CN108646117B - Aging method of optical active device - Google Patents
Aging method of optical active device Download PDFInfo
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- CN108646117B CN108646117B CN201810652522.8A CN201810652522A CN108646117B CN 108646117 B CN108646117 B CN 108646117B CN 201810652522 A CN201810652522 A CN 201810652522A CN 108646117 B CN108646117 B CN 108646117B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
Abstract
The embodiment of the invention provides an aging method of an optical active device, which comprises the following steps: if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board, the electrical connection between the optical active device and the aging board is confirmed to be normal; if the real-time temperature of the optical active device is stabilized within a preset temperature range within preset time by the temperature control module corresponding to any optical active device, the temperature control module of the optical active device is confirmed to be normal; if the electrical connection between any optical active device and the aging board is normal and the temperature control module of the optical active device is normal, determining that the optical active device meets a preset aging condition; and if each optical active device connected with the aging board meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging board. The method provided by the embodiment of the invention improves the aging yield of the optical active device and avoids unnecessary waste of social resources.
Description
Technical Field
The embodiment of the invention relates to the technical field of production inspection of optical active devices, in particular to an aging method of an optical active device.
Background
Aging is a testing method in the production process of the optical active device, and is used for eliminating the optical active device with unstable performance so as to ensure the product quality of the optical active device and improve the reliability of the optical active device.
At present, the optical active device is mostly produced in a batch aging mode. Conventional batch burn-in processes have enabled real-time monitoring and display of bias current, temperature, burn-in duration, etc. for optically active devices. However, due to lack of protection and hidden trouble investigation of the optical active device, in the batch aging process, the optical active device may fail in batch due to improper current and high temperature caused by circuit open circuit or short circuit, which results in reduction of the yield of the optical active device and unnecessary waste of social resources.
Therefore, how to realize the aging of the optical active device more safely and reliably remains a problem to be solved in the field of production inspection of the optical active device.
Disclosure of Invention
The embodiment of the invention provides an aging method of an optical active device, which is used for solving the problem of batch failure of the optical active device caused by improper current and high temperature caused by circuit open circuit or short circuit.
In one aspect, an embodiment of the present invention provides an aging method for an optically active device, including:
if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board, the electrical connection between the optical active device and the aging board is confirmed to be normal;
if the real-time temperature of the optical active device is stabilized within a preset temperature range within preset time by the temperature control module corresponding to any optical active device, the temperature control module of the optical active device is confirmed to be normal;
if the electrical connection between any optical active device and the aging board is normal and the temperature control module of the optical active device is normal, determining that the optical active device meets a preset aging condition;
and if each optical active device connected with the aging board meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging board.
In another aspect, an embodiment of the present invention provides an aging system for an optically active device, including:
the electrical connection judging unit is used for confirming that the electrical connection between the optical active device and the aging board is normal if the real-time temperature of any optical active device on the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board;
the temperature control module judging unit is used for confirming that the temperature control module of the optical active device is normal if the temperature control module corresponding to any optical active device is judged and obtained to stabilize the real-time temperature of the optical active device within a preset temperature range within a preset time;
the comprehensive judgment unit is used for confirming that the optical active device meets the preset aging condition if the electrical connection between any optical active device and the aging board is normal and the temperature control module of the optical active device is normal;
and the aging unit is used for aging all the optical active devices on the aging board in batch if each optical active device on the aging board meets the preset aging condition.
In another aspect, an embodiment of the present invention provides an aging apparatus for an optically active device, including a processor, a communication interface, a memory and a bus, where the processor, the communication interface, and the memory complete communication with each other through the bus, and the processor may call logic instructions in the memory to perform the aging method for the optically active device as described above.
In yet another aspect, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the aging method of the optically active device as described above.
