CN108659245B - 一种屏蔽增强周期结构 - Google Patents

一种屏蔽增强周期结构 Download PDF

Info

Publication number
CN108659245B
CN108659245B CN201810474220.6A CN201810474220A CN108659245B CN 108659245 B CN108659245 B CN 108659245B CN 201810474220 A CN201810474220 A CN 201810474220A CN 108659245 B CN108659245 B CN 108659245B
Authority
CN
China
Prior art keywords
periodic structure
shielding
graphene
band
magnetic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810474220.6A
Other languages
English (en)
Other versions
CN108659245A (zh
Inventor
黄贤俊
刘继斌
刘培国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National University of Defense Technology
Original Assignee
National University of Defense Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National University of Defense Technology filed Critical National University of Defense Technology
Priority to CN201810474220.6A priority Critical patent/CN108659245B/zh
Publication of CN108659245A publication Critical patent/CN108659245A/zh
Application granted granted Critical
Publication of CN108659245B publication Critical patent/CN108659245B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D101/00Coating compositions based on cellulose, modified cellulose, or cellulose derivatives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/43Thickening agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/70Additives characterised by shape, e.g. fibres, flakes or microspheres
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00Coated paper; Coating material
    • D21H19/36Coatings with pigments
    • D21H19/38Coatings with pigments characterised by the pigments
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00Coated paper; Coating material
    • D21H19/36Coatings with pigments
    • D21H19/38Coatings with pigments characterised by the pigments
    • D21H19/385Oxides, hydroxides or carbonates
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00Coated paper; Coating material
    • D21H19/36Coatings with pigments
    • D21H19/44Coatings with pigments characterised by the other ingredients, e.g. the binder or dispersing agent
    • D21H19/46Non-macromolecular organic compounds
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00Coated paper; Coating material
    • D21H19/36Coatings with pigments
    • D21H19/44Coatings with pigments characterised by the other ingredients, e.g. the binder or dispersing agent
    • D21H19/52Cellulose; Derivatives thereof
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00Coated paper; Coating material
    • D21H19/36Coatings with pigments
    • D21H19/44Coatings with pigments characterised by the other ingredients, e.g. the binder or dispersing agent
    • D21H19/56Macromolecular organic compounds or oligomers thereof obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/04Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08J2327/06Homopolymers or copolymers of vinyl chloride
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2401/00Characterised by the use of cellulose, modified cellulose or cellulose derivatives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2401/00Characterised by the use of cellulose, modified cellulose or cellulose derivatives
    • C08J2401/08Cellulose derivatives
    • C08J2401/26Cellulose ethers
    • C08J2401/28Alkyl ethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2265Oxides; Hydroxides of metals of iron
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/01Magnetic additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明提供一种屏蔽增强周期结构,包括设置在支撑衬底上的单层结构或至少两组层叠设置的单层结构,所述单层结构为由石墨烯基磁性导电复合材料制作成的带阻型周期结构;相邻两组单层结构之间设有中间隔离层;以质量分数计所述石墨烯基磁性导电复合材料包括以下组分:石墨烯0.1‑50%、磁性材料0.1‑50%、粘结剂0‑40%、功能性助剂0‑40%以及余量的溶剂。应用本发明的技术方案,效果是:便于制作,且可获得高屏蔽效果产品。

