CN108649051B - Display panel mother board, preparation method thereof, display panel and electronic equipment - Google Patents
Display panel mother board, preparation method thereof, display panel and electronic equipment Download PDFInfo
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- CN108649051B CN108649051B CN201810381065.3A CN201810381065A CN108649051B CN 108649051 B CN108649051 B CN 108649051B CN 201810381065 A CN201810381065 A CN 201810381065A CN 108649051 B CN108649051 B CN 108649051B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention relates to the technical field of electronic display, in particular to a display panel mother board and a preparation method thereof, a display panel and electronic equipment. The display panel mother board is used for cutting to obtain a plurality of independent display surfaces, the laser irradiated vertically during laser cutting can generate reflected light which irradiates the inner side of the substrate, and the light which irradiates the inner part of the substrate is reflected by the reflecting layer and does not enter the substrate or the display panel, so that the stability of the display panel after cutting is improved.
Description
Technical Field
The invention relates to the technical field of electronic display, in particular to a display panel mother board, a preparation method of the display panel mother board, a display panel and electronic equipment.
Background
The OLED display is also called an organic electroluminescent display, an organic light emitting semiconductor, and has the advantages of self-luminescence, wide viewing angle, almost infinite contrast, low power consumption, and high response speed. In the manufacturing process of the OLED display screen, the OLED display layer needs to be packaged to avoid the influence of water and oxygen, thin film packaging or frat packaging can be adopted during specific packaging, and a display panel mother board with a plurality of display screen bodies can be formed after packaging.
Generally, a display panel mother board formed by packaging is cut by laser to obtain a plurality of display panels. During the cutting process, the heat generated by the laser is uniformly transferred along the cutting edge, half is transferred into the display panel, and half is transferred to the outside. The heat transferred to the display panel may affect the packaging effect, thereby affecting the overall reliability of the display panel after cutting.
Disclosure of Invention
Therefore, it is necessary to provide a display panel mother board, a manufacturing method thereof, a display panel and an electronic device, aiming at the problem that the reliability of the display panel is affected by the conventional laser cutting.
A display panel mother board comprises a substrate, a plurality of light emitting devices arranged on the substrate and a plurality of packaging layers packaged on the light emitting devices, wherein the substrate and the packaging layers comprise packaging areas corresponding to the light emitting devices and laser cutting areas arranged on the periphery of the packaging areas, a light reflecting layer is arranged in the laser cutting areas on the substrate and/or the packaging layers, and the light reflecting layer is arranged on one side close to the packaging areas.
In the display panel mother board, the packaging layer is a glass packaging plate, a cutting groove is arranged in the cuttable area on the surface of the substrate and/or the glass packaging plate, the cutting groove extends along the cutting direction and comprises a bottom wall and a side wall, and a reflective layer is arranged on the side wall close to one side of the packaging area.
In the display panel motherboard, the side wall is communicated between the packaging area and the cuttable area and faces away from the light-emitting device.
In the display panel mother board, the bottom wall is parallel to the surface of the glass packaging plate or the substrate back to the light-emitting device, and an included angle between the side wall and the bottom wall is an obtuse angle.
In the display panel motherboard, the material of the reflective layer is aluminum alloy or simple substance silver.
In the display panel motherboard, the light reflecting layer comprises a plurality of total reflection optical parts.
A preparation method of a display panel mother board comprises the following steps:
providing a substrate, and forming a plurality of light-emitting devices and an encapsulation layer encapsulated on the plurality of light-emitting devices on the substrate; wherein the substrate and the encapsulation layer include an encapsulation region corresponding to the light emitting device and a laser-cuttable region located at the periphery of the encapsulation region,
and forming a light reflecting layer in the laser cutting area of the substrate and/or the packaging layer, wherein the light reflecting layer is arranged at one side close to the packaging area.