According to the aging method of the optical active device, before batch aging is carried out, hidden dangers of electrical connection between each optical active device and an aging board and a temperature control module of the optical active device are checked, the problem that the optical active device fails due to improper current and high temperature caused by circuit breaking or short circuit in an aging process is solved, power-on protection of the optical active device is achieved, the aging yield of the optical active device is improved, and unnecessary waste of social resources is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for aging an optically active device according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a burn-in system for an optically active device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a PID compensation network of an optical active device according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating a method for burn-in of an optically active device according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a method for aging an optically active device according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an aging apparatus for an optically active device according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an aging apparatus for an optically active device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Aiming at the situations that in the batch aging process, due to the lack of protection and hidden danger investigation on the optical active devices, improper current caused by circuit open circuit or short circuit and high temperature cause batch failure of the optical active devices, the embodiment of the invention provides a method for investigating hidden dangers of electrical connection between each optical active device and an aging board and a temperature control module of the optical active device before batch aging, so as to avoid unnecessary social resource waste. Fig. 1 is a schematic flowchart of a method for aging an optically active device according to an embodiment of the present invention, and as shown in fig. 1, the method for aging an optically active device includes:
and 101, if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board, confirming that the electrical connection between the optical active device and the aging board is normal.
Specifically, before performing the burn-in of the optically active device, it is first necessary to connect the optically active device with a burn-in board. For example, fig. 2 is a schematic structural diagram of a burn-in system of an optically active device according to an embodiment of the present invention, and referring to fig. 2, the optically active device is mounted on a mounting board and connected to the burn-in board through the mounting board. It should be noted that, in the embodiments of the present invention, the number of the optically active devices mounted on the mounting board, the number of the mounting boards to which the burn-in board is connected, and the number of the burn-in boards are not specifically limited. In order to judge the electrical connection between any optical active device and the aging board, the real-time temperature of the optical active device when the temperature is not controlled is compared with the real-time temperature of the aging board, and before the optical active device is powered on, under the action of thermal cycle, if no open circuit exists between the optical active device and the aging board, the real-time temperature of the optical active device when the temperature is not controlled is consistent with the real-time temperature of the aging board. Based on this, whether the electrical connection between the optical active device and the aging board has an open circuit is judged by comparing the real-time temperature of the optical active device when the temperature is not controlled with the real-time temperature of the aging board: if the real-time temperature of the optical active device when the temperature is not controlled is consistent with the real-time temperature of the aging board, the electrical connection between the optical active device and the aging board is not broken, and the electrical connection between the optical active device and the aging board is confirmed to be normal; otherwise, the electrical connection between the optical active device and the aging board is broken, and the electrical connection between the optical active device and the aging board is confirmed to be abnormal. Here, the real-time temperature of the optical active device when the temperature of the optical active device is not controlled refers to the real-time temperature of the optical active device when the temperature control module on the optical active device is not operating.
And 102, if the real-time temperature of the optical active device is stabilized within a preset temperature range within a preset time by the temperature control module corresponding to any optical active device, determining that the temperature control module of the optical active device is normal.
Here, the temperature control module of the optically active device may be a TEC module preset in the optically active device, or may be a temperature control module arranged on the mounting plate and used for controlling a real-time temperature of the optically active device, which is not specifically limited in this embodiment of the present invention. Wherein, the TEC is a semiconductor refrigerator (Thermo Electric Cooler) and is made by using the peltier effect of semiconductor materials. The peltier effect is a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. The heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials of TEC, and the bismuth telluride elements are electrically connected in series and generate heat in parallel. The TEC comprises a number of P-type and N-type pairs, which are connected together by electrodes and are sandwiched between two ceramic electrodes; when current flows through the TEC, the heat generated by the current is transferred from one side of the TEC to the other, creating a "hot" side and a "cold" side on the TEC.
The temperature control module is used for stabilizing the real-time temperature of the optical active device within a preset temperature range, and if the real-time temperature of the optical active device can be stabilized within the preset temperature range within a preset time in the state that the optical active device is powered on, the temperature control module is confirmed to normally operate; if the real-time temperature of the optical active device cannot be stabilized within the preset temperature range by the temperature control module within the preset time in the state of powering up the optical active device, the temperature control module is in a failure state.
103, if the electrical connection between any of the optical active devices and the burn-in board is normal and the temperature control module of the optical active device is normal, determining that the optical active device meets the preset burn-in condition.
Here, the preset aging condition includes that the electrical connection between the optically active device and the aging board is normal, and the temperature control module of the optically active device is normal, and the optically active device satisfying the preset aging condition can ensure that it does not fail due to improper current and high temperature caused by open circuit or short circuit of the circuit when performing the aging operation.
And 104, if each optical active device on the aging board meets the preset aging condition, performing batch aging on all the optical active devices on the aging board.
