CN108688244A - Ceramic metal composite plate and preparation method thereof - Google Patents
Ceramic metal composite plate and preparation method thereof Download PDFInfo
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- CN108688244A CN108688244A CN201810824632.8A CN201810824632A CN108688244A CN 108688244 A CN108688244 A CN 108688244A CN 201810824632 A CN201810824632 A CN 201810824632A CN 108688244 A CN108688244 A CN 108688244A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/718—Weight, e.g. weight per square meter
Abstract
A kind of ceramic metal composite plate of present invention proposition and preparation method thereof, wherein, ceramic metal composite plate includes ceramic wafer and metal layer, it is fixedly connected by soldering between ceramic wafer and metal layer, metal layer has multiple conduits, there is the first solder layer between ceramic wafer and metal layer, ceramic wafer and metal layer are fixed together;The preparation method of ceramic metal composite plate is used to prepare above-mentioned ceramic metal composite plate.The present invention has environmental protection and fire-protection rating and the high technique effect of intensity.
Description
Technical field
The invention belongs to ceramet Combined Machining Technology field more particularly to a kind of ceramic metal composite plate and its preparations
Method.
Background technology
Ceramics have wear-resisting, anti-corrosion, high temperature resistant and the performances such as good heat conduction and insulating properties, are a kind of important engineerings
Material and good electronic package material.Since ceramics are more crisp, mechanical processing is difficult, electric conductivity is poor or non-conductive,
It generally requires to connect it with metal in many occasions and makes composite material or composite structural member.
Chinese patent application CN201502153U discloses a kind of ceramic metal composite plate comprising surface layer and base, table
Layer is arranged in the top of base, and surface layer and base are connected with each other;Surface layer is ceramic wafer, and base is metal layer.Ceramic wafer and metal
Layer is connected by way of the bonding agents such as epoxide resin type, polyurethane bonding.The ceramic metal composite plate by by ceramic wafer and
Metal layer is combined with each other, and can increase the toughness, thermal conductivity and electric conductivity of material, and be easy to cutting, it is easy for installation.
However, ceramic wafer and metal layer be due to being combined with each other by above-mentioned ceramic metal composite plate by the way of bonding,
Therefore it has the following defects:(1) binder used in has injury inevitable that the gases such as formaldehyde are discharged to human body, from
And so that the ceramic metal composite plate is only used for outdoor wall surface decoration, and be not suitable for interior, i.e., usage scenario is limited;(2)
High polymer binder is easy heated combustion, and pernicious gas can be discharged in combustion process, to which fire safety grade is relatively low simultaneously
And pollution environment;(3) intensity is low, tolerance is poor, be susceptible to degumming phenomenon and service life is shorter.
Invention content
The present invention proposes a kind of environmentally friendly and fire prevention etc. for above-mentioned technical problem existing for above-mentioned ceramic metal composite plate
Grade and the high ceramic metal composite plate of intensity, and prepare the preparation method of the ceramic metal composite plate.
In order to achieve the above object, the technical solution adopted by the present invention is:
A kind of ceramic metal composite plate, including ceramic wafer and metal layer are fixed between ceramic wafer and metal layer by being brazed
Connection, metal layer have multiple conduits, have the first solder layer between ceramic wafer and metal layer, ceramic wafer and metal layer are consolidated
It is scheduled on together.
Preferably, the metal layer is metal porous layer, metal porous layer has multiple slots close to the side of ceramic wafer
Road, to form multiple hole portions between ceramic wafer and the first solder layer.
Preferably, the metal porous layer includes at least one sheet metal, sheet metal has multiple lug bosses, the slot
Road is formed between adjacent projections.
It is molded through deformation preferably, the lug boss is the sheet metal.
Preferably, the sheet metal is multiple, multiple metallic stack settings, the lug boss of adjacent metal piece, which is fixed, to be connected
It connects.
Preferably, the conduit extends from the ceramic wafer to the direction far from ceramic wafer.
Preferably, the metal porous layer is metal beehive core material, first solder layer corresponds to metal honeycomb core
Material is in netted.
Preferably, the metal porous layer is that corrugated plating, corrugated sheet or dimple plate are one kind of.
A kind of preparation method of ceramic metal composite plate is used to prepare ceramic metal composite plate, the ceramic clad plate packet
Ceramic wafer and metal layer are included, metal layer has multiple conduits, and the preparation method comprises the following steps:
The step of to ceramic wafer surface preparation;
The step of ceramic wafer surface metalation is handled;
The step of solder coated ceramic plate;
The step of preparing metal layer;
The step of ceramic wafer is brazed with metal layer, by ceramic wafer and metal layer in vacuum drying oven or atmosphere furnace brazing.
