CN108672965A - A method of alleviating ceramics and solder bonding metal connector residual stress - Google Patents
A method of alleviating ceramics and solder bonding metal connector residual stress Download PDFInfo
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- CN108672965A CN108672965A CN201810424022.9A CN201810424022A CN108672965A CN 108672965 A CN108672965 A CN 108672965A CN 201810424022 A CN201810424022 A CN 201810424022A CN 108672965 A CN108672965 A CN 108672965A
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- welded
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- residual stress
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- thin slice
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses a kind of methods for alleviating ceramics and solder bonding metal connector residual stress, this method is by using a kind of Superplastic Titanium Alloys thin slice of coefficient of thermal expansion between ceramic part to be welded and metal part to be welded as transitional interlayer, using the superplastic deformation of transitional interlayer, plastic deformation and thermally expand adjustment effect, to alleviate the residual stress of soldered fitting, raising strength of joint.Soldering strength is low caused by the high stress that thermal expansion mismatch generates or even is difficult to solder to during the alleviation ceramics of the present invention solve the problems, such as Ceramic and metal joining with the method for solder bonding metal connector residual stress, have the advantages that it is simple and practicable, easy to implement, can be widely applied to alleviate thermal expansion mismatch material soldered fitting residual stress.
Description
Technical field
The invention belongs to welding technology fields, and in particular to a kind of side for alleviating ceramics and solder bonding metal connector residual stress
Method.
Background technology
Ceramics are with its higher intensity, lower thermal conductivity, excellent insulating properties and high temperature resistant, wear-resistant, anticorrosive
Etc. performance characteristics be widely used in the fields such as power electronics, aerospace, derived energy chemical.However, ceramic intrinsic brittleness makes
Its poor processability, it is difficult to prepare large scale, labyrinth component；And it is often required that in commercial Application and realizes ceramics and metal
Connection, such as Al2O3It is had a very important significance with being connected in aerospace and electronic engineering for stainless steel.Therefore, ceramic
The important foundation for widening its application field is had become with being reliably connected for metal.
Ceramics connect very challenging with the high quality of metal.This is because during the connection process, ceramics and metal
Due to the performance differences such as coefficient of thermal expansion and elasticity modulus higher residual stress is generated in linkage interface.Larger stress will be notable
Joint breaking intensity is reduced, its crack initiation or cracking under smaller plus load is made；Connector is even resulted in cannot achieve effectively
Connection.Therefore, how to alleviate the high stress in connector is to realize to thermally expand premise and key that notable mismatched material is reliably connected.
Currently, the alleviation method of ceramics and solder bonding metal connector residual stress mainly has composite soldering method and addition middle layer
Method, if according to buffer layer mechanism of action, it is following several to be divided into：A kind of method is addition soft metal middle layer method.By adding
Add the soft metal layers such as Cu, Ni, Al with low Young's modulus, low yield strength and high plastic deformation's ability, is become using its plasticity
Shape reduces the residual stress of connector, but these soft metal fusing points are relatively low, and connector operating temperature is limited.Another method is
Achieve the purpose that alleviate connector residual stress by coefficient of thermal expansion difference between reduction ceramics and metal.By in solder
The directly low reinforced phase of addition or in-situ preparation coefficient of thermal expansion, such as Si3N4Particle, SiC particulate, Al2O3Particle, TiC particles,
Mo particles, W particles, fiber C and TiB whiskers etc., or addition hard metal middle layer, gradient middle layer etc. within a fitting, to carry
The thermophysical property matching of high ceramics and metal.Although the above method improves the thermal matching between linked system, increase
It is strong mutually or the addition of hard middle layer makes that the modulus of connector increases, heat deformability is decreased obviously, therefore alleviation welding point is answered
The effect of power is restricted, and gradient middle layer requires thickness larger and prepares difficult.In addition, for improve soldering joint strength or
Soft/hard composite interlayer method of addition, porous metals or metal foam buffering has been developed in the comprehensive performance of connector, domestic and foreign scholars
Layer method, and strength of joint etc. is improved by ion implanting and the surface structure processing of ceramic welding end face.But it is soft, hard compound
There are the mutation in performance for the linkage interface of multilayer, limit further increasing for strength of joint.Porous metals or metal foam
Buffer layer method is influenced by middle layer self-characteristic, and strength of joint and sealing performance are to be improved.And ceramic welding end face from
There is no the high stresses solved the problems, such as in connector for son injection and surface structure processing method.
