CN108673769A - A kind of polysilicon slicing device - Google Patents
A kind of polysilicon slicing device Download PDFInfo
- Publication number
- CN108673769A CN108673769A CN201810534102.XA CN201810534102A CN108673769A CN 108673769 A CN108673769 A CN 108673769A CN 201810534102 A CN201810534102 A CN 201810534102A CN 108673769 A CN108673769 A CN 108673769A
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- Prior art keywords
- cutter
- sharpening
- cutting
- module
- seat
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The invention belongs to technical field of polysilicon production, specifically a kind of polysilicon slicing device, including cutter, cutting module, sharpening module and chip removal module, cutter are fixed on cutting module；Cutting module is sliced polysilicon for realizing the movement of cutter；Sharpening module is located above cutting module, sharpens module for realizing the precision of sharpening, the service life and guarantee cutting that improve cutter to cutter；Chip removal module is located inside cutter, and the clast near cutter for being discharged in cutting process, being conducive to the movement of cutter and improving the validity of cutting by chip removal module.The present invention is cut off silicon chip by the continuous cutting of much knives, and the impact force that silicon chip is subject to is small, small to the damage of silicon chip, while cutter can realize sharpening, improve cutting-tool's used life.
Description
Technical field
The invention belongs to technical field of polysilicon production, specifically a kind of polysilicon slicing device.
Background technology
Polysilicon is the main raw material(s) for manufacturing the products such as semiconductor devices and solar cell, can also prepare monocrystalline
Silicon, deep processed product are widely used in semi-conductor industry, as artificial intelligence, automatically control, information processing, opto-electronic conversion
The basic material of equal devices.Simultaneously as the appealing of energy crisis and low-carbon economy, the whole world is just utilizing in active development renewable
The energy.Solar energy due to its cleaning, it is safe, resourceful, it is most noticeable in regenerative resource.Utilize one kind of solar energy
Method is converted solar energy into electrical energy by photoelectric effect.It in silicon chip production process, needs to be sliced silicon chip, cut
It is uneven that the performance of silicon chip is influenced greatly, virtually to increase the difficulty of cutting.
Also occur in the prior art some silicon chips slice technical solution, such as application No. is 2017109672347 one
Item Chinese patent discloses a kind of bipolar transistor production silicon chip slicing device, includes mounting bracket etc.；The bottom of mounting bracket
Left side is provided with through-hole, and the top of mounting bracket is equipped with cutting mechanism, and the lower part of mounting bracket is equipped with pushing mechanism, pushing mechanism and cutting
Mechanism cooperates.The present invention is provided with a kind of bipolar transistor production silicon chip slicing device, provided with pushing mechanism and cuts
Cutting mill structure can make blade constantly to silicon body dicing, to complete the work being sliced to silicon body, be provided with belt pulley peace
Belt need not manually push silicon body so that silicon chip is cut more fine.Although the technical solution can realize to silicon chip into
Row slice, but the technical solution is using single blade is once cut off in such a way that, the requirement height to cutter, and in this scenario, knife
Tool cannot achieve sharpening, cause cutter life it is short, simultaneously as the impact force that is subject to of silicon chip is big, be easy to cause silicon chip and break
It splits.
In consideration of it, a kind of polysilicon slicing device of the present invention, is cut off silicon chip by the continuous cutting of much knives,
The impact force that silicon chip is subject to is small, small to the damage of silicon chip, while cutter can realize sharpening, improve cutting-tool's used life.
Invention content
In order to make up for the deficiencies of the prior art, the present invention proposes a kind of polysilicon slicing device, present invention is mainly used for
Realization is sliced silicon wafer.The present invention can by cutting module, sharpening module and cooperating with each other for chip removal module
Realize the continuous cutting to polysilicon, the impact force that polysilicon is subject to is small, cutter service life is long；Meanwhile the present invention can
It realizes cooling, cooling in cutting process, ensure that the performance of polysilicon.
The technical solution adopted by the present invention to solve the technical problems is：One kind of the present invention is more
Crystal silicon slicing device, including cutter, cutting module, sharpening module and chip removal module, the cutter are fixed on cutting module；Institute
Cutting module is stated for realizing the movement of cutter, polysilicon is sliced；The sharpening module is located above cutting module, sword
Module is ground for realizing the precision of sharpening, the service life and guarantee cutting that improve cutter to cutter；Chip removal module position
Inside cutter, chip removal module is conducive to the movement and raising of cutter for the clast near cutter to be discharged in cutting process
The validity of cutting.