Preferably, the metal layer is metal beehive core material, which is characterized in that the step of preparing metal layer includes following
Step:
The step of preparing foil;
Solder coats the step of foil;
The step of foil lamination;
The step of foil diffusion welding (DW), heats multilayer foil pressurization in vacuum drying oven or atmosphere furnace, wherein heating is so that phase
Solder between adjacent foil is in solid-liquid admixture, and pressurization between adjacent foil so that be tightly pressed together, until between adjacent foil
Solder fixes adjacent foil in a manner of atoms permeating;
Stretching forms the step of metal beehive core material.
Compared with prior art, the advantages and positive effects of the present invention are:
1, ceramic metal composite plate of the present invention is by that by ceramic wafer and metal layer soldering connection, can ensure that ceramics are hardened
In the case of structure stability, relative to existing ceramic metal composite plate, have the advantage that:(1) it is discharged without pernicious gas, environmental protection
Green non-pollution;(2) it is not easy heated combustion, fire safety grade is high;(3) recyclable recycling;(4) intensity height, long lifespan
And it is light-weight.
2, ceramic metal composite plate of the present invention is by setting metal layer to metal beehive core material, and by metal beehive core material
Directly with ceramic wafer soldering connection, the contact area between metal layer and ceramic wafer is reduced, simultaneously because very due to honeycomb cell-wall
It is thin, therefore thermal residual strain can be significantly reduced, so that the soldering of large-area ceramic plate and metal layer is possibly realized.
3, the preparation method of ceramic metal composite plate of the present invention is linked together laminated aluminium foil by diffusion welding (DW), relatively
By the way of preparing metal beehive core material using soldering, it can fundamentally solve existing metal beehive core material preparation method and exist
Technological deficiency, it is big to significantly improve the yield rate in ceramic metal composite plate production process, and then due to yield rate
Amplitude improves, and the production efficiency of ceramic metal composite plate improves instead, while ceramet is compound after batch production
The manufacturing cost of plate is reduction of on the whole.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of embodiment of ceramic metal composite plate of the present invention;
The overlooking structure diagram that Fig. 2 is metal porous layer of the present invention when being metal beehive core material;
Fig. 3 is to embody ceramic wafer and the ceramic intensity of residual stresses coefficient and plate thickness relationship after metallic plate soldering
Curve graph;
Fig. 4 is ceramic wafer and the residual stress distribution figure after metallic plate soldering;
Fig. 5 is the structural schematic diagram of ceramic metal composite plate another kind embodiment of the present invention;
The structural schematic diagram that Fig. 6 is metal porous layer of the present invention when being corrugated plating;
The structural schematic diagram that Fig. 7 is metal porous layer of the present invention when being corrugated sheet;
The structural schematic diagram that Fig. 8 is metal porous layer of the present invention when being dimple plate;
Fig. 9 is one of the stereogram of Fig. 8;
Figure 10 is the two of the stereogram of Fig. 8;
In above each figure:1, ceramic wafer;2, metal layer;3, conduit;4, the first solder layer;5, metal porous layer;6, hole portion;
7, sheet metal;8, lug boss;9, metal beehive core material;10, the first metal decking;11, the second solder layer;12, the second metal covering
Plate;13, third solder layer.
Specific implementation mode
Referring to Fig. 1 and Fig. 5, a kind of ceramic metal composite plate, including ceramic wafer 1 and metal layer 2, ceramic wafer 1 and metal layer 2
Between by soldering be fixedly connected, metal layer 2 have multiple conduits 3, after metal layer 2 is fixedly connected with ceramic wafer 1, to carry
High metal layer 2 adapts to the ability of thermal expansion deformation, to reduce the possibility that rupture failure occurs for ceramic wafer 1;Ceramic wafer 1 with
There is the first solder layer 4 between metal layer 2, ceramic wafer 1 and metal layer 2 are fixed together, the material of the first solder layer 4 can
Think Al-Si hard solders, or can be Zn-Al soft solders;It should be noted that common metal solder is soaked in ceramic surface
Property it is very poor, it usually needs before brazing to ceramic surface carry out surface pre-metalizing, however, due to the present invention inventive point do not exist
In the treatment process of ceramic wafer 1, therefore, ceramic wafer 1 of the invention can also be by the pre- gold in surface either pure ceramic wafer
Categoryization treated ceramic wafer.
