CN108646875A - A kind of heat-sinking structure of chassis - Google Patents
A kind of heat-sinking structure of chassis Download PDFInfo
- Publication number
- CN108646875A CN108646875A CN201810696915.9A CN201810696915A CN108646875A CN 108646875 A CN108646875 A CN 108646875A CN 201810696915 A CN201810696915 A CN 201810696915A CN 108646875 A CN108646875 A CN 108646875A
- Authority
- CN
- China
- Prior art keywords
- pcie
- air
- guiding hole
- heat
- wind scooper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The present invention provides a kind of heat-sinking structure of chassis, mainboard including machine case body and in the machine case body, described machine case body one end is equipped with the hard disc module being electrically connected with the mainboard, the machine case body other end is equipped with the PCIE modules being electrically connected with the mainboard, blower module is equipped between the hard disc module and the PCIE modules, it is additionally provided with wind scooper between the blower module and the PCIE modules, the wind scooper is equipped with the first air-guiding hole corresponding with the mainboard position and the second air-guiding hole corresponding with the PCIE module positions, the wind scooper is additionally provided with battery pack mounting groove.Wind scooper is set in machine case body, wind scooper, which is equipped with the first air-guiding hole and the second air-guiding hole, to blow to mainboard and PCIE modules respectively by the wind that blower module is blown out, thus can effectively it be radiated to multiple modules by one group of fan, reach section space-efficient purpose, and be more energy-saving and environmentally friendly, cost is lower.
Description
Technical field
The present invention relates to server field more particularly to a kind of heat-sinking structure of chassis.
Background technology
Server will produce a large amount of heat at work, all be directly to carry out blow-through by fan to dissipate in existing scheme
Heat, but since the heating element in server is relatively more and parts are also than comparatively dense, it is described multiple need to set
Radiator fan individually radiates to different components, thus can be unfavorable to the layout inside machine box for server, can also make
Its cabinet volume increases.
The case where having unexpected power-off when usual server work can use the storage in battery pack in this case
Electricity completes the storage of Raid card data, avoids the loss of data, then server just has to be equipped in structure function
Install battery pack position, existing battery pack not only occupied space and also dismounting it is also pretty troublesome.
Invention content
In order to solve the problems in the prior art, the present invention provides a kind of better heat-sinking structure of chassis.
The present invention provides a kind of heat-sinking structure of chassis, including machine case body and the master in the machine case body
Plate, described machine case body one end are equipped with the hard disc module that is electrically connected with the mainboard, the machine case body other end equipped with
The PCIE modules that the mainboard is electrically connected are equipped with blower module, the wind between the hard disc module and the PCIE modules
Wind scooper is additionally provided between fan module and the PCIE modules, the wind scooper is equipped with and the mainboard position corresponding first
Air-guiding hole and the second air-guiding hole corresponding with the PCIE module positions, the wind scooper are additionally provided with battery pack mounting groove.
As a further improvement on the present invention, the hard disc module includes hard disk backboard, and the hard disk backboard is equipped with multiple
Connector for installing hard disk, the hard disk backboard are fixed on the cabinet and corresponding with the blower module position,
The hard disk backboard is additionally provided with several heat emission holes.
As a further improvement on the present invention, the PCIE modules are equipped with two groups and are set up in parallel, second air-guiding hole
Close to the PCIE one end first partition with outward extension, the first partition be located at two groups described in PCIE modules it
Between.
As a further improvement on the present invention, be additionally provided between first air-guiding hole and second air-guiding hole second every
Plate, PCIE modules described in two groups are located at the side of the second partition.
As a further improvement on the present invention, the battery pack mounting groove is multiple and is respectively arranged on first air-guiding hole
Both sides and the both sides of second air-guiding hole are each equipped with limiting section and buckle in the battery settling groove.
As a further improvement on the present invention, the blower module includes multigroup radiator fan being set up in parallel, Duo Zusuo
Radiator fan is stated to be connected to described wind scooper one end.
As a further improvement on the present invention, the wind scooper is additionally provided with multiple ventilation holes, multiple ventilation hole difference
Set on first air-guiding hole both sides and second air-guiding hole both sides.
