bonding according to program using nozzle；
4, using the thermosetting resin bonding agent on this layer of ceramic powders of heating devices heat, heat cure crosslinking is brought it about
Polymerisation bonds this layer of ceramic powders；
5, it successively prints, until forming complete ceramic body；
6, ceramic body is cleaned up, removes the not glued ceramic powders adhered to thereon；
7, the ceramic body after cleaning up is put into the calcining of sintering furnace high temperature, on the one hand removes what ceramic body included
On the other hand resin adhesive ingredient makes the ceramic powders in ceramic body that solid phase reaction occur, forms fine and close ceramic part
Finished product.
The material of above-mentioned ceramic powders can be iron oxide, zinc oxide, manganese oxide, aluminium oxide, silica, zirconium oxide, oxygen
Change magnesium, yttrium oxide, silicon nitride, silicon carbide or other can be sintered by high temperature solid state reaction to be formed ceramics metal oxide,
Nitride, carbide or salt and combination thereof, either by surface be modified above-mentioned powder or in order to improve material
The mixed-powder of other powder, fiber, crystal whisker-shaped additive is added in performance.The particle diameter of above-mentioned ceramic powders can be in 10nm-
1000nm, it is therefore preferable to which 30nm-500nm is more preferably 50nm-200nm.
Above-mentioned epoxy monomer refers to that can realize the cured monomer molecule material of heat cross-linking by epoxy functionality
Material, can select Bisphenol F glycidol ether (BFDGE), three epoxy-phenyl para-aminophenol (TGAP), four epoxy-phenyl diamino
The Orqanics Monomers such as diphenyl-methane (TGDDM) or above-mentioned several combination.Above-mentioned curing agent refers to can be with epoxy monomer
The epoxy functionality of molecule is reacted to realize the chemical reagent of crosslinking curing, and diethyl toluene diamine can be selected
(DETDA).The mixture of above-mentioned epoxy monomer and curing agent can generate cross-linking reaction, shape under high-temperature heating effect
At the resin solid of macromolecular, to realize the bonding to ceramic powders.
Since each amidine functional group in curing agent can be sent out with 2 epoxy-phenyl functional groups in epoxy monomer
The ratio of raw cross-linking reaction, above-mentioned epoxy monomer and curing agent needs to calculate accordingly, so that the amido on each curing agent
Functional group can correspond to 1.5-3, it is therefore preferable to the epoxy-phenyl functional group on 1.8-2.5 thermosetting resin, to ensure
The abundant progress of cross-linking reaction.
Above-mentioned heating device, the resistance heater that can be mounted on trays can also be a kind of moveable
It is either installed on the light source or radiation or hot blow air heating device of 3D printer other positions, to realize on trays
The thermosetting resin bonding agent sprayed is heating and curing.Above-mentioned heating device needs that thermosetting resin bonding agent is heated and protected
It holds between 150 DEG C -240 DEG C, preferably between 180 DEG C -200 DEG C, so that thermosetting resin cross-linking reaction ingredient occurs.For
Reduction energy consumption can also arrange thermal insulation material in trays regions.In order to protect the steady of other workpieces of printing device
Fixed operation, can also be arranged heat-barrier material and radiator between trays region and other component.
Above-mentioned cleaning process, it is therefore an objective to the not glued ceramic powders for adhering to ceramic body surface, in order to reach this
Purpose can be removed in the way of the mechanical brushing such as hairbrush, can also by flow, gas washout in the way of remove, also may be used
Can also be the combination of above-mentioned several mode to be removed in the way of ultrasonic vibration.
Ceramic body is first heated to 120 DEG C -150 DEG C by above-mentioned high-temperature burning process, and keeps the temperature 2-5 hours, to remove it
In the moisture that contains；Later, optional calcination temperature is 300 DEG C -700 DEG C, preferably 500 DEG C -600 when removing bonding agent
DEG C, 2-8 hours are kept the temperature, preferably 4-6 hours, environment was air (oxygen-containing) atmosphere；It is allowed to that solid phase occurs in sintering ceramic powder
When reaction, calcination temperature, time and gaseous environment need to refer to the related request of be sintered ceramic composition.
In order to realize the increasing material manufacturing of above-mentioned ceramic body, following application epoxy monomer can be used to make with curing agent
Printer is bonded for the ceramic powders of bonding agent.
As shown in Fig. 2, bonding printer as the ceramic powders of bonding agent using epoxy monomer and curing agent, mainly
Including：Rack 1, feed tray 2, trays 3, heating device 4, stone scraper plate 5, curing agent delivery pipe 6, epoxy monomer
Motor, transmission device, guide rail, the heat-insulated knot of delivery pipe 7, mixing chamber 8, water cooling plant 9, nozzle 10 and other booster actions
The components such as structure, radiator structure, water pump, water tank.
The ceramic powders 11 as raw material are carried on feed tray 2.