According to the aging method provided by the embodiment of the invention, before batch aging is carried out, hidden dangers of the electrical connection between each optical active device and the aging board and the temperature control module of the optical active device are checked, the problem that the optical active device fails due to improper current and high temperature caused by circuit breaking or short circuit in the aging process is solved, the power-on protection of the optical active device is realized, the aging yield of the optical active device is improved, and unnecessary waste of social resources is avoided.
Based on the above embodiment, an aging method for an optical active device, if it is determined that a real-time temperature of any optical active device connected to an aging board when temperature is not controlled is consistent with a real-time temperature of the aging board, it is determined that electrical connection between the optical active device and the aging board is normal, and the method further includes: when any optical active device connected with the aging board is in an uncontrolled temperature state, acquiring the real-time resistance value of a device thermistor on the optical active device, and acquiring the real-time temperature of the optical active device when the temperature is not controlled according to the real-time resistance value of the device thermistor; and acquiring the real-time resistance value of the thermistor on the aging board, and acquiring the real-time temperature of the aging board according to the real-time resistance value of the thermistor on the aging board.
Specifically, the real-time temperature of the optical active device when the temperature is not controlled and the real-time temperature of the aging board are obtained through the resistance values of the device thermistor on the optical active device and the aging board thermistor on the aging board respectively. Preferably, the device thermistor and the aging board thermistor adopted in the embodiment of the present invention are both negative temperature coefficient thermistors (NTCs), and a nonlinear relationship between a real-time resistance value and a real-time temperature of the thermistor is shown in the following formula:
RTH＝RR*exp{B*(1/T-1/TR)}；
in the formula, RTHIs the real-time resistance value, R, of the thermistor at the temperature TRFor the thermistor at temperature TRAnd B is a thermal sensitive index available for the thermistor in the temperature range of aging operation.
After the real-time resistance value of the thermistor is obtained, the corresponding real-time temperature can be obtained through the above formula, and the corresponding real-time temperature can be obtained by inquiring according to the temperature table of the thermistor.
Preferably, the temperature sampling data processing can be performed by applying arithmetic mean filtering, for example, N consecutive real-time temperature sampling values are taken to perform arithmetic mean to filter signals with random interference, and the filtered real-time temperature fluctuates around a certain value range, so that the probability of fault misjudgment is simply and effectively reduced.
In the embodiment of the invention, the real-time temperature is obtained by obtaining the real-time resistance value of the thermistor, so that the real-time temperature acquisition of the optical active device and the aging board under the same condition is realized, and a judgment basis is provided for the electrical connection between the optical active device and the aging board.
Based on any one of the embodiments, an aging method for an optical active device is provided, wherein a temperature control module comprises a TEC module and a closed loop compensation network; the TEC module is used for heating or cooling the light-active device; the closed-loop compensation network controls the TEC module to heat or cool according to the real-time temperature of the optical active device and the preset temperature, so that the real-time temperature of the optical active device can be stabilized within the preset temperature range within the preset time.
The closed-loop compensation network, namely the feedback compensation network, compares the acquired real-time temperature measurement value of the optical active device with a preset temperature to generate a deviation signal, and utilizes the deviation signal to carry out regulation control so that the real-time temperature measurement value of the optical active device is as close to the preset temperature as possible. It should be noted that the preset temperature is within the preset temperature range, and the preset temperature is assumed to be T0If the temperature range threshold is θ, the preset temperature range may be [ T0-θ，T0+θ]。
Preferably, the closed loop compensation network is a PID compensation network.
A PID compensation network is an important link of temperature control and is a main guarantee for achieving high-efficiency and high-precision control, fig. 3 is a schematic structural diagram of a PID compensation network of an optical active device according to an embodiment of the present invention, as shown in fig. 3, VRTHOUTA voltage signal V corresponding to a predetermined temperatureTEMPSETFor the voltage signal, V, corresponding to the real-time temperature of the optically active device to be acquiredOUTIs a voltage signal used to control the TEC module. PIDThe mathematical model of the compensation network is as follows:
where U and e are the output and input, respectively, of the PID compensation network, KPIs a proportionality coefficient, TIAs an integral coefficient, TDIs a differential coefficient.