As a further improvement on the present invention, the machine case body is additionally provided with power module, and the power module is set to institute
State PCIE modules side.
As a further improvement on the present invention, the wind scooper is additionally provided with PCIE corresponding with the PCIE module positions
Holder.
The beneficial effects of the invention are as follows：Wind scooper is set in machine case body, and wind scooper is equipped with the first air-guiding hole and second
The wind that blower module is blown out can be blowed to mainboard and PCIE modules respectively by air-guiding hole, thus can be by one group of fan to more
A module is effectively radiated, and reaches section space-efficient purpose, and be more energy-saving and environmentally friendly, cost is lower.
Description of the drawings
Fig. 1 is a kind of internal structure schematic diagram of heat-sinking structure of chassis of the present invention；
Fig. 2 is the structural schematic diagram of another angles of Fig. 1；
Fig. 3 is a kind of structural schematic diagram of the wind scooper of heat-sinking structure of chassis of the present invention；
Fig. 4 is the structural schematic diagram of another angles of Fig. 3；
Fig. 5 is a kind of structural schematic diagram of the PCIE holders of heat-sinking structure of chassis of the present invention.
Reference numeral：1- machine case bodies；2- mainboards；3- hard disc modules；4-PCIE modules；5- blower modules；6- wind scoopers；
7- power modules；8-PCIE holders；The first air-guiding holes of 611-；The second air-guiding holes of 612-；62- ventilation holes；63- battery packs are installed
Slot；64- first partitions；65- second partitions；631- limiting sections；632- is buckled；81- bracket bases；82- lock tongues；83- lock tongue pins.
Specific implementation mode
As shown in Figure 1 to Figure 3, the invention discloses a kind of heat-sinking structure of chassis, including machine case body 1 and mounted on described
Mainboard 2 in machine case body 1,1 one end of the machine case body are equipped with the hard disc module 3 being electrically connected with the mainboard 2, the machine
1 other end of case ontology is equipped with the PCIE modules 4 being electrically connected with the mainboard 2, and the PCIE modules 4 are equipped with multiple PCIE interfaces
Card is equipped with blower module 5, the blower module 5 and the PCIE modules 4 between the hard disc module 3 and the PCIE modules 4
Between be additionally provided with wind scooper 6, the wind scooper 6 be equipped with the first air-guiding hole 611 corresponding with 2 position of the mainboard and with it is described
Corresponding second air-guiding hole 612 in 4 position of PCIE modules, such blower module 5 can not only carry out air draught to hard disc module 3 and dissipate
Heat can also be blowed mainboard 2 and PCIE modules 4 by the first air-guiding hole 611 on wind scooper 6 and the second air-guiding hole 612
Heat dissipation, reduces the setting quantity of fan, reaches section space-efficient purpose, and be more energy-saving and environmentally friendly, cost is lower, described to lead
Fan housing 6 is additionally provided with battery pack mounting groove 63, and battery pack can be fixed, and keeps its layout more reasonable, saves space, battery pack
Dismounting be also more convenient.
In the technical program, the hard disc module 3 includes hard disk backboard, and the hard disk backboard is equipped with multiple hard for installing
The connector of disk, the connector and mainboard 2 are electrically connected, the hard disk backboard be fixed on the cabinet and with the wind
5 position of fan module is corresponding, and the hard disk backboard is additionally provided with several heat emission holes, in this way when blower module 5 works
Air draught is carried out to hard disc module 3 to radiate.
In the technical program, the PCIE modules 4 are equipped with two groups and are set up in parallel, and every group of PCIE module 4 is equipped with two pieces
PCIE interface cards, second air-guiding hole 612 is close to one end of PCIE first partition 64 with outward extension, and described
One partition board 64 can respectively carry out two groups of PCIE between PCIE modules 4 described in two groups by the setting of first partition 64
Heat dissipation effect is reinforced in individually blowing heat dissipation.