In conclusion alleviating in soldered fitting today mainly by the plastic deformation or thermal expansion adjustment effect of middle layer
Residual stress, two kinds of methods respectively have advantage and disadvantage, currently there is an urgent need for develop a kind of alleviation ceramics effectively combining the two with
The method of solder bonding metal connector residual stress, preferably to alleviate the residual stress of soldered fitting, improve weld joint mechanical
Energy.
Invention content
Technical problem to be solved by the invention is to provide a kind of sides for alleviating ceramics and solder bonding metal connector residual stress
Method.
The alleviation ceramics and the method for solder bonding metal connector residual stress of the present invention include the following steps：
A. the Superplastic Titanium Alloys thin slice for using wire cutting that Superplastic Titanium Alloys are cut into thickness as 0.1mm ~ 0.5mm；
B. polish the surface of ceramic part to be welded, metal part to be welded and Superplastic Titanium Alloys thin slice, by after polishing ceramic part to be welded,
Metal part to be welded, Superplastic Titanium Alloys thin slice and solder I, solder II carry out organic solvent ultrasonic cleaning；
C. the Superplastic Titanium Alloys thin slice that step b is obtained is carried out setting hydrogen processing, obtains the superplasticity titanium of hydrogen content≤0.6wt.%
Alloy sheet；
D. ceramic part to be welded, metal part to be welded, solder I and solder II and step b after cleaning step b obtained or
The Superplastic Titanium Alloys thin slice that step c is obtained is according to ceramic part to be welded, solder I, Superplastic Titanium Alloys thin slice, solder II and metal
The sequence of part to be welded is assembled, the component after being assembled.
E. the component after assembly that step d is obtained is placed in vacuum drying oven and is brazed, brazing conditions are welding pressure 1
MPa ~ 6MPa, vacuum degree are less than or equal to 10–3Pa, brazing process are as follows：
E1. it heats up, with 5oC/min~30oThe heating rate of C/min is heated to welding temperature；
E2. it keeps the temperature, is kept the temperature under welding temperature；
E3. segmented cooling or directly cooling, segmented cooling are first to be cooled to 500oC~600oC is kept the temperature, and soaking time is less than or equal to
10h is cooled to room temperature；Directly cooling completes soldering to be directly cooled to room temperature under welding temperature.
It is thin using sand paper or the ceramic part to be welded of diamond disk polishing, metal part to be welded and Superplastic Titanium Alloys in step b
The surface of piece, until removing the oxide layer on surface, the roughness on surface is less than or equal to 3.2 microns.
Organic solvent described in step b is one or both of ethanol solution or acetone soln mixed solution.
The temperature for setting hydrogen processing described in step c is 550 oC ~850oC。
The soaking time of welding temperature described in step e2 is 5min ~ 30min.
Segmented cooling described in step e3 or the cooling rate directly to cool down are 1 ~ 10oC/min or furnace cooling.
The alleviation ceramics and the method for solder bonding metal connector residual stress of the present invention are situated between by using a kind of coefficient of thermal expansion
Superplastic Titanium Alloys thin slice between ceramic part to be welded and metal part to be welded utilizes transitional interlayer as transitional interlayer
Superplastic deformation, plastic deformation and thermal expansion adjustment effect improve strength of joint to alleviate the residual stress of soldered fitting.
The alleviation ceramics and the method for solder bonding metal connector residual stress of the present invention solve Ceramic and metal joining process
The problem of soldering strength is low caused by the middle high stress generated by thermal expansion mismatch or even is difficult to solder to.The alleviation pottery of the present invention
The method of porcelain and solder bonding metal connector residual stress is not necessarily to special installation, have the advantages that it is simple and practicable, easy to implement, can be extensive
Applied to the residual stress for alleviating thermal expansion mismatch material soldered fitting.
Description of the drawings
The alleviation ceramics and the assembling schematic diagram in the method for solder bonding metal connector residual stress that Fig. 1 is the present invention；
In figure, 1. 4. solder of ceramic part to be welded 2. solder, I 3. Superplastic Titanium Alloys thin slice, II 5. metal part to be welded.
Specific implementation mode
The present invention will be described in detail with reference to the accompanying drawings and examples.