In the method for cutting the mother board of the display panel, the encapsulation layer is a glass encapsulation plate, and the method further comprises the following steps before the reflection layer is formed:
etching the surface of the glass packaging plate and/or the substrate in a laser cutting area of a display panel mother board to form a cutting groove, wherein the cutting groove extends along a cutting direction and comprises a bottom wall and a side wall;
and forming a light reflecting layer on the side wall close to one side of the packaging area.
A display panel is manufactured by cutting the display panel mother board.
An electronic device comprises the display panel.
The display panel mother board is used for cutting to obtain a plurality of independent display panels, incident light of laser is vertically irradiated on the laser cutting area during cutting, and laser light focused on the laser cutting area is used for cutting. For the packaging layer, the laser vertically irradiating the packaging layer can generate reflected light irradiating the inner side of the packaging layer, and the light irradiating the interior of the packaging layer is reflected by the reflecting layer and does not enter the packaging layer; similarly, for the substrate, the laser beam irradiated vertically generates a reflected light beam toward the inner side of the substrate, and the light beam irradiated toward the inner side of the substrate is reflected by the reflective layer without entering the substrate. So when guaranteeing laser cutting performance, the encapsulation effect that laser got into encapsulation layer and base plate influence display panel through the light of reflection during the cutting, improves display panel's after the cutting stability.
Drawings
Fig. 1 is a schematic structural diagram of a display panel mother board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a cutting process of the mother substrate of the display panel shown in FIG. 1;
fig. 3 is a flowchart of a method for manufacturing a mother substrate of a display panel according to an embodiment of the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the production process of the OLED display screen, in order to improve the production efficiency, a display panel mother board is firstly manufactured, and then the display panel mother board is cut to obtain a plurality of independent display panels.
A display panel mother board comprises a substrate, a plurality of light emitting devices arranged on the substrate and a packaging layer packaged on the light emitting devices, wherein the substrate and the packaging layer comprise packaging areas corresponding to the light emitting devices and laser cutting areas positioned on the periphery of the packaging areas; furthermore, the light reflecting layer is positioned on the reflection path of the laser, so that the light rays emitted to the inside of the packaging area can be reflected more efficiently.
Taking Frit packaging as an example, as shown in fig. 1-2, a display panel mother board 100 in an embodiment of the present invention includes a substrate 10, a plurality of light emitting devices (not shown) disposed on the substrate 10, and a glass package plate 30 packaged on the light emitting devices. Among them, the light emitting device is made of an organic material, so that it is required to encapsulate the light emitting device to prevent it from being corroded by water and oxygen.
When the light emitting device is packaged, a plurality of light emitting devices are arranged on the substrate 10, the periphery of each light emitting device is coated with the packaging glue 50, finally, the glass packaging plate 30 is covered on the light emitting device, the substrate 10 and the glass packaging plate 30 are bonded through the packaging glue 50, and the light emitting device is packaged between the substrate and the glass packaging plate 30. As such, the substrate 10 and the glass sealing plate 30 each include a plurality of sealing regions a corresponding to the light emitting devices, when the light emitting devices are plural, the corresponding sealing regions are plural. The substrate 10 and the glass package plate 30 each further include a laser-cuttable region b located at the periphery of the package region a, the light emitting devices in the package region a are not affected when the display panel mother board 100 is cut through the laser-cuttable region b, and finally, a plurality of individual display panels 20 are obtained after cutting. Specifically, in the cutting process, the cutting may be started from any one of the glass sealing plate 30 and the substrate 10, or may be performed from both sides of the glass sealing plate 30 and the substrate 10, depending on the cutting process.
