CN108714832A - Polishing machine - Google Patents

Polishing machine Download PDF

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Publication number
CN108714832A
CN108714832A CN201810587750.1A CN201810587750A CN108714832A CN 108714832 A CN108714832 A CN 108714832A CN 201810587750 A CN201810587750 A CN 201810587750A CN 108714832 A CN108714832 A CN 108714832A
Authority
CN
China
Prior art keywords
polishing
disk
drive rod
slot
polishing machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810587750.1A
Other languages
Chinese (zh)
Inventor
刘先兵
黎宽
何琪娜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Coma Material Polytron Technologies Inc
Original Assignee
Suzhou Coma Material Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Coma Material Polytron Technologies Inc filed Critical Suzhou Coma Material Polytron Technologies Inc
Priority to CN201810587750.1A priority Critical patent/CN108714832A/en
Publication of CN108714832A publication Critical patent/CN108714832A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00Single-purpose machines or devices for particular grinding operations not covered by any other main group

Abstract

A kind of polishing machine, including:Rack;Polishing disk in the rack;Driving mechanism for controlling the polishing disk operating, the driving mechanism includes the first drive rod and driving motor, and first drive rod is connected with the polishing disk;The arc groove that several sizes are identical, are centrosymmetric is uniformly provided on the burnishing surface of the polishing disk, and the connectivity slot that the arc groove is connected, the center of the burnishing surface of the polishing disk is the symmetrical centre of several arc grooves.Above-mentioned polishing machine is in polishing process, because being communicated by arc connectivity slot between snakelike arc groove.No matter polishing disk follows polishing machine to do horizontal swinging arm movement or circular motion, polishing fluid can be cooked periodically with pendulum, so that polishing fluid is evenly dispersed as far as possible in arc groove, the surface of product polished in this way can uniformly receive polishing fluid, and then keep the polishing of polished product surface smooth.In addition, above-mentioned polishing machine simple structure, easy to use.

