CN108709644B - Calibration method of ballastless track plate target and infrared temperature measurement system - Google Patents
Calibration method of ballastless track plate target and infrared temperature measurement system Download PDFInfo
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- CN108709644B CN108709644B CN201810844581.5A CN201810844581A CN108709644B CN 108709644 B CN108709644 B CN 108709644B CN 201810844581 A CN201810844581 A CN 201810844581A CN 108709644 B CN108709644 B CN 108709644B
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims description 37
- 238000001816 cooling Methods 0.000 claims description 29
- 239000010408 film Substances 0.000 claims description 29
- 239000010409 thin film Substances 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 8
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- 238000010586 diagram Methods 0.000 description 14
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- 238000012634 optical imaging Methods 0.000 description 2
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- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012067 mathematical method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
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Abstract
The invention discloses a ballastless track slab target which comprises a ballastless track slab, a temperature control device, a film thermocouple, a control panel and a PID controller, wherein the ballastless track slab and the temperature control device are mutually attached and fixed, the film thermocouple is arranged in a narrow layer of the ballastless track slab, the PID controller is arranged in the control panel, the temperature control device, the control panel and the film thermocouple are all connected with the PID controller, and the temperature control device is connected with the control panel. The ballastless track slab is mainly made of ballastless track slab materials, and the ballastless track slab contained in the ballastless track slab target is also made of the ballastless track slab materials, so that the ballastless track slab target can accurately reflect the emissivity of the ballastless track slab. The invention also discloses a method for calibrating the infrared temperature measurement system by utilizing the ballastless track plate target, which can improve the calibration precision of the infrared temperature measurement system and realize the high-precision measurement of the temperature of the ballastless track plate.
Description
Technical Field
The invention relates to the technical field of railway engineering, in particular to a calibration method of a ballastless track slab target and an infrared temperature measurement system.
Background
This section is intended to provide a background or context to the embodiments of the invention that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.
The stability of the railway track structure directly influences the railway safety, and the ballastless track plate is used as a main railway track structure, so that uneven temperature distribution can be caused due to the influence of environmental factors such as atmospheric temperature, solar radiation, precipitation and the like in the external environment, and larger temperature stress is generated, so that the deformation of the ballastless track plate structure is caused, and the running safety of a train is seriously endangered. Therefore, the temperature change of the ballastless track plate needs to be measured so as to ensure the running safety of the train. The infrared temperature measurement system based on the infrared temperature measurement principle can realize non-contact measurement of the temperature of the ballastless track plate, and calibration of the infrared temperature measurement system is a precondition for realizing high-precision measurement of the temperature of the ballastless track plate.
Currently, a blackbody target (an object with an absorption rate of one and a reflectivity of zero is generally called an ideal blackbody) is generally adopted to calibrate an infrared temperature measurement system. In view of the fact that the emissivity of the ballastless track plate (the ratio of the emissivity of the ballastless track plate to the emissivity of the blackbody at the same temperature, called the emissivity of the ballastless track plate) can be changed along with the change of the temperature of the ballastless track plate, the existing blackbody targets cannot effectively and accurately reflect the emissivity of the ballastless track plate, when the blackbody targets are utilized for calibrating an infrared temperature measuring system, the emissivity of the ballastless track plate needs to be corrected based on an emissivity empirical value, and therefore emissivity correction errors are often generated, and further the calibration accuracy of the infrared temperature measuring system is low, so that high-accuracy measurement of the temperature of the ballastless track plate cannot be achieved.
Therefore, the existing blackbody target has the problem that the emissivity of the ballastless track plate cannot be effectively and accurately reflected.
Disclosure of Invention
The embodiment of the invention provides a ballastless track plate target, which is used for solving the problem that a blackbody target cannot effectively and accurately reflect the emissivity of a ballastless track plate, and comprises the following components:
the device comprises a ballastless track plate, a temperature control device, a film thermocouple, a control panel and a PID controller;
the ballastless track plate is mutually attached and fixed with the temperature control device, the thin film thermocouple is arranged in a narrow layer of the ballastless track plate, the PID controller is arranged in the control panel, the temperature control device, the control panel and the thin film thermocouple are connected with the PID controller, and the temperature control device is connected with the control panel.