The surface of the substrate 10 and/or the glass encapsulation plate 30 is provided with a cutting groove 32 in the laser-cuttable region b, the cutting groove 32 extending in the cutting direction and including a bottom wall 321 and a side wall 323. A cutting groove 32 is provided in the laser-cuttable area b in the cutting direction for assisting laser cutting. In the display panel mother board 100, the surface of the substrate 10 is a surface of the substrate 10 facing away from the light emitting device, and the surface of the glass package plate 30 is a surface of the glass package plate 30 facing away from the light emitting device. Specifically, the cutting groove 32 is formed on the surface of the substrate 10 opposite to the light emitting device, and the display panel mother board 100 is cut from the surface of the substrate 10; or the cutting groove 32 is arranged on the surface of the glass packaging plate 30 back to the light-emitting device, and the display panel mother board is cut from the surface of the glass packaging plate 30; or the cutting grooves 32 are arranged on the surfaces of the substrate 10 and the cutting grooves 32, which face away from the light-emitting device, and cutting is carried out from two sides of the glass packaging plate 30 and the substrate 10. The opening body of the cutting groove 32 depends on the cutting process.
A reflective layer is provided on the sidewall 323 adjacent to one side of the encapsulation area. Further, the bottom wall 321 of the cutting groove 32 is located on the incident path of the laser, and the side wall 323 is located on the reflection path of the laser and near the side of the package region. In the laser cutting process, the incident light of the laser is perpendicularly irradiated on the bottom wall 321, and the laser light focused on the bottom wall 321 is used for cutting. For the glass package plate 30, the laser vertically irradiating the bottom wall 321 can generate reflected light emitted to the inner side of the glass package plate 30, and the light emitted to the inner side of the glass package plate 30 is reflected out through the side wall 323 and does not enter the glass package plate 30; similarly, for the substrate 10, the laser beam perpendicularly irradiated on the bottom wall 321 generates a reflected light toward the inner side of the substrate 10, and the light beam irradiated to the inner side of the substrate 10 is reflected through the sidewall 323 without entering the substrate 10. Therefore, the laser cutting performance is ensured, meanwhile, the laser is prevented from entering the glass packaging plate 30 and the substrate 10 through the reflected light during cutting to influence the packaging effect of the display panel 20, and the stability of the display panel 20 after cutting is improved.
And, the etching is performed on the cuttable area before cutting, so that the glass packaging plate 30 at the bottom wall 321 is thinned, the thickness needing to be cut is reduced, and the cutting is easier.
In one embodiment, the sidewall 323 is connected between the encapsulation region a and the laser cutting region b and faces away from the light emitting device, so that light rays propagating towards the light emitting device are reflected out of the glass encapsulation plate 30 through the sidewall 323, and the heat is prevented from being transferred to the inside of the display panel motherboard 100 to affect the overall encapsulation performance and reliability.
In one embodiment, the bottom wall 321 is parallel to the surface of the glass package plate 30 or the substrate 10 away from the light emitting device, i.e. is horizontally disposed, and forms an included angle with the side wall 323, the included angle is an acute angle or a right angle, which can block the reflected light of the incident light passing through the bottom wall 321, and preferably, the included angle is an obtuse angle, so that when the side wall 323 faces the incident light of the laser, the reflected light of the incident light passing through the bottom wall 321 can be blocked in a wider range. The size of the obtuse included angle between the side wall 323 and the bottom wall 321 is set according to practical requirements, and is not limited herein.
In one embodiment, the material of the light reflecting layer is aluminum alloy or elemental silver, and has high melting point and high reflectivity. Thus, after the reflective layer is coated on the sidewall 323, the light irradiated on the sidewall 323 can be effectively reflected, the heat conduction from the reflected laser light generated during cutting to the glass package plate 30 is prevented, and the package effect and stability of the display panel 20 after cutting are improved. And the reflecting layer has higher melting point and can not be melted by heat generated during laser cutting.
In one embodiment, the reflective layer is made of a total reflection material, such as simple silver, and the light irradiated on the sidewall 323 can be reflected completely when the included angle formed between the bottom wall and the sidewall is an acute angle or a right angle. When other high reflectivity materials are selected for use as the reflective layer material, the included angle between the bottom wall and the side wall can be adjusted to be an obtuse angle, so that the reflective layer reflects light irradiating the side wall 323 in a larger range, and the reflection of the reflective layer to the light is more effectively realized.