When every layer of printing, feed tray 2 moves up a small distance, and the raw ceramic materials powder 11 that it is carried is made to be higher than machine
The upper surface of frame 1；It works at the same time pallet 3 and moves down same distance；Later, stone scraper plate 5, will be high by left movement to right side
It is rushed at trays 3 in the raw ceramic materials powder 11 of rack, it is made to form one layer of uniform material to be printed on trays 3
The bed of material.
Curing agent and epoxy monomer are delivered to mixed by curing agent delivery pipe 6 and epoxy monomer delivery pipe 7 respectively
It closes in room 8, by controlling the feed flow of two delivery pipes, the ratio of curing agent and epoxy monomer can be controlled.Curing agent
After being sufficiently mixed in mixing chamber 8 with epoxy monomer, every layer of specified needs are ejected into according to program by nozzle 10 and are glued
The region of knot.
4 heating work pallet 3 of heating device and its material layer to be printed of carrying, make its temperature higher than thermosetting resin
Solidification temperature.
It, can be in nozzle 10 and mixing chamber 8 weeks in order to avoid the high temperature at trays 3 is transmitted to nozzle 10 and mixing chamber 8
Cloth sets water cooling plant 9, and high temperature is avoided to make mixing chamber 8 or the curing agent in nozzle 10 and epoxy monomer premature cure.
By the mixture of epoxy monomer and curing agent that nozzle 10 sprays, under the high temperature action of heating device 4
The ceramic powders in specified region are bonded, successively print, ultimately form ceramic body 12 by solidification.
With reference to examples illustrate the present invention.
Embodiment 1：The increasing material manufacturing method of aluminium oxide ceramics
1) modelling and layering：Design needs the part model printed, is layered using computer software, calculates every
Layer needs the region of bonding, and generates the printer control program for including bonding agent jet path.
2) preparation of alumina ceramic powder raw material：Select the alumina ceramic powder that particle diameter is 60nm as former
Material is put into the feed tray that ceramic powders bond printer.
3) the calculating proportioning of bonding agent：Using Bisphenol F glycidol ether (BFDGE) as epoxy monomer, each of which
Include two epoxy functionalities on molecule；Using diethyl toluene diamine (DETDA) as curing agent, wrapped on each of which molecule
Containing two amidine functional groups.Select the epoxy group in amidine functional group 2.2 epoxy monomers of correspondence on each curing agent
Functional group, thus may determine that the molar ratio of BFDGE and DETDA is 2.2:1.
4) conveying speed for adjusting curing agent delivery pipe and epoxy monomer delivery pipe, to realize 3) middle two required
The molar ratio of kind bonding agent ingredient.
5) printer is used, alumina ceramic powder is successively laid according to program, sufficient ring is mixed using nozzle injection
The mixture of oxygen resin monomer and curing agent, and said mixture is heated by additional Resistant heating device on trays
It keeps to 200 DEG C, makes it by heat cure, ceramic powders are bonded.Ultimately form the ceramic body of printing part.
6) ceramic body is taken out from trays, is placed in water, the not glued of surface attachment is brushed away using hairbrush
Powder.It places into supersonic wave cleaning machine later, by ultrasonic wave excitation hydrone, realizes further cleaning.
7) ceramic body after cleaning is placed in sintering furnace, is heated to 140 DEG C, keep the temperature 3 hours, it is contained therein to remove
Moisture；600 DEG C are heated under air environment again, 6 hours are kept the temperature, to remove bonding agent ingredient therein；Finally in air ring
It is heated to 1200 DEG C under border, keeps the temperature 8 hours, alumina powder is made to sinter solid ceramic finished part into.
Embodiment 2：The increasing material manufacturing method of silicon carbide ceramics
1) modelling and layering：With embodiment 1；
2) preparation of silicon carbide ceramics powder raw material：By β-SiC powder and micro C, B powder that grain size is 100nm according to
100:3:1 ratio is uniformly mixed, as raw material；
3) the calculating proportioning of bonding agent：Use three epoxy-phenyl para-aminophenol (TGAP), four epoxy-phenyl diamino two
The mixture of phenylmethane (TGDDM) includes accordingly three, four epoxy functionals on each molecule as epoxy monomer
Group；Include two amidine functional groups using diethyl toluene diamine (DETDA) as curing agent, on each of which molecule.It is selected every
Amidine functional group on a curing agent corresponds to the epoxy functionality in 2 epoxy monomers, thus may determine that TGAP,
The molar ratio of TGDDM and DETDA is 2:1:5.
4) conveying speed for adjusting curing agent delivery pipe and epoxy monomer delivery pipe, to realize 3) middle two required
The molar ratio of kind bonding agent ingredient.
5) printer is used, silicon carbide ceramics powder is successively laid according to program, sufficient ring is mixed using nozzle injection
The mixture of oxygen resin monomer and curing agent, and protected by additional heat radiation heating devices heat said mixture on printer
It holds to 180 DEG C, makes it by heat cure, ceramic powders are bonded.Ultimately form the ceramic body of printing part.
