CN108711563B - Flexible heat dissipation assembly and preparation method thereof - Google Patents
Flexible heat dissipation assembly and preparation method thereof Download PDFInfo
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- CN108711563B CN108711563B CN201810182417.2A CN201810182417A CN108711563B CN 108711563 B CN108711563 B CN 108711563B CN 201810182417 A CN201810182417 A CN 201810182417A CN 108711563 B CN108711563 B CN 108711563B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
The invention provides a flexible heat dissipation assembly, which comprises a flexible metal base material, wherein at least one surface of the flexible metal base material is provided with a carbon nano tube array arranged in the same direction or a carbon nano tube array arranged in the same direction with a pattern, and the flexible metal base material is a soft metal material with the temperature resistance of more than or equal to 600 ℃ or a soft metal material with the temperature resistance of less than 600 ℃. The preparation method comprises the preparation of the carbon nanotube array which is arranged in the same direction and the preparation of arranging the carbon nanotube array on the substrate. The heat dissipation assembly has three-dimensional axial heat dissipation and flexible two-dimensional plane heat dissipation, can effectively improve at least 50% of heat dissipation efficiency, is light and thin, and is suitable for various limited heat dissipation spaces.
Description
Technical Field
The invention belongs to the technical field of heat dissipation assemblies, and particularly relates to a flexible heat dissipation assembly and a preparation method thereof.
Background
In recent years, with the rapid development of semiconductor device integration processes, the degree of integration of semiconductor devices is increasing, however, the device size becomes smaller and smaller, and the demand for heat dissipation is increasing, which becomes an increasingly important issue. In order to meet the requirement, various heat dissipation methods such as fan heat dissipation, water-cooling auxiliary heat dissipation, heat pipe heat dissipation and the like are widely applied and achieve a certain heat dissipation effect, but because the contact interface between the heat sink and a heat source (a semiconductor integrated device, such as a CPU) is uneven, the mutual contact area is generally less than 2%, an ideal contact interface is not provided, the effect of transferring heat from the semiconductor device to the heat sink is fundamentally affected, so that the traditional heat sink increases the contact degree of the interface by adding a thermal interface material with higher thermal conductivity coefficient between the heat sink and the semiconductor device, and improves the heat transfer effect between the semiconductor device and the heat sink.
According to the market report, the damage of the electronic component device is the temperature (the rate of temperature influence is 55%) except for moisture, vibration, dust and other factors. In addition, related products and devices (such as tape threading devices, mobile phones, flat panels, etc.) are all oriented to the target direction of light, thin, short and small products, and how to achieve the best heat dissipation performance in a limited space is the main subject of each product. Batch production, reproducibility, uniformity, reliability, large-area fabrication, etc. are always the key to the application of nano-materials, and the reduction of the manufacturing process is also the main factor for commercialization.
Disclosure of Invention
The invention provides a flexible heat dissipation assembly, which has three-dimensional axial heat dissipation and flexible two-dimensional plane heat dissipation, can effectively improve the heat dissipation efficiency by at least 50%, is light and thin, and is suitable for various limited heat dissipation spaces.
The technical scheme of the invention is realized as follows:
a flexible heat dissipation assembly comprises a flexible metal base material, wherein at least one surface of the flexible metal base material is provided with a carbon nano tube array arranged in the same direction or a carbon nano tube array arranged in the same direction with a pattern, and the flexible metal base material is a soft metal material which can resist the temperature of more than or equal to 600 ℃ or a soft metal material which can resist the temperature of less than 600 ℃.
Preferably, the carbon nanotube array is an iron-filled carbon nanotube array or a non-iron-filled carbon nanotube array, and the diameter of the carbon nanotube array is 5-20 nm.