The control panel is used for controlling the temperature control device to adjust the target temperature according to the received temperature adjusting instruction, the temperature control device is used for adjusting the target temperature according to the control of the control panel, the thin film thermocouple is used for detecting the target temperature and feeding back the target temperature to the PID controller, and the PID controller is used for controlling the deviation between the target temperature and the set temperature to be within a preset deviation; the temperature control device comprises a plurality of heating plates and a plurality of refrigerating plates, and the heating plates and the refrigerating plates are alternately arranged at intervals.
The embodiment of the invention also provides a calibration method of the infrared temperature measurement system, which is used for solving the problems that the calibration precision of the infrared temperature measurement system is lower and the high-precision measurement of the ballastless track plate temperature cannot be realized due to the correction error of the target emissivity, and comprises the following steps:
acquiring a fitting data set, wherein the fitting data set comprises the actual temperature of a target and the output voltage of an infrared temperature measurement system, and the infrared temperature measurement system is arranged in the normal direction of the target;
fitting the data in the fitting data set by using a stepwise regression method, and determining a fitting curve model reflecting the relation between the actual temperature of the target and the output voltage of the infrared temperature measurement system, wherein the fitting curve model is a curve model in a Taylor series polynomial form;
wherein the target is the ballastless track plate target in the embodiment; the front surface of the target faces the infrared temperature measurement system;
when fitting data are acquired, setting the temperature of the ballastless track plate target through a switch or a key on a control panel, and determining the set target temperature as the actual temperature of the ballastless track plate target; or determining the target temperature detected by the film thermocouple as the target actual temperature.
In the embodiment of the invention, the ballastless track plate target comprises a ballastless track plate, a temperature control device, a film thermocouple, a control panel and a PID controller, wherein the ballastless track plate and the temperature control device are mutually attached and fixed; the control panel is used for controlling the temperature control device to adjust the target temperature according to the received temperature adjusting instruction, the temperature control device is used for adjusting the target temperature according to the control of the control panel, the film thermocouple is used for detecting the target temperature and feeding back the target temperature to the PID controller, and the PID controller is used for controlling the deviation of the target temperature and the set temperature to be within the preset deviation. The ballastless track slab is mainly made of ballastless track slab materials, and the ballastless track slab contained in the ballastless track slab target is also made of the ballastless track slab materials, so that the ballastless track slab target in the embodiment of the invention can effectively and accurately reflect the emissivity of the ballastless track slab.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. In the drawings:
FIG. 1 is a schematic structural diagram of a ballastless track slab target provided by an embodiment of the invention;
fig. 2 is a schematic structural diagram of a temperature control device 2 in a ballastless track slab target provided by an embodiment of the present invention;
FIG. 3 is another schematic structural diagram of a temperature control device 2 in a ballastless track slab target provided by an embodiment of the present invention;
FIG. 4a is a schematic diagram of an infrared temperature measurement system calibration using ballastless track plate targets according to an embodiment of the present invention;
FIG. 4b is another schematic diagram of an infrared temperature measurement system calibration using ballastless track slab targets according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a ballastless track slab target provided by an embodiment of the present invention;
FIG. 6 is a flowchart of a calibration method of an infrared temperature measurement system according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings. The exemplary embodiments of the present invention and their descriptions herein are for the purpose of explaining the present invention, but are not to be construed as limiting the invention.
Fig. 1 shows a schematic structure of a ballastless track slab target provided by an embodiment of the present invention, and for convenience of explanation, only a portion related to the embodiment of the present invention is shown, and details are as follows:
as shown in fig. 1, the ballastless track slab target includes:
ballastless track plate 1, temperature control device 2, film thermocouple 3, control panel 4 and PID controller 5.
The ballastless track plate 1 and the temperature control device 2 are mutually attached and fixed, the film thermocouple 3 is arranged in a narrow layer of the ballastless track plate 1, the PID controller 5 is arranged in the control panel 4, the temperature control device 2, the control panel 4 and the film thermocouple 3 are connected with the PID controller 5, and the temperature control device 2 is connected with the control panel 4.
The control panel 4 is used for controlling the temperature control device 2 to adjust the target temperature according to the received temperature adjustment instruction, the temperature control device 2 is used for adjusting the target temperature according to the control of the control panel 4, the thin film thermocouple 3 is used for detecting the target temperature and feeding back the target temperature to the PID controller 5, and the PID controller 5 is used for controlling the deviation of the target temperature and the set temperature to be within the preset deviation.
