CN108682474B - A kind of high flowing carrier band PC/PE alloy conductive plastics and preparation method thereof - Google Patents

A kind of high flowing carrier band PC/PE alloy conductive plastics and preparation method thereof Download PDF

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Publication number
CN108682474B
CN108682474B CN201810367890.8A CN201810367890A CN108682474B CN 108682474 B CN108682474 B CN 108682474B CN 201810367890 A CN201810367890 A CN 201810367890A CN 108682474 B CN108682474 B CN 108682474B
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conductive
carrier band
plastic
conductive plastics
flowing carrier
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CN108682474A (en
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李扬福
李铁志
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JIANGMEN SANSHUO NEW MATERIAL CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract

The invention discloses a kind of high flowing carrier band PC/PE alloy conductive plastics, including following components in percentage by weight: the Conductive plastic masterbatch of 50-60%, the PC plastic matrix of 37-46% and 3-6% compatilizer, wherein, the Conductive plastic masterbatch comprises the following raw materials by weight percent: the conductive additive of 38-48%, the PE plastic substrate of 48-58%, the antioxidant of 0.5-2% and the dispersing agent of 0.5-4%.Carrier band of the invention is good with PC/PE alloy conductive plastic flow property, lower than import conduction PC masterbatch processing temperature, and the requirement to process equipment is lower, easy to process, and can be added with large scale, while cost is relatively low, and cost performance is high, has good mechanical property.