Preferably, the preparation method of the patterned carbon nanotube array arranged in the same direction comprises the steps of treating the grown carbon nanotube array with a solvent for a period of time and then airing; the solvent is selected from one or more of water, methanol, ethanol, acetone and isopropanol
Another objective of the present invention is to provide a method for manufacturing a flexible heat dissipation assembly, wherein the carbon nanotube array is an iron-filled carbon nanotube array, comprising the following steps:
1) preparing the carbon nanotube array filled with iron:
placing a soft metal material with temperature resistance of more than or equal to 600 ℃ in a carbon nanotube array growth section of a high-temperature furnace tube, placing a ferrocene catalyst outside a catalyst sublimation section, filling inert gas for heating, and heating to a growth temperature; pushing a ferrocene catalyst into the middle of a catalyst sublimation section, and introducing process gas for reaction, wherein the process gas is mixed gas of carbon source gas and hydrogen; after the reaction is finished, cooling to room temperature under the protection of inert gas to obtain the grown carbon nano tube array which is arranged in the same direction and filled with iron;
2) manufacturing a flexible heat dissipation assembly:
if the flexible metal base material is a soft metal material which can resist the temperature of more than or equal to 600 ℃, the carbon nanotube array which is arranged in the same direction and is filled with iron in the step 1) directly grows on the flexible metal base material; if the flexible metal base material is a soft metal material with the temperature resistance of less than 600 ℃, transferring the iron-filled carbon nanotube array arranged in the same direction in the step 1) onto the soft metal material with the temperature resistance of less than 600 ℃.
Preferably, the specific steps of raising the temperature to the growth temperature are as follows: heating the catalyst sublimation section to 250 ℃, and heating the growth section to 650 ℃; the inert gas is argon or helium, and the carbon source gas is one or more of ethylene gas and acetylene gas.
Preferably, the soft metal material capable of resisting temperature of less than 600 ℃ is a sticky material or a non-sticky material, if the soft metal material capable of resisting temperature of less than 600 ℃ is a non-sticky material, the transfer printing specifically comprises coating a layer of adhesive on the sticky material, covering the carbon nanotube array which is arranged in the same direction and is filled with iron in the step 1) on the adhesive, and taking away the original growth substrate after the adhesive is cured; if the soft metal material with the temperature resistance of less than 600 ℃ is a viscous material, the transfer printing specifically comprises covering the carbon nanotube array which is arranged in the same direction and is filled with iron in the step 1) on the viscous material, and taking away the original growth substrate.
Another object of the present invention is to provide a method for manufacturing a flexible heat dissipation assembly, wherein the carbon nanotube array is a non-iron-filled carbon nanotube array, and an iron-containing film is evaporated on the flexible metal substrate, the method comprising the following steps:
1) preparing a non-iron-filled carbon nanotube array:
placing the flexible metal substrate evaporated with the iron-containing film in a high-temperature furnace tube, then introducing inert gas, heating to a growth temperature, maintaining the temperature for a period of time to anneal the iron-containing film, and introducing process gas for reaction, wherein the process gas is a mixed gas of carbon source gas and hydrogen; after the reaction is finished, cooling to room temperature under the protection of inert gas to obtain a non-iron-filled carbon nanotube array which grows to be arranged in the same direction;
2) manufacturing a flexible heat dissipation assembly:
if the flexible metal base material is a soft metal material which can resist the temperature of more than or equal to 600 ℃, the carbon nanotube array which is not filled with iron and arranged in the same direction in the step 1) directly grows on the flexible metal base material; if the flexible metal base material is a soft metal material with the temperature resistance of less than 600 ℃, transferring the carbon nanotube array which is not filled with iron and arranged in the same direction and is obtained in the step 1) onto the soft metal material with the temperature resistance of less than 600 ℃.
Preferably, the specific steps of raising the temperature to the growth temperature are as follows: heating the growing section to 650 ℃; the inert gas is argon or helium, and the carbon source gas is one or more of ethylene gas and acetylene gas.
Preferably, the soft metal material capable of resisting the temperature of less than 600 ℃ is a sticky material or a non-sticky material, if the soft metal material capable of resisting the temperature of less than 600 ℃ is a non-sticky material, the transfer printing specifically comprises the steps of coating a layer of adhesive on the sticky material, covering the carbon nanotube array which is arranged in the same direction and is not filled with iron and is obtained in the step 1) on the adhesive, and taking away the original growth substrate after the adhesive is cured; if the soft metal material with the temperature resistance of less than 600 ℃ is a viscous material, the transfer printing specifically comprises covering the carbon nanotube array which is arranged in the same direction and is not filled with iron and is obtained in the step 1) on the viscous material, and taking away the original growth substrate.