In this embodiment, one surface of the ballastless track slab 1 and one surface of the temperature control device 2 are mutually attached and fixed, and the other surface of the ballastless track slab 1 and the other surface of the temperature control device 2 respectively form the front surface and the back surface of the target of the ballastless track slab 1. The preset deviation is a preset deviation, and for example, the preset deviation may be set to 0.5 °. Or, the controller 5 is configured to control the deviation ratio of the target temperature and the set temperature to be within a preset deviation ratio. The preset deviation ratio is a preset deviation ratio, and for example, the preset deviation ratio may be set to 2% or 5%. The control panel comprises a controller, such as an embedded computer or a single-chip microcomputer or a microprocessor.
In the embodiment of the invention, the ballastless track slab 1 further comprises a narrow layer, and a thin film thermocouple 3 for detecting the target temperature is arranged. In other embodiments, for the convenience of replacing the damaged film thermocouple 3, the ballastless track plate target comprises two layers of ballastless track plates 1 which are adjacent in a lamination manner, a narrow layer is arranged between the two layers of ballastless track plates 1 and is used for arranging the film thermocouple 3, and the two layers of ballastless track plates 1 can be connected through a flange structure and can be freely opened and closed. Of course, in other embodiments, the thin film thermocouple 3 may be disposed on the surface of the ballastless track slab 1 on the front surface of the target. In addition, the thin film thermocouple 3 can be fixedly arranged inside the ballastless track plate 1.
In the embodiment of the invention, the ballastless track plate target comprises a ballastless track plate 1, a temperature control device 2, a film thermocouple 3, a PID controller 5 and a control panel 4, wherein the ballastless track plate 1 and the temperature control device 2 are mutually attached and fixed, the film thermocouple 3 is arranged in a narrow layer of the ballastless track plate 1, the temperature control device 2, the control panel 4 and the film thermocouple 3 are all connected with the PID controller 5, and the temperature control device 2 is connected with the control panel 4. The ballastless track slab is mainly composed of ballastless track slab materials, and ballastless track slabs contained in the ballastless track slab targets are also ballastless track slab materials, so that the ballastless track slab targets in the embodiment of the invention can effectively and accurately reflect the emissivity of the ballastless track slab.
In a further embodiment, the plate surface shape of the ballastless track plate 1 comprises a square shape, a round shape or a regular polygon shape; and/or, the plate surface shape of the temperature control device 2 comprises a square shape, a round shape or a regular polygon shape. Of course, it will be understood by those skilled in the art that the slab shape of the ballastless track slab 1 or the slab shape of the temperature control device 2 may be other shapes besides the square, round and regular polygon, such as a five-pointed star shape and an irregular polygon, etc., which are not limited by the embodiments of the present invention, and all related variations shall fall within the scope of the present invention.
In a further embodiment, the ballastless track slab target further comprises an outer shell which is hollow in the interior and wraps the side surfaces and the back surface of the ballastless track slab target.
In a further embodiment, in order to improve the temperature uniformity of the ballastless track slab target, the temperature control device 2 includes at least one heating plate and/or n×m cooling plates, where in a case that the temperature control device 2 includes at least one heating plate and n×m cooling plates, the n×m cooling plates are disposed in n×m grooves of the at least one heating plate, where N and M are both positive integers.
In addition, in the case that N and M are both 1, the temperature control device 2 includes a heating plate and a cooling plate, the cooling plate is disposed in a groove of the heating plate, and the shape of the cooling plate is consistent with the shape of the groove, so that the cooling plate can be properly disposed in the groove. In addition, the shape of the heating sheet or the cooling sheet may be set to be a direction, a circle, a regular polygon, a pentagram, an irregular polygon, or the like, as in the case of the temperature control device 2 described above.
In a further embodiment, in order to improve the temperature uniformity of the ballastless track slab target, the temperature control device 2 includes one heating plate and n×m cooling plates, where the n×m cooling plates are disposed in n×m grooves of the one heating plate. In the case where N and M are both 4, the temperature control device 2 includes one heating plate and 16 cooling plates, and the 16 cooling plates are disposed in 16 grooves of the one heating plate.
Fig. 2 shows a schematic structure of a temperature control device 2 in a ballastless track slab target provided by an embodiment of the present invention, and for convenience of explanation, only a portion relevant to the embodiment of the present invention is shown, and details are as follows:
in the embodiment of the present invention, as shown in fig. 2, N and M are both 3, the temperature control device 2 includes one heating plate 201 and 9 cooling plates 202, and the 9 cooling plates 202 are disposed in 9 grooves of the one heating plate 201.
