CN108638429A - Instrument board and plating bright wisp matching process - Google Patents
Instrument board and plating bright wisp matching process Download PDFInfo
- Publication number
- CN108638429A CN108638429A CN201810324888.2A CN201810324888A CN108638429A CN 108638429 A CN108638429 A CN 108638429A CN 201810324888 A CN201810324888 A CN 201810324888A CN 108638429 A CN108638429 A CN 108638429A
- Authority
- CN
- China
- Prior art keywords
- bright wisp
- skeleton
- plating
- plating bright
- cover board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D25/00—Superstructure or monocoque structure sub-units; Parts or details thereof not otherwise provided for
- B62D25/08—Front or rear portions
- B62D25/14—Dashboards as superstructure sub-units
Abstract
The present invention relates to technical field of automobile parts, more particularly, to a kind of instrument board and plating bright wisp matching process.Instrument board includes skeleton, plating bright wisp ontology and cover board；Plating bright wisp is fixed at the side of skeleton by quadric injection mould；Cover board is arranged by being welded and fixed in the side of skeleton, and is arranged in the same side with plating bright wisp.Bright wisp matching process is electroplated specifically, being first molded skeleton, forms semi-finished product after the quadric injection mould of plating bright wisp is carried out on the basis of skeleton, is later fixedly connected with cover board with semi-finished product.Instrument board provided by the invention and plating bright wisp matching process, by way of carrying out quadric injection mould to plating bright wisp, it ensure that the clearance surface difference of plating bright wisp and skeleton periphery, also simultaneously because need not be welded between plating bright wisp and skeleton and reduce the thickness of plating bright wisp and the adjacent spacing being electroplated between bright wisp, while ensure that the bonding strength between plating bright wisp and skeleton, the demand of different moulding is met.
Description
Technical field
The present invention relates to technical field of automobile parts, more particularly, to a kind of instrument board and plating bright wisp matching process.
Background technology
In the prior art, as follows to the processing method of bright wisp is electroplated：
The immediate prior art of the technical program：
1. being first molded big panel；
2. injection molding plating bright wisp；
3. bright wisp, which is electroplated, carries out electroplating processes；
4. the clamping of plating bright wisp is welded on the big panel of injection molding.
Due to moulding, the clamping of plating bright wisp or welding need to be clamped welding space accordingly, and 2 plating are bright
Item is parallel, and at least 5mm spacing is needed between plating bright wisp.
When spacing demand between bright wisp is electroplated is less than 5mm, the scheme of the prior art, that is, utilize traditional clamping
Or welding mating structure, it just cannot achieve, needless to say further decrease the thickness of plating bright wisp.
It can be seen from the above, how to install the plating bright wisp of thinner thickness on the big panel of injection molding or by adjacent two
The spacing of a plating bright wisp reduces, and is a great difficult problem urgently to be resolved hurrily in the prior art.
Invention content
The purpose of the present invention is to provide a kind of instrument board and plating bright wisp matching process, to solve to exist in the prior art
The technical issues of.
Instrument board provided by the invention, including skeleton, plating bright wisp ontology and cover board；
The plating bright wisp is fixed at the side of the skeleton by quadric injection mould；
The cover board is arranged by being welded and fixed in the side of the skeleton, and is arranged same with the plating bright wisp
Side.
Further, it is provided with through-hole on the skeleton.
Further, the plating bright wisp includes the first bright wisp and the second bright wisp；
First bright wisp is arranged on the outer ring of the skeleton；
Second bright wisp is fixed on the outer ring of the through-hole.
Further, the material of the skeleton is non-conducting material；
The material of the plating bright wisp is conductive material.
Further, the thickness of the plating bright wisp is less than 5mm.
The present invention also provides a kind of plating bright wisp matching process, specifically, skeleton is first molded, on the basis of skeleton
Semi-finished product are formed after carrying out the quadric injection mould of plating bright wisp, are later fixedly connected with cover board with semi-finished product.