Based on above-mentioned, ceramic metal composite plate of the present invention is by that by ceramic wafer 1 and 2 soldering connection of metal layer, can protect
In the case of demonstrate,proving 1 structural stability of ceramic wafer, relative to existing ceramic metal composite plate, have the advantage that:(1) without harmful gas
Body discharges, and environment-friendly and green is pollution-free;(2) it is not easy heated combustion, fire safety grade is high;(3) recyclable recycling;(4) strong
Degree is high, long lifespan and light-weight.
For the structure of metal layer 2, can be:In the embodiment shown in fig. 1, metal layer 2 includes the first metal covering
Plate 10 and metal porous layer 5, the first metal decking 10 can be aluminium sheet, copper coin or stainless steel plate, the first metal decking 10 and gold
Genus polyporus layer 5 is fixedly connected, and ceramic wafer 1 is fixedly connected with the first metal decking 10 by soldering, at this point, the first solder layer 4
Between ceramic wafer 1 and the first metal decking 10, the first solder layer 4 is in planar;The material of metal porous layer 5 can be aluminium,
Copper or stainless steel.
Specifically, as depicted in figs. 1 and 2, ceramic wafer 1, the first metal decking 10 and metal porous layer 5 are from top to bottom side by side
Setting, ceramic wafer 1 are fixedly connected the first solder layer 4 with the first metal decking 10 in a manner of soldering, the first metal decking
10 are fixedly connected with metal porous layer 5 preferably by soldering, relative to the mode of gluing, have high mechanical properties and ring
The advantages such as small are polluted in border, have the second solder layer 11 between the first metal decking 10 and metal porous layer 5 at this time, by the first gold medal
Belong to panel 10 to be fixed together with metal porous layer 5, the material of the second solder layer 11 can be Al-Si hard solders, or can be with
For Zn-Al soft solders;Metal porous layer 5 is preferably metal beehive core material 9, relative to corrugated sheet, corrugated plating or dimple plate,
Its honeycomb has many significant advantages:Density is small, and resistance to compression and bending strength are high, side that plank is born, lateral pressure and
Shearing force is not limited and uniform force etc. by direction;The both sides of second solder layer 11 respectively with the first metal decking 10 and
The fitting contact of metal beehive core material 9, the second solder layer 11 is in netted.
In addition, side of the metal layer 2 far from ceramic wafer 1 can also be fixedly connected with other ceramic wafers or other metal coverings
Plate, for example, further as shown in Figure 1, metal layer 2 further includes the second metal decking 12, the second metal decking 12 can be aluminium sheet,
Copper coin or stainless steel plate, the second metal decking 12 are located at the lower section of metal beehive core material 9, the second metal decking 12 and metal beehive
It is fixedly connected preferably by soldering between core material 9, there is between the second metal decking 12 and metal beehive core material 9 third at this time
Second metal decking 12 and metal beehive core material 9 are fixed together by solder layer 13, and the material of third solder layer 13 can be
Al-Si hard solders, or can be Zn-Al soft solders, the both sides of third solder layer 13 respectively with the second metal decking 12 and gold
Belong to the fitting contact of honeycomb core material 9, third solder layer 13 is in netted.
It should be noted that above-mentioned metal layer 2 is using passing through the first metal decking 10 and ceramic wafer 1 and the side that connect
Formula can improve the stress performance of ceramic metal composite plate.However, if the size of ceramic metal composite plate is larger,
It is swollen with the heat of metal since the coefficient of thermal expansion of ceramics is smaller during first metal decking 10 is brazed with ceramic wafer 1
Swollen coefficient difference is larger, therefore, as shown in figure 3, with the increase of the two contact area or contact thickness, coefficient of thermal expansion difference
The residual stress brought exponentially rises, as shown in figure 4, residual stress can cause joint to crack when larger, or even draws
Play rupture failure;So the ceramic metal composite plate exemplar of very little can only be welded into using the structure of above-mentioned metal layer 2.
Based on above-mentioned, in order to which large-area ceramic plate 1 and the soldering of metal layer 2 are possibly realized, the structure of metal layer 2 can be with
For:In the embodiment shown in fig. 5, metal layer 2 is metal porous layer 5, and metal porous layer 5 has close to the side of ceramic wafer 1
Multiple conduits 3, to form multiple hole portions 6 between ceramic wafer 1 and the first solder layer 4, to reduce and the contact of ceramic wafer 1
Area.Ceramic metal composite plate of the present invention is set as metal porous layer 5 by metal layer 2, and by metal porous layer 5 directly with pottery
1 soldering connection of porcelain plate, reduces the contact area between metal layer 2 and ceramic wafer 1, simultaneously because formed between adjacent conduit 3
Thin-walled, therefore thermal residual strain can be significantly reduced, so that large-area ceramic plate 1 and the soldering of metal layer 2 are possibly realized.
