CN104608268A - Pillar and horizontal band sapphire-slicing saw and sawing method thereof - Google Patents
Pillar and horizontal band sapphire-slicing saw and sawing method thereof Download PDFInfo
- Publication number
- CN104608268A CN104608268A CN201510083840.3A CN201510083840A CN104608268A CN 104608268 A CN104608268 A CN 104608268A CN 201510083840 A CN201510083840 A CN 201510083840A CN 104608268 A CN104608268 A CN 104608268A
- Authority
- CN
- China
- Prior art keywords
- band saw
- sapphire
- saw
- sawing
- sapphire crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 64
- 239000010980 sapphire Substances 0.000 claims abstract description 64
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 13
- 239000010432 diamond Substances 0.000 claims abstract description 13
- 239000013078 crystal Substances 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 11
- 230000003028 elevating effect Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000003638 chemical reducing agent Substances 0.000 abstract 2
- 238000003754 machining Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 230000002354 daily effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to a pillar and horizontal band sapphire-slicing saw and a sawing method thereof. Sapphire is of high hardness and brittleness and is very difficult to machine; presently, diamond cemented reciprocating saw blade cutting equipment is used in the actual production of sapphire rod slicing and is complex in structure and difficult to maintain. The pillar and horizontal band sapphire-slicing saw comprises a bed (1); two pillars (6) are mounted on the upper planes of two sides of the bed; the outsides of the pillars are sleeved with a band saw box (12); the center of the upper plane of the band saw box is connected with a lift screw (13); the lift screw penetrates a band saw rack (7); two sides of the band saw rack are connected with the pillars through bolts; the center of the band saw rack is connected with a reducer (8) through a bolt; the reducer is provided with a hole in which the lift screw penetrates. The awing method is applied to the pillar and horizontal band sapphire-slicing saw.
Description
technical field:
the present invention relates to a kind of column horizontal belt sapphire slices sawing machine and carry out the method for sawing.
background technology:
high and the fragility of sapphire hardness is large, and carry out machining to it very difficult, what adopt in sapphire bar section actual production process at present is the reciprocating saw blade cutting equipment of diamond consolidation, and this device structure is complicated, maintenance difficult.Because saw silk moves back and forth, the restriction of moving component inertia, wire travelling speed is low, limit cutting speed, material remove rate is lower, also causes working (machining) efficiency lower (cutting diameter is the bar time of 350mm be about 215min), and direction of motion change simultaneously can leave sharp trace at cutting surfaces, the grinding milk adding man-hour can pollute silicon rod and processing district, and the grinding milk after using must subsequent treatment.
summary of the invention:
the object of this invention is to provide a kind of column horizontal belt sapphire slices sawing machine and carry out the method for sawing.
above-mentioned object is realized by following technical scheme:
a kind of column horizontal belt sapphire slices sawing machine, its composition comprises: lathe bed, Plane Installation 2 columns on described lathe bed both sides, on described column external diameter, cover has band saw casing, on described band saw casing, plane centre position is connected with elevating screw by bolt, described elevating screw is through band saw frame, described band saw frame both sides are connected with described column by bolt, described band saw frame centre position is connected with reductor by bolt, described reductor has hole, is installed with described elevating screw in described hole.
described column horizontal belt sapphire slices sawing machine, on described lathe bed, plane centre position is provided with movable workbench guide rail, described movable workbench guide rail is connected with workbench by guide rail, described workbench inside is provided with ball screw, on described workbench, Plane Installation has magnetic suction disc, and described magnetic suction disc is provided with sapphire crystal.
described column horizontal belt sapphire slices sawing machine, described band saw box house has 2 wheel discs, wheel disc described in 2 is tied with band saw, the diamond particles be cemented on band saw described band saw is equipped with, described be cemented in diamond particles on band saw and described sapphire crystal fits tightly, described band saw casing front end is provided with saw blade protective cover.
