CN108666249A - Wafer cassette and its manufacturing method - Google Patents
Wafer cassette and its manufacturing method Download PDFInfo
- Publication number
- CN108666249A CN108666249A CN201710207559.5A CN201710207559A CN108666249A CN 108666249 A CN108666249 A CN 108666249A CN 201710207559 A CN201710207559 A CN 201710207559A CN 108666249 A CN108666249 A CN 108666249A
- Authority
- CN
- China
- Prior art keywords
- wafer cassette
- bar
- long
- length
- solid iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
A kind of wafer cassette of present invention proposition and its manufacturing method, the wafer cassettes include front panel and rear panel, and the two is in opposition to each other；Bar and at least two root long bottom bars at least two root long mandrils, at least two root longs, each long mandril, it is long in bar, long bottom bar there are multiple grooves.Bar, long bottom bar have both ends in each long mandril, length, are respectively pivoted to front panel and rear panel.Bar and long bottom bar include solid iron in long mandril, length, and surface is wrapped by layer and is coated.
Description
Technical field
The present invention relates to a kind of wafer cassette (wafer cassette), more particularly to one kind having structure-improved and strengthening
The wafer cassette of accuracy and intensity.
Background technology
Wafer cassette is a kind of the device of wafer is clamped, transported between equipment with profit processing to carry out wafer or
It measures.Manipulator (robotic hand) or tooth fork (fork) can be used to be drawn off or set for the wafer for being stored in wafer cassette
Enter.
After operating with a period of time, accuracy or intensity can reduce traditional wafer cassette.For example, shrinkage heat
The swollen accuracy or intensity that can reduce wafer cassette.
The structure of traditional wafer cassette has defect, often such that manipulator (the especially front end of manipulator) is because of dislocation
And the bottom end of wafer cassette is unexpectedly bumped against, thus cause kicking down for wafer.
Has defect compared with low accuracy, intensity and structure in view of traditional wafer cassette tool, therefore a kind of novel there is an urgent need for proposing
Wafer cassette, to improve its structure and strengthen accuracy and intensity.
Invention content
In view of above-mentioned, the first purpose of the embodiment of the present invention is to propose a kind of wafer cassette, to store and transport crystalline substance
Circle.Compared to traditional wafer cassette, the wafer cassette of the present embodiment, which has, strengthens accuracy and intensity, and can avoid manipulator meaning
Other places bumps against wafer cassette.
According to embodiments of the present invention, wafer cassette includes front panel and rear panel, and the two is in opposition to each other；At least two root long tops
Bar and at least two root long bottom bars in bar, at least two root longs, each long mandril, it is long in bar, long bottom bar there are multiple grooves.It is each
Bar, long bottom bar have both ends in a long mandril, length, are respectively pivoted to front panel and rear panel.Bar and long bottom bar in long mandril, length
Including solid iron, surface are wrapped by layer and are coated.
According to another embodiment of the present invention, a kind of method of manufacture wafer cassette is provided.With injection molding processing procedure, will coat
Layer is coated on the surface of multiple solid irons, to form bar and at least two root long bottoms at least two root long mandrils, at least two root longs
Bar.The both ends of bar and long bottom bar in each long mandril, length are respectively pivoted to front panel and rear panel, wherein front panel is with after
Panel is in opposition to each other.
The beneficial effects of the present invention are compared to conventional wafer cassette, wafer cassettes proposed by the present invention, which have, to be strengthened
Accuracy and intensity, and can avoid manipulator and unexpectedly bump against wafer cassettes.
Description of the drawings
The perspective view of Fig. 1 shows the wafer cassette of the embodiment of the present invention, to store and transport wafer.
Fig. 2 shows another perspective view of the wafer cassette of Fig. 1.
Fig. 3 shows the enlarged partial view of bar and long bottom bar in the long mandril of Fig. 2, length.
Fig. 4 A show the cross section view of the long mandril of Fig. 1/Fig. 2.
Fig. 4 B show the cross section view of bar and long bottom bar in the length of Fig. 1/Fig. 2.