Description

一种屏蔽增强周期结构
技术领域
本发明涉及电磁屏蔽技术领域,具体涉及一种屏蔽增强周期结构。
背景技术
电磁屏蔽材料主要功能是对电磁波信号进行屏蔽,防止外界电磁波进入到某个保护区域中。屏蔽材料在电子与通信设备电磁兼容与防护、防静电、抗干扰等方面应用广泛。
传统屏蔽材料主要通过电屏蔽、磁屏蔽和电磁屏蔽的原理,主要采用金属材料如金、银、铜、铝、铁、石墨、炭黑等导电材料,或采用镍等磁性材料,以及导电材料和镍等磁性材料两者的混合。然而金属材料中,金银等贵金属造价昂贵,成本高。而其它铜铝等金属材料容易氧化,不利于长期稳定性。石墨、炭黑等碳材料导电率低、屏蔽效能不够。磁性材料由于比重大、功能单一,单独磁性材料也难以达到理想的屏蔽效果。为此,人们提出了复合材料的方法,结合导电金属与磁性材料,从电、磁两个方面进行屏蔽。复合材料不但可以达到已定的屏蔽效能,而且具有可共形印刷、涂敷等特征,具有一定的优势。但是,在复合材料的制备过程中,需要引入大量的非导电粘连剂,大大提高了导电载体之间的接触电阻,降低了电屏蔽性能。
因此,开发一种新的屏蔽增强周期结构具有重要应用意义。
发明内容
本发明目的在于提供一种屏蔽性能好且易加工的屏蔽增强周期结构,具体技术方案如下:
一种屏蔽增强周期结构,该屏蔽增强周期结构包括设置在支撑衬底上的单层结构或至少两组层叠设置的单层结构,所述单层结构为由石墨烯基磁性导电复合材料制作成的带阻型周期结构;相邻两组单层结构之间设有中间隔离层;
以质量分数计所述石墨烯基磁性导电复合材料包括以下组分:石墨烯0.1-50%、磁性材料0.1-50%、粘结剂0-40%、功能性助剂0-40%以及余量的溶剂。
以上技术方案中优选的,所述石墨烯基磁性导电复合材料制作成带阻型周期结构的方式为丝网印刷、平版印刷、凹版印刷、凸版印刷、孔版印刷或涂布中的至少一种。
以上技术方案中优选的,所述带阻型周期结构为宽带、窄带或多频带阻。
以上技术方案中优选的,所述石墨烯为片状结构,其片径为0.01-100微米;所述磁性材料的磁导率为100×10-6-20000×10-6H/m;所述单层结构为经过辊压处理后的结构。
以上技术方案中优选的,所述磁性材料为片状或颗粒状结构,所述磁性材料为镍、镍铁合金、铁氧体、钕铁硼、钐钴磁体、铝镍钴磁铁以及铁铬钴磁铁中的至少一种;所述磁性材料为导电型磁性材料。
以上技术方案中优选的,所述粘结剂为环氧树脂、纤维素类树脂以及丙烯酸类树脂中的至少一种;所述粘结剂的分子量为1000-1000000。
以上技术方案中优选的,所述功能性助剂为分散剂、流平剂、消泡剂、防沉剂、触变剂以及增稠剂中的至少一种。
以上技术方案中优选的,所述溶剂为醇类、醚类、酮类以及酯类中的至少一种。
以上技术方案中优选的,所述溶剂为具有水溶性的溶剂。
应用本发明的技术方案,具有以下有益效果:
1、本发明屏蔽增强周期结构为基于石墨烯基磁性材料的高导电复合周期结构,充分发挥材料的电屏蔽和磁屏蔽性能,又采用带阻型电磁周期结构进一步增强特定频段的屏蔽效能。
2、本发明充分利用了石墨烯材料的高导电、抗氧化、柔韧性、易复合、低成本的特征,避免了贵金属及易氧化金属的使用,大幅降低了成本提高了稳定性。
3、本发明充分利用了石墨烯的大比表面特征,将其与镍等磁性材料复合形成石墨烯基磁性导电复合材料,形成可规模化图案化印刷、涂敷的复合材料,使得其磁屏蔽及易加工性能提升。
4、为克服传统复合材料屏蔽性能下降的缺陷,本发明充分利用石墨烯基磁性导电复合材料易于图案化成膜的特征,采用丝网印刷、平版印刷、凹版印刷、凸版印刷或孔版印刷、涂布等增材加工方式进行阻带型电磁周期结构加工,从而进一步提高屏蔽效能。
5、本发明的屏蔽增强周期结构具有便于大规模、低成本、高效率生产的特性。
除了上面所描述的目的、特征和优点之外,本发明还有其它的目的、特征和优点。下面将参照图,对本发明作进一步详细的说明。
附图说明
构成本申请的一部分的附图用来提供对本发明的进一步理解,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。在附图中:
图1是本发明优选实施例1的屏蔽增强周期结构制作原理图;
图2是实施例1中屏蔽增强周期结构的剖视图;
图3是图2中带阻型周期结构的结构示意图;
图4是本发明实施例2中带阻型周期结构的结构示意图;
图5是本发明实施例3中带阻型周期结构的结构示意图;
图6是本发明实施例5中屏蔽增强周期结构的剖视图;
其中:1、支撑衬底,2、单层结构,3、图案,4、中间隔离层。
具体实施方式
以下结合附图对本发明的实施例进行详细说明,但是本发明可以根据权利要求限定和覆盖的多种不同方式实施。
实施例1:
一种屏蔽增强周期结构,该屏蔽增强周期结构包括设置在支撑衬底1上的单层结构2,所述单层结构为由石墨烯基磁性导电复合材料制作成的带阻型周期结构,支撑衬底为非柔性基材(如泡沫、聚氯乙烯基材等)或柔性基材(如聚对苯二甲酸乙二醇酯基材、聚醚酰亚胺基材、纸张等),详情如下:
以质量分数计所述石墨烯基磁性导电复合材料包括以下组分:石墨烯0.5%、磁性材料1.0%、粘结剂20%、功能性助剂20%以及余量的溶剂(58.5%),所述磁性材料的磁导率为20000×10-6H/m。所述石墨烯为片状结构,其片径为50微米;所述磁性材料为片状结构,所述磁性材料为镍、铁氧体以及钕铁硼按照重量比1:1:1的配比混合而成;所述粘结剂为纤维素类树脂,所述粘结剂的分子量为100000-1000000;20%的功能性助剂由10%的分散剂(优选十六烷基三甲基溴化铵)、5%的流平剂(优选丁基纤维素)以及5%的增稠剂(优选聚乙烯酰胺)混合而成;所述溶剂为醇类,具体为乙醇。