column horizontal belt sapphire slices sawing machine and carry out the method for sawing, the method comprises the steps:
first be open magnetic suction disc, fixed by bonding sapphire crystal on the table, under the control of electric-control system, suction plate bench is under the driving of drive motors and ball-screw, move along movable workbench guide rail to band saw direction, translational speed is 2-3mm/min;
the lifting of band saw frame controlled by reductor and leading screw, speed reducing ratio is higher, and described speed reducing ratio is 1:24, and load-carrying is large, operate steadily, open, stop freely;
bonding sapphire crystal is on the table fixed, the adjustable height of the band saw frame according to the sawing position adjustment of described sapphire crystal, after described sapphire crystal is contacted with band saw, under the pressure effect contacted with each other, the diamond particles be cemented on band saw is utilized to carry out grinding to sapphire, meanwhile, the direction of sucker rotation is identical with the tangential direction that band saw runs, and can effectively avoid chip to pile up like this.
beneficial effect:
1. the present invention is column horizontal belt sapphire slices sawing machine, that one can be quick by sapphire crystal, the little special purpose device cutting into appointed thickness of collateral damage, sapphire hardness is high and fragility is large, wayward surface roughness in process, limit is collapsed in easy generation, this apparatus structure is compact, (master worker can complete all operations) simple to operate, low cost of manufacture, working (machining) efficiency is high, cutting diameter is the bar time of 350mm be about 65min, not easily produce and collapse limit, flatness is good, surface damage and cut little, roughness is less than 0.5 μm, stability is high, work under normal circumstances 8 hours in every day, band saw can continuous operation 4 days, ensure that sapphire cutting efficiency and quality, provide strong support for producing high-quality sapphire lamellar body.
the present invention, by the acting in conjunction of reductor and elevating screw, makes band saw frame steadily fix at an arbitrary position, can freely change sapphire slices thickness, ensures the surface quality of section.
the present invention drives sapphire crystal spinning by magnetic suction disc, makes the sapphire of cutting same thickness, compared to without spinning device, time decreased half, substantially increase stock-removing efficiency, and band saw is identical with the tangential velocity direction of sapphire rotation, efficiently solves a chip removal difficult problem.
feeding process of the present invention, first be open magnetic suction disc, the sapphire crystal be bonded on iron pan is fixed, under the control of electric-control system, suction plate bench, under the driving of drive motors and ball-screw, moves (2-3mm/min) along movable workbench guide rail to band saw direction.
the present invention adopts stepper motor, and feeding is accurate, operate steadily, stride value by the impact of various disturbing factor and error not long term accumulation, control performance is good, starts, stops, upset is all complete in a few pulses.
the present invention adopts ball screw, and described ball screw positioning precision is high, transmission efficiency is high, high life (wearing and tearing low) and resistance is little, there will not be creeping phenomenon.
band saw frame lifting process of the present invention, the lifting of described band saw frame is controlled by reductor and leading screw, speed reducing ratio high (speed reducing ratio reaches 1:24), load-carrying is large, operate steadily, start and stop are effective, install simple and easy, flexibly spry and light, superior performance, be easy to Maintenance and Repair, operate steadily, noise be little, durable in use, compact mechanical structure, volumetric bulk light and handy, can self-locking be realized, control the thickness of section more exactly.
sawing process of the present invention, after sapphire crystal contacts with band saw, under the pressure effect contacted with each other, the diamond particles be cemented on band saw is utilized to carry out grinding to sapphire, simultaneously, the direction of sucker rotation is identical with the tangential direction that band saw runs, and can effectively avoid chip to pile up like this.
band saw frame supporting of the present invention adopts two column, and this rigidity of structure is good, can ensure chipping qualities (roughness is less than 0.5 μm),
this product structure is simple, and reasonable in design, easy to maintenance, manufacturing cycle is short, and four master worker's collaborative works, can complete the assembly working of complete machine for one day.
accompanying drawing illustrates:
accompanying drawing 1 is structural representation of the present invention.
accompanying drawing 2 is outline drawings of accompanying drawing 1.
detailed description of the invention:
embodiment 1:
a kind of column horizontal belt sapphire slices sawing machine, its composition comprises: lathe bed 1, Plane Installation 2 columns 6 on described lathe bed both sides, on described column external diameter, cover has band saw casing 12, on described band saw casing, plane centre position is connected with elevating screw 13 by bolt, described elevating screw is through band saw frame 7, described band saw frame both sides are connected with described column by bolt, described band saw frame centre position is connected with reductor 8 by bolt, described reductor has hole, is installed with described elevating screw in described hole.