For the structure of metal porous layer 5, can be:In Fig. 5 to embodiment shown in Fig. 8, metal porous layer 5 wraps
Include at least one sheet metal 7 (such as metal foil, that is, use cold draw at foil), sheet metal 7 have multiple lug bosses 8,
Conduit 3 is formed between adjacent projections 8;Lug boss 8 is preferably that sheet metal 7 is molded through deformation, i.e., lug boss 8 is sheet metal 7
A part, the deformation that the deformation can be sheet metal 7 to be generated by bending can also be sheet metal 7 by hot pressing or
The deformation that Sheet Metal Forming Technology generates.
Specifically, as shown in figure 5, metal porous layer 5 is metal beehive core material 9, wherein sheet metal 7 is foil (such as aluminium
Foil, copper foil or stainless steel foil), sheet metal 7 is in bending, and lug boss 8 is formed in the bending place of sheet metal 7, and sheet metal 7 is preferably
Multiple, 7 lamination of multiple sheet metals is arranged and is in that honeycomb is netted, and the lug boss 8 of adjacent metal piece 7 connects preferably by soldering is fixed
It connects, in contrast in the mode of gluing, mechanical property can be improved;Conduit 3 prolongs from ceramic wafer 1 to the direction far from ceramic wafer 1
It stretches, it is preferred that conduit 3 extends along perpendicular to the direction of ceramic wafer 1, and the first solder layer 4 is located at ceramic wafer 1 and metal beehive core material
Between 9, the first solder layer 4 corresponds to metal beehive core material 9 in netted.Ceramic metal composite plate of the present invention is more by the way that metal is arranged
Aperture layer 5 is metal beehive core material 9, is ensureing good stress performance simultaneously as honeycomb cell-wall is very thin, therefore can further drop
Low-heat residual stress, and then the area using ceramic wafer 1 can be further increased.
Further as shown in figure 5, metal layer 2 further includes the second metal decking 12, the second metal decking 12 is located at metal bee
The lower section of nest core material 9 is fixedly connected between second metal decking 12 and metal beehive core material 9 preferably by soldering, and at this time
There is third solder layer 13, by the second metal decking 12 and metal beehive between two metal deckings 12 and metal beehive core material 9
Core material 9 is fixed together, and the material of third solder layer 13 can be Al-Si hard solders, or can be Zn-Al soft solders, the
The both sides of three solder layers 13 are contacted with the second metal decking 12 and the fitting of metal beehive core material 9 respectively, and third solder layer 13 is in net
Shape.
In addition, metal porous layer 5 can also be specifically:As shown in fig. 6, metal porous layer 5 is metal corrugated plate, wherein
Sheet metal 7 is in bending, and sheet metal 7 is one (or vertically lamination setting is multiple), and conduit 3 is along being parallel to
The direction of ceramic wafer 1 extends, and lug boss 8 is formed in the bending place of sheet metal 7, at this point, the first solder layer 4 and third solder layer 13
It is in along the direction for being parallel to ceramic wafer 1 corresponding to the end (i.e. with the end of 1 soldering connection of ceramic wafer, similarly hereinafter) of lug boss 8
Interval and the multiple linears being distributed side by side.
In addition, metal porous layer 5 can also be specifically:As shown in fig. 7, metal porous layer 5 is corrugated metal sheet, wherein
Sheet metal 7 is in bending, and sheet metal 7 is one (or vertically lamination setting is multiple), and conduit 3 is along being parallel to
The direction of ceramic wafer 1 extends, and lug boss 8 is the odontoid formed by 7 integral heat pressure of sheet metal, at this point, the first solder layer 4 and the
Three solder layers 13 correspond to the end of lug boss 8, are in the multiple rectangles for being parallel to the direction interval of ceramic wafer 1 and being distributed side by side
Face.
In addition, metal porous layer 5 can also be specifically:As shown in Fig. 8 to Figure 10, metal porous layer 5 is metal dimple plate,
Wherein, lug boss 8 is the circular platform type being stamped and formed out in part by sheet metal 7, and multiple lug bosses 8 are in net distribution, and conduit 3 is in
Netted, sheet metal 7 is one (or vertically lamination setting is multiple), at this point, the first solder layer 4 and third pricker
The bed of material 13 corresponds to the end of lug boss 8, is in multiple rounded faces of net distribution.