Wherein, the reference numerals are as follows：
100 wafer cassettes
10 wafers
11 front panels
12 rear panels
13 long mandrils
Bar in 14 length
15 long bottom bars
16 fixed links
17 connectors
111 solid irons
112 clads
Specific implementation mode
The perspective view of Fig. 1 shows the wafer cassette 100 of the embodiment of the present invention, to store and transport wafer.Fig. 2 display figures
A wafer 10, such as optical element (such as optical lens or glass) is clamped in another perspective view of 1 wafer cassette 100.In order to
Internal structure is allowed to be more easily viewed, wafer cassette 100 shown in Fig. 2 is omitted some elements and is not drawn into.
In the present embodiment, wafer cassette 100 may include front panel 11 and rear panel 12, and the two is in opposition to each other.This implementation
The wafer cassette 100 of example also may include bar 14 and at least two root long bottom bars 15 at least two root long mandrils 13, at least two root longs.Often
Bar 14, long bottom bar 15 have multiple grooves (groove) in one long mandril 13, length.Groove can entirely surround long mandril 13, length
Middle bar 14, long bottom bar 15, or part bar 14, long bottom bar 15 in long mandril 13, length.
Embodiment as shown in Figure 1 and Figure 2, two row wafer cassettes are in juxtaposition, wherein a long mandril 13 is common to two row
Between wafer cassette.However, each wafer cassette possesses bar 14 and long bottom bar 15 in the length of oneself.
Bar 14, long bottom bar 15 have both ends in each long mandril 13, length, are pivotally connected (pivotally respectively
Connected) in front panel 11 and rear panel 12.Therefore, bar 14, long bottom bar 15 are from top to bottom sequentially set in long mandril 13, length
It sets.
In the present embodiment, more by least a connection piece 17, (diagram makes bar 14 with long bottom bar 15 in the length of homonymy
With three connectors) so that the two is fixed together, thus strengthen the accuracy of wafer cassette 100.
The wafer cassette 100 of the present embodiment also may include four fixed links 16, be set to four of front panel 11 and rear panel 12
The intensity of wafer cassette 100 to make wafer cassette 100 more firm, thus is strengthened in corner.Each fixed link 16 has both ends,
It is respectively pivoted to front panel 11 and rear panel 12.
Fig. 3 shows the enlarged partial view of bar 14 and long bottom bar 15 in the long mandril 13 of Fig. 2, length, is clamped with wafer 10.
According to one of the feature of the present embodiment, the bottom of wafer 10 bears against (that is, two root long bottom bars 15) at 2 points, rather than bears against list
A bit.The wafer cassette 100 of the present embodiment has two (rather than single) and separated long bottom bar 15 so that manipulator (robotic
Hand front end) will not bump against the single long bottom bar set on centre position because of dislocation and unexpectedly, cause kicking down for wafer 10.
Fig. 4 A show the cross section view of the long mandril 13 of Fig. 1/Fig. 2, and Fig. 4 B show bar 14 and long bottom in the length of Fig. 1/Fig. 2
The cross section view of bar 15.According to another feature of the present embodiment, bar 14, long bottom bar 15 may include solid-iron in long mandril 13, length
Bar (solid-iron rod) 111, surface is wrapped by layer 112 and is coated, which can be polymer (polymer).
The clad 112 of the present embodiment includes polyether-ether-ketone (polyether rather ketone, PEEK), with excellent machine
Tool and chemoresistance can resist high temperature and cold shrinkage and thermal expansion.The long mandril 13 of the present embodiment, it is long in bar 14, long bottom bar 15 use it is real
The clad 112 of heart iron 111 and polyether-ether-ketone (PEEK), can strengthen the intensity and accuracy of wafer cassette 100, and can prevent
Peeling and warpage.In another embodiment, before coating the clad 112, the surface of solid iron 111 is more handled through texture
(texture treatment) makes its surface roughening, changes the reciprocation between solid iron 111 and clad 112, because
And more it is avoided that the peeling of clad 112.