embodiment 2:
column horizontal belt sapphire slices sawing machine according to embodiment 1, on described lathe bed, plane centre position is provided with movable workbench guide rail 2, described movable workbench guide rail is connected with workbench 3 by guide rail, described workbench inside is provided with ball screw 4, on described workbench, Plane Installation has magnetic suction disc 5, described magnetic suction disc is provided with sapphire crystal 10.
embodiment 3:
column horizontal belt sapphire slices sawing machine according to embodiment 1, described band saw box house has 2 wheel discs, wheel disc described in 2 is tied with band saw 11, the diamond particles be cemented on band saw described band saw is equipped with, described be cemented in diamond particles on band saw and described sapphire crystal fits tightly, described band saw casing front end is provided with saw blade protective cover 9.
embodiment 4:
a kind of method utilizing the column horizontal belt sapphire slices sawing machine described in embodiment 1-3 to carry out sawing, this method is: be first open magnetic suction disc, bonding sapphire crystal is on the table fixed, under the control of electric-control system, suction plate bench is under the driving of drive motors and ball-screw, move along movable workbench guide rail to band saw direction, translational speed is 2-3mm/min;
the lifting of band saw frame controlled by reductor and leading screw, speed reducing ratio is higher, and described speed reducing ratio is 1:24, and load-carrying is large, operate steadily, open, stop freely;
bonding sapphire crystal is on the table fixed, the adjustable height of the band saw frame according to the sawing position adjustment of described sapphire crystal, after described sapphire crystal is contacted with band saw, under the pressure effect contacted with each other, the diamond particles be cemented on band saw is utilized to carry out grinding to sapphire, meanwhile, the direction of sucker rotation is identical with the tangential direction that band saw runs, and can effectively avoid chip to pile up like this.
embodiment 5:
column horizontal belt sapphire slices sawing machine according to embodiment 1-4, sapphire composition is aluminium oxide, sapphire crystal has excellent optical property, mechanical performance and chemical stability, anticorrosive, high rigidity, high light transmittance, fusing point are high (2045 DEG C), can work under the mal-condition close to 2000 DEG C of high temperature, in view of above characteristic, sapphire extensive use.
due to comparatively large (the maximum gauge 350mm of the sapphire volume that will carry out cutting into slices, the highest 400mm, maximum slice thickness 370mm), and require that surface quality is good, collateral damage little (roughness is less than 0.5 μm), working (machining) efficiency is high (when maximum section diameter is 350mm, often 80min is not more than), based on requiring ad hoc meter sapphire slices special saw machine above, utilize the diamond particles grinding sapphire be cemented on band saw, for reducing process time, sapphire bar carries out spinning (30r/min) with certain speed in the process along guide rail feeding, at least 1/2 is decreased than not rotation to make process time, this sawing machine structure is simple simultaneously, durable, automaticity high (master worker can complete all operations), so this product is to the processing conditions solving sapphire crystal harshness, promote sapphire and play huge impetus at military and civil area.
after this Product processing is gone into operation, the ability of sapphire crystal section rapid processing can be achieved, reach daily output 160 (20, sawing machine, every work platform day 8 hours, every sheet thickness 7mm, roughness is less than 0.5 μm), can realize providing stable to sapphire lamellar body party in request, the ability of the high-quality supply of material, simultaneously can create good economic benefit.
Claims (4)
1. a column horizontal belt sapphire slices sawing machine, its composition comprises: lathe bed, it is characterized in that: Plane Installation 2 columns on described lathe bed both sides, on described column external diameter, cover has band saw casing, on described band saw casing, plane centre position is connected with elevating screw by bolt, described elevating screw is through band saw frame, described band saw frame both sides are connected with described column by bolt, described band saw frame centre position is connected with reductor by bolt, described reductor has hole, is installed with described elevating screw in described hole.
2. column horizontal belt sapphire slices sawing machine according to claim 1, it is characterized in that: on described lathe bed, plane centre position is provided with movable workbench guide rail, described movable workbench guide rail is connected with workbench by guide rail, described workbench inside is provided with ball screw, on described workbench, Plane Installation has magnetic suction disc, and described magnetic suction disc is provided with sapphire crystal.