The invention further relates to a kind of preparation methods of ceramic metal composite plate, are used to prepare ceramic metal composite plate, described
Ceramic clad plate includes ceramic wafer 1 and metal layer 2, and metal layer 2 has multiple conduits 3, the specific knot of the ceramic metal composite plate
Structure includes the following steps with reference to above-described embodiment, the preparation method of the ceramic metal composite plate:
The step of to 1 surface preparation of ceramic wafer, for example, oil removing, polishing and sandblasting etc.;
The step of 1 surface metalation of ceramic wafer is handled;
The step of solder coated ceramic plate 1, for example, by solder machine by paste or strip brazing material be fixed on ceramic wafer 1 with
On the joint face of metal layer 2;
The step of preparing metal layer 2;
The step of ceramic wafer 1 is brazed with metal layer 2, by ceramic wafer 1 and metal layer 2 in vacuum drying oven or atmosphere furnace brazing.
Based on above-mentioned, the preparation method of ceramic metal composite plate of the present invention, by by pricker between ceramic wafer 1 and metal layer 2
Weldering connection, relative to existing ceramic metal composite plate preparation method, has following advantage:(1) it is discharged without pernicious gas, environmental protection is green
Color is pollution-free;(2) it is not easy heated combustion, fire safety grade is high;(3) recyclable recycling;(4) intensity is high, long lifespan and
It is light-weight.
Preferably, in the step of ceramic wafer 1 and metal layer 2 are brazed, brazing temperature is preferably 450 DEG C or more.
The metal layer 2 is preferably metal beehive core material 9, for the step of preparing metal layer 2 comprising following steps:
The step of preparing foil removes the greasy dirt and oxidation film of foil for example, being cleaned to foil surface, used clear
Lotion can be metal product scavenger specially, and cleaning equipment can be supersonic wave cleaning machine;
Solder coats the step of foil, for example, by band-like or paste solder by equipment such as solder machines according to preset
Away from coated on foil;
The step of foil lamination, misplaces up and down for example, the multilayer foil for coating solder is carried out lamination.
It is known to those skilled in the art that existing metal beehive core material 9 is by multilayer foil by gluing or soldering
Mode be fixedly connected after formed through overstretching, wherein preparing metal beehive core material 9, phase in such a way that soldering is fixedly connected
It is small and the advantages that degumming phenomenon will not occur to have high mechanical properties, environmental pollution for the mode of gluing.However, when gold
Belong to when the fusing point of 9 inside solder of honeycomb core material is not higher than the fusing point of the first solder layer 3 that (such as the former is soft solder and the latter is hard
Solder, the either situation both for hard solder or both for soft solder), connect fixing ceramic wafer 1 and metal layer 2
In termination process, in order to enable the first solder layer 3 melts after reaching fusing point, the solder inside metal beehive core material 9 is necessarily caused to be sent out
Raw fusing leads to metal bee so that being extremely easy to disconnect due to losing stable connection relation between foil and foil
Nest core material 9 falls apart, and then the extremely low industry of generation yield rate is general during ceramic metal composite plate is produced in enormous quantities
All over phenomenon.Based on this, the step of preparing metal layer 2 further includes the steps that foil diffusion welding (DW):
The step of foil diffusion welding (DW), heats multilayer foil pressurization in vacuum drying oven or atmosphere furnace, wherein heating is so that phase
Solder between adjacent foil is in solid-liquid admixture, and pressurization between adjacent foil so that be tightly pressed together, until between adjacent foil
Solder fixes adjacent foil in a manner of atoms permeating.
It should be noted that those skilled in the art are also known that:Diffusion welding (DW) refer to workpiece is pressurizeed at high temperature, but
Visible deformation and the solid-state soldering method of relative movement are not generated, and between surface to be welded plus one layer is conducive to the intermediate wood spread
Material, which melts in heating and thermal insulation, and forms a small amount of liquid phase, and gap can be filled in these liquid metals, also makes in liquid phase
Certain elements to base material spread, eventually form metallurgical connection;In the ceramic metal composite plate industry for needing to produce in enormous quantities,
Diffusion welding (DW) is increased relative to soldering to add high pressure, to need during preparing metal beehive core material 9 to processing
Technique and process equipment propose higher requirement, and then extend the production cycle, improve production cost, are unfavorable for continous way batch
Amount production, therefore, soldering is generally adopted in honeycomb board industry.