The cutting module includes belt wheel, conveyer belt, cutting motor, tool fixing seat, column, lifter plate, positioning seat, spiral shell
Bar and lifting motor, the belt wheel quantity are two, and belt wheel is symmetrical horizontally disposed；The conveyer belt is mounted on belt wheel；Institute
Cutting motor is stated to rotate for driving pulley；On a moving belt, tool fixing seat is used for cutter for the tool fixing seat installation
It fixes on a moving belt, cutter can be moved with the rotation of conveyer belt；The column quantity is two, and column, which is located at, to be cut
The lower section of knife, the symmetrical vertical placement of column, column inside are provided with sliding slot；The lifter plate is horizontally placed under cutter
Side, lifter plate is between two columns, and lifter plate left and right ends are located in the sliding slot of column, and what lifter plate upper surface was provided with determines
Position seat, polysilicon are fixed on lifter plate upper surface by positioning seat；The screw rod is vertically installed in the sliding slot of column, screw rod with
Lifter plate realizes by screw thread and connects that screw rod moves up and down for realizing lifter plate along sliding slot；The lifting motor is mounted on
On column, lifting motor for realizing screw rod rotation.When work, cutting motor rotation, so that conveyer belt is moved, cutter with
Conveyer belt movement；During cutter moves, lifting motor work drive screw rod rotation, lifter plate along column sliding slot
It moves upwards, it is close to cutter that lifter plate pushes polysilicon, and cutter is made to cut polysilicon.
The sharpening module includes sharpening seat, sharpening stone, adjusting screw and spring one, and the sharpening seat is that lower end is equipped with V
The cuboid of type opening, cutter are open from the lower end V-type of sharpening seat across sharpening seat is open in V-type with when conveyer belt moves
The corresponding position in both sides and cutter sharpening area be provided with guide groove, sharpen seat guiding trench bottom be provided with threaded hole with；Institute
It is two to state sword number of grinding stone, and sharpening stone is set to by spring one in the guide groove of sharpening seat, and two blocks of sharpening stones are used for cutter
Two sides sharpened respectively；The adjusting screw is mounted on sharpening seat, and adjusting screw end extends to inside sharpening seat
With sword abrasive stones contact, adjusting screw is for pushing sharpening stone to be moved along guide groove, to adjust the degree of sharpening.Pass through adjusting
The position that screw adjusts sharpening stone enables sharpening stone to be contacted with cutter surface, after the completion of polysilicon cutting, moves to conveyer belt
The cutter of top passes through sharpening seat one by one, and the cutter into sharpening seat passes through sharpening with sword abrasive stones contact using the movement of cutter
Stone sharpens cutter, realizes the automatic sharpening of cutter.
The chip removal module includes helical axis, holder and chip removal motor, and the cutter is arranged in inside from blade to back
There are the chip space tilted upward, chip space both ends to be communicated with the external world；The helical axis is set in the chip space inside cutter；Institute
The back that holder is mounted on cutter is stated, helical axis is rack-mount；The chip removal motor is rack-mount, and chip removal motor is used
In realization helical axis rotation.During cutter cuts polysilicon, the clast cut down can remain in cutter
Near blade, the cutting efficiency of cutter is not only influenced, while being easy to damage cutter.It is attached in cutter blade in talus accumulation
When close, start the work of chip removal motor, the clast of cutter blade position is involved in inside cutter by helical axis, and by cutter inside
Chip space is discharged from cutter back, realizes chip removal.
The positioning seat upper surface position corresponding with cutter movement locus is provided with cutting groove, and positioning seat is in cutting groove
It is inside provided with plug, positioning seat is provided with reservoir in the bottom of cutting groove, deionized water, deionized water are stored in reservoir
For being cooled down to cutter and cutting part；The plug is frustum cone structure, and plug lower part is arranged along external peripheral surface
There are circular ring type groove, plug to be contacted with cutting groove inner wall, plug bottom is connected by spring two with liquid storage trench bottom, inside plug
It is provided with exhalant canal, exhalant canal lower end is communicated with the circular ring type groove of plug, position of the exhalant canal upper end on plug inclined-plane
It sets and is communicated with the external world.During cutter cuts polysilicon, the tip of cutter pushes plug downward along cutting groove
Mobile, the deionized water in reservoir is sprayed through the exhalant canal inside plug, is realized and is carried out cooling to cutting part, cools down.