所述石墨烯基磁性导电复合材料制作成带阻型周期结构的方式为丝网印刷,具体是:根据设计的宽带带阻型周期结构,制作丝印网版;将支撑衬底置于丝印网版下,隔离1毫米距离,采用0.1m/s速度印刷,将所制备的石墨烯基磁性导电复合材料沉积在支撑衬底上,形成设计的图案3;将所印物放入真空烘箱150度,15分钟,得到产品。本实施例的屏蔽增强周期结构制作原理详见图1,结构详见图2。
通过分形结构的设计,所述带阻型周期结构为宽带,详见图3,图3中的深灰色为印刷的石墨烯基磁性导电复合材料。
本实施例所得屏蔽增强周期结构的性能详见表1。
实施例2:
一种屏蔽增强周期结构,该屏蔽增强周期结构包括设置在支撑衬底1上的单层结构,所述单层结构为由石墨烯基磁性导电复合材料制作成的带阻型周期结构,详情如下:
以质量分数计所述石墨烯基磁性导电复合材料包括以下组分:石墨烯10%、磁性材料10%以及余量的溶剂(80%),所述磁性材料的磁导率为10000×10-6H/m。所述石墨烯为片状结构,其片径为20微米;所述磁性材料为片状结构,所述磁性材料为镍、铁氧体、钐钴磁体以及铝镍钴磁铁按照重量比1:1:1:1的配比混合而成;所述溶剂为去离子水。
所述石墨烯基磁性导电复合材料制作成带阻型周期结构的方式为平版印刷,具体是:根据设计的窄带带阻型周期结构,制作平版印刷网版;将支撑衬底置于平版网版下,采用0.1m/s速度印刷,将所制备的石墨烯基磁性导电复合材料沉积在支撑衬底上,形成设计图案;将所印物放入真空烘箱200度,10分钟,得到样品。将样品进行辊压处理,辊压压力25吨,辊轮速度1厘米/秒,得到产品。
所述带阻型周期结构为窄带,详见图4。
本实施例所得屏蔽增强周期结构的性能详见表1。
实施例3:
一种屏蔽增强周期结构,该屏蔽增强周期结构包括设置在支撑衬底1上的单层结构,所述单层结构为由石墨烯基磁性导电复合材料制作成的带阻型周期结构,详情如下:
以质量分数计所述石墨烯基磁性导电复合材料包括以下组分:石墨烯4%、磁性材料20%、粘结剂40%、功能性助剂25%以及余量的溶剂(11%),所述磁性材料的磁导率为5000×10-6H/m。所述石墨烯为片状结构,其片径为0.05微米;所述磁性材料为片状结构,所述磁性材料为镍、铝镍钴磁铁以及铁铬钴磁铁按照重量比1:2:1的配比混合而成;所述粘结剂为丙烯酸类树脂,所述粘结剂的分子量为500000-100000;25%的功能性助剂由13%的分散剂(优选十六烷基三甲基溴化铵)以及12%的增稠剂(优选聚乙烯酰胺)混合而成;所述溶剂为醚类,具体为乙醚。
所述石墨烯基磁性导电复合材料制作成带阻型周期结构的方式为涂布,具体是:根据设计的多频带阻型周期结构,制作涂布网版。将支撑衬底置于网版下,涂布厚度10微米,将所制备的石墨烯基磁性导电复合材料涂布在支撑衬底上,形成设计图案。将所印物放入真空烘箱250度,10分钟,得到样品。将样品进行辊压处理,辊压压力25吨,辊轮速度1厘米/秒;得到产品。
所述带阻型周期结构为多频带阻,详见图5。
本实施例所得屏蔽增强周期结构的性能详见表1。
实施例4:
一种屏蔽增强周期结构,与实施例3不同之处仅在于:将样品进行辊压处理,辊压压力50吨,辊轮速度1厘米/秒。
本实施例所得屏蔽增强周期结构的性能详见表1。
实施例5:
一种屏蔽增强周期结构,详见图6,该屏蔽增强周期结构包括设置在支撑衬底1上的两组层叠设置的单层结构2,所述单层结构为由石墨烯基磁性导电复合材料制作成的带阻型周期结构,相邻两组单层结构之间设有中间隔离层4(中间隔离层一般采用现有技术中绝缘且透波的材质),详情如下:
以质量分数计所述石墨烯基磁性导电复合材料包括以下组分:石墨烯10%、磁性材料10%以及余量的溶剂(80%),所述磁性材料的磁导率为10000×10-6H/m。所述石墨烯为片状结构,其片径为20微米;所述磁性材料为片状结构,所述磁性材料为镍、铁氧体、钐钴磁体以及铝镍钴磁铁按照重量比1:1:1:1的配比混合而成;所述溶剂为去离子水。
所述石墨烯基磁性导电复合材料制作成带阻型周期结构的方式为平版印刷,具体是:根据设计的窄带带阻型周期结构,制作平版印刷网版;将支撑衬底置于平版网版下,采用0.1m/s速度印刷,将所制备的石墨烯基磁性导电复合材料沉积在支撑衬底上,形成设计的图案3;将所印物放入真空烘箱200度,10分钟,得到样品。将样品进行辊压处理,辊压压力25吨,辊轮速度1厘米/秒;在第一层印刷之后,通过涂敷一层隔离层,隔离层厚度2mm,再在其上采用同样方式印刷同样的带阻型周期结构,完成多层结构加工;得到产品。
所述带阻型周期结构为窄带,窄带结构与实施例2相同。
本实施例所得屏蔽增强周期结构的性能详见表1。
表1实施例1-5所得屏蔽增强周期结构的性能统计表
Figure BDA0001664003030000061
由表1可知:
通过实施例1-5可知,采用本发明的技术方案,某工作频段的屏蔽效果好,均可达40dB以上,与现有技术中的20dB比较,取得显著进步。
通过实施案例3和实施例4比较可知:增强辊压压力,可在工作频段5.3-6.8GHz,7.2-8.6GHz内分别增强屏蔽8-9dB。这主要是辊压压力增强提高了电屏蔽性。
通过实施例2和实施例5比对可知:多层结构显著增强屏蔽,工作频率保持稳定。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。