Preferably, the preparation method of the patterned carbon nanotube array arranged in the same direction comprises the steps of treating the grown carbon nanotube array with a solvent for a period of time and then airing; the solvent is selected from one or more of water, methanol, ethanol, acetone and isopropanol.
The technical solution of the present invention is further explained in detail below
The core of the flexible heat dissipation assembly is that the flexible metal substrate is provided with the carbon nano tube arrays which are arranged in the same direction. This is because the XYZ directions are heat dissipation directions, the XY two-dimensional plane is a heat dissipation direction, and the Z (vertical heat source) direction is a main heat dissipation direction, so if there is axial material in the Z direction and there are tens of thousands of, the heat dissipation efficiency can be effectively enhanced, and the carbon nanotube array of the present invention arranged in the same direction has this characteristic.
The carbon nano tube array arranged in the same direction is formed into the carbon nano tube array filled with iron and the carbon nano tube array not filled with iron according to whether the carbon nano tube array and the ferrocene participate in the preparation process.
Preparing a carbon nanotube array filled with iron: placing a soft metal material (preferably aluminum foil paper) with the temperature resistance of more than or equal to 600 ℃ in a carbon nanotube array growth section of a high-temperature furnace tube, placing a ferrocene catalyst on the outer side of a catalyst sublimation section, filling inert gas for heating, heating the catalyst sublimation section to 250 ℃, and preferably heating the growth section to 650 ℃ (wherein the temperature of the growth section is more than 600 ℃, so that the carbon nanotube array can grow), wherein the preferable heating time is 50 minutes; pushing a ferrocene catalyst into the middle of a catalyst sublimation section, and introducing process gas for reaction, wherein the reaction time is preferably 30 minutes, and the process gas is mixed gas of carbon source gas and hydrogen; and after the reaction is finished, cooling to room temperature under the protection of inert gas to obtain the grown iron-filled carbon nanotube array which is arranged in the same direction. In the preparation method, hydrogen is gas for preventing the defects of the carbon nano tube array from generating, and inert gas is mainly used for carrying sublimed ferrocene gas molecules.
Preparing a non-iron-filled carbon nanotube array:
placing a flexible metal substrate (the iron-containing film is an iron film or an aluminum oxide/iron film) which is evaporated with the iron-containing film in a high-temperature furnace tube, then introducing inert gas, heating to the growth temperature of 650 ℃, keeping the temperature for 50 minutes, annealing the iron-containing film at the temperature for 10 minutes, and introducing process gas for reaction, wherein the process gas is mixed gas of carbon source gas and hydrogen; and after the reaction is finished, cooling to room temperature under the protection of inert gas to obtain the non-iron-filled carbon nanotube array which grows into the same-directional arrangement. In the preparation method, hydrogen is used for preventing the generation of the defects of the carbon nano tube array, and inert gas is mainly used as carrying and protecting process gas.
The flexible metal base material is divided into a soft metal material which can resist the temperature of more than or equal to 600 ℃ or a soft metal material which can resist the temperature of less than 600 ℃ according to the heat-resistant temperature; the grown carbon nanotube arrays (including the iron-filled carbon nanotube array and the non-iron-filled carbon nanotube array) arranged in the same direction can be directly or indirectly arranged on the flexible metal substrate. If the flexible metal base material is a soft metal material which can resist the temperature of more than or equal to 600 ℃, the carbon nanotube array arranged in the same direction can be directly grown above the flexible metal base material, and the flexible heat dissipation assembly is manufactured. If the flexible metal base material is a soft metal material with the temperature resistance of less than 600 ℃, a transfer printing step is required to indirectly obtain the flexible heat dissipation assembly. The shape of the substrate to be transferred can include various types of substrates, such as curved surface, rugged structural surface, etc., and both surfaces of the substrate can be covered by the present invention.