In the technical program, second partition is additionally provided between first air-guiding hole 611 and second air-guiding hole 612
65, the first air-guiding hole 611 is located at 65 side of second partition, and PCIE modules 4 described in two groups are located at the other side of second partition 65, this
Sample can make the first air-guiding hole 611 individually radiate the mainboard 2 of the other side, reinforce heat dissipation effect.
In the technical program, the battery pack mounting groove 63 is multiple and is respectively arranged on 611 both sides of the first air-guiding hole
And the both sides of second air-guiding hole 612, limiting section 631 and buckle 632, Ke Yitong are equipped in each battery settling groove
632 pairs of battery packs of limiting section 631 and buckle are crossed effectively fix, it is convenient for disassembly and assembly.
In the technical program, the blower module 5 includes multigroup radiator fan being set up in parallel, radiator fan and wind scooper
6 one end are connected to, and multigroup radiator fan is connected to 6 one end of the wind scooper, can ensure heat dissipation effect,.
In the technical program, the wind scooper 6 is additionally provided with multiple ventilation holes 62, and multiple ventilation holes 62 are respectively arranged on institute
Blower module 5 can also be blown out by stating 611 both sides of the first air-guiding hole and 612 both sides of the second air-guiding hole, multiple ventilation holes 62
Wind radiate to other positions, to keep the heat dissipation effect of entire server more preferable.
In the technical program, the machine case body 1 is additionally provided with power module 7, and the power module 7 is set to the PCIE moulds
4 side of block, power module 7 are electrically connected with mainboard 2, are powered to it.
In the technical program, the wind scooper 6 is additionally provided with PCIE holders 8 corresponding with 4 position of PCIE modules, institute
It includes bracket base 81, lock tongue 82 and the lock tongue pin 83 being mounted on wind scooper 6 to state PCIE holders 8, and the lock tongue 82 passes through lock
Tongue pin 83 is fixed on bracket base 81 and can be rotated, and lock tongue 82 is equipped with fixing groove, the free end energy of PCIE interface cards
It is enough stuck in the fixing groove, the PCIE holders 8 can carry out PCIE interface cards effectively to fix, and facilitate PCIE modules
4 dismounting.
The configuration of the present invention is simple, is arranged wind scooper 6 in machine case body 1, and wind scooper 6 is equipped with the first air-guiding hole 611 and the
The wind that blower module 5 is blown out can be blowed to mainboard 2 and PCIE modules 4 respectively by two air-guiding holes 612, can thus pass through one group
Fan effectively radiates to multiple modules, reaches section space-efficient purpose, and be more energy-saving and environmentally friendly, cost is lower.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention's
Protection domain.
Claims (9)
1. a kind of heat-sinking structure of chassis, it is characterised in that：Mainboard including machine case body and in the machine case body, institute
It states machine case body one end and is equipped with the hard disc module being electrically connected with the mainboard, the machine case body other end is equipped with and the master
The PCIE modules that plate is electrically connected are equipped with blower module, the blower module between the hard disc module and the PCIE modules
Wind scooper is additionally provided between the PCIE modules, the wind scooper is equipped with the first air-guiding hole corresponding with the mainboard position
And the second air-guiding hole corresponding with the PCIE module positions, the wind scooper are additionally provided with battery pack mounting groove.
2. heat-sinking structure of chassis according to claim 1, it is characterised in that：The hard disc module includes hard disk backboard, institute
State hard disk backboard be equipped with it is multiple for installing the connectors of hard disk, the hard disk backboard be fixed on the cabinet and with it is described
Blower module position is corresponding, and the hard disk backboard is additionally provided with several heat emission holes.
3. heat-sinking structure of chassis according to claim 1, it is characterised in that：The PCIE modules are equipped with two groups and arranged side by side
Setting, second air-guiding hole are located at close to one end of PCIE first partition with outward extension, the first partition
Between PCIE modules described in two groups.
4. heat-sinking structure of chassis according to claim 3, it is characterised in that：First air-guiding hole and second wind-guiding
Second partition is additionally provided between hole, PCIE modules described in two groups are located at the side of the second partition.