Claims (10)

1.一种屏蔽增强周期结构,其特征在于,该屏蔽增强周期结构包括设置在支撑衬底上的单层结构或至少两组层叠设置的单层结构,所述单层结构为由石墨烯基磁性导电复合材料制作成的带阻型周期结构;相邻两组单层结构之间设有中间隔离层;
以质量分数计所述石墨烯基磁性导电复合材料包括以下组分:石墨烯0.1-50%、磁性材料0.1-50%、粘结剂0-40%、功能性助剂0-40%以及余量的溶剂。
2.根据权利要求1所述的屏蔽增强周期结构,其特征在于,所述石墨烯基磁性导电复合材料制作成带阻型周期结构的方式为丝网印刷、平版印刷、凹版印刷、凸版印刷、孔版印刷或涂布中的至少一种。
3.根据权利要求2所述的屏蔽增强周期结构,其特征在于,所述带阻型周期结构为宽带、窄带或多频带阻。
4.根据权利要求1-3任意一项所述的屏蔽增强周期结构,其特征在于,所述石墨烯为片状结构,其片径为0.01-100微米;所述磁性材料的磁导率为100×10-6-20000×10-6H/m;所述单层结构为经过辊压处理后的结构。
5.根据权利要求4所述的屏蔽增强周期结构,其特征在于,所述磁性材料为片状或颗粒状结构,所述磁性材料为镍、镍铁合金、铁氧体、钕铁硼、钐钴磁体、铝镍钴磁铁以及铁铬钴磁铁中的至少一种。
6.根据权利要求5所述的屏蔽增强周期结构,其特征在于,所述磁性材料为导电型磁性材料。
7.根据权利要求4所述的屏蔽增强周期结构,其特征在于,所述粘结剂为环氧树脂、纤维素类树脂以及丙烯酸类树脂中的至少一种;所述粘结剂的分子量为1000-1000000。
8.根据权利要求4所述的屏蔽增强周期结构,其特征在于,所述功能性助剂为分散剂、流平剂、消泡剂、防沉剂、触变剂以及增稠剂中的至少一种。
9.根据权利要求4所述的屏蔽增强周期结构,其特征在于,所述溶剂为醇类、醚类、酮类以及酯类中的至少一种。
10.根据权利要求9所述的屏蔽增强周期结构,其特征在于,所述溶剂为具有水溶性的溶剂。
CN201810474220.6A 2018-05-17 2018-05-17 一种屏蔽增强周期结构 Active CN108659245B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810474220.6A CN108659245B (zh) 2018-05-17 2018-05-17 一种屏蔽增强周期结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810474220.6A CN108659245B (zh) 2018-05-17 2018-05-17 一种屏蔽增强周期结构