Description

A kind of high flowing carrier band PC/PE alloy conductive plastics and preparation method thereof
Technical field
The present invention relates to conductive plastic object technical fields, relate more specifically to a kind of high flowing carrier band PC/PE alloy Conductive plastics and preparation method thereof.
Background technique
Conductive plastics is to mix resin and conductive materials, the functional macromolecule processed with the processing method of plastics Material.Conductive plastics is mainly used in the anti-electromagnetism screen of antisatic additive, computer, smart window, light emitting diode, solar energy Fields, the application prospects such as battery, mobile phone, micro-television screen are very extensive.
Currently, the domestic conductive PC plastic processing temperature of the electronic packaging materials for sheet material carrier band is high, melt viscosity Greatly, production and processing is more difficult, basic structure are as follows: plastic material+conductive black+auxiliary agent.Domestic conduction PC plastic, melt are viscous Degree is high, and in production and processing, screw torque is big, and equipment loss is fast.In addition, external existing conductive PC plastic masterbatch generally cannot It adds, is at high price and more demanding to process equipment and processing conditions.
Therefore, it is necessary to develop a kind of mobility is good, processing temperature is low, and the requirement to process equipment is lower, easy to process Carrier band uses conductive plastics.
Summary of the invention
That the object of the present invention is to provide a kind of mobility is good, processing temperature is low, the requirement to process equipment is lower, be easy to plus The carrier band of work PC/PE alloy conductive plastics.
The technical solution adopted by the present invention is that: a kind of high flowing carrier band PC/PE alloy conductive plastics, including following weight The component of percentage: the Conductive plastic masterbatch of 50-60%, the PC plastic matrix of 37-46% and 3-6% compatilizer, wherein described Conductive plastic masterbatch comprises the following raw materials by weight percent: the PE plastics base of the conductive additive of 38-48%, 48-58% The dispersing agent of body, the antioxidant of 0.5-2% and 0.5-4%.
Preferably, the PE plastic substrate is at least one of LDPE, MDPE, HDPE and LLDPE.
Preferably, the conductive additive is at least one of conductive black, electrically conductive graphite and conductive carbon fibres.It is preferred that , conductive additive is selected from the conductive additive of Cabot, Degussa and Colombia's production, with excellent electric conductivity and Mobility.
Preferably, the antioxidant be 1010,168,1076,242,626, at least one of B225 and B215.
Preferably, the dispersing agent is ethylene bis stearamide, PE wax, EVA wax, triethyl group hexyl phosphoric acid, dodecyl At least one of sodium sulphate, silicone powder, methyl anyl alcohol, polyacrylamide, oxidized polyethylene wax and fatty acid polyethylene glycol ester.
Preferably, the compatilizer is SBS, SEBS, maleic anhydride-g-SBS, Maleic anhydride-containg polyethylene, MBS and height At least one of rubber powder.Compatilizer can make each plastic fraction mixing of system mutual in the case where not reducing system electric conductivity It is molten and reach preferable comprehensive mechanical property.
Preferably, the PC plastic matrix is at least one of injection grade PC and extrusion grade PC.
The present invention also provides the preparation methods that high flowing carrier band uses PC/PE alloy conductive plastics, comprising the following steps:
1) be warming up to 90-100 DEG C, by conductive additive and dispersant, add PE plastic substrate and antioxidant after It is continuous to be mixed to get mixture, then by mixture melting extrusion, obtain Conductive plastic masterbatch;
2) Conductive plastic masterbatch is mixed with PC plastic matrix, compatilizer is added, remelted extruding pelletization flows to get to high Dynamic load band PC/PE alloy conductive plastics.
Preferably, in step 1), conductive additive and dispersing agent are turned in high speed mixer with 500-800r/min Speed mixing 5-6min;In step 2), by Conductive plastic masterbatch and PC plastic matrix with 200-400r/min in low speed batch mixer Revolving speed mixing 5-10min.
Preferably, in step 1), control condition when mixture melting extrusion are as follows: 160 DEG C -200 DEG C of temperature, twin-screw extrusion Engine speed is 350rpm;In step 2), control condition when melting extrusion is granulated are as follows: 210 DEG C -250 DEG C of temperature, twin-screw extrusion Engine speed is 400rpm.
More specifically, the high flowing carrier band preparation method of PC/PE alloy conductive plastics, comprising the following steps:
1) high mixer is warming up to 90-100 DEG C, it in proportion will be sufficiently mixed in conductive additive, dispersing agent high speed mixer 5-6min is closed, adds PE plastic substrate, antioxidant continuess to mix 5-6min, then mixture is placed in melt in extruder and is squeezed Out, Conductive plastic masterbatch is obtained;
2) Conductive plastic masterbatch, PC plastic matrix and compatilizer are placed in low speed batch mixer to be uniformly mixed, then are placed in extrusion Melting extrusion is granulated in machine.
Preparation process of the present invention be initially formed conductive plastic base particle (containing PE plastic substrate), then by conductive plastic base particle with The mixing of PC plastic matrix prepares the functional composite material with island structure by double-screw extruding pelletizing;This island structure Mainly conductive additive is preferentially scattered in PE matrix and prepares conductive plastic base particle, conducting masterbatch is further walked as dispersed phase It is scattered in PC plastic, forms island structure, this improves the content of conductive material indirectly, improves electric conductivity.