The beneficial effects of the invention are as follows：
1. a kind of polysilicon slicing device of the present invention, cutting module, sharpening module and chip removal mould of the present invention
Block cooperates with each other, and being cut to silicon chip for much knives tool cycle is driven using V belt translation, and reduce that silicon chip is subject to rushes
The performance of polysilicon is hit, ensure that, meanwhile, cutter can realize sharpening during the motion, improve cutting-tool's used life.
2. a kind of polysilicon slicing device of the present invention, the cutter are internally provided with chip removal module, chip removal module
The clast of cutter blade position can be in time discharged in time in cutting process, avoid talus accumulation excessively and influence cutter into
One step is cut, and the validity of cutting is improved.
3. a kind of polysilicon slicing device of the present invention, it is provided with reservoir and plug in the positioning seat, is being cut
During knife cuts polysilicon, the deionized water in reservoir is sprayed by plug, is cooled down to cutting part,
Avoid polysilicon causes performance to decline because the temperature in cutting process is excessively high.
Description of the drawings
The invention will be further described below in conjunction with the accompanying drawings.
Fig. 1 is the front view of the present invention；
Fig. 2 is the sectional view of present invention sharpening module；
Fig. 3 is the sectional view of chip removal module of the present invention；
Fig. 4 is A-A sectional views in Fig. 1 of the present invention；
In figure：Cutter 1, cutting module 2, sharpening module 3, chip removal module 4, polysilicon 5, belt wheel 21, conveyer belt 22, cutter
Fixed seat 23, lifter plate 25, positioning seat 28, screw rod 26, lifting motor 27, sharpening seat 31, sharpening stone 32, adjusts spiral shell at column 24
Nail 33, helical axis 41, holder 42, chip removal motor 43, plug 6.
Specific implementation mode
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below
Specific implementation mode is closed, the present invention is further explained.
As shown in Figures 1 to 4, a kind of polysilicon slicing device of the present invention, including cutter 1, cutting module 2, sword
Mill module 3 and chip removal module 4, the cutter 1 are fixed on cutting module 2；The cutting module 2 for realizing cutter 1 fortune
It is dynamic, polysilicon 5 is sliced；The sharpening module 3 is located at 2 top of cutting module, and sharpening module 3 is for realizing to cutter 1
Sharpening, improve cutter 1 service life and ensure cutting precision；The chip removal module 4 is located inside cutter 1, chip removal mould
Clast near cutter 1 for being discharged in cutting process, being conducive to the movement of cutter 1 and improving the validity of cutting by block 4.
The cutting module 2 includes belt wheel 21, conveyer belt 22, cutting motor, tool fixing seat 23, column 24, lifter plate
25, positioning seat 28, screw rod 26 and lifting motor 27,21 quantity of the belt wheel are two, and belt wheel 21 is symmetrical horizontally disposed；It is described
Conveyer belt 22 is mounted on belt wheel 21；The cutting motor is rotated for driving pulley 21；The tool fixing seat 23 is mounted on
On conveyer belt 22, tool fixing seat 23 is used to cutter 1 being fixed on conveyer belt 22, and cutter 1 can turn with conveyer belt 22
It moves and moves；24 quantity of the column is two, and column 24 is located at the lower section of cutter 1, the symmetrical vertical placement of column 24,
24 inside of column is provided with sliding slot；The lifter plate 25 is horizontally placed on the lower section of cutter 1, lifter plate 25 be located at two columns 24 it
Between, 25 left and right ends of lifter plate are located in the sliding slot of column 24, the positioning seat 28 that 25 upper surface of lifter plate is provided with, polysilicon 5
It is fixed on 25 upper surface of lifter plate by positioning seat 28；The screw rod 26 is vertically installed in the sliding slot of column 24, screw rod 26 with
Lifter plate 25 realizes by screw thread and connects that screw rod 26 moves up and down for realizing lifter plate 25 along sliding slot；The lifting motor
27 be mounted on column 24 on, lifting motor 27 for realizing screw rod 26 rotation.When work, cutting motor rotation makes conveyer belt
22 move, and cutter 1 is moved with conveyer belt 22；During cutter 1 moves, the work of lifting motor 27 drives screw rod 26
Rotation, lifter plate 25 moves upwards along the sliding slot of column 24, and it is close to cutter 1 that lifter plate 25 pushes polysilicon 5, makes cutter 1
Polysilicon 5 is cut.