The flexible heat dissipation assembly of the invention not only has the flexible metal base material provided with the carbon nano tube arrays arranged in the same direction, but also can be provided with the carbon nano tube arrays arranged in the same direction with patterns.
The flexible metal substrate of the flexible heat dissipation assembly of the present invention may be a carbon nanotube array with one side having the same directional arrangement (see fig. 1), or a carbon nanotube array with two sides having the same directional arrangement (in the preparation process, the carrier under the flexible metal substrate is not tightly attached to the flexible metal substrate, see fig. 12).
The flexible metal substrate of the flexible heat dissipation assembly of the present invention may be a carbon nanotube array (see fig. 13) having a pattern and arranged in a same direction on one surface, or may be a carbon nanotube array (see fig. 14) having a pattern and arranged in a same direction on both surfaces. The preparation method of the carbon nanotube array with the pattern and the same directional arrangement comprises the steps of treating the grown iron-filled carbon nanotube array or the non-iron-filled carbon nanotube array with a solvent for a period of time and then airing; the solvent is selected from one or more of water, methanol, ethanol, acetone and isopropanol.
The flexible metal base material with the carbon nano tube arrays arranged in the same direction and provided with the patterns on one side is obtained by soaking the flexible metal base material with the carbon nano tube arrays arranged in the same direction and provided with a solvent for a period of time and then airing.
The flexible metal base material with the carbon nanotube arrays arranged in the same direction and provided with patterns on both sides is obtained by soaking the flexible metal base material with the carbon nanotube arrays arranged in the same direction and provided with patterns on both sides in a solvent for a period of time and then airing.
The flexible metal base material with the carbon nano tube arrays arranged in the same direction and with the patterns on one surface and the carbon nano tube arrays arranged in the same direction on the other surface is prepared by dripping a solvent on one surface of the flexible metal base material with the carbon nano tube arrays arranged in the same direction on both surfaces.
Each iron-filled or iron-unfilled carbon nanotube of the patterned carbon nanotube array with homeotropic alignment uniformly grows vertically on a substrate resistant to 600 ℃. The height of the carbon nanotube array can grow the carbon nanotube array with different heights and the same directional arrangement with patterns according to the actual requirements of products.
The carbon nanotube array with the pattern and the same directional arrangement can be directly or indirectly arranged on the flexible metal base material, and the arrangement method is the same as that of the common carbon nanotube array with the same directional arrangement.
The invention has the beneficial effects that:
1. the flexible heat dissipation assembly of the invention has three-dimensional axial heat dissipation and flexible two-dimensional plane heat dissipation, can effectively improve at least 50% of heat dissipation efficiency, is light and thin, and has the total thickness of several micrometers and the unit weight<4.8mg/cm2And is suitable for various limited heat dissipation spaces.
2. The flexible characteristic of the heat dissipating double-fuselage can be used on various surfaces, the substrate of the invention has possible characteristic, wherein if the metal substrate still has the heat dispersion characteristic of the two-dimentional level, can disperse the heat first effectively, and then conduct the heat by the carbon nanotube array, greatly promote the heat-dissipating efficiency. The carbon nanotube array growth technique of the present invention has the characteristic of large-area production, and the growth and production have high reproducibility and uniformity, and is suitable for commercial mass production, thereby reducing the production cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible heat dissipation assembly according to embodiments 1-4 of the present invention;
fig. 2 is a schematic structural view of a flexible heat dissipation assembly according to embodiment 5 of the present invention;
FIG. 3 is a flow chart of the manufacturing process of the flexible heat sink assembly of example 1;
FIG. 4 is a flow chart of the manufacturing process of the flexible heat sink assembly of example 2;
FIG. 5 is a flow chart of the process for preparing the flexible heat sink assembly of example 3;
FIG. 6 is a flow chart of the manufacturing process of the flexible heat sink assembly of example 4;
FIG. 7 is a flow chart illustrating the process of fabricating the flexible heat sink assembly of example 5;
FIG. 8 is an electron microscope of the flexible heat sink assembly of example 1;
FIG. 9 is a top view of an electron microscope showing the flexible heat sink assembly of example 5;
FIG. 10 is an electron microscope side view of the flexible heat sink assembly of example 5;
FIG. 11 is a diagram illustrating the heat dissipation effect of the flexible heat dissipation assembly according to the experimental example;
FIG. 12 is a diagram of a flexible heat sink assembly with carbon nanotube arrays on both sides arranged in the same direction;
FIG. 13 is a diagram of a flexible heat sink assembly with patterned carbon nanotube arrays arranged in a same direction;
FIG. 14 is a diagram of a flexible heat sink assembly with patterned carbon nanotube arrays on both sides.