In this embodiment, the material of the reflective layer is an aluminum-silver alloy. It is understood that in other embodiments, the material of the light reflecting layer is other aluminum alloy, and is not limited herein.
In one embodiment, a plurality of total reflection optics (not shown) are disposed on the sidewall 323. Thus, the light reflected to the total reflection optical part through the bottom wall 321 is totally reflected out of the glass package plate 30, the reflection effect is better, the heat conducted to the display panel 20 during laser cutting is less, and the package effect of the display panel 20 is better. Optionally, the total reflection optical portion is a wave-shaped protrusion.
In one embodiment, taking thin film encapsulation as an example, the substrate and the encapsulation layer include an encapsulation region corresponding to the light emitting device and a laser-cuttable region located at the periphery of the encapsulation region, and a reflective layer is disposed in the laser-cuttable region of the substrate and/or the encapsulation layer and located at a side close to the encapsulation region. Further, a light reflecting layer is located on the reflection path of the laser light. And no cutting groove is required to be arranged on the packaging layer. When the laser is cut, the reflecting layer is positioned at one side close to the packaging area, and can reflect light irradiated on the reflecting layer, so that the reflected laser light generated during cutting is prevented from conducting heat to the packaging layer; further, the reflection stratum is located the reflection route of laser, and the reflection effect of reflection stratum is better, can block the laser light of the reflection that produces when cutting more comprehensively effectively, and the laser light of the reflection that produces when preventing to cut improves display panel 20's behind the cutting encapsulation effect and stability to packaging layer conduction heat. It is understood that the reflective layer material may be the reflective layer material in the above embodiments, and may also include a total reflection optical portion, which is not described herein again. It is understood that the substrate may be disposed in the specific manner of the above embodiments, such as disposing a cutting groove; the specific cutting method may also be the method in the above embodiments, and will not be described herein again.
As shown in fig. 3, the present invention further provides a method for manufacturing a display panel motherboard, comprising the following steps:
step S100, providing a substrate, and forming a plurality of light emitting devices and a packaging layer packaged on the plurality of light emitting devices on the substrate; the substrate and the packaging layer comprise a packaging area corresponding to the light-emitting device and a laser cutting area located on the periphery of the packaging area;
step S300, forming a reflective layer in the laser-cutting area of the packaging layer, wherein the reflective layer of the reflective layer is arranged on one side close to the packaging area.
In one embodiment, taking frat packaging as an example, a method for preparing a display panel motherboard, where the packaging layer is a glass packaging plate, and before forming the reflective layer, the method further includes the following steps:
step S200, etching the surface of the glass package plate 30 and/or the substrate 10 in the laser-cuttable region b of the display panel mother board 100 to form a cutting groove 32, wherein the cutting groove 32 extends along a cutting direction and includes a bottom wall 321 and a side wall 323;
in step S300, a light reflecting layer is formed on the sidewall 323 near one side of the encapsulation region. Specifically, the reflective layer is coated on the side wall 323, so that light irradiated onto the side wall 323 can be effectively reflected, heat is prevented from being conducted to the glass package plate 30 by the reflected laser light generated by laser cutting, and the package effect and stability of the display panel 20 after cutting are improved.
Further, step S300 further includes etching the sidewall 323 to form a plurality of total reflection optical portions, so that the light reflected to the total reflection optical portions through the bottom wall 321 is totally reflected out of the glass sealing plate 30, the reflection effect is better, the heat conducted to the inside of the display panel 20 during laser cutting is less, and the sealing effect of the display panel 20 is better. Optionally, the total reflection optical portion is a wave-shaped protrusion.