Description

Polishing machine
Technical field
The present invention relates to polissoir fields, more particularly to a kind of polishing machine.
Background technology
Polishing machine is mainly polished the high precision plane in workpiece.Traditional polissoir is in polishing process, very Difficulty polishes on the surface of polished product uniformly, causes the surface irregularity of polished product, is difficult to meet polished product high-precision The requirement of plane, in addition, existing polisher structure is complicated, it is inconvenient to use.
Invention content
Based on this, it is necessary to be directed to the surface irregularity and inconvenient problem with use of polished product, provide a kind of structure Simply, the surface of polished product can be made to polish smooth polishing machine.
A kind of polishing machine, including:
Rack;
Polishing disk in the rack;
Driving mechanism for controlling the polishing disk operating, the driving mechanism include the first drive rod and driving electricity Machine, first drive rod are connected with the polishing disk;
The arc groove that several sizes are identical, are centrosymmetric is uniformly provided on the burnishing surface of the polishing disk, and The center of the connectivity slot that the arc groove is connected, the burnishing surface of the polishing disk is the symmetrical of several arc grooves Center.
Above-mentioned polishing machine is in polishing process, because being communicated by arc connectivity slot between snakelike arc groove.No matter throw CD follows polishing machine to do horizontal swinging arm movement or circular motion, and polishing fluid can be cooked periodically with pendulum, so as to throw Light liquid is evenly dispersed as far as possible in arc groove, and the surface of product polished in this way can uniformly receive polishing fluid, and then make The polishing of polished product surface is smooth.In addition, above-mentioned polishing machine simple structure, easy to use.
The connectivity slot is two arc connectivity slots being centrosymmetric, the polishing disk in one of the embodiments, Burnishing surface center be the arc connectivity slot symmetrical centre.
Further include the balancing disk to match with the size of the polishing disk, the balancing disk in one of the embodiments, It is detachably connected with the polishing disk.
In one of the embodiments, with offered in the disk of the non-contacting balancing disk of the polishing disk uniformly point Several first slots hole of cloth, first drive rod are detachably connected with first slot hole.
The first drive rod quantity is 3 in one of the embodiments, and the first slot hole number is 3, institute The first slot hole is stated to arrange in equilateral triangle in the disk of the balancing disk.
In one of the embodiments, with offered in the disk of the non-contacting balancing disk of the polishing disk second insert Slot, the driving mechanism further include the second drive rod, and second drive rod is detachably connected with second slot hole, institute State the center that the second slot hole is located at the balancing disk.
Further include the wear ring with the hot charging cooperation in a manner of interference of second slot hole in one of the embodiments, Connection is can be inserted into second drive rod, to prevent from wearing the balancing disk in the second drive rod operation process.
The groove depth of the arc groove is 1mm-5mm in one of the embodiments,.
The groove depth of the connectivity slot is 1mm-5mm in one of the embodiments,.
The groove width of the arc groove is 0.5mm-5mm in one of the embodiments, and the groove width of the connectivity slot is 0.5mm-5mm。
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of specific embodiment of polishing machine of the present invention.
Fig. 2 is the schematic diagram of the burnishing surface of polishing disk of the present invention.
Fig. 3 is polishing disk of the present invention, balancing disk and the mutually matched explosive view of wear ring.
Fig. 4 is that polishing disk of the present invention polishing fluid the circular motion during flows to schematic diagram.
Fig. 5 is that polishing disk of the present invention polishing fluid in the swing arm reciprocatory movement flows to schematic diagram.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with specific implementation mode, The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are only used to explain this hair It is bright, it is not intended to limit the present invention.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more Any and all combinations of relevant Listed Items.
Refering to fig. 1 and Fig. 2, one embodiment of the invention are a kind of polishing machine 100, which includes:Rack 110, position In the polishing disk 120 in rack 110, the driving mechanism 130 for controlling the operating of polishing disk 120.
Wherein, driving mechanism 130 includes the first drive rod 131 and driving motor 133, and the first drive rod mainly drives and throws CD 120 moves in a circle.First drive rod 131 is connected with polishing disk 120.The main function of driving mechanism 130 is that driving is thrown CD 120 operates, and is polished with treating polished product 600.It can be direct that first drive rod 131 is connected with polishing disk 120 Connection, can also be to be indirectly connected with by another device.It is connected directly with polishing disk 120 if it is the first drive rod 131, It can be that the first drive rod 131 is fixedly connected with polishing disk 120, such as:First drive rod 131 is welded with polishing disk 120.? Can open up slot at the back side (opposite face of contact surface) of polishing disk 120, the first drive rod 131 is inserted, drive Polishing disk 120 rotates.If polishing is completed or needs replacing polishing mode, the first drive rod 131 can be extracted again, carried out The next step.
In the present embodiment, it is uniformly provided with that several sizes are identical, are centrosymmetric on the burnishing surface 121 of polishing disk 120 Arc groove 201, because by the way of uniformly opening up, that is to say, that the center of the burnishing surface 121 of polishing disk 120 be it is several The symmetrical centre of arc groove 201, and connectivity slot 301 that arc groove 201 is connected.In polishing process, arc is recessed Slot 201 is for accommodating polishing fluid, and polishing fluid can be moved with the rotation direction of polishing disk 120, and polishing fluid is in polishing disk 120 Burnishing surface 121 arc groove 201 in be uniformly distributed, connectivity slot 301 can play the role of by polishing fluid shunting, adverse current, To prevent polishing fluid from polishing disk 120 being swung or being turned to the side of polishing disk 120, is influenced by its structure, lead to polishing fluid It can not flow back to again, and then cause polishing fluid can not be the problem of the surface of polished product 600 is uniformly distributed.And the application The fluting design of disk can ensure that polishing fluid and the surface of polished product 600 come into full contact with, and the surface of polished product is thrown Light is smooth.
In one embodiment, connectivity slot 301 is two arc connectivity slots being centrosymmetric, the burnishing surface of polishing disk 120 121 center is the symmetrical centre of arc connectivity slot.It is fast in arc groove that two arc connectivity slots can be more conducive to polishing fluid Speed shunting, adverse current.Preferably, arc connectivity slot with arc groove 201 is as much as possible is connected to.It is highly preferred that each arc connects Straight slot is connected to 6-9 arc groove 201.To realize quickly shunting, reflux.
In one embodiment, polishing machine 100 further includes the balancing disk 401 to match with the size of polishing disk 120, balancing disk 401 are detachably connected with polishing disk 120, and connection type preferably is pasted with epoxy resin, so that the two fastens.Balancing disk 401 main function is the weight for enhancing polishing disk 120, to facilitate driving mechanism 130 that polishing disk 120 is driven to rotate.It can be with It avoids being splashed on polishing disk 120 because of water, polishing fluid, causes its corrosion.The material of balancing disk 401 is stainless steel.Certainly also may be used To be that those skilled in the art think suitable other materials.
In a preferred embodiment, with offered in the disk of 120 non-contacting balancing disk 401 of polishing disk it is equally distributed Several first slots hole 403, the first drive rod 131 and the first slot hole 403 of driving mechanism 130 are detachably connected, and at this moment, are driven Motivation structure 130 is just to be indirectly connected with polishing disk 120.
Wherein, with the disk of 120 non-contacting balancing disk 401 of polishing disk be balancing disk 401 lower surface 402 (referring to figure 3)。
In a preferred embodiment, the quantity of the first drive rod 131 is 3, and the quantity in the first slot hole 403 is 3, the It arranges in equilateral triangle in the disk of balancing disk 401 in one slot hole 403.First drive rod 131 is in rotary course, because of first Drive rod 131 is evenly distributed in the disk of balancing disk 401, and then in drive balancing disk 401 in rotation process, balancing disk 401 stress also more uniformly, is conducive to polishing.
Refering to Fig. 3, in a preferred embodiment, driving mechanism 130 further includes the second drive rod (not shown), with throwing Offer the second slot hole 405 in the disk of 120 non-contacting balancing disk 401 of CD, the second drive rod of driving mechanism 130 with Second slot hole 405 is detachably connected, and the second slot hole 405 is located at the center of balancing disk 401.Second drive rod can drive throwing CD 120 does left and right reciprocally swinging, and the above-mentioned polishing machine 100 that is designed as provides a kind of polished die of new left and right reciprocally swinging Formula, and the first drive rod mainly drives polishing disk 120 to move in a circle.So far, needs, the throwing of the application are polished according to practical Ray machine 100 can switch in two kinds of motor patterns.
In a preferred embodiment, further include with the second slot hole 405 in a manner of interference hot charging coordinate wear ring 501, Wear ring 501 and the second drive rod can be inserted into connection, and the second drive rod mainly prevents the second drive rod by way of lantern ring Balancing disk 401 is worn in operation process, especially polishing disk 120 is when doing horizontal swinging arm movement, it is possible to reduce rotational resistance, Wearability is good.Preferably, wear ring 501 is zirconia ceramics wear ring, and the wear-resisting property of this kind of ring is more preferable.
In a preferred embodiment, the groove depth of arc groove 201 is 1mm-5mm.The arc groove of the depth can accommodate Enough polishing fluids, it is also ensured that polishing fluid is not thrown away easily during the motion, and polishing fluid is caused to be lost in.
In a preferred embodiment, the groove depth of connectivity slot 301 is 1mm-5mm.The connectivity slot of the depth can accommodate enough Polishing fluid, it is also ensured that polishing fluid is not thrown away easily during the motion, and polishing fluid is caused to be lost in.
In a preferred embodiment, the groove width of arc groove is 0.5mm-5mm, and the groove width of connectivity slot is 0.5mm-5mm.Into And ensures polishing fluid and the surface of polished product 600 and come into full contact with.Arc groove is consistent with the groove width of connectivity slot, can also add Fast polishing fluid quickly shunts, flows back, until uniformly spreading out.
Above-mentioned polishing machine is in polishing process, because being communicated by arc connectivity slot between snakelike arc groove.No matter throw CD follows polishing machine to do horizontal swinging arm movement or circular motion, and polishing fluid can be cooked periodically with pendulum, so as to throw Light liquid is evenly dispersed as far as possible in arc groove, and the surface of product polished in this way can uniformly receive polishing fluid, and then make The polishing of polished product surface is smooth.In addition, above-mentioned polishing machine simple structure, easy to use.
In order to be better understood from present invention purpose, inventor will combine two kinds of this polishing machine 100 and specifically polish Mode illustrates the mobility status of polishing fluid in different modes.
There are two types of the motor patterns of the drive rod of the polishing machine of the application, the first is the first drive in allowing the first slot hole Lever moves in a circle, and then it drives polishing disk consistent with the direction of motion of the first drive rod.Second is to allow the second slot The second drive rod in hole does the reciprocal swing arm motion in left and right, and then it drives polishing disk also to swing.In two kinds of swing arm moulds Under formula, the polishing fluid motion mode in polishing disk also slightly has difference.
In the first way, in the case that the first drive rod moves in a circle, refering to Fig. 4, polishing fluid is in the direction of the arrow Flowing, i.e., as polishing disk moves in a circle, polishing fluid is also cooked shuttling movement.When polishing fluid flows at arc connectivity slot, throw Light liquid shunts herein, is back to arc groove again.
In the case that the second drive rod does the reciprocal swing arm motion in left and right in the second way, refering to Fig. 5, polishing fluid edge Arrow direction flows, i.e., as polishing disk does bilateral reciprocation, polishing fluid is also cooked bilateral reciprocation.When polishing fluid flows to At arc connectivity slot, polishing fluid shunts herein, is back to arc groove again.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