However, the preparation method of ceramic metal composite plate of the present invention, laminated aluminium foil is linked together, make by diffusion welding (DW)
Solder between adjacent foil is fixedly connected adjacent foil in a manner of atoms permeating, add high pressure although increasing,
But during 1 metal beehive core material 9 of ceramic wafer is subsequently brazed fixed, even if 9 inner attachment points of metal beehive core material
The solder at place melts after reaching fusing point, is not changed with the relationship that is fixedly connected of atoms permeating because of early period between adjacent foil
Without being influenced by brazing filler metal melts, from regardless of select the material combination of which kind of solder, can effectively reduce foil it
Between tie point disconnect risk, then reduce the case where metal beehive core material 9 falls apart, can fundamentally solve
Technological deficiency existing for existing metal beehive core material preparation method, and then significantly improve in ceramic metal composite plate production process
Yield rate, more and then increasing substantially due to yield rate, relative to the side for preparing metal beehive core material 9 using soldering
The production efficiency of formula, ceramic metal composite plate improves instead, at the same after batch production ceramic metal composite plate system
Standby cost is reduction of on the whole.
In addition, under the premise of the material of 9 inside solder of metal beehive core material is certain, the foil diffusion welding (DW) the step of
In, due to it is not necessary that by the solder heat between foil to fusing point, the temperature reached needed for heating is reduced, to the present invention
The preparation method of ceramic metal composite plate also reduces the requirement to heating process and heating equipment;Furthermore by diffusion welding (DW), pricker
Wetability between material and foil is good, so that the welding between foil and foil is more firm.
It can not will expand it can be seen from the above, the preparation method of ceramic metal composite plate of the present invention overcomes those skilled in the art
Scattered weldering is applied to the connection between foil, with the technology prejudice produced in enormous quantities suitable for ceramic metal composite plate, and in metal
Honeycomb core material field has reached the production efficiency for improving ceramic metal composite plate, and reduces being prepared into for ceramic metal composite plate
This this unexpected technique effect.
If the realization method of the step of for above-mentioned foil diffusion welding (DW) works as selection in the preparation foil the step of
Foil when being aluminium foil, then the foil diffusion welding (DW) the step of in, the pressure limit of pressurization is 0.5-5MPa;At this point, such as
For fruit in the step of solder coats foil, the solder of selection is Al-Si hard solders, then the foil diffusion welding (DW) the step of
In, the temperature range of heating is 580-620 DEG C;In addition, if in the step of solder coats foil, the solder of selection is
Zn-Al soft solders, then the foil diffusion welding (DW) the step of in, the temperature range of heating is 400-450 DEG C.
Preferably, in the foil diffusion welding (DW) the step of, the solder of selection is hard solder, in ceramic wafer 1 and metal layer 2
In the step of soldering, the solder of selection is soft solder, with this in the step of ceramic wafer 1 and metal layer 2 are brazed, due to metal bee
Brazing filler metal fusing point inside nest core material 9 is higher than the brazing filler metal fusing point between ceramic wafer 1 and metal layer 2, therefore inside metal beehive core material 9
Solder will not melt, to further reduced the phenomenon that tie point disconnects between foil, and then further improve
Yield rate in ceramic metal composite plate production process.
When metal layer 2 is structure shown in Fig. 2, the step of preparing metal layer 2, is further comprising the steps of:
The step of preparing the first metal decking 10 removes the first gold medal for example, being cleaned to 10 surface of the first metal decking
Belong to the greasy dirt and oxidation film of panel 10, cleaning agent used can be metal product scavenger specially, and cleaning equipment can be ultrasound
Wave cleaning machine;
Solder coats the step of the first metal decking 10, for example, paste or strip brazing material are coated on the by solder machine
On the contact surface of one metal decking 10 and the above-mentioned metal beehive core material 9 prepared;
The step of fixing the first metal decking 10 and metal beehive core material 9;
The step of first metal decking 10 is brazed with metal beehive core material 5;
The step of first metal decking 10 is brazed with ceramic wafer 1.
In the following, specifically being retouched to the preparation method of ceramic metal composite plate of the present invention by illustrative embodiment
It states.It should be appreciated, however, that in the case where not being further discussed below, element, structure and features in an embodiment also may be used
To be advantageously incorporated into other embodiment.