Referring to FIG. 3, resistor R2And R1Is proportional coefficient KPActing immediately on the offset signal pair (V)RTHOUT-VTEMPSET) The real-time temperature is changed in a direction in which the deviation is reduced. KPThe increase, PID compensation network response speed is accelerated, compensation action is more sensitive, but KPThe dynamic performance of the PID compensation network is deteriorated due to the overlarge size, and the stability of the PID compensation network is even affected, for example, the TEC module current jumps and is directly damaged. R1×C1The integral network can memorize and integrate small deviation, the integral coefficient is small, the temperature stabilization time is prolonged, the integral coefficient is large, the response time is shortened, but the PID compensation network is easy to generate oscillation. R2×C2For the differential coefficient, the differential network can introduce an effective correction signal before the deviation becomes large, so that the adjusting time of the PID compensation network is reduced, the temperature response is accelerated and the stability is enhanced if the differential coefficient is properly increased, but the stability of the network is influenced if the differential coefficient is too large. When oscillation occurs in the PID compensation network, the proportional coefficient is reduced, and after the PID compensation network is stable, the integral coefficient and the differential coefficient are finely adjusted, so that the precision and the efficiency of temperature control are ensured.
For example, the preset temperature is set to the real-time temperature (i.e., the ambient temperature) of the burn-in board, and the incremental temperature setting is as follows:
U(k)＝U(k-1)+ΔU(k-1)；
ΔU(k-1)＝KP[E(k)-E(k-1)]+KIE(k)
+KD[E(k)-2E(k-1)+E(k-2)]。
based on any of the above embodiments, a method for aging an optical active device, where if each optical active device connected to an aging board satisfies a preset aging condition, all optical active devices connected to the aging board are subjected to batch aging, and the method further includes: if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged and known to be inconsistent with the real-time temperature of the aging board, the fact that the electrical connection between the optical active device and the aging board is broken is confirmed; and if the real-time temperature of the optical active device is not stabilized within the preset temperature range within the preset time by the temperature control module corresponding to any optical active device, determining that the temperature control module of the optical active device fails or the electrical connection between the active device and the aging board is short-circuited according to the change condition of the real-time temperature of the optical active device within the preset time.
Specifically, if it is determined and known that the temperature control module corresponding to any of the optical active devices does not stabilize the real-time temperature of the optical active device within the preset temperature range within the preset time, the possible situations include, but are not limited to, that the real-time temperature of the optical active device continuously rises or falls within the preset time, and that the real-time temperature of the optical active device is maintained at a temperature that is not controlled by the temperature control module in the power-up state within the preset time. The reason why the real-time temperature of the optical active device continuously rises or falls within the preset time indicates that the temperature control module is in operation but the temperature control effect of the temperature control module is not ideal may be that a closed-loop compensation network in the temperature control module is open or parameters of the closed-loop compensation network are improperly set. The real-time temperature of the optical active device is kept at the temperature which is not controlled by the temperature control module in the power-up state within the preset time, which indicates that the temperature control module completely fails or the electrical connection between the active device and the aging board may have a short circuit, so that the temperature control module does not enter the working state.
Based on any of the above embodiments, a method for aging an optical active device, where if an electrical connection between any of the optical active devices and an aging board is normal and a temperature control module of the optical active device is normal, it is determined that the optical active device satisfies a preset aging condition, specifically includes: and if the electrical connection between any optical active device and the aging board is normal, the temperature control module of the optical active device is normal, and the bias current of the optical active device is within a preset bias current range, determining that the optical active device meets a preset aging condition.
Here, when judging whether the optical active device satisfies the preset aging condition, in addition to the need of judging the electrical connection between the optical active device and the aging board, the temperature control module of the optical active device, the bias current of the optical active device needs to be compared with the preset bias current range: under the condition that the electrical connection between the optical active device and the aging board is normal and the temperature control module of the optical active device is normal, if the bias current of the optical active device is within the range of the preset bias current, the optical active device is confirmed to meet the preset aging condition; and if the bias current of the optical active device is not in the preset bias current range, confirming that the optical active device does not meet the preset aging condition.
Preferably, in addition to comparing the bias current of the optical active device with the preset bias current range, the backlight current of the optical active device may be compared with the preset backlight current range, for example, in a case that the electrical connection between the optical active device and the burn-in board is normal and the temperature control module of the optical active device is normal, if the bias current of the optical active device is within the preset bias current range and the backlight current of the optical active device is within the preset backlight current range, it is determined that the optical active device satisfies the preset burn-in condition.