In addition, in other embodiments, the temperature control device 2 includes n×m heating plates and/or at least one cooling plate, where the temperature control device 2 includes n×m heating plates and at least one cooling plate, the n×m heating plates are disposed in n×m grooves of the at least one cooling plate.
For example, in the case where N and M are both 3, the temperature control device 2 includes 9 heating plates and one cooling plate, and the 9 heating plates are disposed in 9 grooves of the one cooling plate.
Of course, it will be understood by those skilled in the art that the temperature control device 2 further includes other numbers of heating fins and other numbers of cooling fins, and the embodiments of the present invention are not limited thereto, and the related variations should fall within the protection scope of the present invention.
Fig. 3 shows a schematic structure of the temperature control device 2 in the ballastless track slab target provided by the embodiment of the present invention, and for convenience of explanation, only the portion relevant to the embodiment of the present invention is shown, and the details are as follows:
in this embodiment, the temperature control device 2 includes a plurality of heating plates and a plurality of cooling plates, where the heating plates and the cooling plates are alternately arranged at intervals. For example, as shown in fig. 3, the temperature control device 2 includes 8 heating fins 301 and 8 cooling fins 302, where the 8 heating fins 301 and the 8 cooling fins 302 are alternately arranged at intervals.
In a further embodiment, the heating sheet is a resistive heating sheet or an arc heating sheet or an electron beam heating sheet or an infrared heating sheet.
In a further embodiment, the heating sheet comprises a caterpillar-type heating sheet and the cooling sheet comprises a semiconductor cooling sheet.
In a further embodiment, the thin film thermocouple 3 is a patch type platinum resistor.
Fig. 4a shows a schematic diagram of calibrating an infrared temperature measurement system by using a ballastless track plate target according to an embodiment of the present invention, and for convenience of explanation, only a portion related to the embodiment of the present invention is shown, which is described in detail below:
in this embodiment, as shown in fig. 4a, when the infrared temperature measurement system is calibrated by using the ballastless track slab target, the infrared temperature measurement system is in the normal direction of the ballastless track slab target. The basic principle of the infrared temperature measurement system is as follows: all objects with the temperature higher than absolute zero emit infrared radiation energy to the surrounding space continuously, the infrared radiation energy of the objects is distributed according to the wavelength, the infrared radiation energy of the objects has quite close relation with the surface temperature of the objects, when the infrared temperature measuring system is calibrated, the infrared radiation energy of the objects is detected, the corresponding relation is established between the infrared radiation energy and the surface temperature of the objects, and then the infrared radiation energy of the objects is reflected on a photosensitive element of the infrared detector through the optical imaging objective lens, so that a voltage value corresponding to the infrared radiation energy of the objects (namely the output voltage of the infrared temperature measuring system) is obtained. In the embodiment of the invention, when the infrared temperature measurement system is calibrated, the infrared temperature measurement system is used for detecting the energy radiated by the ballastless track slab target, and the infrared temperature measurement system and the ballastless track slab 1 in the ballastless track slab target meet the following conditions:
wherein a is the diameter of a circular ballastless track slab 1 in the ballastless track slab target, d is the distance from the infrared temperature measurement system to the ballastless track slab 1 in the ballastless track slab target, and alpha is the angle of view of the infrared temperature measurement system.
Fig. 4b shows another schematic diagram of calibrating an infrared temperature measurement system by using a ballastless track slab target according to an embodiment of the present invention, and for convenience of explanation, only a portion related to the embodiment of the present invention is shown, which is described in detail below:
in this embodiment, as shown in fig. 4b, when the infrared temperature measurement system is calibrated by using the ballastless track slab target, the infrared temperature measurement system is used for detecting the energy radiated by the ballastless track slab target when the infrared temperature measurement system is calibrated in the normal direction of the ballastless track slab target, and the following conditions are satisfied by the infrared temperature measurement system and the ballastless track slab 1 in the ballastless track slab target:
wherein a is the diameter of the square ballastless track slab 1 in the ballastless track slab target, d is the distance from the infrared temperature measurement system to the ballastless track slab 1 in the ballastless track slab target, and alpha is the angle of view of the infrared temperature measurement system.