In the present embodiment, solid iron 111 is polygonal (polygon) solid iron, and especially octagonal (octagon) is real
Heart iron.Since solid iron 111 has polygon (such as octagon) section, and noncircular cross section so that wafer 10 with it is long
It is line contact rather than point contact between bar 14, long bottom bar 15 in mandril 13, length, thus is able to mitigate stress concentration to avoid crystalline substance
Circle is broken.In addition, the articulated section of bar 14, long bottom bar 15 is with groove in front panel 11, rear panel 12 and long mandril 13, length.It is special
Other to be, the shape of the groove corresponds to the polygonal cross-section of solid iron 111.Therefore, wafer 10 can accurately be contacted with length
Bar 14, long bottom bar 15 in mandril 13, length.
According to the further feature of the present embodiment, the clad 112 for coating solid iron 111 is to use injection molding
(injection moulding) process technique and be integrally formed manufacture.In details of the words, solid iron 111 is locked into tool first
In the mold of groove shape, then covering material (such as polyether-ether-ketone) is poured into around solid iron 111, thus form cladding
Layer 112 surrounds solid iron 111, and is formed with groove in the surface of clad 112.Compared to using computer numerical control
(CNC) polyether-ether-ketone (PEEK) bar that tool institute vehicle comes out, the clad 112 of the present embodiment can not only strengthen wafer cassette 100
Intensity and accuracy, and can prevent peel off and warpage.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not limited to the guarantor of claims of the present invention
Protect range；The equivalent change or modification completed under all other spirit disclosed without departing from invention, should be included in following
In the protection domain of claims.
Claims (20)
1. a kind of wafer cassette, including：
One front panel and a rear panel, the two are in opposition to each other；And
Bar and at least two root long bottom bars at least two root long mandrils, at least two root longs, bar, the length in each long mandril, the length
Bottom bar has multiple grooves；
Bar, the long bottom bar have both ends in wherein each long mandril, the length, are respectively pivoted to the front panel and the rear panel；
Bar, the long bottom bar include solid iron wherein in the long mandril, the length, and surface is wrapped by layer and is coated.
2. wafer cassette according to claim 1 by the bar in the length of homonymy and is somebody's turn to do also comprising at least a connection piece
Long bottom bar links together.
3. wafer cassette according to claim 1 also includes four fixed links, is set to four of the front panel and the rear panel
Corner, each fixed link have both ends, are respectively pivoted to the front panel and the rear panel.
4. wafer cassette according to claim 1, the wherein clad include polymer.
5. wafer cassette according to claim 4, the wherein clad include polyether-ether-ketone.
6. wafer cassette according to claim 1, before coating the clad, the surface of the solid iron through texture at
Reason.
7. wafer cassette according to claim 1, the wherein solid iron are polygonal solid iron.
8. wafer cassette according to claim 7, the wherein solid iron are octagonal solid iron.
9. bar in wafer cassette according to claim 7, the wherein front panel, the rear panel and the long mandril, the length, should
There is groove, the wherein shape of the groove to correspond to the polygonal cross-section of the polygonal solid iron for the articulated section of long bottom bar.
10. wafer cassette according to claim 1, the wherein clad are to be integrally formed system using injection molding processing procedure
It makes.
11. a kind of method of manufacture wafer cassette, including：
Multiple solid irons are provided；
With injection molding processing procedure, clad is coated on to the surface of the multiple solid iron, with formed at least two root long mandrils,
Bar and at least two root long bottom bars at least two root longs；And
The both ends of bar in each long mandril, the length, the long bottom bar are respectively pivoted to a front panel and a rear panel, before this
Plate and the rear panel are in opposition to each other.
12. according to the method for manufacturing wafer cassette described in claim 11, wherein the injection molding processing procedure includes by the solid-iron
Lever lock enters to have in the mold of groove shape, then pours into covering material around the solid iron, thus in the table of the clad
Face forms multiple grooves.
13. according to the method for manufacturing wafer cassette described in claim 12, wherein the covering material includes polymer.