The figures are numbered: 10 a flexible heat sink assembly; 11 a flexible metal substrate; 12 carbon nanotube arrays arranged in the same direction; 13 a patterned carbon nanotube array arranged in a homeotropic manner.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, a flexible heat dissipation assembly 10 includes a flexible metal substrate 11, a carbon nanotube array 12 arranged in a same direction is disposed on the flexible metal substrate 11, and the flexible metal substrate 11 is a soft metal material capable of resisting temperature higher than or equal to 600 ℃.
Referring to fig. 3, the preparation method:
1) preparing the carbon nanotube array filled with iron:
placing a soft metal material with the temperature resistance of more than or equal to 600 ℃ in a carbon nanotube array growth section of a high-temperature furnace tube, placing a ferrocene catalyst outside a catalyst sublimation section, filling argon for heating, heating the catalyst sublimation section to 250 ℃, heating the growth section to 650 ℃, and heating for 50 minutes; pushing a ferrocene catalyst into the middle of a catalyst sublimation section, and introducing process gas for reacting for 30 minutes, wherein the process gas is mixed gas of acetylene gas and hydrogen; after the reaction is finished, cooling to room temperature under the protection of argon to obtain the grown carbon nano tube array which is arranged in the same direction and filled with iron;
2) manufacturing a flexible heat dissipation assembly:
and (2) if the flexible metal substrate is aluminum foil paper, directly growing the carbon nanotube array filled with iron and arranged in the same direction in the step 1) on the aluminum foil paper.
Example 2
Referring to fig. 1, a flexible heat dissipation assembly includes a flexible metal substrate, on which a carbon nanotube array arranged in a same direction is disposed, and the flexible metal substrate is a soft metal material capable of resisting temperature of 600 ℃ or higher.
Referring to fig. 4, the preparation method:
1) preparing a non-iron-filled carbon nanotube array:
placing a flexible metal substrate of a double-layer film of aluminum oxide/iron evaporation into a high-temperature furnace tube, then introducing argon gas, heating a growth section to 650 ℃, wherein the heating time is 50 minutes, maintaining the temperature for 10 minutes to anneal the double-layer film, introducing process gas for reaction, wherein the process gas is mixed gas of acetylene gas and hydrogen gas; after the reaction is finished, cooling to room temperature under the protection of argon to obtain a non-iron-filled carbon nanotube array which grows into a homodromous arrangement;
2) manufacturing a flexible heat dissipation assembly:
and (2) if the flexible metal substrate is aluminum foil paper, the carbon nanotube array which is not filled with iron and arranged in the same direction in the step 1) directly grows on the aluminum foil paper.
Example 3
Referring to fig. 1, a flexible heat dissipation assembly includes a flexible metal substrate, on which a carbon nanotube array arranged in a same direction is disposed, and the flexible metal substrate is a soft metal material capable of resisting a temperature of less than 600 ℃.