Fig. 5 shows another schematic structure of the ballastless track slab target provided by the embodiment of the present invention, and for convenience of explanation, only the portion relevant to the embodiment of the present invention is shown, and the details are as follows:
as shown in fig. 5, in an embodiment of the present invention, the ballastless track slab target further includes:
and the display module 6 is connected with the film thermocouple 3 and is used for displaying the target temperature detected by the film thermocouple 3 in real time. In other embodiments, the display module 6 includes a first display screen and a second display screen, where the first display screen is used for displaying the set temperature of the target, and the second display screen is used for displaying the target temperature detected by the thin film thermocouple 3 in real time.
And the alarm module 7 is connected with the film thermocouples 3 and is used for alarming when the temperature uniformity of the target exceeds the preset temperature uniformity, wherein the temperature uniformity of the target comprises variances of the temperatures of a plurality of targets detected by the film thermocouples 3 at the same time.
In the embodiment of the present invention, the preset temperature uniformity is preset temperature uniformity, for example, when the temperature uniformity of the ballastless track slab target is the variance of the temperatures of the multiple targets detected by the multiple film thermocouples 3 at the same time, the preset temperature uniformity is a preset variance value. The alarm module 7 includes a buzzer for sounding according to a preset frequency when the alarm module 7 alarms, where the preset frequency is a preset sounding frequency, for example, may be preset to 2 times/second, and of course, a person skilled in the art may perform other settings according to the actual situation, and the present invention is not limited thereto.
In a further embodiment, as shown in fig. 5, the ballastless track slab target further comprises a moving mechanism 8 disposed at the bottom of the target.
In a further embodiment, the movement mechanism 8 comprises a roller. Of course, those skilled in the art may also set other moving mechanisms according to practical situations, and the related variations should fall within the protection scope of the present invention, which is not limited in particular.
In a further embodiment, the thickness of the ballastless track slab 1 is 1-2 mm.
In the embodiment of the invention, the temperature of the ballastless track plate target can be set through a switch and a key on the control panel 4, the temperature of the ballastless track plate target is displayed through a first display screen in the display module 6, the target temperature of the ballastless track plate target is detected by the film thermocouple 3, the temperature of the detected target is displayed through a second display screen in the display module 6, and the detected target temperature is fed back to the PID controller 5 by the film thermocouple 3. When the target temperature of the ballastless track slab target is lower than the set temperature, the PID controller 5 controls the heating plate in the temperature control device 2 to work, and when the target temperature of the ballastless track slab target is higher than the set temperature, the PID controller 5 controls the cooling plate in the temperature control device 2 to work, so that the deviation between the ballastless track slab target temperature and the set temperature is within the preset deviation, and finally, the target temperature of the ballastless track slab target is as close to the set temperature as possible.
When the ballastless track plate target in any embodiment is utilized to calibrate the infrared temperature measurement system, emissivity correction is not needed, emissivity correction errors are not generated, and the infrared temperature measurement system after the calibration of the ballastless track plate target in the embodiment can be used for realizing high-precision measurement of the temperature of the ballastless track plate.
The applicant further researches find that in the process of calibrating the infrared temperature measurement system by using the ballastless track plate targets in the above embodiment, certain fitting errors can be generated by using the existing linear fitting model, parabolic fitting model and exponential fitting model, so that the calibration accuracy of the infrared temperature measurement system is lower, and high-accuracy measurement of the temperature of the ballastless track plate cannot be realized.
Fig. 6 shows a calibration method of an infrared temperature measurement system according to an embodiment of the present invention, and for convenience of explanation, only the portions related to the embodiment of the present invention are shown in detail as follows:
as shown in fig. 6, the calibration method of the infrared temperature measurement system includes:
step 601, acquiring a fitting data set, wherein the fitting data set comprises the actual temperature of a target and the output voltage of an infrared temperature measurement system, and the infrared temperature measurement system is arranged in the normal direction of the target. The target in the embodiment of the invention is the ballastless track plate target in any embodiment.
In the embodiment of the invention, when the ballastless track plate target is utilized to calibrate the infrared temperature measurement system, the infrared temperature measurement system is arranged in the normal direction of the ballastless track plate target, and the front surface of the ballastless track plate target containing the ballastless track plate faces the infrared temperature measurement system.
When fitting data are acquired, the temperature of the ballastless track plate target is set through a switch or a key on the control panel, and the actual temperature of the ballastless track plate target is the target temperature detected by the film thermocouple. However, in view of the embodiment of the present invention, the PID controller is used to control so that the actual target temperature and the set target temperature tend to be as consistent as possible, and the deviation between the target temperature and the set target temperature is controlled by the PID controller to be within a preset deviation, so that the set target temperature can be determined as the actual target temperature of the ballastless track slab.
