CN108696800A - Electroacoustic transducer high temperature resistant composite diaphragm - Google Patents
Electroacoustic transducer high temperature resistant composite diaphragm Download PDFInfo
- Publication number
- CN108696800A CN108696800A CN201810722775.8A CN201810722775A CN108696800A CN 108696800 A CN108696800 A CN 108696800A CN 201810722775 A CN201810722775 A CN 201810722775A CN 108696800 A CN108696800 A CN 108696800A
- Authority
- CN
- China
- Prior art keywords
- electroacoustic transducer
- layer
- film layer
- high temperature
- temperature resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 20
- 230000008878 coupling Effects 0.000 claims abstract description 19
- 238000010168 coupling process Methods 0.000 claims abstract description 19
- 238000005859 coupling reaction Methods 0.000 claims abstract description 19
- 229920000642 polymer Polymers 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 230000009970 fire resistant effect Effects 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229910001339 C alloy Inorganic materials 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- VMWYVTOHEQQZHQ-UHFFFAOYSA-N methylidynenickel Chemical compound [Ni]#[C] VMWYVTOHEQQZHQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910021389 graphene Inorganic materials 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000004433 Thermoplastic polyurethane Substances 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 poly- ammonia Ester Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/08—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers separated by air or other fluid
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
The invention discloses a kind of electroacoustic transducer high temperature resistant composite diaphragms, including basal layer, coupling layer and film layer, the coupling layer is between basal layer and film layer and bonded substrate layer and film layer, the film layer are fire resistant polymer polymer film layer;Thermoplastic polyurethane film layer in traditional vibrating diaphragm is substituted for high molecular polymer film layer by the composite diaphragm of the present invention, simultaneously provided with coupling layer bonding high molecular polymer film layer and basal layer, the environment temperature that vibrating diaphragm and entire electroacoustic transducer can bear is improved by traditional 75 DEG C to 265 DEG C or more, increase the application field of electroacoustic transducer, simultaneously but also electroacoustic transducer can use more production technologies, in particular so that electroacoustic transducer can use SMT techniques to carry out high speed assembly, the production efficiency of electroacoustic transducer is improved.
Description
Technical field
The present invention relates to electrical component field more particularly to a kind of high temperature resistant composite diaphragms for electroacoustic transducer.
Background technology
In the prior art, vibrating diaphragm used by electroacoustic transducer is double-layer structure, including basal layer and is attached to substrate
Thermoplastic polyurethane film layer on layer;Wherein, the environmental resistance temperature of thermoplastic polyurethane film layer cannot be more than 75 DEG C.
When environment temperature is more than 75 DEG C, thermoplastic polyurethane film, that is, decomposition failure, electroacoustic transducer characteristic deterioration causes product to lose
Effect.Therefore, the temperature characterisitic of the vibrating diaphragm of prior art electroacoustic transducer limit electroacoustic transducer many fields application with
And production;For example, in electronic product produces common surface high speed attachment process (SMT techniques), the temperature of reflow oven is 260
DEG C (typical case), the temperature conflict with the temperature characterisitic of the vibrating diaphragm of electroacoustic transducer, cause electroacoustic transducer that can not use SMT techniques
High speed assembly is carried out, the production capacity of electroacoustic transducer is significantly limited.
Invention content
The technical problem to be solved in the present invention is to provide a kind of novel (265 DEG C of high temperature resistants applied to electroacoustic transducer
Above temperature) vibrating diaphragm, increase the application field of electroacoustic transducer, while but also electroacoustic transducer can use more lifes
Production. art.
In order to solve the above technical problems, the technical solution adopted by the present invention is:A kind of electroacoustic transducer high temperature resistant is compound to shake
Film, including basal layer, coupling layer and film layer, the coupling layer simultaneously bonded substrate layer and thin between basal layer and film layer
Film layer, the film layer are fire resistant polymer polymer film layer.
The material of the high molecular polymer film layer includes silica-base material and polyurethane, or including ceramics and poly- ammonia
Ester, or including carbon fiber and polyurethane;The thickness of high molecular polymer film layer is 0.01~0.03 millimeter;Wherein, silicon substrate
Material refers to compound containing element silicon, such as silica, silicon nitride etc.;
The material of the basal layer is nickel carbon alloy, metallic aluminium, stainless steel (such as 304 stainless steels) or ceramics;Basal layer
Thickness is 0.05~0.1 millimeter;
The material of the coupling layer includes silica-base material and adhesive, either including ceramics and adhesive or including stone
Black alkene and adhesive, the thickness for coupling layer are 0.0015-0.0025 millimeters.