Referring to fig. 5, the preparation method:
1) preparing the carbon nanotube array filled with iron:
placing a soft metal material with the temperature resistance of more than or equal to 600 ℃ in a carbon nanotube array growth section of a high-temperature furnace tube, placing a ferrocene catalyst outside a catalyst sublimation section, filling argon for heating, heating the catalyst sublimation section to 250 ℃, heating the growth section to 650 ℃, and heating for 50 minutes; pushing a ferrocene catalyst into the middle of a catalyst sublimation section, and introducing process gas for reacting for 30 minutes, wherein the process gas is mixed gas of acetylene gas and hydrogen; after the reaction is finished, cooling to room temperature under the protection of argon to obtain the grown carbon nano tube array which is arranged in the same direction and filled with iron;
2) manufacturing a flexible heat dissipation assembly:
and (3) transferring the carbon nano tube array which is arranged in the same direction and is filled with iron in the step 1) onto the soft metal material with the temperature resistance of less than 600 ℃ if the flexible metal base material is the soft metal material with the temperature resistance of less than 600 ℃. The soft metal material which can resist the temperature of less than 600 ℃ is a viscous material, and the transfer printing specifically comprises the step of covering the carbon nanotube array which is arranged in the same direction and is filled with iron and arranged on the viscous material in the step 1), and taking away the original growth substrate.
Example 4
Referring to fig. 1, a flexible heat dissipation assembly includes a flexible metal substrate, on which a carbon nanotube array arranged in a same direction is disposed, and the flexible metal substrate is a soft metal material capable of resisting a temperature of less than 600 ℃.
Referring to fig. 6, the preparation method:
1) preparing a non-iron-filled carbon nanotube array:
placing a flexible metal substrate of a double-layer film of aluminum oxide/iron evaporation into a high-temperature furnace tube, then introducing argon gas, heating a growth section to 650 ℃, wherein the heating time is 50 minutes, maintaining the temperature for 10 minutes to anneal the double-layer film, introducing process gas for reaction, wherein the process gas is mixed gas of acetylene gas and hydrogen gas; after the reaction is finished, cooling to room temperature under the protection of argon to obtain a non-iron-filled carbon nanotube array which grows into a homodromous arrangement;
2) manufacturing a flexible heat dissipation assembly:
and (3) transferring the carbon nano tube array which is arranged in the same direction and is filled with iron in the step 1) onto the soft metal material with the temperature resistance of less than 600 ℃ if the flexible metal base material is the soft metal material with the temperature resistance of less than 600 ℃. The soft metal material which can resist the temperature of less than 600 ℃ is a viscous material, and the transfer printing specifically comprises the step of covering the carbon nanotube array which is arranged in the same direction and is filled with iron and arranged on the viscous material in the step 1), and taking away the original growth substrate.
Example 5
Referring to fig. 2, a flexible heat dissipation assembly 10 includes a flexible metal substrate 11, the flexible metal substrate 11 is provided with a carbon nanotube array 12 arranged in a same direction and a carbon nanotube array 13 arranged in a same direction and having a pattern, and the flexible metal substrate is a soft metal material capable of resisting a temperature of 600 ℃ or higher. The flexible metal substrate with the carbon nano tube arrays arranged in the same direction on both sides is prepared by dripping a solvent on one side of the flexible metal substrate.
Referring to fig. 7, the preparation method:
1) preparing the carbon nanotube array filled with iron:
placing a soft metal material with the temperature resistance of more than or equal to 600 ℃ in a carbon nanotube array growth section of a high-temperature furnace tube, placing a ferrocene catalyst outside a catalyst sublimation section, filling argon for heating, heating the catalyst sublimation section to 250 ℃, heating the growth section to 650 ℃, and heating for 50 minutes; pushing a ferrocene catalyst into the middle of a catalyst sublimation section, and introducing process gas for reacting for 30 minutes, wherein the process gas is mixed gas of acetylene gas and hydrogen; after the reaction is finished, cooling to room temperature under the protection of argon to obtain a carbon nano tube array which grows on two sides of the soft metal material and is filled with iron and arranged in the same direction;
2) manufacturing a flexible heat dissipation assembly:
the flexible metal substrate is aluminum foil paper, ethanol is dripped into the carbon nanotube array filled with iron on one surface in the step 1) for a period of time, and then the carbon nanotube array is taken out and dried, so that the obtained carbon nanotube array with patterns arranged in the same direction directly grows on the aluminum foil paper.