Publications (2)

Publication Number Publication Date
CN108659245A CN108659245A (zh) 2018-10-16
CN108659245B true CN108659245B (zh) 2020-07-31

Family

ID=63776173

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810474220.6A Active CN108659245B (zh) 2018-05-17 2018-05-17 一种屏蔽增强周期结构

Country Status (1)

Country Link
CN (1) CN108659245B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101214722A (zh) * 2007-12-28 2008-07-09 四川大学 制备可设计层状聚合物基导电复合材料的方法
CN102555375A (zh) * 2011-12-29 2012-07-11 四川大学 一种新型聚合物基电磁屏蔽薄膜或片材及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006015198A1 (de) * 2006-04-01 2007-10-11 Semikron Elektronik Gmbh & Co. Kg Verbindungseinrichtung für elektronische Bauelemente

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101214722A (zh) * 2007-12-28 2008-07-09 四川大学 制备可设计层状聚合物基导电复合材料的方法
CN102555375A (zh) * 2011-12-29 2012-07-11 四川大学 一种新型聚合物基电磁屏蔽薄膜或片材及其制备方法

Also Published As

Publication number Publication date
CN108659245A (zh) 2018-10-16

Similar Documents

Publication Publication Date Title
JP6923644B2 (ja) 電磁波シールドフィルム及びその製造方法
Kim et al. Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing
CN103436099B (zh) 一种复合导电油墨
JP5281529B2 (ja) 加熱硬化型導電性ペースト組成物およびその導電性ペースト組成物を用いた電極並びに配線パターンの形成方法
CN102850885B (zh) 一种塑料表面用导电涂料
CN207885101U (zh) 一种电磁屏蔽膜
CN108323140A (zh) 一种电磁波屏蔽膜及其制备方法和应用
US10233346B2 (en) Conductive ink composition and conductive architecture for wireless antenna
CN113707362A (zh) 一种高导电铜浆、制备方法、柔性高导电铜膜及其应用
CN103535123A (zh) 电磁屏蔽衬垫及其制备方法
CN105802346B (zh) 一种复合导电油墨膜及其制备方法
CN101880499A (zh) 一种醇溶性电磁波屏蔽涂料
CN110047637B (zh) 一种高频用2:17型稀土类-铁-氮系复合磁性材料的制备方法
US20160164171A1 (en) Wireless antenna made from binder-free conductive carbon inks
CN108659245B (zh) 一种屏蔽增强周期结构
CN103000369B (zh) 高耐电压片式陶瓷电容器的制备方法
GB2533782A (en) Method of manufacturing conductive ink composition, antenna structure, and antenna for RFID tag
CN201576464U (zh) 环保型天线微结构电磁波隔离材料
EP3591012A1 (en) Conductive ink for use in manufacturing radio frequency identification (rfid) tag antenna and method for manufacturing rfid tag antenna
CN113084151B (zh) 一种5g滤波器用银粉及其生产方法
CN205491653U (zh) 金属屏蔽罩单体结构
CN203105046U (zh) 抑制电磁波干扰结构及具有该结构的软性印刷电路板
CN204125417U (zh) 一种高屏蔽性导电布胶带
CN201947602U (zh) 磁屏蔽装置
CN105990675A (zh) 由无粘着剂的导电墨水所制成的无线天线

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant