CN108659461A - A kind of preparation method of PTFE bases PCB copper-clad plate prepregs - Google Patents
A kind of preparation method of PTFE bases PCB copper-clad plate prepregs Download PDFInfo
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- CN108659461A CN108659461A CN201810340380.1A CN201810340380A CN108659461A CN 108659461 A CN108659461 A CN 108659461A CN 201810340380 A CN201810340380 A CN 201810340380A CN 108659461 A CN108659461 A CN 108659461A
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- Prior art keywords
- ptfe
- clad plate
- powders
- copper
- pcb copper
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- 229920001343 polytetrafluoroethylene Polymers 0.000 title claims abstract description 49
- 239000004810 polytetrafluoroethylene Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000011858 nanopowder Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims abstract description 7
- 239000004744 fabric Substances 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 20
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 8
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 6
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 32
- 238000000034 method Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- -1 Polytetrafluoroethylene Polymers 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2427/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2427/18—Homopolymers or copolymers of tetrafluoroethylene
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention discloses a kind of preparation methods of PTFE bases PCB copper-clad plate prepregs, including：A certain proportion of curing agent, accelerating agent and stirring solvent are uniformly first obtained into clear solution, a certain proportion of resin then is being added, after stirring a period of time so that resin is completely dissolved；A certain amount of PTFE nano-powders and acetone are then added, and is stirred under certain rotating speed, until PTFE nano-powders are evenly dispersed；Finally again by glass-fiber-fabric immerse gluing, drying and etc., prepare the PCB copper-clad plate prepregs of PTFE bases.The present invention is mixed to get PCB base copper-clad plate prepregs by PTFE nano-powders and epoxy resin makes the dielectric properties of copper-clad plate prepreg greatly improve due to the addition of PTFE powders, plays an important roll to the application of 5G epoch frequency PCB copper-clad plates.
Description
Technical field
The present invention relates to a kind of preparation methods of PTFE bases PCB copper-clad plate prepregs, belong to the preparation neck of PCB copper-clad plates
Domain.
Background technology
Printed circuit board (Printed Circuit Board, PCB) is important electronic unit, is electronic component
Supporter is the carrier of electronic component electrical connection.With being constantly progressive for electronic information technology development, electronic equipment high frequency
Change is development trend, especially as wireless network, satellite communication it is growing, information products constantly move towards at a high speed and high frequency
Change.Development new generation product is required for frequency PCB plate, the especially communication products such as satellite system, mobile phone reception base station necessary
It using high-frequency circuit board, applies with these and is rapidly developed within the coming years, can have wilderness demand to frequency PCB plate.
Polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene, PTFE) has excellent dielectric properties, it is current
Until the best organic material of the dielectric properties that find, excellent dielectric properties are conducive to signal integrity and rapidly transmit.PTFE
Also high-fire resistance and weather-resistant property, these performance guarantee electronic equipments can under relatively rugged environment long-term normal work
Make, such as exposure outdoors, the temperature difference convert big place.So PTFE base copper-clad plates are that the fields such as military affairs, space flight and aviation are indispensable
One of few material.But how to be combined PTFE with existing common FR4 copper-clad plates, it is the problem of everybody pays close attention to jointly.
PTFE is since the structure of high degree of symmetry and its characteristic of F elements make the surfaces PTFE very smooth, it is difficult to adhere to any substance.
Therefore those skilled in the art are dedicated to developing a kind of method that PTFE can be made to be combined with existing common copper-clad plate prepreg,
It lays the first stone to the requirements at the higher level of pcb board for the 5G epoch.
Invention content
Goal of the invention：In order to overcome the deficiencies in the prior art, a kind of PTFE bases PCB copper-clad plates of present invention offer half
PTFE nano-powders are added on the basis of conventional copper-clad plate prepreg preparation process in the preparation method of cured sheets, to big
The big dielectric properties for improving copper-clad plate prepreg, lay the first stone to the requirements at the higher level of pcb board for the 5G epoch.
Technical solution：To achieve the above object, the technical solution adopted by the present invention is：
A kind of preparation method of PTFE bases PCB copper-clad plate prepregs, includes the following steps：
S1：Curing agent dicyandiamide and accelerating agent methylimidazole are put into solvent dimethylformamide, stirring keeps its molten
Solution obtains transparency liquid A；
S2：Epoxy resin is put into transparency liquid A, stirring makes epoxy resin be completely dissolved, and obtains uniformly sticky liquid
Body B；
S3：PTFE nano-powders are added in liquid B to and are added suitable acetone, stir to get uniform solution C；
S4：Glass-fiber-fabric is infiltrated 20-30 minutes in solution C, is dried in the good place of ventilation condition after taking-up；
S5：Sample after drying is put into baking oven, is dried 1-2 hours with 185-210 DEG C of temperature；
S6：The prepreg of drying is taken out, cutting edge is carried out with edge cutting machine, obtains the PTFE base PCB copper-clad plates half of finished product
Cured sheets.