The basic principle of the infrared temperature measurement system is as follows: all objects with the temperature higher than absolute zero emit infrared radiation energy to the surrounding space continuously, the infrared radiation energy of the objects is distributed according to the wavelength, the infrared radiation energy of the objects has quite close relation with the surface temperature of the objects, when the infrared temperature measuring system is calibrated, the infrared radiation energy of the objects is detected, the corresponding relation is established between the infrared radiation energy and the surface temperature of the objects, and then the infrared radiation energy of the objects is reflected on a photosensitive element of the infrared detector through the optical imaging objective lens, so that a voltage value corresponding to the infrared radiation energy of the objects (namely the output voltage of the infrared temperature measuring system) is obtained.
When fitting data are acquired, the actual temperature of a target is determined, the infrared radiation energy of the target is detected by the infrared temperature measuring system under the actual temperature of the target, and then a voltage value corresponding to the infrared radiation energy of the target is obtained, wherein the voltage value is the output voltage of the infrared temperature measuring system corresponding to the actual temperature of the target. The fitting data set comprises a plurality of target actual temperatures and output voltages of the infrared temperature measurement system corresponding to the target actual temperatures.
In other embodiments, in order to further improve the calibration accuracy of the infrared temperature measurement system, the target temperature detected by the thin film thermocouple may be determined as the target actual temperature.
Step 602, fitting data in a fitting data set by using a stepwise regression method, and determining a fitting curve model reflecting the relation between the actual temperature of a target and the output voltage of an infrared temperature measurement system, wherein the fitting curve model is a curve model in a Taylor series polynomial form.
Wherein the target is the ballastless track plate target of any one of the embodiments.
In the embodiment of the invention, the acquired fitting data is fitted by using a stepwise regression method, and a fitting curve model capable of reflecting the relation between the actual temperature of the target and the output voltage of the infrared temperature measurement system is determined, so that the calibration of the infrared temperature measurement system is completed.
The mathematical method for carrying out data fitting by a gradual return method is that variables are introduced one by one, the condition for introducing the variables is that the partial regression square sum of the variables (regression square sum is the deviation square sum reflecting the correlation degree between independent variables and dependent variables, if a multiple regression model cancels one independent variable, the part with reduced regression square sum is called the partial regression square sum of the independent variable to the dependent variable) is obvious through inspection; if the partial regression square sum of the variables is not significant through inspection, the non-significant variables are removed, and the partial regression square sum of each variable in the fitted curve model is ensured to be significant.
In the embodiment of the invention, the acquired fitting data is fitted by using a stepwise regression method, so that the fitting error of the data can be reduced, the calibration precision of the infrared temperature measurement system is improved, and the infrared temperature measurement system realizes high-precision measurement of the temperature of the ballastless track slab.
In a further embodiment, the acquiring the fitting dataset comprises:
determining the set temperature of the target as the actual temperature of the target;
acquiring output voltage of the infrared temperature measurement system at the set temperature by using the infrared temperature measurement system;
repeating the steps to obtain the actual temperatures of multiple groups of targets and the output voltage of the infrared temperature measuring system corresponding to the actual temperatures.
In the embodiment of the invention, when fitting data are acquired, a temperature regulation instruction is issued through a switch or a key on a control panel to set the set temperature of the ballastless track plate target, the control panel controls a heating plate or a refrigerating plate in a temperature control module to work according to the received temperature regulation instruction, a PID controller controls the deviation between the actual target temperature detected by a film thermocouple and the set temperature to be within a preset deviation, and the preset temperature is the preset temperature of the ballastless track plate target and is taken as the actual target temperature.
Or in other embodiments, the temperature of the ballastless track slab is detected by using a standard thermocouple (the standard thermocouple refers to a temperature detector based on the principle that the resistance value of a metal conductor increases with the increase of temperature, and the temperature detector has the advantages of higher precision, good physical and chemical properties, good oxidation resistance at high temperature, good stability and reproducibility of thermal electromotive force) and the temperature of the ballastless track slab detected by the standard thermocouple is determined as the actual temperature of the ballastless track slab. And acquiring the output voltage of the infrared temperature measuring system at the set temperature by using the infrared temperature measuring system.