3. column horizontal belt sapphire slices sawing machine according to claim 1, it is characterized in that: described band saw box house has 2 wheel discs, wheel disc described in 2 is tied with band saw, the diamond particles be cemented on band saw described band saw is equipped with, described be cemented in diamond particles on band saw and described sapphire crystal fits tightly, described band saw casing front end is provided with saw blade protective cover.
4. utilize the column horizontal belt sapphire slices sawing machine described in claim 1-3 to carry out a method for sawing, it is characterized in that: the method comprises the steps:
First be open magnetic suction disc, fixed by bonding sapphire crystal on the table, under the control of electric-control system, suction plate bench is under the driving of drive motors and ball-screw, move along movable workbench guide rail to band saw direction, translational speed is 2-3mm/min;
The lifting of band saw frame controlled by reductor and leading screw, speed reducing ratio is higher, and described speed reducing ratio is 1:24, and load-carrying is large, operate steadily, open, stop freely;
Bonding sapphire crystal is on the table fixed, the adjustable height of the band saw frame according to the sawing position adjustment of described sapphire crystal, after described sapphire crystal is contacted with band saw, under the pressure effect contacted with each other, the diamond particles be cemented on band saw is utilized to carry out grinding to sapphire, meanwhile, the direction of sucker rotation is identical with the tangential direction that band saw runs, and can effectively avoid chip to pile up like this.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510083840.3A CN104608268A (en) | 2015-02-16 | 2015-02-16 | Pillar and horizontal band sapphire-slicing saw and sawing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510083840.3A CN104608268A (en) | 2015-02-16 | 2015-02-16 | Pillar and horizontal band sapphire-slicing saw and sawing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104608268A true CN104608268A (en) | 2015-05-13 |
Family
ID=53143029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510083840.3A Withdrawn CN104608268A (en) | 2015-02-16 | 2015-02-16 | Pillar and horizontal band sapphire-slicing saw and sawing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104608268A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108673769A (en) * | 2018-05-29 | 2018-10-19 | 顾雨彤 | A kind of polysilicon slicing device |
| CN109531839A (en) * | 2018-11-26 | 2019-03-29 | 国宏中晶集团有限公司 | A kind of sapphire slices Nvidia custom thermal system NVIDIA and method |
| CN110491808A (en) * | 2019-08-20 | 2019-11-22 | 施林荣 | A kind of wafer saw |
| CN112936624A (en) * | 2020-12-31 | 2021-06-11 | 六安优云通信技术有限公司 | Wafer slicing machine for manufacturing power supply chip and preparation process |
| CN113290722A (en) * | 2021-06-22 | 2021-08-24 | 浙江森尼克半导体有限公司 | Wire drawing type cutting machine suitable for semiconductor material |
-
2015
- 2015-02-16 CN CN201510083840.3A patent/CN104608268A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108673769A (en) * | 2018-05-29 | 2018-10-19 | 顾雨彤 | A kind of polysilicon slicing device |
| CN109531839A (en) * | 2018-11-26 | 2019-03-29 | 国宏中晶集团有限公司 | A kind of sapphire slices Nvidia custom thermal system NVIDIA and method |
| CN110491808A (en) * | 2019-08-20 | 2019-11-22 | 施林荣 | A kind of wafer saw |
| CN110491808B (en) * | 2019-08-20 | 2021-08-03 | 湖南艾凯瑞斯智能科技有限公司 | Wafer scribing machine |
| CN112936624A (en) * | 2020-12-31 | 2021-06-11 | 六安优云通信技术有限公司 | Wafer slicing machine for manufacturing power supply chip and preparation process |
| CN113290722A (en) * | 2021-06-22 | 2021-08-24 | 浙江森尼克半导体有限公司 | Wire drawing type cutting machine suitable for semiconductor material |
| CN113290722B (en) * | 2021-06-22 | 2023-08-18 | 浙江森尼克半导体有限公司 | Wire drawing type cutting machine suitable for semiconductor material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20150513 |
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| WW01 | Invention patent application withdrawn after publication |