Embodiment one
Prepare foil, selects foil for aluminium foil, foil is carried out in supersonic wave cleaning machine with aluminum products scavenger specially
Surface clean, to remove the greasy dirt and oxidation film of foil;
Solder coats foil, and Al-Si soldering paste is coated in aluminium foil surface according to preset spacing;
The laminated aluminium foil for coating Al-Si soldering paste is carried out lamination, misplaced up and down by foil lamination;
Foil diffusion welding (DW) is diffused weldering soldering under nitrogen or argon, and temperature is 580-620 DEG C, and pressure is
0.5-5MPa, time 30-60min;
It cools down and cuts foil, be cooled to 450 DEG C or so and come out of the stove, continue cool to room temperature and cut by size requirement;
It is spare to be drawn into metal beehive core material 9;
Prepare the first metal decking 10 and the second metal decking 12, selects the first metal decking 10 and the second metal decking 12
For aluminium alloy plate, surface clean is carried out to aluminium alloy plate in supersonic wave cleaning machine with aluminum products scavenger specially, to remove aluminium
The greasy dirt and oxidation film of alloy sheets;
To ceramic wafer 1 surface preparation, including oil removing, polishing, sandblasting etc.;
Metalized is carried out to 1 surface of ceramic wafer;
Operation applies solder machine, by Zn-Al paste applications connecing in aluminium alloy plate and the above-mentioned metal beehive core material prepared
In contacting surface;
Solder coated ceramic plate 1, operation applies solder machine, by Zn-Al paste applications in ceramic wafer 1 and the first metal decking 10
Connection side on, paste application thickness be 0.05-0.5mm;
By the above-mentioned metal beehive core material 9 prepared and the first metal decking 10, the second metal decking 12 and 1 group of ceramic wafer
Sandwich formats are synthesized, are fixed with heat resisting steel fixture;
Under nitrogen protection by metal beehive core material and the first metal decking 10 and the second metal decking 12, and by first
Metal decking 10 is brazed with ceramic wafer 1, and temperature is 400-450 DEG C;
After cooling is come out of the stove, ceramic metal composite plate finished product as shown in Figure 1 is obtained.
Embodiment two
Prepare foil, selects foil for aluminium foil, foil is carried out in supersonic wave cleaning machine with aluminum products scavenger specially
Surface clean, to remove the greasy dirt and oxidation film of foil;
Solder coats foil, and Al-Si soldering paste is coated in aluminium foil surface according to preset spacing;
The laminated aluminium foil for coating Al-Si soldering paste is carried out lamination, misplaced up and down by foil lamination;
Foil diffusion welding (DW) is diffused weldering soldering under nitrogen or argon, and temperature is 580-620 DEG C, and pressure is
0.5-5MPa, time 30-60min;
It cools down and cuts foil, be cooled to 450 DEG C or less and come out of the stove, continue cool to room temperature and cut by size requirement;
It is spare to be drawn into metal beehive core material 9;
Prepare the second metal decking 12, it is aluminium alloy plate to select the second metal decking 12, is existed with aluminum products scavenger specially
Surface clean is carried out to aluminium alloy plate in supersonic wave cleaning machine, to remove the greasy dirt and oxidation film of aluminium alloy plate;
To ceramic wafer 1 surface preparation, including oil removing, polishing, sandblasting etc.;
Metalized is carried out to 1 surface of ceramic wafer;
Operation applies solder machine, by Al-Si paste applications connecing in aluminium alloy plate and the above-mentioned metal beehive core material prepared
In contacting surface;
Solder coated ceramic plate 1, operation applies solder machine, by Al-Si paste applications in ceramic wafer 1 and the first metal decking 10
Connection side on, paste application thickness be 0.05-0.5mm;
The above-mentioned metal beehive core material 9 prepared and the second metal decking 12 and ceramic wafer 1 are combined into sandwich formats,
It is fixed with heat resisting steel fixture;
Under nitrogen protection by metal beehive core material 9 and the second metal decking 12, and by metal beehive core material 9 with ceramics
Plate 1 is brazed, and temperature is 450 DEG C or more;
After cooling is come out of the stove, ceramic metal composite plate finished product as shown in Figure 5 is obtained.
Claims (10)
1. a kind of ceramic metal composite plate, it is characterised in that:Including ceramic wafer (1) and metal layer (2), ceramic wafer (1) and metal
It is fixedly connected by soldering between layer (2), metal layer (2) has multiple conduits (3), has between ceramic wafer (1) and metal layer (2)
There is the first solder layer (4), ceramic wafer (1) and metal layer (2) are fixed together.
2. ceramic metal composite plate according to claim 1, it is characterised in that:The metal layer (2) is metal porous layer
(5), metal porous layer (5) close to ceramic wafer (1) side have multiple conduits (3), with ceramic wafer (1) and the first solder layer
(4) multiple hole portions (6) are formed between.