That is, an etching process is added to etch the cutting groove 32 with the bottom wall 321 and the sidewall 323 at the position where laser cutting is needed, so as to match with the subsequent cutting. Specifically, etching may be performed on a surface of either the glass package plate 30 or the substrate 10, which is away from the light emitting device, or etching may be performed on surfaces of both the glass package plate 30 and the substrate 10, which are away from the light emitting device. The positions of the etched bottom wall 321 and side wall 323 are determined by the cutting process and are not limited herein. For example, the glass package plate 30 is etched on the surface facing away from the light emitting device, and then cut from the glass package plate 30, or the substrate 10 is etched on the surface facing away from the light emitting device, and then cut from the substrate 10, or both the glass package plate 30 and the substrate 10 are etched on the surface facing away from the light emitting device, and then cut from both sides of the glass package plate 30 and the substrate 10.
When the mother board of the display panel is cut, the laser irradiates the laser cutting area, and the laser moves along the cutting direction to cut the display panels 20.
Specifically, for the Frit package as an example, when the mother board of the display panel is cut, the laser is irradiated on the bottom wall 321 of the cutting groove 32, and the laser is moved in the cutting direction to cut the plurality of display panels 20.
In one embodiment, the step of cutting the mother board of the display panel specifically includes step S410 and step S420.
Step S410, determining a cutting line 11 in the laser cutting area b;
in step S420, the display panel mother substrate 100 is cut on the bottom wall 321 along the cutting line 11 by laser.
In the laser dicing, the dicing is performed with reference to the dicing line 11 in the laser-cuttable region b.
Further, step S410 is specifically: the cutting line 11 is determined according to the boundary of the individual display panel 20 within the laser-cuttable region b.
The display panel mother board 100 includes a plurality of display panels 20, and the display panels 20 are generally arranged in order during the production process, for example, in a plurality of rows and a plurality of columns, a straight line extending along the boundaries of the display panels 20 in each row and each column can be determined as a cutting line 11, so that the display panels 20 can be obtained after cutting through the cutting line 11.
In one embodiment, the cutting line 11 includes the intersecting transverse cutting line 112, the longitudinal cutting line 114 and the slotting cutting line 116, and the step S420 specifically includes the steps S421 and S422.
In step S421, the laser cuts the display panel mother substrate 100 along the transverse boundary 112 and the longitudinal boundary 114 to obtain a plurality of individual display panels 20. Specifically, in the laser cutting process, light rays are moved along the transverse boundary 112 and the longitudinal boundary 114, so that a plurality of display screen bodies 20 can be obtained, and the obtained display screen bodies 20 can be used in electronic devices such as mobile phones and tablet computers.
Step S422, a notch is formed by notching the display panel 20 along the notching cutting line 116 to obtain the special-shaped display panel 20, i.e. the above-mentioned cutting method is also suitable for cutting the notch of the special-shaped screen.
The invention also provides a display panel 20, and the display panel 20 is obtained by cutting the display panel mother board. When the mother board 100 of the display panel is cut, the incident light of the laser irradiates the bottom wall 321 in the laser cutting area b, the incident light is focused on the bottom wall 321 to cut the mother board 100 of the display panel, and meanwhile, the incident light is reflected by the bottom wall 321 and reaches the reflective layer of the side wall 323, and is reflected out of the glass packaging plate 30 by the reflective layer, so that the reflected light of the incident laser is prevented from transmitting heat through the glass packaging plate 30 to affect the packaging effect, and the stability and the reliability of the display panel after cutting are improved.
The invention also provides an electronic device comprising the display panel 20.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display panel mother board is characterized by comprising a substrate, a plurality of light emitting devices arranged on the substrate and a packaging layer packaged on the light emitting devices, wherein the substrate and the packaging layer comprise packaging areas corresponding to the light emitting devices and laser cutting areas positioned on the periphery of the packaging areas; the surface of the substrate, which faces away from the light-emitting device, and/or the surface of the encapsulation layer, which faces away from the light-emitting device, are provided with the light-reflecting layer, and the light-reflecting layer is located on a reflection path of laser.