The preparation method can substantially reduce the additive amount of conductive filler and reach identical electric conductivity, while keep gained conductive PC/PE alloy plastic is lower than conductive PC plastic good fluidity, processing temperature, to reduce processing cost.
The beneficial effects of the present invention are: carrier band of the invention is good with PC/PE alloy conductive plastic flow property, than import conduction PC masterbatch processing temperature is low, and the requirement to process equipment is lower, easy to process, and can be added with large scale, while cost is relatively low, Cost performance is high, has good mechanical property.
Specific embodiment
A kind of high flowing carrier band PC/PE alloy conductive plastics, including following components in percentage by weight: 50-60%'s The PC plastic matrix and 3-6% compatilizer of Conductive plastic masterbatch, 37-46%, wherein the Conductive plastic masterbatch is by following weight The raw material of percentage forms: the conductive additive of 38-48%, the PE plastic substrate of 48-58%, 0.5-2% antioxidant and The dispersing agent of 0.5-4%.
The height flowing carrier band preparation method of PC/PE alloy conductive plastics, comprising the following steps:
1) be warming up to 90-100 DEG C, by conductive additive and dispersant, add PE plastic substrate and antioxidant after It is continuous to be mixed to get mixture, then by mixture melting extrusion, obtain Conductive plastic masterbatch;
2) Conductive plastic masterbatch is mixed with PC plastic matrix, compatilizer is added, remelted extruding pelletization flows to get to high Dynamic load band PC/PE alloy conductive plastics.
Formula of the invention is described further combined with specific embodiments below.
Embodiment 1
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition are as follows:
Table 1: the carrier band formula composition of PC/PE alloy conductive plastics
Raw material Mass percentage
Conductive plastic masterbatch 60%
Injection grade PC plastic matrix 37%
Compatilizer SEBS 3%
The formula composition of Conductive plastic masterbatch is as follows:
Table 2: the formula composition of conducting masterbatch
Raw material Mass percentage
Conductive black 38%
LDPE plastic substrate 58%
Antioxidant 1010 1%
Dispersing agent fatty acid polyethylene glycol ester 3%
The height flowing carrier band preparation method of PC/PE alloy conductive plastics, comprising the following steps:
1) it is warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersing agent (fatty acid polyethylene glycol ester) in height With the revolving speed mixing 5-6min of 500-800r/min in fast batch mixer, PE plastic substrate (LDPE) and antioxidant (1010) are added It continuess to mix to obtain mixture, then by mixture melting extrusion, obtains Conductive plastic masterbatch;
2) by Conductive plastic masterbatch and PC plastic matrix in low speed batch mixer with the revolving speed mixing 5- of 200-400r/min 10min mixing, is added compatilizer (SEBS), and remelted extruding pelletization is moulded to get to high flowing carrier band PC/PE alloy conductive Material.
In step 1), control condition when mixture melting extrusion are as follows: 160 DEG C -200 DEG C of temperature, twin-screw extrusion host turns Speed is 350rpm;In step 2), control condition when melting extrusion is granulated are as follows: 210 DEG C -250 DEG C of temperature, twin-screw extrusion host turns Speed is 400rpm.
Embodiment 2
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition are as follows:
Table 3: the carrier band formula composition of PC/PE alloy conductive plastics
The formula composition of Conductive plastic masterbatch is as follows:
Table 4: the formula composition of conducting masterbatch
Raw material Mass percentage
Electrically conductive graphite 43.5%
MDPE plastic substrate 55%
Antioxidant 1076 1%
Dispersing agent EVA wax 0.5%
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Embodiment 3
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition are as follows:
Table 5: the carrier band formula composition of PC/PE alloy conductive plastics
Raw material Mass percentage
Conductive plastic masterbatch 54%
Injection grade PC plastic matrix 42.5%
Compatilizer SBS 3.5%
The formula composition of Conductive plastic masterbatch is as follows:
Table 6: the formula composition of conducting masterbatch
Raw material Mass percentage
Conductive black 44.5%
LLDPE plastic substrate 50%
Antioxidant B225 1.5%
Dispersing agent silicone powder 4%
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Embodiment 4
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition are as follows:
Table 7: the carrier band formula composition of PC/PE alloy conductive plastics
Raw material Mass percentage
Conductive plastic masterbatch 52%
Extrusion grade PC plastic matrix 42%
Compatilizer MBS 6%
The formula composition of Conductive plastic masterbatch is as follows:
Table 8: the formula composition of conducting masterbatch
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Embodiment 5:
A kind of high flowing carrier band PC/PE alloy conductive plastics, formula composition are as follows:
Table 9: the carrier band formula composition of PC/PE alloy conductive plastics
Raw material Mass percentage
Conductive plastic masterbatch 50%
Injection grade PC plastic matrix 46%
Compatilizer SBS 4%
The formula composition of Conductive plastic masterbatch is as follows:
Table 10: the formula composition of conducting masterbatch
Raw material Mass percentage
Conductive black 48%
HDPE plastic matrix 51%
Antioxidant B215 0.5%
Dispersing agent oxidized polyethylene wax 0.5%
The preparation method of height flowing carrier band PC/PE alloy conductive plastics is identical as the preparation method of embodiment 1.
Comparative example 1
A kind of PC conductive plastics, formula composition are as follows:
The formula composition of table 11:PC conductive plastics
Raw material Mass percentage
Conductive plastic masterbatch 54%
Injection grade PC plastic matrix 42.5%
Compatilizer SBS 3.5%
The formula composition of Conductive plastic masterbatch is as follows:
Table 12: the formula composition of conducting masterbatch
Raw material Mass percentage
Conductive black 44.5%
Injection grade PC plastic matrix 50%