5. heat-sinking structure of chassis according to claim 1, it is characterised in that：The battery pack mounting groove is multiple and difference
Set on first air-guiding hole both sides and the both sides of second air-guiding hole, limiting section is equipped in each battery settling groove
And buckle.
6. heat-sinking structure of chassis according to claim 1, it is characterised in that：The blower module includes multigroup is set up in parallel
Radiator fan, multigroup radiator fan is connected to described wind scooper one end.
7. heat-sinking structure of chassis according to claim 1, it is characterised in that：The wind scooper is additionally provided with multiple ventilation holes,
Multiple ventilation holes are respectively arranged on first air-guiding hole both sides and second air-guiding hole both sides.
8. heat-sinking structure of chassis according to claim 1, it is characterised in that：The machine case body is additionally provided with power module,
The power module is set to PCIE modules side.
9. heat-sinking structure of chassis according to claim 1, it is characterised in that：The wind scooper is additionally provided with and the PCIE moulds
The corresponding PCIE holders in block position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810696915.9A CN108646875A (en) | 2018-06-29 | 2018-06-29 | A kind of heat-sinking structure of chassis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810696915.9A CN108646875A (en) | 2018-06-29 | 2018-06-29 | A kind of heat-sinking structure of chassis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108646875A true CN108646875A (en) | 2018-10-12 |
Family
ID=63749929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810696915.9A Pending CN108646875A (en) | 2018-06-29 | 2018-06-29 | A kind of heat-sinking structure of chassis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108646875A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111367370A (en) * | 2018-12-26 | 2020-07-03 | 鸿富锦精密工业(武汉)有限公司 | Electronic device |
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| CN1707395A (en) * | 2004-06-09 | 2005-12-14 | 中国科学院计算技术研究所 | Radiating system for four-path frame server |
| CN201828873U (en) * | 2010-10-14 | 2011-05-11 | 浪潮电子信息产业股份有限公司 | Modular air guide cover facilitating radiation |
| CN201904980U (en) * | 2010-11-24 | 2011-07-20 | 汉柏科技有限公司 | Highly space-saving network equipment |
| CN204331591U (en) * | 2014-12-30 | 2015-05-13 | 曙光信息产业(北京)有限公司 | A kind of novel blade group |
| CN206193613U (en) * | 2016-11-02 | 2017-05-24 | 郑州云海信息技术有限公司 | Multi -functional wind scooper of server |
| US20170150633A1 (en) * | 2015-11-24 | 2017-05-25 | Inventec Technology Co., Ltd | Electronic device |
| CN208654697U (en) * | 2018-06-29 | 2019-03-26 | 深圳市同泰怡信息技术有限公司 | A kind of heat-sinking structure of chassis |
-
2018
- 2018-06-29 CN CN201810696915.9A patent/CN108646875A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1707395A (en) * | 2004-06-09 | 2005-12-14 | 中国科学院计算技术研究所 | Radiating system for four-path frame server |
| CN201828873U (en) * | 2010-10-14 | 2011-05-11 | 浪潮电子信息产业股份有限公司 | Modular air guide cover facilitating radiation |
| CN201904980U (en) * | 2010-11-24 | 2011-07-20 | 汉柏科技有限公司 | Highly space-saving network equipment |
| CN204331591U (en) * | 2014-12-30 | 2015-05-13 | 曙光信息产业(北京)有限公司 | A kind of novel blade group |
| US20170150633A1 (en) * | 2015-11-24 | 2017-05-25 | Inventec Technology Co., Ltd | Electronic device |
| CN206193613U (en) * | 2016-11-02 | 2017-05-24 | 郑州云海信息技术有限公司 | Multi -functional wind scooper of server |
| CN208654697U (en) * | 2018-06-29 | 2019-03-26 | 深圳市同泰怡信息技术有限公司 | A kind of heat-sinking structure of chassis |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111367370A (en) * | 2018-12-26 | 2020-07-03 | 鸿富锦精密工业(武汉)有限公司 | Electronic device |
| CN111367370B (en) * | 2018-12-26 | 2022-07-29 | 鸿富锦精密工业(武汉)有限公司 | Electronic device |
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