Further, the cover board is injection molding.
Further, the mode that is fixedly connected between the cover board and the skeleton is welding.
Further, described to be welded as thermofussion welding or supersonic welding.
Further, it after the semi-finished product first carry out electroplating processes, is fixedly connected then at the cover board.
Instrument board provided by the invention and plating bright wisp matching process, by the side for carrying out quadric injection mould to plating bright wisp
Formula ensure that the clearance surface difference of plating bright wisp and skeleton periphery, also simultaneously because need not be welded between plating bright wisp and skeleton
And reduce the spacing between the thickness and adjacent plating bright wisp of plating bright wisp, it ensure that the company between plating bright wisp and skeleton
While connecing intensity, the demand of different moulding is met.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is the front view of instrument board provided in an embodiment of the present invention；
Fig. 2 is the A-A sectional views of Fig. 1；
Fig. 3 is the B-B sectional views of Fig. 1；
Fig. 4 is the explosive view of instrument board provided in an embodiment of the present invention；
Fig. 5 is the flow chart of plating bright wisp matching process provided in an embodiment of the present invention.
Reference numeral：
1：Cover board；2：First bright wisp；3：Second bright wisp；4：Skeleton；5：Weld part；6：Welding hole.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
The every other embodiment that personnel are obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
In addition, term " first ", " second ", " third " are used for description purposes only, it is not understood to indicate or imply phase
To importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be electrical connection to be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
As shown in attached drawing 1-4, the present invention provides a kind of instrument boards, including skeleton 4, plating bright wisp ontology and cover board 1；
The plating bright wisp is fixed at the side of the skeleton 4 by quadric injection mould；
The cover board 1 is arranged by being welded and fixed in the side of the skeleton 4, and is arranged same with the plating bright wisp
Side.
In the present embodiment, to after producing skeleton 4 by way of injection molding, secondary injection is carried out on the basis of skeleton 4
Modeling, and then plating bright wisp is formed on skeleton 4, change is finally welded and fixed setting on skeleton 4 or plating bright wisp.
Such setting forms plating bright wisp by way of quadric injection mould on skeleton 4, need not give plating bright wisp
The assembled end between skeleton 4 is left, the connection structure also being connect with skeleton 4 there is no need to leave plating bright wisp, Jin Erneng
In the case of the enough intensity that bright wisp is electroplated in guarantee, the thickness of plating bright wisp is effectively reduced；Meanwhile bright wisp is electroplated and does not also need
It is welded with skeleton 4, welds space into without being left in the side of plating bright wisp, and then can effectively reduce adjacent
Two plating bright wisps between spacing.
That is, by above-mentioned set-up mode, the electricity that thinner thickness is installed on the big panel of injection molding can be realized
It plates bright wisp or reduces the spacing of two adjacent plating bright wisps, and then can realize the demand of the different shaping of plating bright wisp.
In the present embodiment, the manufacturing of cover board 1 is also by injection molding.
It should be pointed out that cover board 1 can be such as injection molding in the present embodiment, but it is not limited solely to be molded into
Type can also be that other modes are produced, such as can be compression moulding, that is to say, that as long as it can produce cover board 1
.
It may also be noted that in the present embodiment, the fixed company between cover board 1 and skeleton 4 or cover board 1 and plating bright wisp
It is welding to connect mode, but it is not limited solely to weld, and can also be that others are fixedly connected with mode, can also such as rivet
Deng, that is to say, that as long as it can realize being fixedly connected between skeleton 4 or plating bright wisp.
Preferred embodiment is to be provided with through-hole on the skeleton 4.
In the present embodiment, according to the needs of moulding, through-hole is provided on skeleton 4.
Preferred embodiment is that the plating bright wisp includes the first bright wisp 2 and the second bright wisp 3；
First bright wisp 2 is arranged on the outer ring of the skeleton 4；
Second bright wisp 3 is fixed on the outer ring of the through-hole.
