CN108680800A - A kind of ESD test devices - Google Patents
A kind of ESD test devices Download PDFInfo
- Publication number
- CN108680800A CN108680800A CN201810218060.9A CN201810218060A CN108680800A CN 108680800 A CN108680800 A CN 108680800A CN 201810218060 A CN201810218060 A CN 201810218060A CN 108680800 A CN108680800 A CN 108680800A
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- Prior art keywords
- pins
- electrically connected
- esd
- connection position
- test devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to display technology field, the ESD test devices include measurement jig ontology, and the measurement jig ontology is equipped with several test positions, and the test position is electrically connected with electrical connection component, and the electrical connection component with the IC pins for being electrically connected.When needing the IC pins to bonding on shielding body to carry out ESD detections, it only needs to be detected the test position on measurement jig ontology the ESD detections that can be realized to IC pins, it avoids traditional hit by static gun and shields body FPC connector, the more a pins of FPC are hit simultaneously caused by static gun pipette tips are larger, influence the problem of IC pins detect.ESD test devices provided by the invention effectively can carry out ESD detections to IC pins of the bonding on screen body, and reliability is high, and use is more convenient, and structure is also relatively simple.
Description
Technical field
The present invention relates to display technology fields, and in particular to a kind of ESD test devices.
Background technology
Static discharge (Electro-Static discharge, ESD) refers to when two objects with different electrostatic potentials
It is close to each other to certain degree or contact when, electrostatic is banished suddenly from an object to the phenomenon on another object.The generation of electrostatic
It is inevitable in the industrial production, and be easy to cause various harm, such as cause failure or the malfunction of electronic equipment,
Cause electromagnetic interference；Puncture integrated circuit and accurate electronic component, or promote component ageing, reduces production yield rate etc..
Especially in display technology field, since display screen substrate is mostly based on the glass material of insulation, electrostatic disappears
Except speed is slower, substrate surface is easy a large amount of electrostatic charge of accumulation, there are larger security risk, certainly will influence the entirety for shielding body
Performance.Therefore, the requirement of the anti-ESD abilities to shielding body is higher and higher, i.e. the anti-ESD reliability tests requirement to IC on display screen
It is higher and higher.Currently, the ESD test methods to IC mainly directly test IC pins, but the test method is uncomfortable
For being tested with the IC pins after screen body bonding (bonding).Also a kind of test method is using static gun strike screen body FPC
Connector be easy to cause multiple pins on FPC connector to carry out IC ESD tests, but since static gun pipette tips are larger
It is hit simultaneously, is unfavorable for being detected each pins of IC.
To sum up, how to carry out ESD tests to IC of the bonding on screen body is this field urgent problem.
Invention content
For this purpose, the technical problem to be solved by the present invention is to how carry out ESD tests to IC of the bonding on screen body.
In order to solve the above technical problems, the technical solution adopted by the present invention is as follows：
The present invention provides a kind of ESD test devices, including measurement jig ontology, if the measurement jig ontology is equipped with
Dry test position, the test position are electrically connected with electrical connection component, and the electrical connection component with the IC pins for being electrically connected
It connects.
Optionally, the electrical connection component includes the first inner lead being arranged in the measurement jig ontology.
Optionally, be additionally provided with the first default connection position on the measurement jig ontology, the first default connection position with
The electrical connection component electrical connection；The first default connection position with the IC pins for being electrically connected.
Optionally, the electrical connection component further includes pinboard, the pinboard and the described first default connection position electricity
Connection；The pinboard with the IC pins for being electrically connected.
Optionally, the second default connection position, the second default connection position and described first are configured on the pinboard
Default connection position electrical connection；The second default connection position with the IC pins for being electrically connected.
Optionally, the electrical connection component further includes flexible PCB, the flexible PCB and pinboard electricity
Connection；The flexible PCB with the IC pins for being electrically connected.
Optionally, the described first default connection position is arranged in a one-to-one correspondence with the described second default connection position.
Optionally, the described first default connection position is electrically connected with the described second default connection position by conducting connecting part.
Optionally, each test column pitch is more than or equal to 5mm.
Technical scheme of the present invention has the following advantages that：
1, ESD test devices provided by the invention, the setting test position on measurement jig ontology, then pass through electric connection group
Part will be tested position and is electrically connected with IC pin of the bonding on screen body.ESD is carried out when needing the IC pins to bonding on shielding body
When detection, it is only necessary to the ESD detections that can be realized to IC pins are detected to the test position on measurement jig ontology, without logical
Static gun strike screen body FPC connector is crossed, the more a pins of FPC caused by static gun pipette tips are larger is avoided while being beaten
The problem of hitting, influencing the detection of IC pins.ESD test devices provided by the invention can effectively to bonding screen body on IC pins into
Row ESD detections, and reliability is high, and use is more convenient, and structure is also relatively simple.
2, the ESD test devices of offer of the invention are electrically connected the first inner lead that part includes measurement jig ontology,
Be electrically connected to IC pins by position is tested by the first inner lead of jig body, be conducive to by jig body test position with
IC pin of the bonding on screen body maintains a certain distance, and when avoiding detection, static gun is directly hit onto IC pins.
3, ESD test devices provided by the invention, first inner lead one end connecting test position of measurement jig ontology, separately
The first default connection position in the connecting test jig body of one end, the first default connection position are connected to bonding on screen body simultaneously
IC pins.When static gun hits test position, electric signal is transmitted to first by the first inner lead of measurement jig ontology and presets
Connection position passes to IC pins via the first default connection position.Since each test position all has the corresponding first default company
Position is connect, the first default connection position has corresponding IC pins again, therefore tests position and corresponded with IC pins, is conducive to IC
Pin is targetedly detected.
4, ESD test devices provided by the invention, by pinboard by the first default connection position on measurement jig ontology
It is electrically connected with IC pin of the bonding on screen body, the setting of pinboard contributes between the first default connection position and IC pins
Connection, is conducive to the transmission of electric signal.
5, ESD test devices provided by the invention, test column pitch are more than or equal to 5mm, and the spacing setting for testing position is existed
Within the scope of this, be conducive to keep the safe distance between each test position, to both sides when avoiding static gun strike is single from testing position
Test position interfere, to improve the accuracy and reliability of the ESD test devices.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of ESD test devices provided by the invention；
Reference numeral：
1- measurement jig ontologies；11- tests position；12- first presets connection position；
The first inner leads of 21-；22- pinboards；The second inner leads of 221-；222- second presets connection position；23- is conductive
Connector；24- flexible PCBs；
3- screen bodies；31-IC pins.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
The every other embodiment that personnel are obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for description purposes only, and is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be electrical connection to be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the connection inside two elements, can be wirelessly connected, can also be wired connection.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
As long as in addition, technical characteristic involved in invention described below different embodiments non-structure each other
It can be combined with each other at conflict.
Embodiment
The embodiment of the present invention provides a kind of ESD test devices, as shown in Figure 1, including measurement jig ontology 1, measurement jig
Ontology 1 is equipped with several test positions 11, and test position 11 is electrically connected with electrical connection component, and electrical connection component with bonding for existing
The IC pins 31 shielded on body 3 are electrically connected.Wherein, measurement jig ontology 1 is made of bakelite material, and test position 11 is that setting is being tested
Metal ESD striking points in jig body 1.
ESD test devices provided in this embodiment, the setting test position 11 on measurement jig ontology 1, then by electrically connecting
Connected components will be tested position 11 and are electrically connected with IC pin 31 of the bonding on screen body 3.When need to bonding screen body 3 on IC draw
When foot 31 carries out ESD detections, it is only necessary to be detected and be can be realized to IC pins 31 to the test position 11 on measurement jig ontology 1
ESD detection, avoid it is traditional by static gun hit screen body 3FPC connectors caused by static gun pipette tips are larger
The more a pins of FPC are hit simultaneously, to influence the problem of IC pins 31 detect.ESD test devices provided by the invention can have
It imitates and ESD detections is carried out to IC pin 31 of the bonding on screen body 3, and reliability is high, use is more convenient, and structure is also more simple
It is single.
As one embodiment of the present invention, the electrical connection component in the present embodiment includes being arranged in measurement jig sheet
First inner lead 21 of body 1.By the first inner lead 21 of jig body IC pins 31 are electrically connected to by position 11 is tested.The
On the one hand electric signal transmission is played the role of in the setting of one inner lead 21；On the other hand be conducive to the survey in jig body
IC pin 31 of examination position 11 and the bonding on shielding body 3 maintains a certain distance, and when detection, avoids static gun from directly hitting IC and draws
On foot 31, interfere.
As one embodiment of the present invention, it is default that first is additionally provided on the measurement jig ontology 1 in the present embodiment
Connection position 12, the first default connection position 12 are electrically connected with electrical connection component；First default connection position 12 is used for and IC pins 31
Electrical connection.Wherein, the first default connection position 12 is metal connection point.21 one end of the first inner lead of measurement jig ontology 1 connects
Test position 11, the first default connection position 12 in other end connecting test jig body 1 are connect, the first default connection position 12 connects simultaneously
Then IC pin 31 of the bonding on screen body 3.When static gun hits test position 11, electric signal passes through measurement jig ontology 1 the
One inner lead 21 is transmitted to the first default connection position 12, and IC pins 31 are passed to via the first default connection position 12.Due to every
A test position 11 all has the corresponding first default connection position 12, and the first default connection position 12 has corresponding IC pins again
31, therefore test position 11 and corresponded with IC pins 31, be conducive to targetedly be detected IC pins 31.
As one embodiment of the present invention, the electrical connection component in the present embodiment further includes pinboard 22, switching
Plate 22 is electrically connected with the first default connection position 12；Pinboard 22 with IC pins 31 for being electrically connected.The setting of pinboard 22 helps
Being bonded between the first default connection position 12 and IC pins 31, is conducive to the transmission of electric signal.
As one embodiment of the present invention, the second default connection position is configured on the pinboard 22 in the present embodiment
222, the second default connection position 222 is electrically connected with the first default connection position 12, meanwhile, the second default connection position 222 passes through switching
Second inner lead 221 of plate 22 is electrically connected with IC pins 31, and the second default connection position 222 is metal connection point.
In the present embodiment, the first default connection position 12 is arranged in a one-to-one correspondence with the second default connection position 222, and first is default
Connection position 12 is electrically connected with the second default connection position 222 by conducting connecting part 23.Wherein, conducting connecting part 23 is generally conducting wire
Or other electric connecting devices.
As one embodiment of the present invention, the electrical connection component in the present embodiment further includes flexible PCB 24,
Flexible PCB 24 is electrically connected with pinboard 22；Flexible PCB 24 with IC pins 31 for being electrically connected.Wherein, flexible PCB
24 one end weld together with IC of the bonding on screen body 3, and the other end is connected to by electric connector on pinboard 22, electrical connection
Device is connected by the second inner lead 221 of pinboard 22 with the second default connection position 222, and then via the first default connection position
12, the first inner lead 21 of measurement jig ontology 1 is connected with test position 11.
As one embodiment of the present invention, each 11 spacing of test position in the present embodiment is more than or equal to 5mm.It will survey
The spacing setting for trying position 11 in the range, is conducive to keep the safe distance between each test position 11, static gun is avoided to beat
The test position 11 of both sides is interfered when hitting single test position 11, to improve the accuracy of the ESD test devices and reliable
Property.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (9)
1. a kind of ESD test devices, which is characterized in that including measurement jig ontology (1), set on the measurement jig ontology (1)
There are several test positions (11), the test position (11) to be electrically connected with electrical connection component, the electrical connection component is used for and institute
State IC pins (31) electrical connection.
2. ESD test devices according to claim 1, which is characterized in that the electrical connection component includes being arranged in institute
State the first inner lead (21) of measurement jig ontology (1).
3. ESD test devices according to claim 2, which is characterized in that be additionally provided on the measurement jig ontology (1)
First default connection position (12), the first default connection position (12) are electrically connected with the electrical connection component；Described first is pre-
If connection position (12) with the IC pins (31) for being electrically connected.
4. ESD test devices according to claim 3, which is characterized in that the electrical connection component further includes pinboard
(22), the pinboard (22) is electrically connected with the described first default connection position (12)；The pinboard (22) is used for and the IC
Pin (31) is electrically connected.
5. ESD test devices according to claim 4, which is characterized in that pre- configured with second on the pinboard (22)
If connection position (222), the second default connection position (222) is electrically connected with the described first default connection position (12)；Described second
Default connection position (222) with the IC pins (31) for being electrically connected.
6. ESD test devices according to claim 5, which is characterized in that the electrical connection component further includes flexible electrical
Road plate (24), the flexible PCB (24) are electrically connected with the pinboard (22)；The flexible PCB (24) is used for and institute
State IC pins (31) electrical connection.
7. ESD test devices according to claim 5 or 6, which is characterized in that the first default connection position (12) and institute
The second default connection position (222) is stated to be arranged in a one-to-one correspondence.
8. according to claim 5-7 any one of them ESD test devices, which is characterized in that the first default connection position
(12) it is electrically connected by conducting connecting part (23) with the described second default connection position (222).
9. according to claim 1-8 any one of them ESD test devices, which is characterized in that between each test position (11)
Away from more than or equal to 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218060.9A CN108680800B (en) | 2018-03-16 | 2018-03-16 | ESD testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810218060.9A CN108680800B (en) | 2018-03-16 | 2018-03-16 | ESD testing arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108680800A true CN108680800A (en) | 2018-10-19 |
| CN108680800B CN108680800B (en) | 2021-10-29 |
Family
ID=63799264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810218060.9A Active CN108680800B (en) | 2018-03-16 | 2018-03-16 | ESD testing arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108680800B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951700A (en) * | 2019-02-15 | 2019-06-28 | 信利光电股份有限公司 | A kind of the ESD testing tool and test method of camera module |
| CN116963386A (en) * | 2023-09-21 | 2023-10-27 | 成都光创联科技有限公司 | Flexible circuit board, testing system of optical device and testing method of optical device |
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| CN206163048U (en) * | 2016-11-07 | 2017-05-10 | 厦门华联电子股份有限公司 | Intelligent LED nixie display of integrated IC encapsulation |
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| US7082676B2 (en) * | 2003-08-05 | 2006-08-01 | Qualitau, Inc. | Electrostatic discharge (ESD) tool for electronic device under test (DUT) boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951700A (en) * | 2019-02-15 | 2019-06-28 | 信利光电股份有限公司 | A kind of the ESD testing tool and test method of camera module |
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| CN116963386A (en) * | 2023-09-21 | 2023-10-27 | 成都光创联科技有限公司 | Flexible circuit board, testing system of optical device and testing method of optical device |
| CN116963386B (en) * | 2023-09-21 | 2024-01-05 | 成都光创联科技有限公司 | Flexible circuit board, testing system of optical device and testing method of optical device |
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| Publication number | Publication date |
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| CN108680800B (en) | 2021-10-29 |
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