Technical scheme of the present invention is not limited to the specific implementation mode of act set forth below, further includes each specific implementation mode
Between arbitrary combination.
Embodiment 1
The alleviation ceramics and the method for solder bonding metal connector residual stress of the present embodiment carry out according to the following steps：
1. the Superplastic Titanium Alloys thin slice 3 for using wire cutting that Superplastic Titanium Alloys are cut into thickness as 0.1mm ~ 0.5mm；
2. the surface of the ceramic part to be welded 1 of polishing, metal part to be welded 5 and Superplastic Titanium Alloys thin slice 3, until removing the oxidation on surface
The roughness of layer, surface is less than or equal to 3.2 microns；By ceramic part to be welded 1, metal part to be welded 5, the Superplastic Titanium Alloys after polishing
Thin slice 3 and solder I 2, solder II 4 carry out ethanol solution ultrasonic cleaning；
3. the ceramic part to be welded 1, metal part to be welded 5, solder I 2, solder II 4 and superplasticity titanium after the cleaning that step 2 is obtained close
Golden thin slice 3 according to ceramic part to be welded 1, solder I 2, Superplastic Titanium Alloys thin slice 3, solder II 4 and metal part to be welded 5 sequence into
Row assembling, the component after being assembled.
It is brazed 4. the component after assembly that step 3 obtains is placed in vacuum drying oven, brazing conditions are welding pressure 1
MPa ~ 6MPa, vacuum degree are less than or equal to 10–3Pa, brazing process are as follows：
4a. heats up, with 5oC/min~30oThe heating rate of C/min is heated to welding temperature；
4b. is kept the temperature, and 5min ~ 30min is kept the temperature under welding temperature；
4c. directly cools down, and cools to room temperature with the furnace under welding temperature, completes soldering.
Embodiment 2
1. the Superplastic Titanium Alloys thin slice 3 for using wire cutting that Superplastic Titanium Alloys are cut into thickness as 0.1mm ~ 0.5mm；
2. the surface of the ceramic part to be welded 1 of polishing, metal part to be welded 5 and Superplastic Titanium Alloys thin slice 3, until removing the oxidation on surface
The roughness of layer, surface is less than or equal to 3.2 microns；By ceramic part to be welded 1, metal part to be welded 5, the Superplastic Titanium Alloys after polishing
Thin slice 3 and solder I 2, solder II 4 carry out acetone soln ultrasonic cleaning；
3. the Superplastic Titanium Alloys thin slice that step 2 obtains is carried out to set hydrogen processing, the temperature for setting hydrogen processing is 550 oC ~850oC,
Obtain the Superplastic Titanium Alloys thin slice of hydrogen content≤0.6wt.%；
4. ceramic part to be welded, metal part to be welded, solder I, solder II and the step 3 after cleaning that step 2 obtains are obtained super
Plasticity titanium alloy thin slice according to ceramic part to be welded, solder I, Superplastic Titanium Alloys thin slice, solder II and metal part to be welded sequence
It is assembled, the component after being assembled.
It is brazed 5. the component after assembly that step 4 obtains is placed in vacuum drying oven, brazing conditions are welding pressure 1
MPa ~ 6MPa, vacuum degree are less than or equal to 10–3Pa, brazing process are as follows：
E1. it heats up, with 5oC/min~30oThe heating rate of C/min is heated to welding temperature；
E2. it keeps the temperature, is kept the temperature under welding temperature, soaking time is 5min ~ 30min；
E3. the cooling rate of segmented cooling, segmented cooling is 1 ~ 10oC/min, segmented cooling are first to be cooled to 500oC~600oC is protected
Temperature, soaking time are less than or equal to 10h, are cooled to room temperature, complete soldering.