Based on any of the above embodiments, a method for aging an optical active device, where if each optical active device connected to an aging board satisfies a preset aging condition, all optical active devices connected to the aging board are subjected to batch aging, and the method further includes:
the aging board is connected with a plurality of assembling boards, and the assembling boards are used for mounting the optical active devices; aiming at any assembly plate, acquiring in-place information of the assembly plate according to the electrical connection state between each optical active device and the aging plate mounted on the assembly plate and the state of a temperature control module; and if the in-place information of the assembly plate is consistent with the preset in-place information of the assembly plate, confirming that the in-place information of the assembly plate is correct.
Here, the electrical connection state between the optical active device and the burn-in board is normal or abnormal, and the temperature control module state of the optical active device is normal or abnormal. Specifically, for any optical active device, when the electrical connection state between the optical active device and the aging board is normal and the temperature control module state of the optical active device is normal, the optical active device is in an in-place state. Therefore, for any one of the mounting boards, the in-place information of the mounting board can be obtained according to whether each optically active device mounted on the mounting board is in the in-place state. Here, the in-place information of the assembly board may be whether the optical active device in each slot in the assembly board is in place, or may be the number of the in-place optical active devices in the assembly board and the slot corresponding to each in-place optical active device, which is not specifically limited in this embodiment of the present invention.
Correspondingly, if each optically active device connected with the aging board meets the preset aging condition, all the optically active devices connected with the aging board are aged in batches, and the method specifically comprises the following steps: and if the in-place information of each assembling plate is correct and each optical active device connected with the aging plate meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging plate.
In the embodiment of the invention, the detection of the in-place information of the assembling plate is added, so that conditions are provided for further realizing the power-on protection of the optical active device and improving the aging yield of the optical active device.
In order to better understand and apply the aging method of the optically active device proposed by the present invention, the following examples are given, and the present invention is not limited to the following examples.
Fig. 4 is a schematic flowchart of an aging method of an optical active device according to an embodiment of the present invention, fig. 5 is a schematic structural diagram of an aging method of an optical active device according to an embodiment of the present invention, and referring to fig. 4 and fig. 5, the aging method of an optical active device includes the following specific steps:
step 1, assembling the batch of photo-active devices to be aged into an assembling plate shown in fig. 2, connecting the aging plate and the assembling plate by an upper computer, and judging whether the aging plate and the assembling plate are in place.
And 2, after the aging board and the assembling board are judged to be in place, the upper computer detects the real-time resistance value of the thermistor of the aging board on the aging board and the real-time resistance value of the thermistor of the device on the optical active device, obtains the real-time temperature of the aging board and the real-time temperature of the optical active device when the temperature is not controlled, compares whether the real-time temperature of the aging board is consistent with the real-time temperature of the optical active device when the temperature is not controlled, and judges whether open circuit exists between the optical active device and the aging board. Controlling a temperature control module of the optical active device to reach the ambient temperature, detecting the real-time resistance value of a thermistor of the device on the optical active device, acquiring the current temperature of the optical active device, and judging whether the temperature control module is abnormal or not.
And 3, after the temperature control detection of the assembly plate device is finished, obtaining the in-place information of the aging plate and the assembly plate according to the current detection result, and judging whether the in-place information is matched with the received preset in-place information. If not, record unmatched assembly plate trench and lead to not matching the abnormal type, close the assembly plate power.
And 4, after the in-place information is matched, the aging board sets a preset bias current of each in-place optical active device, detects the bias current of each in-place optical active device and the backlight current of the device and judges whether the abnormality exists. If the current is abnormal, the current abnormality is recorded, and the power supply of the assembly plate is turned off.
And 5, if the abnormal record exists, judging the reason causing the abnormality according to the type of the abnormal record, eliminating the fault, and carrying out in-place detection again. And if no abnormity exists, carrying out aging parameter configuration to start device aging.
Before the batch aging is carried out, hidden dangers of the electrical connection between each optical active device and the aging board and the temperature control module of the optical active device are checked, the problem that the optical active devices fail due to improper current and high temperature caused by circuit breaking or short circuit in the aging process is solved, the power-on protection of the optical active devices is realized, the aging yield of the optical active devices is improved, and unnecessary waste of social resources is avoided.