In the present embodiment, plating bright wisp has two, is respectively 2 He of the first bright wisp being arranged around entire skeleton 4
Around the second bright wisp 3 of through-hole setting.
By the setting of the first bright wisp 2 and the second bright wisp 3 instrument board is also added while increasing the intensity of instrument board
Aesthetics.
As shown in Figure 1, in the present embodiment, since the upper end of through-hole is closer at a distance from the edge of skeleton 4, and then being arranged
The spacing relative close of the first bright wisp 2 and the second bright wisp 3 in the position.
Preferred embodiment is that the material of the skeleton 4 is non-conducting material；
The material of the plating bright wisp is conductive material.
In the present embodiment, skeleton 4 is set as non-conducting material, avoids being connected to the circuit inside instrument board, cause short
Road, and then it is effectively protected the circuit in instrument board and instrument.
In the present embodiment, plating connection is set to conductive material, to ensure that plating bright wisp can carry out electroplating processes.
Specifically, in the present embodiment, the material of skeleton 4 is PA6, and the material that bright wisp is electroplated is PC+ABS.
PA6 is also known as polyamide 6 or nylon 6, and PA6 has good comprehensive performance, and density is low, is easy molding, design is freely
Degree is big, partiting thermal insulation, and also has apparent advantage on mold and assembly cost.
PC is makrolon, has tool high intensity and coefficient of elasticity, high impact, use temperature range wide；Highly
The transparency and free dyeability；Shaping shrinkage rate is low, dimensional stability is good；Fatigue durability is poor；Weatherability is good；Electrical characteristic
It is excellent；It is tasteless odorless harmless to meet the advantages that safe and healthy.
It should be pointed out that the material of skeleton 4 can be PA6, other non-conducting materials are can also be, that is,
It says, as long as can be while ensureing the intensity of skeleton 4, additionally it is possible to ensure the safety of the circuit and electric appliance inside instrument board
Property, avoid circuit inside instrument board or electric appliance and 4 conduction of skeleton.
ABS is acrylonitrile-butadiene-styrene copolymer, is a kind of intensity height, good toughness, heat easily processed into type
Plastotype high molecular material.
It is combined by PC and ABS, while capable of ensureing that the intensity of bright wisp is electroplated, additionally it is possible to ensure the good of plating bright wisp
Electric conductivity, and then enable to plating smoothly complete.
It should be pointed out that in the present embodiment, the material that bright wisp is electroplated can be the combination of PC+ABS, but it is not only
It is confined to such a mode, it can be with other conductive materials, as long as electroplating technology can be completed.
Preferred embodiment is that the thickness of the plating bright wisp is less than 5mm.
The thickness of plating bright wisp is less than 5mm in the present embodiment, but it is necessary not only for less than this range of 5mm,
Can also be complete using the mode of the quadric injection mould in the present invention when production and assembly of the plating bright wisp more than or equal to 5mm
At.
The present invention also provides a kind of plating bright wisp matching process, as shown in figure 5, itself specifically, first be molded skeleton 4,
Semi-finished product are formed after carrying out the quadric injection mould of plating bright wisp on the basis of skeleton 4, are later fixedly connected with cover board 1 with semi-finished product.
In the present embodiment, specific mode is：
1. being molded skeleton 4, material is the non-conducting materials such as PA6；
2. skeleton 4 is put into mold, 2 bright wisps of quadric injection mould, bright wisp material is PC+ABS conductive materials；
3. skeleton 4 and 2 bright wisp injection moldings become the semi-finished product of 4 ontology of skeleton；
It is at this time conductive plastics due to there was only bright wisp, so only bright wisp is plated 4. a pair semi-finished product are electroplated；
5. 4 ontology of skeleton and cover board 1 after plating are welded, become finished product.
Preferred embodiment is that the cover board 1 is injection molding.
It should be pointed out that cover board 1 can be such as injection molding in the present embodiment, but it is not limited solely to be molded into
Type can also be that other modes are produced, such as can be compression moulding, that is to say, that as long as it can produce cover board 1
.