2. The display panel mother board according to claim 1, wherein the encapsulation layer is a glass encapsulation plate, a cutting groove is formed in the surface of the substrate and/or the glass encapsulation plate in the laser cutting area, the cutting groove extends in the cutting direction and includes a bottom wall and a side wall, and a reflective layer is formed on the side wall close to one side of the encapsulation area.
3. The display panel motherboard of claim 2, wherein the sidewalls communicate between the encapsulation region and the laser-cuttable region and face away from the light emitting devices.
4. The display panel mother board according to claim 2 or 3, wherein the bottom wall is parallel to a surface of the glass package plate or the substrate facing away from the light emitting device, and an included angle between the side wall and the bottom wall is an obtuse angle.
5. The display panel motherboard according to claim 1, wherein the material of the light reflecting layer is aluminum alloy or elemental silver.
6. The display panel motherboard of claim 1, wherein the light reflecting layer comprises a plurality of total reflection optics.
7. A preparation method of a display panel mother board is characterized by comprising the following steps:
providing a substrate, and forming a plurality of light-emitting devices and an encapsulation layer encapsulated on the plurality of light-emitting devices on the substrate; the substrate and the packaging layer comprise a packaging area corresponding to the light-emitting device and a laser cutting area located on the periphery of the packaging area;
forming a light reflecting layer in the laser cutting area of the substrate and/or the packaging layer, wherein the light reflecting layer is arranged on one side close to the packaging area; the light reflecting layer is arranged on the surface of the substrate, which faces away from the light emitting device, and/or the surface of the packaging layer, which faces away from the light emitting device, and is positioned on a reflection path of laser.
8. The method for manufacturing a display panel mother board according to claim 7, wherein the encapsulation layer is a glass encapsulation plate, and further comprising the following steps before forming the light reflection layer:
etching the surface of the glass packaging plate and/or the substrate in a laser cutting area of a display panel mother board to form a cutting groove, wherein the cutting groove extends along a cutting direction and comprises a bottom wall and a side wall;
and forming a light reflecting layer on the side wall close to one side of the packaging area.
9. A display panel cut from the mother substrate of any one of claims 1 to 7.
10. An electronic device characterized by comprising the display panel according to claim 9.
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| KR20200060636A (en) * | 2018-11-22 | 2020-06-01 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
| CN112840467A (en) * | 2020-04-10 | 2021-05-25 | 厦门三安光电有限公司 | Light emitting diode chip and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101414073A (en) * | 2007-10-17 | 2009-04-22 | 株式会社日立显示器 | Liquid crystal display device and manufacturing method thereof |
| CN104439720A (en) * | 2014-12-25 | 2015-03-25 | 京东方科技集团股份有限公司 | Laser cutting method, display substrate and display device |
| CN105244339A (en) * | 2015-10-10 | 2016-01-13 | 苏州晶方半导体科技股份有限公司 | Packaging method for image sensor chip and packaging structure |
| CN106025097A (en) * | 2016-08-01 | 2016-10-12 | 京东方科技集团股份有限公司 | Mother board substrate, mother board panel, display panel, manufacturing method of display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102000043B1 (en) * | 2012-10-31 | 2019-07-15 | 엘지디스플레이 주식회사 | Organic light emitting display device and method of fabricating thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101414073A (en) * | 2007-10-17 | 2009-04-22 | 株式会社日立显示器 | Liquid crystal display device and manufacturing method thereof |
| CN104439720A (en) * | 2014-12-25 | 2015-03-25 | 京东方科技集团股份有限公司 | Laser cutting method, display substrate and display device |
| CN105244339A (en) * | 2015-10-10 | 2016-01-13 | 苏州晶方半导体科技股份有限公司 | Packaging method for image sensor chip and packaging structure |
| CN106025097A (en) * | 2016-08-01 | 2016-10-12 | 京东方科技集团股份有限公司 | Mother board substrate, mother board panel, display panel, manufacturing method of display panel and display device |
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