The sharpening module 3 includes that sharpening seat 31, sharpening stone 32, adjusting screw 33 and spring one, the sharpening seat 31 are
Lower end is equipped with the cuboid of V-type opening, and cutter 1 is open from the lower end V-type of sharpening seat 31 across sword with when conveyer belt 22 moves
Mill seat 31 is provided with guide groove in the both sides that V-type is open position corresponding with the sharpening area of cutter 1, sharpens the guiding trench bottom of seat 31
It is provided with threaded hole；32 quantity of sharpening stone is two, and sharpening stone 32 is set to by spring one in the guide groove of sharpening seat 31,
Two blocks of sharpening stones 32 for sharpening the two sides of cutter 1 respectively；The adjusting screw 33 is mounted on sharpening seat 31, is adjusted
Section screw 33 end extends to 31 inside of sharpening seat and is contacted with sharpening stone 32, and adjusting screw 33 sharpens stone 32 along leading for pushing
It is moved to slot, to adjust the degree of sharpening.By adjusting screw 33 adjust sharpening stone 32 position enable sharpening stone 32 with
1 surface of cutter contacts, and after the completion of polysilicon 5 is cut, the cutter 1 for moving to 22 top of conveyer belt passes through sharpening seat 31 one by one, into
The cutter 1 for entering to sharpen seat 31 is contacted with sharpening stone 32, using the movement of cutter 1, is sharpened to cutter 1 by sharpening stone 32,
Realize the automatic sharpening of cutter 1.Further, it is equipped with elastic component between the adjusting screw 33 and sharpening stone 32, is carrying out sword
When mill, under the action of the elastic member, the position of sharpening stone 32 can be moved afterwards relatively, to avoid hard contact from causing the damage of cutter 1
It is bad.
The chip removal module 4 include helical axis 41, holder 42 and chip removal motor 43, the cutter 1 inside from blade to
Back is provided with the chip space tilted upward, and chip space both ends are communicated with the external world；The helical axis 41 is set to inside cutter 1
In chip space；The holder 42 is mounted on the back of cutter 1, and helical axis 41 is mounted on holder 42；The chip removal motor 43 is pacified
On holder 42, chip removal motor 43 rotates for realizing helical axis 41.During cutter 1 cuts polysilicon 5,
The clast cut down can remain near the blade of cutter 1, not only influence the cutting efficiency of cutter 1, while being easy to cutter 1
It damages.When talus accumulation is near 1 blade of cutter, starts chip removal motor 43 and work, helical axis 41 is by 1 blade part of cutter
The clast of position is involved in inside cutter 1, and is discharged from 1 back of cutter by the chip space inside cutter 1, and chip removal is realized.
28 upper surface of positioning seat position corresponding with 1 movement locus of cutter is provided with cutting groove, and positioning seat 28 exists
Plug 6 is provided in cutting groove, positioning seat 28 is provided with reservoir in the bottom of cutting groove, deionization is stored in reservoir
Water, deionized water is for cooling down cutter and cutting part；6 lower part of plug is provided with ring groove, plug 6 with cut
The contact of slot inner wall is cut, 6 bottom of plug is connected by spring two with liquid storage trench bottom, and plug 6 is internally provided with exhalant canal, water outlet
Channel lower end is communicated with the ring groove of plug 6, and exhalant canal upper end is communicated in the position on 6 inclined-plane of plug with the external world.In cutter 1
During being cut to polysilicon 5, the tip of cutter 1 pushes plug 6 to be moved down along cutting groove, is gone in reservoir
Ionized water is sprayed through the exhalant canal inside plug 6, is realized and is carried out cooling to cutting part, cools down.
As one embodiment of the present invention, the conveyer belt 22 is steel band, and the inside of conveyer belt 22 is equipped with electromagnet,
The tool fixing seat 23 is made of ferrous material, and when cutting, the upper surface of underlying conveyer belt 22 and tool are magnetic
The lower surface sliding contact of electromagnet.It can increase stability of the cutter 1 in cutting by the electromagnet of setting, be conducive to improve
The effect of cutting.Further, the electromagnet is arranged along the length direction of conveyer belt 22, and the lower surface of electromagnet is equipped with left and right
The triangle open mouth slot of perforation is filled with lubricating grease in triangle open mouth slot, and lubricating grease advantageously reduces conveyer belt 22 and electromagnetism
Frictional force between iron, to improve the service life of conveyer belt 22.
As another embodiment of the invention, the conveyer belt 22 is steel band, and the inside of conveyer belt 22 is equipped with electromagnetism
Iron, the tool fixing seat 23 are made of ferrous material, and the inside of steel band is equipped with wearing layer, and wearing layer is bonded with electromagnet,
When being cut, wearing layer abrasion so that the position of cutter 1 is opposite to be moved up, to realize the automatic tune of 1 cutting position of cutter
It is whole, avoid 1 concentrated wear of cutter excessive, it is preferred that the limit of wear of wearing layer is adapted with the sharpness of cutter 1, works as abrasion
When layer reaches limit of wear position, cutter 1 just needs to sharpen, and in the present embodiment, can cancel the use of sharpening module 3.
Preferably, the wearing layer is that the copper coating formed in steel band inner surface is electroplated in copper.
Specific workflow is as follows：
Before work, polysilicon 5 is fixed on positioning seat 28 first；When work, cutting motor rotation makes conveyer belt 22 send out
Raw movement, cutter 1 are moved with conveyer belt 22；During cutter 1 moves, the work of lifting motor 27 drives 26 turns of screw rod
Dynamic, lifter plate 25 is moved upwards along the sliding slot of column 24, and it is close to cutter 1 that lifter plate 25 pushes polysilicon 5, keeps cutter 1 right
Polysilicon 5 is cut.The position of sharpening stone 32 is adjusted by adjusting screw 33 enables sharpening stone 32 to be connect with 1 surface of cutter
It touches, after the completion of polysilicon 5 is cut, the cutter 1 for moving to 22 top of conveyer belt passes through sharpening seat 31 one by one, into sharpening seat 31
Cutter 1 is contacted with sharpening stone 32, using the movement of cutter 1, is sharpened to cutter 1 by sharpening stone 32, is realized oneself of cutter 1
Dynamic sharpening.When talus accumulation is near 1 blade of cutter, starts chip removal motor 43 and work, helical axis 41 is by 1 blade position of cutter
Clast be involved in inside cutter 1, and by the chip space inside cutter 1 from 1 back of cutter be discharged, realize chip removal.In cutter 1
During being cut to polysilicon 5, the tip of cutter 1 pushes plug 6 to be moved down along cutting groove, is gone in reservoir
Ionized water is sprayed through the exhalant canal inside plug 6, is realized and is carried out cooling to cutting part, cools down.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe the originals of the present invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (6)
1. a kind of polysilicon slicing device, it is characterised in that：Including cutter (1), cutting module (2), sharpening module (3) and chip removal
Module (4), the cutter (1) are fixed on cutting module (2)；The cutting module (2) for realizing cutter (1) movement,
Polysilicon (5) is sliced；The sharpening module (3) is located above cutting module (2), and sharpening module (3) is for realizing right
The sharpening of cutter (1), the service life for improving cutter (1) and the precision for ensureing cutting；The chip removal module (4) is located at cutter
(1) internal, chip removal module (4) is for the clast of cutter (1) nearby to be discharged in cutting process；Wherein：
The cutting module (2) include belt wheel (21), conveyer belt (22), cutting motor, tool fixing seat (23), column (24),
Lifter plate (25), positioning seat (28), screw rod (26) and lifting motor (27), belt wheel (21) quantity are two, and belt wheel (21) is left
It is right symmetrical horizontally disposed；The conveyer belt (22) is mounted on belt wheel (21)；The cutting motor turns for driving pulley (21)
It is dynamic；The tool fixing seat (23) is mounted on conveyer belt (22), and tool fixing seat (23) is used to cutter (1) being fixed on transmission
On band (22), cutter (1) can be moved with the rotation of conveyer belt (22)；Column (24) quantity is two, column
(24) it is located at the lower section of cutter (1), the symmetrical vertical placement of column (24), column (24) inside is provided with sliding slot；The liter
Drop plate (25) is horizontally placed on the lower section of cutter (1), and lifter plate (25) is between two columns (24), lifter plate (25) left and right two
In the sliding slot of column (24), the positioning seat (28) that lifter plate (25) upper surface is provided with, polysilicon (5) passes through positioning seat at end
(28) it is fixed on lifter plate (25) upper surface；The screw rod (26) is vertically installed in the sliding slot of column (24), screw rod (26) with
Lifter plate (25) realizes by screw thread and connects that screw rod (26) moves up and down for realizing lifter plate (25) along sliding slot；The liter
Drop motor (27) be mounted on column (24) on, lifting motor (27) for realizing screw rod (26) rotation.
2. a kind of polysilicon slicing device according to claim 1, it is characterised in that：The sharpening module (3) includes sword
Seat (31), sharpening stone (32), adjusting screw (33) and spring one are ground, the sharpening seat (31) is the length that lower end is equipped with V-type opening
Cube, cutter (1) are open from the lower end V-type of sharpening seat (31) across sharpening seat (31) is in V-type with when conveyer belt (22) move
The both sides of opening position corresponding with cutter (1) sharpening area is provided with guide groove, and the guiding trench bottom of sharpening seat (31) is provided with
Threaded hole；Sharpening stone (32) quantity is two, and sharpening stone (32) is set to by spring one in the guide groove of sharpening seat (31),
Two pieces of sharpening stones (32) for sharpening the two sides of cutter (1) respectively；The adjusting screw (33) is mounted on sharpening seat
(31) on, adjusting screw (33) end extends to sharpening seat (31) inside and is contacted with sharpening stone (32), and adjusting screw (33) is used for
Sharpening stone (32) is pushed to be moved along guide groove, to adjust the degree of sharpening.
3. a kind of polysilicon slicing device according to claim 1, it is characterised in that：The chip removal module (4) includes spiral shell
Spin axis (41), holder (42) and chip removal motor (43), the cutter (1) are provided with from blade to back in inside and tilt upward
Chip space, chip space both ends are communicated with the external world；The helical axis (41) is set in the internal chip space of cutter (1)；The branch
Frame (42) is mounted on the back of cutter (1), and helical axis (41) is mounted on holder (42)；The chip removal motor (43) is mounted on branch
On frame (42), chip removal motor (43) rotates for realizing helical axis (41).
4. a kind of polysilicon slicing device according to claim 1, it is characterised in that：Positioning seat (28) upper surface with
Cutter (1) corresponding position of movement locus is provided with cutting groove, and positioning seat (28) is provided with plug (6) in cutting groove, fixed
Position seat (28) is provided with reservoir in the bottom of cutting groove, and deionized water is stored in reservoir, and deionized water is used for cutter
And cutting part cools down；Plug (6) lower part is provided with ring groove, and plug (6) is contacted with cutting groove inner wall, plug
(6) bottom is connected by spring two with liquid storage trench bottom, and plug (6) is internally provided with exhalant canal, exhalant canal lower end with it is stifled
The ring groove of head (6) communicates, and exhalant canal upper end is communicated in the position on plug (6) inclined-plane with the external world.
5. a kind of polysilicon slicing device according to claim 1, it is characterised in that：The conveyer belt (22) is steel band,
The inside of conveyer belt (22) is equipped with electromagnet, and the tool fixing seat (23) is made of ferrous material, underlying when cutting
The upper surface of conveyer belt (22) and the lower surface sliding contact for having magnetic electromagnet.
6. a kind of polysilicon slicing device according to claim 5, it is characterised in that：The electromagnet is along conveyer belt (22)
Length direction arrangement, the lower surface of electromagnet is equipped with the triangle open mouth slot of left and right perforation, is filled in triangle open mouth slot
Lubricating grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810534102.XA CN108673769B (en) | 2018-05-29 | 2018-05-29 | Polycrystalline silicon slicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810534102.XA CN108673769B (en) | 2018-05-29 | 2018-05-29 | Polycrystalline silicon slicing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108673769A true CN108673769A (en) | 2018-10-19 |
| CN108673769B CN108673769B (en) | 2020-08-21 |
Family
ID=63808815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810534102.XA Active CN108673769B (en) | 2018-05-29 | 2018-05-29 | Polycrystalline silicon slicing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108673769B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466793A (en) * | 2021-02-01 | 2021-03-09 | 四川晶辉半导体有限公司 | Chip wafer scribing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201833488U (en) * | 2010-10-23 | 2011-05-18 | 镇江市港南电子有限公司 | Cutting tool for processing silicon wafers |
| CN102371632A (en) * | 2011-11-22 | 2012-03-14 | 江苏金晖光伏有限公司 | Polysilicon slicing method |
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| CN201833488U (en) * | 2010-10-23 | 2011-05-18 | 镇江市港南电子有限公司 | Cutting tool for processing silicon wafers |
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| CN108673769B (en) | 2020-08-21 |
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