1. a kind of polishing machine, which is characterized in that including:
Rack;
Polishing disk in the rack;
Driving mechanism for controlling the polishing disk operating, the driving mechanism include the first drive rod and driving motor, institute The first drive rod is stated with the polishing disk to be connected;
It is uniformly provided with the arc groove that several sizes are identical, are centrosymmetric on the burnishing surface of the polishing disk, and by institute State the connectivity slot that arc groove is connected, the center of the burnishing surface of the polishing disk be several arc grooves it is symmetrical in The heart.
2. polishing machine according to claim 1, which is characterized in that the connectivity slot is that two arcs being centrosymmetric connect Straight slot, the center of the burnishing surface of the polishing disk are the symmetrical centre of the arc connectivity slot.
3. polishing machine according to claim 1, which is characterized in that further include matching with what the size of the polishing disk matched Disk again, the balancing disk are detachably connected with the polishing disk.
4. polishing machine according to claim 3, which is characterized in that the disk with the non-contacting balancing disk of the polishing disk Equally distributed several first slots hole is offered on face, first drive rod is detachably connected with first slot hole.
5. polishing machine according to claim 4, which is characterized in that the first drive rod quantity is 3, and described first inserts Slot quantity is 3, and first slot hole is arranged in the disk of the balancing disk in equilateral triangle.
6. polishing machine according to claim 5, which is characterized in that the disk with the non-contacting balancing disk of the polishing disk The second slot hole is offered on face, the driving mechanism further includes the second drive rod, and second drive rod is inserted with described second Slot is detachably connected, and second slot hole is located at the center of the balancing disk.
7. polishing machine according to claim 6, which is characterized in that further include hot in a manner of interference with second slot hole The wear ring closed is assembled, connection is can be inserted into second drive rod, to prevent from wearing in the second drive rod operation process The balancing disk.
8. polishing machine according to claim 1, which is characterized in that the groove depth of the arc groove is 1mm-5mm.
9. polishing machine according to claim 1, which is characterized in that the groove depth of the connectivity slot is 1mm-5mm.
10. polishing machine according to claim 1, which is characterized in that the groove width of the arc groove is 0.5mm-5mm, institute The groove width for stating connectivity slot is 0.5mm-5mm.
CN201810587750.1A 2018-06-08 2018-06-08 Polishing machine Pending CN108714832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810587750.1A CN108714832A (en) 2018-06-08 2018-06-08 Polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810587750.1A CN108714832A (en) 2018-06-08 2018-06-08 Polishing machine