The operation principle of the present invention is that：It is epoxy resin and PTFE nano-powders to want ingredient, and PTFE bases copper-clad plate half is solid
Changing piece is prepared by adding PTEFE nano-powders in the epoxy.The dielectric properties of copper-clad plate are adjusted by PTFE,
The grain size of PTFE nano-powders is 1-10 nanometers.
Further, the proportion scale of each component is：1000-5000 parts of epoxy resin, 5-9 parts of the double cyanogen of curing agent
Amine, 1-6 parts of accelerating agent methylimidazole, 20-30 parts of solvent dimethylformamide, the PTFE nano powders of 000 part of 1000-50
20-50 milliliters of acetone is added in body.
Further, it in the step S1, is stirred 3-5 minutes with 100-200 rpms of rate, obtains transparency liquid
A。
Further, it in the step S2, is stirred 30-60 minutes with 100-200 rpms of rate, is uniformly glued
Thick liquid B.
Further, it in the step S3, is stirred 2-5 hours, is obtained uniform with 800-1000 rpms of speed
Solution C.
Further, the grain size of the PTFE nano-powders is 1-10 nanometers.
Advantageous effect：The preparation method of a kind of PTFE bases PCB copper-clad plate prepregs provided by the invention, relative to existing
Technology has the following advantages：(1) manufacture craft is simple, and cost is relatively low, and the operation cycle is short, and Repeatability is good, is suitble to volume production；(2)
PTFE nano-powders are added on the basis of common epoxy type copper-clad plate prepreg, so that Jie of copper-clad plate prepreg
Electrical property greatly promotes, and lays the first stone to the requirements at the higher level of pcb board for the 5G epoch.
Specific implementation mode
The present invention is further described with reference to embodiment.
Embodiment 1：
A kind of preparation method of PTFE bases PCB copper-clad plate prepregs, includes the following steps：
S1：7 parts of curing agent dicyandiamide and 2 parts of accelerating agent methylimidazole are put into 20 parts of solvent dimethylformamide
In, it is stirred 4 minutes, is made it dissolve as transparency liquid A with 120 rpms of rate；
S2：1000 parts of epoxy resin is put into transparency liquid A, is stirred 40 minutes, is made with 120 rpms of rate
Epoxy resin is completely dissolved, and obtains uniformly sticky liquid B；
S3：The PTFE nano-powders that grain size is 5 nanometers, weight is 20 000 parts are added in liquid B, and 30 millis are added
Then the acetone risen is stirred 3 hours with 800 rpms of speed, obtains uniform solution C；
S4：Glass-fiber-fabric is infiltrated 25 minutes in solution C, is dried in the good place of ventilation condition after taking-up；
S5：Sample after drying is put into baking oven, is dried 1 hour with 200 DEG C of temperature.
S6：The prepreg of drying is taken out, cutting edge is carried out with edge cutting machine, obtains the PTFE base PCB copper-clad plates half of finished product
Cured sheets.
The prepreg vector network analyzer that will be obtained is tested its dielectric properties with resonant cavity method, is implemented
The dielectric constant for the substrate that 1 method of example obtains is 2.312, and dielectric loss tangent value is 0.000198.
Embodiment 2：
A kind of preparation method of PTFE bases PCB copper-clad plate prepregs, includes the following steps：
S1：8 parts of curing agent dicyandiamide and 6 parts of accelerating agent methylimidazole are put into 30 parts of solvent dimethylformamide
In, it is stirred 5 minutes, is made it dissolve as transparency liquid A with 200 rpms of rate；
S2：1000 parts of epoxy resin is put into transparency liquid A, is stirred 60 minutes, is made with 200 rpms of rate
Epoxy resin is completely dissolved, and obtains uniformly sticky liquid B；
S3：The PTFE nano-powders that grain size is 10 nanometers, weight is 50 000 parts are added in liquid B, are added appropriate
Acetone, then stirred 5 hours with 1000 rpms of speed, obtain uniform solution C；
S4：Glass-fiber-fabric is infiltrated 30 minutes in solution C, is dried in the good place of ventilation condition after taking-up；
S5：Sample after drying is put into baking oven, is dried 2 hours with 210 DEG C of temperature.