6) ceramic body is taken out from trays, green body is rinsed using high pressure water flow, it is not glued to go to surface to adhere to
Powder.It places into supersonic wave cleaning machine later, by ultrasonic wave excitation hydrone, realizes further cleaning.
7) ceramic body after cleaning is placed in sintering furnace, is heated to 140 DEG C, keep the temperature 3 hours, it is contained therein to remove
Moisture；700 DEG C are heated under air environment again, 5 hours are kept the temperature, to remove bonding agent ingredient therein；Finally in indifferent gas
It is heated to 2020 DEG C under body environment, keeps the temperature 10 hours, silicon carbide powder is made to sinter solid ceramic finished part into.
Embodiment 3：The increasing material manufacturing method of ferrite ceramics
1) modelling can be found in embodiment 1 or embodiment 2 with layering, the calculating proportioning of bonding agent, print procedure.
2) preparation of ferrite ceramics powder raw material：Using the manganese-zinc ferrite powder that the trade mark is PC40 as raw material.
3) according to preceding method, ceramic body is printed after completing and cleaning up, ceramic body is placed in sintering furnace, is added
Heat keeps the temperature 3 hours, to remove moisture contained therein to 140 DEG C；600 DEG C are heated under air environment again, keeps the temperature 6 hours, with
Remove bonding agent ingredient therein；It is last to be heated to 1200 DEG C in an inert atmosphere, 5 hours are kept the temperature, manganese-zinc ferrite is made
It is powder sintered at solid ceramic finished part.
Claims (4)
1. a kind of ceramic powders bond printer, including：Rack, the feed tray for carrying ceramic powders as raw material, work
Making pallet, stone scraper plate, feed tray and trays can move up and down, and stone scraper plate is used to will be above the raw material pottery of rack
Porcelain powder rushes at trays, it is made to form one layer of uniform material layer to be printed on trays, which is characterized in that also
Including curing agent delivery pipe, epoxy monomer delivery pipe, mixing chamber, nozzle and heating device, curing agent delivery pipe and epoxy
Resin monomer delivery pipe is connected to mixing chamber, nozzle for will the thermosetting resin bonding agent that be obtained after mixing chamber mixes according to
Control program is injected in the region of every layer of specified needs bonding on trays；Heating device for heating work pallet and its
The material layer to be printed of carrying makes its temperature be higher than the solidification temperature of thermosetting resin.
2. printer according to claim 1, which is characterized in that be disposed with water cooling plant around nozzle and mixing chamber.
3. printer according to claim 1, which is characterized in that the heating device is to be arranged on trays periphery
Resistance heater.
4. printer according to claim 1, which is characterized in that the heating device is moveable or is fixed on
Light source, heat radiation device or the hot blow air heating device of printer other positions.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110240485A (en) * | 2019-06-21 | 2019-09-17 | 天津大学 | A kind of ceramic increasing material manufacturing method and apparatus based on thermosetting bonding |
| CN111678332A (en) * | 2020-05-12 | 2020-09-18 | 首钢集团有限公司 | Alloy baking method for reducing blockage rate of burner |
| CN114474707A (en) * | 2022-02-10 | 2022-05-13 | 北京京城增材科技有限公司 | Method for manufacturing silicon carbide substrate for aluminizing |
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| CN107098715A (en) * | 2017-04-26 | 2017-08-29 | 西安交通大学 | A kind of ceramic part 3D printing method based on dual UV curable paint bonding agent |
| CN107325770A (en) * | 2017-05-26 | 2017-11-07 | 苏州汉力新材料有限公司 | A kind of 3D printing powder binding agent and its application |
| CN209304751U (en) * | 2018-07-09 | 2019-08-27 | 天津大学 | A kind of ceramic powders bonding printer |
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| CN107098715A (en) * | 2017-04-26 | 2017-08-29 | 西安交通大学 | A kind of ceramic part 3D printing method based on dual UV curable paint bonding agent |
| CN107325770A (en) * | 2017-05-26 | 2017-11-07 | 苏州汉力新材料有限公司 | A kind of 3D printing powder binding agent and its application |
| CN209304751U (en) * | 2018-07-09 | 2019-08-27 | 天津大学 | A kind of ceramic powders bonding printer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110240485A (en) * | 2019-06-21 | 2019-09-17 | 天津大学 | A kind of ceramic increasing material manufacturing method and apparatus based on thermosetting bonding |
| CN111678332A (en) * | 2020-05-12 | 2020-09-18 | 首钢集团有限公司 | Alloy baking method for reducing blockage rate of burner |
| CN114474707A (en) * | 2022-02-10 | 2022-05-13 | 北京京城增材科技有限公司 | Method for manufacturing silicon carbide substrate for aluminizing |
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