14. according to the method for manufacturing wafer cassette described in claim 12, wherein the covering material includes polyether-ether-ketone.
Also include a step, using at least a connection piece by position 15. according to the method for manufacturing wafer cassette described in claim 11
Bar links together with the long bottom bar in the length of homonymy.
16. according to the method for manufacturing wafer cassette described in claim 11, also includes a step, four fixed links are set to before this
Four corners of plate and the rear panel, wherein the both ends of each fixed link are respectively pivoted to the front panel and the rear panel.
Also include a step pair before coating the clad 17. according to the method for manufacturing wafer cassette described in claim 11
The surface of the solid iron carries out texture processing.
18. according to the method for manufacturing wafer cassette described in claim 11, wherein the solid iron is polygonal solid iron.
19. according to the method for manufacturing wafer cassette described in claim 18, wherein the solid iron is octagonal solid iron.
20. according to described in claim 18 manufacture wafer cassette method, also include a step, in the long mandril, the length bar,
The articulated section of the long bottom bar and the front panel, the rear panel forms groove, and the wherein shape of the groove is polygonal solid corresponding to this
The polygonal cross-section of iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710207559.5A CN108666249A (en) | 2017-03-31 | 2017-03-31 | Wafer cassette and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710207559.5A CN108666249A (en) | 2017-03-31 | 2017-03-31 | Wafer cassette and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108666249A true CN108666249A (en) | 2018-10-16 |
Family
ID=63783657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710207559.5A Pending CN108666249A (en) | 2017-03-31 | 2017-03-31 | Wafer cassette and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108666249A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5863334A (en) * | 1997-06-20 | 1999-01-26 | Winbond Electronics Corp. | Strength-enhanced quartz boat |
| KR100447636B1 (en) * | 2002-01-29 | 2004-09-13 | 김봉희 | Box for handling glass substrates |
| CN2833883Y (en) * | 2005-11-08 | 2006-11-01 | 深圳市捷佳创精密设备有限公司 | Silicon wafer basket |
| CN102629564A (en) * | 2011-02-08 | 2012-08-08 | 象牙弗隆泰克株式会社 | Solar wafer cassette |
| WO2012174432A2 (en) * | 2011-06-15 | 2012-12-20 | Entegris, Inc. | Solar cell process carrier |
| CN202640952U (en) * | 2012-06-18 | 2013-01-02 | 东远机械工业(昆山)有限公司 | Adjusting and positioning structure for clamping case |
| CN204144294U (en) * | 2014-09-15 | 2015-02-04 | 中电投西安太阳能电力有限公司 | Silicon wafer bearing box |
| CN204857690U (en) * | 2015-08-20 | 2015-12-09 | 上海嘉氟新材料科技有限公司 | Silicon chip slide glass basket |
-
2017
- 2017-03-31 CN CN201710207559.5A patent/CN108666249A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5863334A (en) * | 1997-06-20 | 1999-01-26 | Winbond Electronics Corp. | Strength-enhanced quartz boat |
| KR100447636B1 (en) * | 2002-01-29 | 2004-09-13 | 김봉희 | Box for handling glass substrates |
| CN2833883Y (en) * | 2005-11-08 | 2006-11-01 | 深圳市捷佳创精密设备有限公司 | Silicon wafer basket |
| CN102629564A (en) * | 2011-02-08 | 2012-08-08 | 象牙弗隆泰克株式会社 | Solar wafer cassette |
| WO2012174432A2 (en) * | 2011-06-15 | 2012-12-20 | Entegris, Inc. | Solar cell process carrier |
| CN202640952U (en) * | 2012-06-18 | 2013-01-02 | 东远机械工业(昆山)有限公司 | Adjusting and positioning structure for clamping case |
| CN204144294U (en) * | 2014-09-15 | 2015-02-04 | 中电投西安太阳能电力有限公司 | Silicon wafer bearing box |
| CN204857690U (en) * | 2015-08-20 | 2015-12-09 | 上海嘉氟新材料科技有限公司 | Silicon chip slide glass basket |
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