Test examples
Comparing the heat dissipation performance of the flexible heat dissipation assembly of example 1, the commercially available graphite sheet and the commercially available copper foil, the result is shown in fig. 11, it can be seen that the cooling rate of the flexible heat dissipation assembly of the present invention is faster than that of the other two commercially available heat dissipation materials, i.e. the heat dissipation efficiency is the best, and the time for cooling to 20 ℃ is the shortest, i.e. the heat dissipation rate is the best, so the measurement result shows that the flexible heat dissipation assembly of the present invention has the best and best heat dissipation performance.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (3)
1. A preparation method of a flexible heat dissipation assembly is characterized in that the flexible heat dissipation assembly comprises a flexible metal base material, at least one surface of the flexible metal base material is provided with a carbon nano tube array arranged in the same direction or a carbon nano tube array arranged in the same direction with patterns, and the flexible metal base material is a soft metal material which can resist the temperature of more than or equal to 600 ℃ or a soft metal material which can resist the temperature of less than 600 ℃; the carbon nanotube array is an iron-filled carbon nanotube array and comprises the following steps:
1) preparing the carbon nanotube array filled with iron:
placing a soft metal material with temperature resistance of more than or equal to 600 ℃ in a carbon nanotube array growth section of a high-temperature furnace tube, placing a ferrocene catalyst outside a catalyst sublimation section, filling inert gas for heating, and heating to a growth temperature; pushing a ferrocene catalyst into the middle of a catalyst sublimation section, and introducing process gas for reaction, wherein the process gas is mixed gas of carbon source gas and hydrogen; after the reaction is finished, cooling to room temperature under the protection of inert gas to obtain the grown carbon nano tube array which is arranged in the same direction and filled with iron; the specific steps of raising the temperature to the growth temperature are as follows: heating the catalyst sublimation section to 250 ℃, and heating the growth section to 650 ℃; the inert gas is argon or helium, and the carbon source gas is one or more of ethylene gas and acetylene gas;
2) manufacturing a flexible heat dissipation assembly:
if the flexible metal base material is a soft metal material which can resist the temperature of more than or equal to 600 ℃, the carbon nanotube array which is arranged in the same direction and is filled with iron in the step 1) directly grows on the flexible metal base material; if the flexible metal base material is a soft metal material with the temperature resistance of less than 600 ℃, transferring the iron-filled carbon nanotube array arranged in the same direction in the step 1) onto the soft metal material with the temperature resistance of less than 600 ℃.
2. The method for preparing a flexible heat dissipation assembly as claimed in claim 1, wherein the soft metal material resistant to temperature less than 600 ℃ is a sticky material or a non-sticky material, and if the soft metal material resistant to temperature less than 600 ℃ is a non-sticky material, the transferring process comprises coating a layer of adhesive on the sticky material, covering the iron-filled carbon nanotube array arranged in the same direction in step 1) on the adhesive, and removing the original growth substrate after the adhesive is cured; if the soft metal material with the temperature resistance of less than 600 ℃ is a viscous material, the transfer printing specifically comprises covering the carbon nanotube array which is arranged in the same direction and is filled with iron in the step 1) on the viscous material, and taking away the original growth substrate.
3. The method of claim 1, wherein the patterned carbon nanotube array is prepared by treating the grown carbon nanotube array with a solvent for a period of time and then drying the treated array; the solvent is selected from one or more of water, methanol, ethanol, acetone and isopropanol.
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| JP3837392B2 (en) * | 2003-03-25 | 2006-10-25 | 憲治郎 尾浦 | Carbon nanotube manufacturing method, carbon nanotube device, and electric double layer capacitor |
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|---|---|---|---|---|
| CN101083234A (en) * | 2006-05-26 | 2007-12-05 | 香港科技大学 | Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use |
| CN107059004A (en) * | 2017-04-19 | 2017-08-18 | 江苏联科纳米科技有限公司 | A kind of high radiant rate heat radiating metal paper tinsel and preparation method and application |
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