Preferred embodiment is that the mode that is fixedly connected between the cover board 1 and the skeleton 4 is welding.
In the present embodiment, as shown in figure 3, the fixed connection method between cover board 1 and skeleton 4 is welding, i.e., in skeleton 4
Weld part 5 is arranged close to one end of skeleton 4 in cover board 1, after weld part 5 is passed through welding hole 6, to welding in upper setting welding hole 6
Portion 5 is welded, it is made to be welded together with skeleton 4, and then completes being fixedly connected between cover board 1 and skeleton 4.
It should be pointed out that in the present embodiment, being fixedly connected between cover board 1 and skeleton 4 or cover board 1 and plating bright wisp
Mode is welding, but it is not limited solely to weld, and can also be that others are fixedly connected with mode, such as can also rivet,
That is, as long as it can realize being fixedly connected between skeleton 4 or plating bright wisp.
Preferred embodiment is, described to be welded as thermofussion welding or supersonic welding.
In the present embodiment, the mode of welding is that thermofussion welding or supersonic welding can after weld part 5 is passed through welding hole 6
It passes through the part exposed from skeleton 4 after welding hole 6 to melt weld part 5 in a manner of hot melt or ultrasonic wave, makes itself and skeleton 4
It is fused, and then realizes the welding between cover board 1 and skeleton 4.
It should be pointed out that in the present embodiment, the mode of welding is thermofussion welding or supersonic welding, but it not only limits to
In two kinds of above-mentioned welding manners, it can also be that other welding manners are fixedly connected, that is to say, that as long as it can
It realizes and is fixed together cover board 1 and skeleton 4 by welding.
Preferred embodiment is, after the semi-finished product first carry out electroplating processes, is fixedly connected then at the cover board 1.
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique for making the surface of metal or other materials product adhere to layer of metal film using electrolysis prevents metal oxygen to play
The effects that changing (such as corrosion), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.
In the present embodiment, semi-finished product are electroplated, since skeleton 4 produces for non-conducting material, are finally completed plating
Position can only plating bright wisp part.
In the present embodiment, after carrying out electroplating processes to plating bright wisp, the anti-oxidant of plating bright wisp can effectively be increased
Property, it ensure that the brightness of plating bright wisp, and then ensure that the aesthetics and ornamental value of instrument board.
Instrument board provided by the invention and plating bright wisp matching process, by the side for carrying out quadric injection mould to plating bright wisp
Formula ensure that the clearance surface difference of plating bright wisp and 4 periphery of skeleton, also simultaneously because need not be welded between plating bright wisp and skeleton 4
It connects and reduces the thickness of plating bright wisp and the adjacent spacing being electroplated between bright wisp, ensure that between plating bright wisp and skeleton 4
Bonding strength while, meet the demand of different moulding.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of instrument board, which is characterized in that including skeleton, plating bright wisp ontology and cover board；
The plating bright wisp is fixed at the side of the skeleton by quadric injection mould；
The cover board is arranged by being welded and fixed in the side of the skeleton, and is arranged in the same side with the plating bright wisp.
2. instrument board according to claim 1, which is characterized in that be provided with through-hole on the skeleton.
3. instrument board according to claim 2, which is characterized in that the plating bright wisp includes that the first bright wisp and second are bright
Item；
First bright wisp is arranged on the outer ring of the skeleton；
Second bright wisp is fixed on the outer ring of the through-hole.
4. instrument board according to claim 1, which is characterized in that the material of the skeleton is non-conducting material；
The material of the plating bright wisp is conductive material.
5. instrument board according to claim 1, which is characterized in that the thickness of the plating bright wisp is less than 5mm.
6. a kind of plating bright wisp matching process, which is characterized in that be first molded skeleton, plating bright wisp is carried out on the basis of skeleton
Semi-finished product are formed after quadric injection mould, are later fixedly connected with cover board with semi-finished product.