Claims (6)
1. a kind of method for alleviating ceramics and solder bonding metal connector residual stress, which is characterized in that the method includes following
Step：
A. the Superplastic Titanium Alloys thin slice for using wire cutting that Superplastic Titanium Alloys are cut into thickness as 0.1mm ~ 0.5mm（3）；
B. the ceramic part to be welded of polishing（1）, metal part to be welded（5）With Superplastic Titanium Alloys thin slice（3）Surface, by the pottery after polishing
Porcelain part to be welded（1）, metal part to be welded（5）, Superplastic Titanium Alloys thin slice（3）With solder I（2）, solder II（4）Carry out organic solvent
It is cleaned by ultrasonic；
C. Superplastic Titanium Alloys thin slice step b obtained（3）It carries out setting hydrogen processing, obtains the super modeling of hydrogen content≤0.6wt.%
Property titanium alloy thin slice（3）；
D. the ceramic part to be welded after cleaning step b obtained（1）, metal part to be welded（5）, solder I（2）And solder II（4）,
And the Superplastic Titanium Alloys thin slice that step b or step c are obtained（3）According to ceramic part to be welded（1）, solder I（2）, superplasticity
Titanium alloy thin slice（3）, solder II（4）With metal part to be welded（5）Sequence assembled, the component after being assembled；
E. the component after assembly that step d is obtained is placed in vacuum drying oven and is brazed, brazing conditions be 1 MPa of welding pressure ~
6MPa, vacuum degree are less than or equal to 10–3Pa, brazing process are as follows：
E1. it heats up, with 5oC/min~30oThe heating rate of C/min is heated to welding temperature；
E2. it keeps the temperature, is kept the temperature under welding temperature；
E3. segmented cooling or directly cooling, segmented cooling are first to be cooled to 500oC~600oC is kept the temperature, and soaking time is less than or equal to
10h is cooled to room temperature；Directly cooling completes soldering to be directly cooled to room temperature under welding temperature.
2. the method according to claim 1 for alleviating ceramics and solder bonding metal connector residual stress, it is characterised in that：Step
Using sand paper or the ceramic part to be welded of diamond disk polishing in b（1）, metal part to be welded（5）With Superplastic Titanium Alloys thin slice（3）'s
Surface, until removing the oxide layer on surface, the roughness on surface is less than or equal to 3.2 microns.
3. the method according to claim 1 for alleviating ceramics and solder bonding metal connector residual stress, it is characterised in that：Step
Organic solvent described in b is one or both of ethanol solution or acetone soln mixed solution.
4. the method according to claim 1 for alleviating ceramics and solder bonding metal connector residual stress, it is characterised in that：Step
The temperature for setting hydrogen processing described in c is 550 oC ~850oC。
5. the method according to claim 1 for alleviating ceramics and solder bonding metal connector residual stress, it is characterised in that：Step
The soaking time of welding temperature described in e2 is 5min ~ 30min.
6. the method according to claim 1 for alleviating ceramics and solder bonding metal connector residual stress, it is characterised in that：Step
Segmented cooling described in e3 or the cooling rate directly to cool down are 1 ~ 10oC/min or furnace cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810424022.9A CN108672965B (en) | 2018-05-07 | 2018-05-07 | Method for relieving residual stress of ceramic and metal soldered joint |
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|---|---|---|---|
| CN201810424022.9A CN108672965B (en) | 2018-05-07 | 2018-05-07 | Method for relieving residual stress of ceramic and metal soldered joint |
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| CN108672965A true CN108672965A (en) | 2018-10-19 |
| CN108672965B CN108672965B (en) | 2020-08-28 |
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| CN109282082A (en) * | 2018-11-23 | 2019-01-29 | 潜江新锐硬质合金工具有限公司 | A kind of needle-type throttle valve valve rod and its processing and forming technology |
| CN109702317A (en) * | 2019-02-19 | 2019-05-03 | 中国科学院金属研究所 | A kind of processing method for realizing the high superplasticity property of titanium alloy welding joint |