S6：The prepreg of drying is taken out, cutting edge is carried out with edge cutting machine, obtains the PTFE base PCB copper-clad plates half of finished product
Cured sheets.
The substrate vector network analyzer that will be obtained tests its dielectric properties with resonant cavity method, obtains 2 side of embodiment
The dielectric constant for the substrate that method obtains is 2.298, and dielectric loss tangent value is 0.000192.
In addition, show by the way that PTFE nano-powders are added in the epoxy by a large amount of experimental data, it can be significantly
Improve the dielectric properties of copper-clad plate.
The above is only a preferred embodiment of the present invention, it should be pointed out that：For the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (6)
1. a kind of preparation method of PTFE bases PCB copper-clad plate prepregs, which is characterized in that include the following steps：
S1：Curing agent dicyandiamide and accelerating agent methylimidazole are put into solvent dimethylformamide, stirred to dissolve
To transparency liquid A；
S2：Epoxy resin is put into transparency liquid A, stirring makes epoxy resin be completely dissolved, and obtains uniformly sticky liquid B；
S3：PTFE nano-powders are added in liquid B and are added acetone, stir to get uniform solution C；
S4：Glass-fiber-fabric is infiltrated 20-30 minutes in solution C, is dried in the good place of ventilation condition after taking-up；
S5：Sample after drying is put into baking oven, is dried 1-2 hours with 185-210 DEG C of temperature；
S6：The prepreg of drying is taken out, cutting edge is carried out with edge cutting machine, obtains the PTFE base PCB copper-clad plate semi-solid preparations of finished product
Piece.
2. a kind of preparation method of PTFE bases PCB copper-clad plate prepregs according to claim 1, which is characterized in that institute
The proportion scale for stating each component is：1000-5000 parts of epoxy resin, 5-9 parts of curing agent dicyandiamide, 1-6 parts of accelerating agent two
Methylimidazole, 20-30 parts of solvent dimethylformamide, the PTFE nano-powders of 000 part of 1000-50.
3. a kind of preparation method of PTFE bases PCB copper-clad plate prepregs according to claim 1, which is characterized in that institute
It states in step S1, is stirred 3-5 minutes with 100-200 rpms of rate, obtain transparency liquid A.
4. a kind of preparation method of PTFE bases PCB copper-clad plate prepregs according to claim 1, which is characterized in that institute
It states in step S2, is stirred 30-60 minutes with 100-200 rpms of rate, obtain uniformly sticky liquid B.
5. a kind of preparation method of PTFE bases PCB copper-clad plate prepregs according to claim 1, which is characterized in that institute
It states in step S3, is stirred 2-5 hours with 800-1000 rpms of speed, obtain uniform solution C.
6. a kind of preparation method of PTFE bases PCB copper-clad plate prepregs according to claim 1, which is characterized in that institute
The grain size for stating PTFE nano-powders is 1-10 nanometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810340380.1A CN108659461A (en) | 2018-04-17 | 2018-04-17 | A kind of preparation method of PTFE bases PCB copper-clad plate prepregs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810340380.1A CN108659461A (en) | 2018-04-17 | 2018-04-17 | A kind of preparation method of PTFE bases PCB copper-clad plate prepregs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108659461A true CN108659461A (en) | 2018-10-16 |
Family
ID=63783609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810340380.1A Pending CN108659461A (en) | 2018-04-17 | 2018-04-17 | A kind of preparation method of PTFE bases PCB copper-clad plate prepregs |
Country Status (1)
| Country | Link |
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| CN (1) | CN108659461A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226033A (en) * | 2011-05-03 | 2011-10-26 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same |
| CN102558858A (en) * | 2011-12-22 | 2012-07-11 | 云南云天化股份有限公司 | Resin compound for copper-coated laminated boards and prepreg |
| EP3115416A1 (en) * | 2014-03-03 | 2017-01-11 | Shengyi Technology Co., Ltd. | Thermosetting resin composition and use thereof |
-
2018
- 2018-04-17 CN CN201810340380.1A patent/CN108659461A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226033A (en) * | 2011-05-03 | 2011-10-26 | 广东生益科技股份有限公司 | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same |
| CN102558858A (en) * | 2011-12-22 | 2012-07-11 | 云南云天化股份有限公司 | Resin compound for copper-coated laminated boards and prepreg |
| EP3115416A1 (en) * | 2014-03-03 | 2017-01-11 | Shengyi Technology Co., Ltd. | Thermosetting resin composition and use thereof |
Non-Patent Citations (1)
| Title |
|---|
| 杜仕国: "《轻量化材料技术》", 31 January 2014, 国防工业出版社 * |
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Application publication date: 20181016 |
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