For example, firstly, setting the temperature of a target to be-40 degrees, and after controlling the actual temperature of the target to be basically stabilized at-40 degrees, acquiring the output voltage of an infrared temperature measuring system at-40 degrees to be A1 by using the infrared temperature measuring system; then repeating the steps, setting the temperature of the target to be-30 degrees, -20 degrees, -10 degrees, 0 degrees, 10 degrees, 20 degrees, 30 degrees and 40 degrees respectively, after the actual temperature of the control target is basically stabilized at-30 DEG, -20 DEG, -10 DEG, 0 DEG, 10 DEG, 20 DEG, 30 DEG and 40 DEG, the infrared temperature measuring system is utilized to obtain the output voltages A2, A3, A4, A5, A6, A7, A8 and A9 at-30 degrees, -20 degrees, -10 degrees, -0 degrees, 10 degrees, 20 degrees, 30 degrees and 40 degrees. So far, the actual temperatures of a plurality of groups of targets and the output voltage of the infrared temperature measurement system corresponding to the actual temperatures can be obtained. It is confirmed that the more fitting data are acquired, the better the fitting effect of the data is.
In a further embodiment, in order to further improve the calibration accuracy of the infrared temperature measurement system, the calibration method of the infrared temperature measurement system further includes:
acquiring the measured temperature of the ballastless track plate by using the calibrated infrared temperature measurement system;
and verifying the calibration accuracy of the infrared temperature measurement system according to the actual temperature and the measured temperature of the ballastless track plate.
In this embodiment, the temperature of the ballastless track plate is detected by using a standard thermocouple, and the temperature of the ballastless track plate detected by the standard thermocouple is determined as the actual temperature of the ballastless track plate. In addition, when the calibrated infrared temperature measurement system measures the ballastless track plate, the infrared radiation energy of the ballastless track plate is detected, and then the measurement temperature of the ballastless track plate is obtained according to the voltage value corresponding to the infrared radiation energy of the ballastless track plate and based on a fitting curve model reflecting the relation between the temperature and the output voltage of the infrared temperature measurement system, so that the measurement temperature of the ballastless track plate is obtained when the calibrated infrared temperature measurement system measures the ballastless track plate. Furthermore, the calibration accuracy of the infrared temperature measurement system can be verified according to the actual temperature of the ballastless track plate detected by the standard thermocouple and the measured temperature obtained by measuring the ballastless track plate by the calibrated infrared temperature measurement system.
When verifying the calibration precision of the infrared temperature measurement system, the maximum value of the absolute values of the differences between the measured temperatures and the actual temperatures of the plurality of groups of ballastless track plates can be used for representing the temperature measurement precision of the infrared temperature measurement system, and it can be determined that the smaller the maximum value of the absolute values of the differences is, the higher the temperature measurement precision of the infrared temperature measurement system is. For example, assuming that the actual temperatures of the ballastless track slabs detected by the standard thermocouples are 25 °,35 °,45 °, and the measured temperatures of the ballastless track slabs obtained by using the calibrated infrared temperature measurement system are 25.08 °,35.02 °,44.9 °, respectively, the absolute values of the differences are 0.08 °,0.02 °,0.1 °, and the maximum value of the absolute values of the differences is 0.1 °, which may be used to represent the temperature measurement accuracy of the infrared temperature measurement system, that is, the temperature measurement accuracy of the infrared temperature measurement system is 0.1 °. The smaller the calibration error of the infrared temperature measurement system is, the higher the temperature measurement precision of the infrared temperature measurement system is.
In summary, in the embodiment of the invention, the ballastless track slab target comprises a ballastless track slab 1, a temperature control device 2, a film thermocouple 3, a PID controller 5 and a control panel 4, wherein the ballastless track slab 1 and the temperature control device 2 are mutually attached and fixed, the film thermocouple 3 is arranged in a narrow layer of the ballastless track slab 1, the temperature control device 2, the control panel 4 and the film thermocouple 3 are all connected with the PID controller 5, and the temperature control device 2 is connected with the control panel 4; the control panel 4 is used for controlling the temperature control device 2 to adjust the target temperature according to the received temperature adjustment instruction, the temperature control device 2 is used for adjusting the target temperature according to the control of the control panel 4, the thin film thermocouple 3 is used for detecting the target temperature and feeding back the target temperature to the PID controller 5, and the PID controller 5 is used for controlling the deviation of the target temperature and the set temperature to be within the preset deviation. The ballastless track slab is mainly composed of ballastless track slab materials, and ballastless track slabs contained in the ballastless track slab targets are also ballastless track slab materials, so that the ballastless track slab targets in the embodiment of the invention can effectively and accurately reflect the emissivity of the ballastless track slab.