Antioxidant B225 1.5%
Dispersing agent silicone powder 4%
The preparation method of PC conductive plastics, comprising the following steps:
1) it is warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersing agent (silicone powder) in high speed mixer With the revolving speed mixing 5-6min of 500-800r/min, adds PC plastic matrix and antioxidant (B225) is continuesd to mix and mixed Object, then by mixture melting extrusion, obtain Conductive plastic masterbatch;
2) by Conductive plastic masterbatch and PC plastic matrix in low speed batch mixer with the revolving speed mixing 5- of 200-400r/min 10min mixing, be added compatilizer (SBS), remelted extruding pelletization to get arrive PC conductive plastics.
In step 1), control condition when mixture melting extrusion are as follows: 160 DEG C -200 DEG C of temperature, twin-screw extrusion host turns Speed is 350rpm;In step 2), control condition when melting extrusion is granulated are as follows: 210 DEG C -250 DEG C of temperature, twin-screw extrusion host turns Speed is 400rpm.
Comparative example 2
A kind of PE conductive plastics, formula composition are as follows:
The formula composition of table 13:PE conductive plastics
Raw material Mass percentage
Conductive plastic masterbatch 54%
LLDPE plastic substrate 42.5%
Compatilizer SBS 3.5%
The formula composition of Conductive plastic masterbatch is as follows:
Table 14: the formula composition of conducting masterbatch
Raw material Mass percentage
Conductive black 44.5%
LLDPE plastic substrate 50%
Antioxidant B225 1.5%
Dispersing agent silicone powder 4%
The preparation method of PE conductive plastics, comprising the following steps:
1) it is warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersing agent (silicone powder) in high speed mixer With the revolving speed mixing 5-6min of 500-800r/min, adds PE plastic substrate (LLDPE) and antioxidant (B225) continuess to mix Mixture is obtained, then by mixture melting extrusion, obtains Conductive plastic masterbatch;
2) Conductive plastic masterbatch is mixed with LLDPE plastic substrate in low speed batch mixer with the revolving speed of 200-400r/min Close 5-10min mixing, be added compatilizer (SBS), remelted extruding pelletization to get arrive PE conductive plastics.
In step 1), control condition when mixture melting extrusion are as follows: 160 DEG C -200 DEG C of temperature, twin-screw extrusion host turns Speed is 350rpm;In step 2), control condition when melting extrusion is granulated are as follows: 210 DEG C -250 DEG C of temperature, twin-screw extrusion host turns Speed is 400rpm.
Comparative example 3
A kind of PC/PE alloy conductive plastics, formula composition are as follows:
The formula composition of table 15:PC/PE alloy conductive plastics
Raw material Mass percentage
Conductive plastic masterbatch 54%
Injection grade PC plastic matrix 42.5%
Compatilizer SBS 3.5%
The formula composition of Conductive plastic masterbatch is as follows:
Table 16: the formula composition of conducting masterbatch
Raw material Mass percentage
Conductive black 44.5%
LLDPE plastic substrate 50%
Antioxidant B225 1.5%
Dispersing agent silicone powder 4%
PC/PE alloy conductive plastics the preparation method comprises the following steps:
Be warming up to 90-100 DEG C, by conductive additive (conductive black) and dispersing agent (silicone powder) in high speed mixer with The revolving speed mixing 5-6min of 500-800r/min, adds PE plastic substrate (LLDPE) and antioxidant (B225) continuess to mix, after Continuous addition PC plastic matrix and compatilizer (SBS) obtain mixture, and melting extrusion is granulated to arrive PC/PE alloy conductive plastics.
Wherein, control condition when melting extrusion is granulated are as follows: 210 DEG C -250 DEG C of temperature, twin-screw extrusion engine speed is 400rpm。
Conductive modeling prepared by the embodiment 1-5 high flowing carrier band PC/PE alloy conductive plastics prepared and comparative example 1-3 Material carries out performance detection, and acquired results are as shown in table 17.
The performance test results of the conductive plastics of the PC/PE alloy conductive plastics and comparative example 1-3 of 17 embodiment 1-5 of table
Mobility (230 DEG C/10kg) Processing temperature Resistance Cantilever beam impact strength (J/M)
Embodiment 1 1.65g/10min 210℃-250℃ 40-60Ω 15
Embodiment 2 1.22g/10min 210℃-250℃ 35-50Ω 12
Embodiment 3 1.31g/10min 210℃-250℃ 30-40Ω 9
Embodiment 4 1.05g/10min 210℃-250℃ 25-35Ω 8
Embodiment 5 1.16g/10min 210℃-250℃ 30-45Ω 10
Comparative example 1 0.1g/10min 260℃-300℃ 800-1000Ω 2
Comparative example 2 3.22g/10min 160℃-200℃ 10000-20000Ω 80
Comparative example 3 0.92g/10min 230℃-255℃ 60-80Ω 7
The PC conduction carrier band that the carrier band of embodiment 1-5 is respectively produced with the formula composition of PC/PE alloy conductive plastics is used Particle measures products obtained therefrom after PC plastic material production carrier sheet (thickness is between 0.25mm-0.4mm) for adding 15-30% Sheet resistance 104-106Between Ω, the smooth non-crystal point in surface, good combination property, product effect is used conductive close to import carrier band PC can reduce 20-30% cost.
When carrier sheet produces, when than commercially available carrier band with conduction PC, temperature can be reduced to 210~250 DEG C;Same processing item Under part (host 200RPM), the low 15~30A of electric current.
And the product of comparative example 1-3:
Comparative example 1: system melt viscosity is high, poor fluidity, and is difficult to disperse, poorly conductive.
Comparative example 2: good fluidity, processing temperature is lower, and cantilever beam impact strength is also very high, but resistance is very big, uncomfortable Share the conductive carrier band particle of work.
Comparative example 3: mobility is poor than the present invention, and electric conductivity is also poorer than of the invention, and when processing will reach identical surface Resistance, client need more addition more products, then system liquidity and product impact strength can be caused to be deteriorated, influence the entirety of product Performance.