7. plating bright wisp matching process according to claim 6, which is characterized in that the cover board is injection molding.
8. plating bright wisp matching process according to claim 6, which is characterized in that between the cover board and the skeleton
It is welding to be fixedly connected with mode.
9. plating bright wisp matching process according to claim 8, which is characterized in that described to be welded as thermofussion welding or ultrasonic wave
Weldering.
10. plating bright wisp matching process according to claim 6, which is characterized in that the semi-finished product first carry out at plating
After reason, it is fixedly connected then at the cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810324888.2A CN108638429A (en) | 2018-04-12 | 2018-04-12 | Instrument board and plating bright wisp matching process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810324888.2A CN108638429A (en) | 2018-04-12 | 2018-04-12 | Instrument board and plating bright wisp matching process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108638429A true CN108638429A (en) | 2018-10-12 |
Family
ID=63746307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810324888.2A Pending CN108638429A (en) | 2018-04-12 | 2018-04-12 | Instrument board and plating bright wisp matching process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108638429A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4546695A (en) * | 1981-10-13 | 1985-10-15 | Nissan Motor Company, Limited | Louvered grille unit and method of its manufacture |
| JP2000015650A (en) * | 1998-07-02 | 2000-01-18 | Mitsuboshi Belting Ltd | Method and apparatus for molding partially foamed molding and partially foamed molding |
| CN202320528U (en) * | 2011-11-08 | 2012-07-11 | 浙江远翅控股集团有限公司 | Compact type automobile instrument board assembly |
| CN202952835U (en) * | 2012-12-07 | 2013-05-29 | 苏州万隆汽车零部件股份有限公司 | Split automobile instrument panel |
| CN203464453U (en) * | 2013-09-04 | 2014-03-05 | 宁波福尔达智能科技股份有限公司 | Horizontal vane decorating strip structure at air outlet of automobile air conditioner |
| CN105479764A (en) * | 2015-12-16 | 2016-04-13 | 爱卓塑料(上海)有限公司 | Double-mold-embedment production process of instrument panel |
| CN205417094U (en) * | 2016-03-17 | 2016-08-03 | 北京长城华冠汽车技术开发有限公司 | Automobile air outlet blade with bright wisp |
| CN106273213A (en) * | 2015-05-28 | 2017-01-04 | 大陆汽车电子(芜湖)有限公司 | The method manufacturing the coarse filter of the oil supply system for vehicle |
-
2018
- 2018-04-12 CN CN201810324888.2A patent/CN108638429A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4546695A (en) * | 1981-10-13 | 1985-10-15 | Nissan Motor Company, Limited | Louvered grille unit and method of its manufacture |
| JP2000015650A (en) * | 1998-07-02 | 2000-01-18 | Mitsuboshi Belting Ltd | Method and apparatus for molding partially foamed molding and partially foamed molding |
| CN202320528U (en) * | 2011-11-08 | 2012-07-11 | 浙江远翅控股集团有限公司 | Compact type automobile instrument board assembly |
| CN202952835U (en) * | 2012-12-07 | 2013-05-29 | 苏州万隆汽车零部件股份有限公司 | Split automobile instrument panel |
| CN203464453U (en) * | 2013-09-04 | 2014-03-05 | 宁波福尔达智能科技股份有限公司 | Horizontal vane decorating strip structure at air outlet of automobile air conditioner |
| CN106273213A (en) * | 2015-05-28 | 2017-01-04 | 大陆汽车电子(芜湖)有限公司 | The method manufacturing the coarse filter of the oil supply system for vehicle |
| CN105479764A (en) * | 2015-12-16 | 2016-04-13 | 爱卓塑料(上海)有限公司 | Double-mold-embedment production process of instrument panel |
| CN205417094U (en) * | 2016-03-17 | 2016-08-03 | 北京长城华冠汽车技术开发有限公司 | Automobile air outlet blade with bright wisp |
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Application publication date: 20181012 |
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