Advantageous effect:Thermoplastic polyurethane film layer in traditional vibrating diaphragm is substituted for macromolecule by the composite diaphragm of the present invention
Polymer film layer, while provided with coupling layer bonding high molecular polymer film layer and basal layer, by vibrating diaphragm and entire electricity
The environment temperature that sonic transducer can bear is improved by traditional 75 DEG C to 265 DEG C or more, increases the application of electroacoustic transducer
Field, while but also electroacoustic transducer can use more production technologies, in particular so that electroacoustic transducer can use
SMT techniques carry out high speed assembly, improve the production efficiency of electroacoustic transducer.
Description of the drawings
Fig. 1 is the schematic diagram of 1 composite diaphragm of embodiment.
Fig. 2 is the explosive view of 1 composite diaphragm of embodiment.
Wherein:1, basal layer;2, layer is coupled;3, film layer.
Specific implementation mode
Invention is further described in detail With reference to embodiment.
Embodiment 1
As depicted in figs. 1 and 2, the high temperature resistant composite diaphragm of the present embodiment, including basal layer 1, coupling layer 2 and film layer 3;
The material of the basal layer 1 is 304 stainless steels, is made such as institute in Fig. 2 of the mode of Sheet Metal Forming Technology or metal etch
The rectangle shown;
The material of coupling layer 2 includes silica-base material and high-temperature-resistant adhesive, and coupling layer 2 is directly formed in substrate, specifically
Way is:Using metal surface sputtering technology, the mixture of silica-base material and adhesive is attached on basal layer 1, then
Fine and close coupling layer 2 is formed on the surface of basal layer 1 using ion implanting mode;
Film layer 3 is high molecular polymer film layer, and the material of high molecular polymer film layer includes silica-base material and gathers
Urethane.
The specific production stage of composite diaphragm is:
(1) the above-mentioned basal layer 1 for being attached with coupling layer 2 is put into hot-forming fixture;
(2) fire resistant polymer thin polymer film is placed on to the one side with coupling layer 2 of basal layer 1;
(3) hot-forming fixture is closed, temperature is increased to 200 DEG C by room temperature, keeps the temperature 50 seconds, then at 15 seconds
It is interior that temperature is down to 40 DEG C by 200 DEG C, last cooled to room temperature;
(4) hot-forming fixture is opened, composite diaphragm is taken out.
Thermoplastic polyurethane film layer 3 in traditional vibrating diaphragm is substituted for high molecular polymer by the composite diaphragm of the present embodiment
Film layer, while high molecular polymer film layer 3 and basal layer 1 are bonded provided with coupling layer 2, vibrating diaphragm and entire electroacoustic are changed
The environment temperature that energy device can bear is improved by traditional 75 DEG C to 265 DEG C or more, increases the application field of electroacoustic transducer,
Simultaneously but also electroacoustic transducer can use more production technologies, in particular so that electroacoustic transducer can use SMT works
Skill carries out high speed assembly, improves the production efficiency of electroacoustic transducer.
Although embodiments of the present invention are illustrated in specification, these embodiments are intended only as prompting,
It should not limit protection scope of the present invention.It is equal that various omission, substitution, and alteration are carried out without departing from the spirit and scope of the present invention
It should be included within the scope of the present invention.
Claims (8)
1. a kind of electroacoustic transducer high temperature resistant composite diaphragm, it is characterised in that:Including basal layer, coupling layer and film layer, described
Layer is coupled between basal layer and film layer and bonded substrate layer and film layer, the film layer polymerize for fire resistant polymer
Object film layer.
2. electroacoustic transducer high temperature resistant composite diaphragm according to claim 1, it is characterised in that:The high molecular polymer
The material of film layer includes silica-base material and polyurethane.
3. electroacoustic transducer high temperature resistant composite diaphragm according to claim 1, it is characterised in that:The high molecular polymer
The material of film layer includes ceramics and polyurethane.
4. electroacoustic transducer high temperature resistant composite diaphragm according to claim 1, it is characterised in that:The high molecular polymer
The material of film layer includes carbon fiber and polyurethane.
5. electroacoustic transducer high temperature resistant composite diaphragm according to claim 1, it is characterised in that:The material of the basal layer
For nickel carbon alloy, metallic aluminium, stainless steel or ceramics.
6. electroacoustic transducer high temperature resistant composite diaphragm according to claim 1, it is characterised in that:The material of the coupling layer
Including silica-base material and adhesive.