Based on any of the above method embodiments, fig. 6 is a schematic structural diagram of an aging apparatus for an optical active device according to an embodiment of the present invention, and as shown in fig. 6, the aging apparatus for an optical active device includes:
the electrical connection judging unit 601 is configured to determine that the electrical connection between the optical active device and the burn-in board is normal if it is judged that the real-time temperature of any optical active device on the burn-in board when the temperature is not controlled is consistent with the real-time temperature of the burn-in board;
a temperature control module determining unit 602, configured to determine that a temperature control module of any optical active device is normal if it is determined that the temperature control module corresponding to the optical active device stabilizes the real-time temperature of the optical active device within a preset temperature range within a preset time;
a comprehensive judgment unit 603, configured to determine that the optical active device meets a preset aging condition if the electrical connection between any optical active device and the aging board is normal and the temperature control module of the optical active device is normal;
the aging unit 604 is configured to perform batch aging on all the optical active devices on the aging board if each optical active device on the aging board meets a preset aging condition.
It should be noted that, the electrical connection determining unit 601, the temperature control module determining unit 602, the comprehensive determining unit 603, and the aging unit 604 cooperate to execute an aging method of the optical active device in the foregoing embodiment, and specific functions of the system refer to the foregoing embodiment of the aging method of the optical active device, which is not described herein again.
According to the aging device provided by the embodiment of the invention, before batch aging is carried out, hidden dangers of the electrical connection between each optical active device and the aging board and the temperature control module of the optical active device are checked, the problem that the optical active device fails due to improper current and high temperature caused by circuit breaking or short circuit in the aging process is solved, the power-on protection of the optical active device is realized, the aging yield of the optical active device is improved, and unnecessary waste of social resources is avoided.
Based on any one of the above embodiments, an aging apparatus for an optically active device further includes:
the temperature acquisition unit is used for acquiring the real-time resistance value of a device thermistor on any optical active device connected with the aging board when the optical active device is in an uncontrolled temperature state, and acquiring the real-time temperature of the optical active device when the temperature is not controlled according to the real-time resistance value of the device thermistor; and acquiring the real-time resistance value of the thermistor on the aging board, and acquiring the real-time temperature of the aging board according to the real-time resistance value of the thermistor on the aging board.
Based on any one of the embodiments, the temperature control module comprises a TEC module and a closed-loop compensation network; the TEC module is used for heating or cooling the light-active device; the closed-loop compensation network controls the TEC module to heat or cool according to the real-time temperature of the optical active device and the preset temperature, so that the real-time temperature of the optical active device can be stabilized within the preset temperature range within the preset time.
Based on any one of the above embodiments, an aging apparatus for an optically active device further includes:
the abnormity diagnosis unit is used for confirming that the electrical connection between the optical active device and the aging board is broken if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged and known to be inconsistent with the real-time temperature of the aging board; and if the real-time temperature of the optical active device is not stabilized within the preset temperature range within the preset time by the temperature control module corresponding to any optical active device, determining that the temperature control module of the optical active device fails or the electrical connection between the active device and the aging board is short-circuited according to the change condition of the real-time temperature of the optical active device within the preset time.
Based on any of the above embodiments, the comprehensive judgment unit 603 of the aging apparatus for an optical active device is specifically configured to:
and if the electrical connection between any optical active device and the aging board is normal, the temperature control module of the optical active device is normal, and the bias current of the optical active device is within a preset bias current range, determining that the optical active device meets the preset aging condition.
Based on any one of the above embodiments, an aging apparatus for an optical active device, wherein the closed-loop compensation network is a PID compensation network.
Based on any one of the above embodiments, an aging apparatus for an optically active device, the aging board is connected to a plurality of mounting boards, and the mounting boards are used for mounting the optically active device; the aging apparatus further includes:
the in-place information unit is used for acquiring in-place information of any assembly plate according to the electrical connection state between each optical active device and the aging plate and the state of the temperature control module, wherein the optical active devices are mounted on the assembly plate; and if the in-place information of the assembly plate is consistent with the preset in-place information of the assembly plate, confirming that the in-place information of the assembly plate is correct.
Correspondingly, the aging unit is specifically configured to perform batch aging on all the optical active devices connected with the aging board if the in-place information of each assembly board is correct and each optical active device connected with the aging board meets a preset aging condition.
Fig. 7 is a schematic structural diagram of an aging apparatus for an optically active device according to an embodiment of the present invention, and as shown in fig. 7, the aging apparatus for an optically active device includes: a processor (processor)701, a communication Interface (Communications Interface)702, a memory (memory)703 and a bus 704, wherein the processor 701, the communication Interface 702 and the memory 703 complete communication with each other through the bus 704. The processor 701 may invoke logic instructions in the memory 703 to perform methods including, for example: if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board, the electrical connection between the optical active device and the aging board is confirmed to be normal; if the real-time temperature of the optical active device is stabilized within a preset temperature range within preset time by the temperature control module corresponding to any optical active device, the temperature control module of the optical active device is confirmed to be normal; if the electrical connection between any optical active device and the aging board is normal and the temperature control module of the optical active device is normal, determining that the optical active device meets a preset aging condition; and if each optical active device connected with the aging board meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging board.
An embodiment of the present invention discloses a computer program product, which includes a computer program stored on a non-transitory computer readable storage medium, where the computer program includes program instructions, and when the program instructions are executed by a computer, the computer can execute the method provided by the above method embodiments, for example, the method includes: if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board, the electrical connection between the optical active device and the aging board is confirmed to be normal; if the real-time temperature of the optical active device is stabilized within a preset temperature range within preset time by the temperature control module corresponding to any optical active device, the temperature control module of the optical active device is confirmed to be normal; if the electrical connection between any optical active device and the aging board is normal and the temperature control module of the optical active device is normal, determining that the optical active device meets a preset aging condition; and if each optical active device connected with the aging board meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging board.
The present embodiments provide a non-transitory computer-readable storage medium storing computer instructions that cause a computer to perform the methods provided by the above method embodiments, for example, including: if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board, the electrical connection between the optical active device and the aging board is confirmed to be normal; if the real-time temperature of the optical active device is stabilized within a preset temperature range within preset time by the temperature control module corresponding to any optical active device, the temperature control module of the optical active device is confirmed to be normal; if the electrical connection between any optical active device and the aging board is normal and the temperature control module of the optical active device is normal, determining that the optical active device meets a preset aging condition; and if each optical active device connected with the aging board meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging board.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
The above-described embodiments of the communication device and the like are merely illustrative, and units illustrated as separate components may or may not be physically separate, and components displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods of the various embodiments or some parts of the embodiments.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present invention, and are not limited thereto; although embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A method of burn-in of an optically active device, comprising:
if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board, the electrical connection between any optical active device and the aging board is confirmed to be normal; if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged and known to be inconsistent with the real-time temperature of the aging board, the fact that the electrical connection between any optical active device and the aging board is broken is confirmed;
if the real-time temperature of any optical active device is stable within a preset temperature range within preset time by the temperature control module corresponding to any optical active device, the temperature control module of any optical active device is confirmed to be normal;
if the electrical connection between any optical active device and the aging board is normal and the temperature control module of any optical active device is normal, determining that any optical active device meets a preset aging condition;
and if each optical active device connected with the aging board meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging board.
2. The method of claim 1, wherein if it is determined that the real-time temperature of any optically active device connected to the burn-in board when the temperature is not controlled is consistent with the real-time temperature of the burn-in board, it is determined that the electrical connection between the optically active device and the burn-in board is normal, the method further comprises:
when any optical active device connected with the aging board is in an uncontrolled temperature state, acquiring the real-time resistance value of a device thermistor on any optical active device, and acquiring the real-time temperature of any optical active device when the temperature is not controlled according to the real-time resistance value of the device thermistor;
and acquiring the real-time resistance value of the thermistor on the aging board, and acquiring the real-time temperature of the aging board according to the real-time resistance value of the thermistor on the aging board.
3. The method of claim 1, wherein the temperature control module comprises a TEC module and a closed loop compensation network;
the TEC module is used for heating or cooling the optical active device;
and the closed-loop compensation network controls the TEC module to heat or cool according to the real-time temperature of the optical active device and a preset temperature, so that the real-time temperature of the optical active device can be stabilized within the preset temperature range within the preset time.
4. The method of claim 1, wherein if each of the optically active devices connected to the burn-in board satisfies the predetermined burn-in condition, performing batch burn-in on all the optically active devices connected to the burn-in board, and before the step of performing the step of:
if the real-time temperature of any optical active device is not stabilized within a preset temperature range within a preset time by the temperature control module corresponding to any optical active device, determining that the temperature control module of any optical active device fails or the electrical connection between any optical active device and the aging board is short-circuited according to the change condition of the real-time temperature of any optical active device within the preset time.
5. The method according to claim 1, wherein the confirming that the optically active device satisfies a predetermined aging condition if the electrical connection between the optically active device and the aging board is normal and the temperature control module of the optically active device is normal comprises:
and if the electrical connection between any optical active device and the aging board is normal, the temperature control module of any optical active device is normal, and the bias current of any optical active device is within a preset bias current range, determining that any optical active device meets the preset aging condition.
6. The method of claim 3, wherein the closed loop compensation network is a PID compensation network.
7. The method of claim 4, wherein if each of the optically active devices connected to the burn-in board satisfies the predetermined burn-in condition, performing batch burn-in on all the optically active devices connected to the burn-in board, and before the step of performing the step of:
the aging board is connected with a plurality of assembling boards, and the assembling boards are used for mounting the optical active devices;
aiming at any assembly plate, acquiring in-place information of the assembly plate according to the electrical connection state and the temperature control module state between each optical active device installed on the assembly plate and the aging plate;
if the in-place information of any assembling plate is consistent with the preset in-place information of any assembling plate, confirming that the in-place information of any assembling plate is correct;
correspondingly, if each optically active device connected to the burn-in board satisfies the preset burn-in condition, all the optically active devices connected to the burn-in board are burned in batch, which specifically includes:
and if the in-place information of each assembling plate is correct and each optical active device connected with the aging plate meets the preset aging condition, performing batch aging on all the optical active devices connected with the aging plate.
8. An apparatus for burn-in of an optically active device, comprising:
the electrical connection judging unit is used for confirming that the electrical connection between any optical active device and the aging board is normal if the real-time temperature of any optical active device on the aging board when the temperature is not controlled is judged to be consistent with the real-time temperature of the aging board; if the real-time temperature of any optical active device connected with the aging board when the temperature is not controlled is judged and known to be inconsistent with the real-time temperature of the aging board, the fact that the electrical connection between any optical active device and the aging board is broken is confirmed;
the temperature control module judging unit is used for confirming that the temperature control module of any optical active device is normal if the temperature control module corresponding to any optical active device is judged and obtained that the real-time temperature of any optical active device is stabilized within a preset temperature range within a preset time;
the comprehensive judgment unit is used for confirming that any optical active device meets a preset aging condition if the electrical connection between any optical active device and the aging board is normal and the temperature control module of any optical active device is normal;
and the aging unit is used for aging all the optical active devices on the aging board in batches if each optical active device on the aging board meets a preset aging condition.
9. An aging apparatus for an optically active device, comprising a processor, a communication interface, a memory and a bus, wherein the processor, the communication interface and the memory communicate with each other via the bus, and the processor can call logic instructions in the memory to execute the aging method of the optically active device according to any one of claims 1 to 7.
10. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out a method of aging an optically active device as claimed in any one of claims 1 to 7.
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| CN101046694A (en) * | 2006-03-31 | 2007-10-03 | 中兴通讯股份有限公司 | Automatic temp control method of laser |
| JP5743944B2 (en) * | 2012-03-30 | 2015-07-01 | 株式会社日立産機システム | Power converter |
| CN105487574A (en) * | 2016-02-01 | 2016-04-13 | 江汉大学 | Temperature control system for laser, and method and apparatus for high-sensitivity detection |
| US10355966B2 (en) * | 2016-03-25 | 2019-07-16 | Advanced Micro Devices, Inc. | Managing variations among nodes in parallel system frameworks |
| CN106370963B (en) * | 2016-08-26 | 2019-08-20 | 武汉光迅科技股份有限公司 | A kind of automatic aging system and method for optical active component |
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| US5504432A (en) * | 1993-08-31 | 1996-04-02 | Hewlett-Packard Company | System and method for detecting short, opens and connected pins on a printed circuit board using automatic test equipment |
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