| CN110776329A (en) * | 2018-12-31 | 2020-02-11 | 深圳硅基仿生科技有限公司 | Brazing method of ceramic and metal |
| CN110824181A (en) * | 2019-10-18 | 2020-02-21 | 中国航空工业集团公司西安飞行自动控制研究所 | Signal connection method for low-resistance sensitive device |
| CN110883397A (en) * | 2019-12-06 | 2020-03-17 | 哈尔滨工业大学 | Welding method for relieving residual stress of ceramic and metal brazed joint |
| CN110883443A (en) * | 2019-12-12 | 2020-03-17 | 郑州机械研究所有限公司 | Hard alloy brazing joint, preparation method thereof and hard alloy tool |
| CN111001890A (en) * | 2019-12-16 | 2020-04-14 | 中国电子科技集团公司第四十三研究所 | Method for reducing welding deformation of heterogeneous material |
| CN111014867A (en) * | 2019-12-24 | 2020-04-17 | 新疆大学 | Laser brazing method for titanium alloy and ceramic dissimilar materials |
| CN112331572A (en) * | 2021-01-04 | 2021-02-05 | 度亘激光技术（苏州）有限公司 | Packaging method of semiconductor device |
| CN113732424A (en) * | 2021-09-14 | 2021-12-03 | 哈尔滨工业大学 | Method for improving silicon carbide-niobium brazing connection quality through low-expansion 4J42 alloy middle layer auxiliary brazing filler metal |
| CN114043026A (en) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | Stress relieving method in ceramic-metal |
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| CN115283770A (en) * | 2022-08-29 | 2022-11-04 | 浙江工业大学 | AgCuTi-based composite solder and method for connecting AlN ceramic and Cu through brazing |
| WO2024007453A1 (en) * | 2022-07-05 | 2024-01-11 | 中国机械总院集团宁波智能机床研究院有限公司 | Method for reducing residual stress of heterogeneous brazed joint |
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| CN109702317B (en) * | 2019-02-19 | 2021-10-22 | 中国科学院金属研究所 | Processing method for realizing high superplasticity of titanium alloy welded joint |
| CN109702317A (en) * | 2019-02-19 | 2019-05-03 | 中国科学院金属研究所 | A kind of processing method for realizing the high superplasticity property of titanium alloy welding joint |
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| CN110883397A (en) * | 2019-12-06 | 2020-03-17 | 哈尔滨工业大学 | Welding method for relieving residual stress of ceramic and metal brazed joint |
| CN110883443A (en) * | 2019-12-12 | 2020-03-17 | 郑州机械研究所有限公司 | Hard alloy brazing joint, preparation method thereof and hard alloy tool |
| CN111001890A (en) * | 2019-12-16 | 2020-04-14 | 中国电子科技集团公司第四十三研究所 | Method for reducing welding deformation of heterogeneous material |
| CN111014867B (en) * | 2019-12-24 | 2022-03-01 | 新疆大学 | Laser brazing method for titanium alloy and ceramic dissimilar materials |
| CN111014867A (en) * | 2019-12-24 | 2020-04-17 | 新疆大学 | Laser brazing method for titanium alloy and ceramic dissimilar materials |
| CN112331572B (en) * | 2021-01-04 | 2021-04-02 | 度亘激光技术（苏州）有限公司 | Packaging method of semiconductor device |
| CN112331572A (en) * | 2021-01-04 | 2021-02-05 | 度亘激光技术（苏州）有限公司 | Packaging method of semiconductor device |
| CN113732424A (en) * | 2021-09-14 | 2021-12-03 | 哈尔滨工业大学 | Method for improving silicon carbide-niobium brazing connection quality through low-expansion 4J42 alloy middle layer auxiliary brazing filler metal |
| CN113732424B (en) * | 2021-09-14 | 2022-08-02 | 哈尔滨工业大学 | Method for improving connection quality of silicon carbide-niobium brazing by aid of low-expansion 4J42 alloy interlayer auxiliary brazing filler metal |
| CN114043026A (en) * | 2021-11-12 | 2022-02-15 | 哈尔滨工业大学 | Stress relieving method in ceramic-metal |
| CN114043026B (en) * | 2021-11-12 | 2023-08-29 | 哈尔滨工业大学 | Stress relieving method in ceramic-metal |
| CN114161021A (en) * | 2021-12-17 | 2022-03-11 | 中国电子科技集团公司第十三研究所 | Sealing welding structure and welding method of air-tight micro-rectangular electric connector |
| CN114161021B (en) * | 2021-12-17 | 2023-08-15 | 中国电子科技集团公司第十三研究所 | Sealing welding structure and welding method of airtight micro-rectangular electric connector |
| CN114160899A (en) * | 2021-12-19 | 2022-03-11 | 南京理工大学 | Manufacturing method of cast aluminum engine piston component |
| WO2024007453A1 (en) * | 2022-07-05 | 2024-01-11 | 中国机械总院集团宁波智能机床研究院有限公司 | Method for reducing residual stress of heterogeneous brazed joint |
| CN115283770A (en) * | 2022-08-29 | 2022-11-04 | 浙江工业大学 | AgCuTi-based composite solder and method for connecting AlN ceramic and Cu through brazing |
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