In addition, the method and the device utilize the ballastless track plate target to calibrate the infrared temperature measurement system, utilize the stepwise regression method to perform data fitting, reduce data fitting errors, and simultaneously avoid emissivity correction errors, so that the ballastless track plate target can effectively and accurately reflect the emissivity of the ballastless track plate, and can also improve the calibration accuracy of the infrared temperature measurement system.
It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the scope of the invention, but to limit the invention to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (9)
1. A ballastless track slab target, comprising:
the device comprises a ballastless track plate, a temperature control device, a film thermocouple, a control panel and a PID controller;
the ballastless track plate is mutually attached and fixed with the temperature control device, the thin film thermocouple is arranged in a narrow layer of the ballastless track plate, the PID controller is arranged in the control panel, and the temperature control device, the control panel and the thin film thermocouple are all connected with the PID controller;
the temperature control device is connected with the control panel; the control panel is used for controlling the temperature control device to adjust the target temperature according to the received temperature adjusting instruction, the temperature control device is used for adjusting the target temperature according to the control of the control panel, the thin film thermocouple is used for detecting the target temperature and feeding back the target temperature to the PID controller, and the PID controller is used for controlling the deviation between the target temperature and the set temperature to be within a preset deviation;
the temperature control device comprises a plurality of heating plates and a plurality of refrigerating plates, and the heating plates and the refrigerating plates are alternately arranged at intervals.
2. The ballastless track slab target of claim 1, wherein the heating patch comprises a track-type heating patch and the cooling patch comprises a semiconductor cooling patch.
3. The ballastless track slab target of claim 1, wherein the thin film thermocouple is a patch type platinum resistor.
4. The ballastless track slab target of claim 1, wherein the slab surface shape of the ballastless track slab comprises a square or a circle or a regular polygon; and/or
The plate surface shape of the temperature control device comprises a square shape, a round shape or a regular polygon shape.
5. The ballastless track slab target of claim 1, wherein when the ballastless track slab target is utilized to calibrate the infrared temperature measurement system, the infrared temperature measurement system and the ballastless track slab in the ballastless track slab target meet the following conditions:
wherein a is the side length of a square ballastless track slab in the ballastless track slab target or the diameter of a round ballastless track slab, d is the distance from an infrared temperature measurement system to the ballastless track slab in the ballastless track slab target, and alpha is the angle of view of the infrared temperature measurement system.
6. The ballastless track slab target of claim 1, further comprising:
the display module is connected with the film thermocouple and used for displaying the target temperature detected by the film thermocouple in real time;
the alarm module is connected with the film thermocouple and used for alarming when the temperature uniformity of the target exceeds the preset temperature uniformity; the temperature uniformity of the target comprises variances of temperatures of a plurality of targets detected by a plurality of thin film thermocouples at the same time.
7. The ballastless track slab target of claim 1, further comprising a movement mechanism disposed at the bottom of the target.
8. The ballastless track slab target of claim 7, wherein the moving mechanism comprises a roller.
9. The calibration method of the infrared temperature measurement system is characterized by comprising the following steps of:
acquiring a fitting data set, wherein the fitting data set comprises the actual temperature of a target and the output voltage of an infrared temperature measurement system;
fitting the data in the fitting data set by using a stepwise regression method, and determining a fitting curve model reflecting the relation between the actual temperature of the target and the output voltage of the infrared temperature measurement system, wherein the fitting curve model is a curve model in a Taylor series polynomial form;
wherein the infrared temperature measurement system is arranged in the normal direction of a target, and the target is the ballastless track plate target of any one of claims 1 to 8; the front surface of the target faces the infrared temperature measurement system;
when fitting data are acquired, setting the temperature of the ballastless track plate target through a switch or a key on a control panel, and determining the set target temperature as the actual temperature of the ballastless track plate target; or determining the target temperature detected by the film thermocouple as the target actual temperature.
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| CN109269466B (en) * | 2018-10-30 | 2021-04-27 | 兰州交通大学 | Target surface relative pose measuring method and system based on feature points |
| CN109520624A (en) * | 2019-01-26 | 2019-03-26 | 长春奥普光电技术股份有限公司 | A kind of target plate and electro-optical system resolution test method |
| CN112816078A (en) * | 2020-12-31 | 2021-05-18 | 亿新（北京）科技有限公司 | Ballastless track slab temperature measurement system |
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