7. electroacoustic transducer high temperature resistant composite diaphragm according to claim 1, it is characterised in that:The material of the coupling layer
Including ceramics and adhesive.
8. electroacoustic transducer high temperature resistant composite diaphragm according to claim 1, it is characterised in that:The material of the coupling layer
Including graphene and adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810722775.8A CN108696800A (en) | 2018-07-04 | 2018-07-04 | Electroacoustic transducer high temperature resistant composite diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810722775.8A CN108696800A (en) | 2018-07-04 | 2018-07-04 | Electroacoustic transducer high temperature resistant composite diaphragm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108696800A true CN108696800A (en) | 2018-10-23 |
Family
ID=63851404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810722775.8A Pending CN108696800A (en) | 2018-07-04 | 2018-07-04 | Electroacoustic transducer high temperature resistant composite diaphragm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108696800A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918190A (en) * | 2019-05-10 | 2020-11-10 | 中芯国际集成电路制造(上海)有限公司 | MEMS microphone, preparation method thereof and electronic device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01270493A (en) * | 1988-04-22 | 1989-10-27 | Foster Electric Co Ltd | Diaphragm for heat resisting speaker |
| JPH03278699A (en) * | 1990-03-28 | 1991-12-10 | Foster Electric Co Ltd | Diaphragm for speaker |
| JPH05183983A (en) * | 1991-12-27 | 1993-07-23 | Matsushita Electric Ind Co Ltd | Diaphragm for speaker |
| US20060238067A1 (en) * | 2005-03-02 | 2006-10-26 | Mcnc Research And Development Institute | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
| US20100158284A1 (en) * | 2008-12-18 | 2010-06-24 | Industrial Technology Research Institute | Assembly structure of a flat speaker |
| CN203675306U (en) * | 2013-07-17 | 2014-06-25 | 嵊州市天乐电声科技有限公司 | Loudspeaker vibration diaphragm for mobile phone and tablet computer |
| CN104202699A (en) * | 2014-09-17 | 2014-12-10 | 苏州亿欧得电子有限公司 | Vibrating diaphragm for electroacoustic transducer |
| CN106604188A (en) * | 2016-12-13 | 2017-04-26 | 南京大学 | Electrostatic loudspeaker based on silicon thin film materials |
| CN107404685A (en) * | 2017-08-14 | 2017-11-28 | 歌尔股份有限公司 | A kind of vibrating diaphragm |
| CN208462043U (en) * | 2018-07-04 | 2019-02-01 | 苏州亿欧得电子有限公司 | Electroacoustic transducer high temperature resistant composite diaphragm |
-
2018
- 2018-07-04 CN CN201810722775.8A patent/CN108696800A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01270493A (en) * | 1988-04-22 | 1989-10-27 | Foster Electric Co Ltd | Diaphragm for heat resisting speaker |
| JPH03278699A (en) * | 1990-03-28 | 1991-12-10 | Foster Electric Co Ltd | Diaphragm for speaker |
| JPH05183983A (en) * | 1991-12-27 | 1993-07-23 | Matsushita Electric Ind Co Ltd | Diaphragm for speaker |
| US20060238067A1 (en) * | 2005-03-02 | 2006-10-26 | Mcnc Research And Development Institute | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
| US20100158284A1 (en) * | 2008-12-18 | 2010-06-24 | Industrial Technology Research Institute | Assembly structure of a flat speaker |
| CN203675306U (en) * | 2013-07-17 | 2014-06-25 | 嵊州市天乐电声科技有限公司 | Loudspeaker vibration diaphragm for mobile phone and tablet computer |
| CN104202699A (en) * | 2014-09-17 | 2014-12-10 | 苏州亿欧得电子有限公司 | Vibrating diaphragm for electroacoustic transducer |
| CN106604188A (en) * | 2016-12-13 | 2017-04-26 | 南京大学 | Electrostatic loudspeaker based on silicon thin film materials |
| CN107404685A (en) * | 2017-08-14 | 2017-11-28 | 歌尔股份有限公司 | A kind of vibrating diaphragm |
| CN208462043U (en) * | 2018-07-04 | 2019-02-01 | 苏州亿欧得电子有限公司 | Electroacoustic transducer high temperature resistant composite diaphragm |
Non-Patent Citations (1)
| Title |
|---|
| 张银华: "扬声器振膜用石墨—聚氯乙烯复合材料", 《电声技术》, pages 15 - 22 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111918190A (en) * | 2019-05-10 | 2020-11-10 | 中芯国际集成电路制造(上海)有限公司 | MEMS microphone, preparation method thereof and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181023 |