CN108700661A - 在镭射加工系统中的像平面的定位 - Google Patents

在镭射加工系统中的像平面的定位 Download PDF

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Publication number
CN108700661A
CN108700661A CN201780009710.2A CN201780009710A CN108700661A CN 108700661 A CN108700661 A CN 108700661A CN 201780009710 A CN201780009710 A CN 201780009710A CN 108700661 A CN108700661 A CN 108700661A
Authority
CN
China
Prior art keywords
workpiece
intensity distribution
spatial intensity
laser
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201780009710.2A
Other languages
English (en)
Chinese (zh)
Inventor
刘源
胡宏华
吉姆·布鲁克伊塞
李光宇
布兰登·比利恩
克尔特·伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of CN108700661A publication Critical patent/CN108700661A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
CN201780009710.2A 2016-03-17 2017-03-17 在镭射加工系统中的像平面的定位 Withdrawn CN108700661A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662309759P 2016-03-17 2016-03-17
US62/309,759 2016-03-17
PCT/US2017/022987 WO2017161284A1 (en) 2016-03-17 2017-03-17 Location of image plane in a laser processing system

Publications (1)

Publication Number Publication Date
CN108700661A true CN108700661A (zh) 2018-10-23

Family

ID=59851425

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780009710.2A Withdrawn CN108700661A (zh) 2016-03-17 2017-03-17 在镭射加工系统中的像平面的定位

Country Status (6)

Country Link
US (1) US10864599B2 (https=)
JP (1) JP2019512397A (https=)
KR (1) KR20180118143A (https=)
CN (1) CN108700661A (https=)
TW (1) TW201733728A (https=)
WO (1) WO2017161284A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113751880A (zh) * 2020-06-05 2021-12-07 Nps株式会社 蚀刻装置

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KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
EP3548295B1 (en) * 2016-12-02 2021-08-25 Videojet Technologies Inc. A system and method for laser marking substrates
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
DE102018119313B4 (de) * 2018-08-08 2023-03-30 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Anlage zum Durchführen des Verfahrens
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
JP7386073B2 (ja) * 2019-12-24 2023-11-24 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
EP4132739A1 (fr) * 2020-04-10 2023-02-15 Rolex Sa Système de tournage laser, procédé de tournage laser utilisant un tel système, et composant obtenu par un tel procédé
US12097558B2 (en) 2021-04-27 2024-09-24 General Electric Company Systems and methods for laser processing system characterization and calibration
WO2023183976A1 (en) * 2022-03-30 2023-10-05 Kajuem Holdings Pty Limited Improved plastic masks
JPWO2023228548A1 (https=) * 2022-05-24 2023-11-30
TWI867380B (zh) * 2022-12-02 2024-12-21 新代科技股份有限公司 雷射加工機台控制系統及其控制方法
US20260002874A1 (en) * 2024-06-28 2026-01-01 Wolfspeed, Inc. Multi-Channel Workpiece Inspection System

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AU4660293A (en) 1992-12-23 1994-07-19 Bausch & Lomb Incorporated Method of shaping laser beam
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
GB9811557D0 (en) * 1998-05-29 1998-07-29 Exitech Ltd The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages
US6720519B2 (en) * 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
US6815638B2 (en) * 2002-07-25 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of determining a minimum pulse width for a short pulse laser system
EP1585613A1 (en) * 2002-09-13 2005-10-19 Tamicare Ltd. Laser modification of complex objects
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JP2007229786A (ja) * 2006-03-02 2007-09-13 Sumitomo Heavy Ind Ltd レーザ加工装置及び焦点合わせ制御方法
US7605343B2 (en) 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
US7659989B2 (en) * 2007-06-29 2010-02-09 Coherent, Inc. Focus determination for laser-mask imaging systems
US20090242526A1 (en) 2008-03-26 2009-10-01 Electro Scientific Industries, Inc. Laser micromachining through a protective member
US8198564B2 (en) * 2008-09-09 2012-06-12 Electro Scientific Industries, Inc. Adaptive optic beamshaping in laser processing systems
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
JP6055414B2 (ja) 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113751880A (zh) * 2020-06-05 2021-12-07 Nps株式会社 蚀刻装置

Also Published As

Publication number Publication date
TW201733728A (zh) 2017-10-01
JP2019512397A (ja) 2019-05-16
WO2017161284A1 (en) 2017-09-21
KR20180118143A (ko) 2018-10-30
US10864599B2 (en) 2020-12-15
US20190001434A1 (en) 2019-01-03

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WW01 Invention patent application withdrawn after publication

Application publication date: 20181023

WW01 Invention patent application withdrawn after publication