Publications (1)

Publication Number Publication Date
CN108714832A true CN108714832A (en) 2018-10-30

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ID=63911883

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810587750.1A Pending CN108714832A (en) 2018-06-08 2018-06-08 Polishing machine

Country Status (1)

Country Link
CN (1) CN108714832A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111644990A (en) * 2020-05-29 2020-09-11 杭州电子科技大学 Method for polishing hard materials using a molded rod pressed with wood fiber wet powder

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6749714B1 (en) * 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
CN201067863Y (en) * 2007-07-16 2008-06-04 横店集团东磁股份有限公司 Hard alloy metallographic polishing machine
US20090311955A1 (en) * 2008-03-14 2009-12-17 Nexplanar Corporation Grooved CMP pad
CN201552490U (en) * 2009-07-28 2010-08-18 武汉海创电子股份有限公司 Special polishing disk for quartz wafers
CN207358732U (en) * 2017-10-12 2018-05-15 辽宁科技学院 A kind of long stroke synchronous hunting magnetorheological finishing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6749714B1 (en) * 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
CN201067863Y (en) * 2007-07-16 2008-06-04 横店集团东磁股份有限公司 Hard alloy metallographic polishing machine
US20090311955A1 (en) * 2008-03-14 2009-12-17 Nexplanar Corporation Grooved CMP pad
CN201552490U (en) * 2009-07-28 2010-08-18 武汉海创电子股份有限公司 Special polishing disk for quartz wafers
CN207358732U (en) * 2017-10-12 2018-05-15 辽宁科技学院 A kind of long stroke synchronous hunting magnetorheological finishing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111644990A (en) * 2020-05-29 2020-09-11 杭州电子科技大学 Method for polishing hard materials using a molded rod pressed with wood fiber wet powder
CN111644990B (en) * 2020-05-29 2021-04-30 杭州电子科技大学 Method for polishing hard materials using a molded rod pressed with wood fiber wet powder

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Application publication date: 20181030

RJ01 Rejection of invention patent application after publication