Claims (9)

1. a kind of high flowing carrier band PC/PE alloy conductive plastics, which is characterized in that by following components in percentage by weight group At: the Conductive plastic masterbatch of 50-60%, the PC plastic matrix of 37-46% and 3-6% compatilizer, wherein the conductive plastics is female Material comprises the following raw materials by weight percent: PE plastic substrate, the 0.5-2% of the conductive additive of 38-48%, 48-58% Antioxidant and 0.5-4% dispersing agent;
The high flowing carrier band preparation method of PC/PE alloy conductive plastics, comprising the following steps:
1) it is warming up to 90-100 DEG C, by conductive additive and dispersant, PE plastic substrate is added and antioxidant continues to mix Conjunction obtains mixture, then by mixture melting extrusion, obtains Conductive plastic masterbatch;
2) Conductive plastic masterbatch is mixed with PC plastic matrix, compatilizer is added, remelted extruding pelletization carries to get to high flowing Band PC/PE alloy conductive plastics.
2. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the PE plastics Matrix is at least one of LDPE, MDPE, HDPE and LLDPE.
3. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the conduction adds Adding agent is at least one of conductive black, electrically conductive graphite and conductive carbon fibres.
4. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the antioxidant For 1010,168,1076,242,626, at least one of B225 and B215.
5. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the dispersing agent For ethylene bis stearamide, PE wax, EVA wax, triethyl group hexyl phosphoric acid, lauryl sodium sulfate, silicone powder, methyl anyl alcohol, gather At least one of acrylamide, oxidized polyethylene wax and fatty acid polyethylene glycol ester.
6. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the compatilizer For at least one of SBS, SEBS, maleic anhydride-g-SBS, Maleic anhydride-containg polyethylene, MBS and high glue powder.
7. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that the PC plastic Matrix is at least one of injection grade PC and extrusion grade PC.
8. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that, will in step 1) Conductive additive and dispersing agent are in high speed mixer with the revolving speed mixing 5-6min of 500-800r/min;In step 2), it will lead Electric plastic matrix and PC plastic matrix are in low speed batch mixer with the revolving speed mixing 5-10min of 200-400r/min.
9. high flowing carrier band PC/PE alloy conductive plastics according to claim 1, which is characterized in that in step 1), mix Control condition when polymer melt squeezes out are as follows: 160 DEG C -200 DEG C of temperature, twin-screw extrusion engine speed is 350rpm;In step 2), Control condition when melting extrusion is granulated are as follows: 210 DEG C -250 DEG C of temperature, twin-screw extrusion engine speed is 400rpm.
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CN113308104A (en) * 2021-06-01 2021-08-27 江苏天奈科技股份有限公司 High-conductivity plastic master batch, preparation method thereof and conductive plastic particles

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CN104292607A (en) * 2014-10-22 2015-01-21 东莞市德诚塑化科技有限公司 Ultralow-resistance conductive plastic and preparation method thereof
CN106366395A (en) * 2015-07-20 2017-02-01 江苏爱福特科技开发有限公司 Composite electric conduction plastic and preparation method thereof
CN107200910A (en) * 2017-06-30 2017-09-26 徐州市耐力高分子科技有限公司 A kind of high temperature resistant conductive plastics and preparation method thereof

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Publication number Priority date Publication date Assignee Title
CN102286166A (en) * 2011-08-25 2011-12-21 江门市三硕新材料有限公司 Anti-adhesion electroconductive plastic for film blowing
CN103351564A (en) * 2013-04-02 2013-10-16 江门职业技术学院 Electric conduction polystyrene plastic for carrier tape, and preparation method thereof
CN104292607A (en) * 2014-10-22 2015-01-21 东莞市德诚塑化科技有限公司 Ultralow-resistance conductive plastic and preparation method thereof
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