3. ceramic metal composite plate according to claim 2, it is characterised in that:The metal porous layer (5) includes at least
There are multiple lug bosses (8), the conduit (3) to be formed between adjacent projections (8) for one sheet metal (7), sheet metal (7).
4. ceramic metal composite plate according to claim 3, it is characterised in that:The lug boss (8) is the sheet metal
(7) it is molded through deformation.
5. ceramic metal composite plate according to claim 4, it is characterised in that:The sheet metal (7) is multiple, Duo Gejin
Belong to the setting of piece (7) lamination, the lug boss (8) of adjacent metal piece (7) is fixedly connected.
6. ceramic metal composite plate according to claim 5, it is characterised in that:The conduit (3) is from the ceramic wafer (1)
Extend to the direction far from ceramic wafer (1).
7. ceramic metal composite plate according to claim 6, it is characterised in that:The metal porous layer (5) is metal bee
Nest core material (9), first solder layer (4) correspond to metal beehive core material (9) in netted.
8. ceramic metal composite plate according to claim 4 or 5, it is characterised in that:The metal porous layer (5) is ripple
Plate, corrugated sheet or dimple plate are one kind of.
9. a kind of preparation method of ceramic metal composite plate, is used to prepare ceramic metal composite plate, the ceramic clad plate includes
Ceramic wafer (1) and metal layer (2), metal layer (2) have multiple conduits (3), which is characterized in that the preparation method includes following
Step:
The step of to ceramic wafer (1) surface preparation;
The step of ceramic wafer (1) surface metalation is handled;
The step of solder coated ceramic plate (1);
The step of preparing metal layer (2);
The step of ceramic wafer (1) is brazed with metal layer (2), the pricker in vacuum drying oven or atmosphere furnace by ceramic wafer (1) and metal layer (2)
Weldering.
10. the preparation method of ceramic metal composite plate according to claim 9, the metal layer (2) is metal honeycomb core
Material (9), which is characterized in that the step of preparing metal layer (2) includes the following steps:
The step of preparing foil;
Solder coats the step of foil;
The step of foil lamination;
The step of foil diffusion welding (DW), heats multilayer foil pressurization in vacuum drying oven or atmosphere furnace, wherein heating is so that adjacent foil
Solder between material is in solid-liquid admixture, and pressurization between adjacent foil so that be tightly pressed together, until the solder between adjacent foil
Fix adjacent foil in a manner of atoms permeating;
Stretching forms the step of metal beehive core material (4).
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| CN201810824632.8A CN108688244A (en) | 2018-07-25 | 2018-07-25 | Ceramic metal composite plate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810824632.8A CN108688244A (en) | 2018-07-25 | 2018-07-25 | Ceramic metal composite plate and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584444A (en) * | 2020-05-12 | 2020-08-25 | 京东方科技集团股份有限公司 | Display module and display device |
| CN113000960A (en) * | 2021-03-17 | 2021-06-22 | 哈尔滨工业大学 | Method for connecting ceramic radome and metal connecting ring |
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| JPH0226730A (en) * | 1988-07-18 | 1990-01-29 | Sumitomo Light Metal Ind Ltd | Honeycomb panel |
| CN101861647A (en) * | 2007-11-19 | 2010-10-13 | 三菱综合材料株式会社 | Process for producing substrate for power module, substrate for power module, and power module |
| CN107214388A (en) * | 2017-07-28 | 2017-09-29 | 镇江市天通新材料科技有限公司 | A kind of preparation method of aluminum honeycomb panel |
| CN208558467U (en) * | 2018-07-25 | 2019-03-01 | 青岛归来科技有限公司 | Ceramic metal composite plate |
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2018
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226730A (en) * | 1988-07-18 | 1990-01-29 | Sumitomo Light Metal Ind Ltd | Honeycomb panel |
| CN101861647A (en) * | 2007-11-19 | 2010-10-13 | 三菱综合材料株式会社 | Process for producing substrate for power module, substrate for power module, and power module |
| CN107214388A (en) * | 2017-07-28 | 2017-09-29 | 镇江市天通新材料科技有限公司 | A kind of preparation method of aluminum honeycomb panel |
| CN208558467U (en) * | 2018-07-25 | 2019-03-01 | 青岛归来科技有限公司 | Ceramic metal composite plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111584444A (en) * | 2020-05-12 | 2020-08-25 | 京东方科技集团股份有限公司 | Display module and display device |
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| CN113000960A (en) * | 2021-03-17 | 2021-06-22 | 哈尔滨工业大学 | Method for connecting ceramic radome and metal connecting ring |
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