CN108638134A - A kind of novel PCB substrate cutting knife and preparation method thereof - Google Patents
A kind of novel PCB substrate cutting knife and preparation method thereof Download PDFInfo
- Publication number
- CN108638134A CN108638134A CN201810377924.1A CN201810377924A CN108638134A CN 108638134 A CN108638134 A CN 108638134A CN 201810377924 A CN201810377924 A CN 201810377924A CN 108638134 A CN108638134 A CN 108638134A
- Authority
- CN
- China
- Prior art keywords
- thickness
- cutting knife
- matrix
- pcb substrate
- sawtooth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/002—Materials or surface treatments therefor, e.g. composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/0053—Cutting members therefor having a special cutting edge section or blade section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/006—Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a kind of novel PCB substrate cutting knife and preparation method thereof, which includes the sawtooth of circular matrix and multiple intervals set on described matrix neighboring, and the center of described matrix is equipped with mounting hole；Described matrix includes the mounting portion of inner ring and the interconnecting piece of outer ring, and the thickness of the mounting portion is 3.2mm, and the thickness of the mounting portion is more than the thickness of the interconnecting piece, constitute in it is thick outer thin ladder-like, the thickness of the sawtooth is identical as the thickness of the interconnecting piece.Cutting knife using the present invention can be reduced the waste consumed when base material cutting, reduce production cost in the case where not changing existing cutting apparatus structure.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of novel PCB substrate cutting knife and its system
Make method.
Background technology
In the manufacturing process of printed circuit board, diamond sawing sheet is all made of when being cut to base material in sawing sheet process
The size of knife, the diamond sawing sheet knife is 305mm (matrix outer diameter) * 25.4mm (aperture) * 3.2mm (integral thickness) * 72Z (saws
The number of teeth), external sawtooth wide (i.e. thickness) is 4.0mm.
Cut and can have the following defects using existing diamond sawing sheet knife：The facewidth 4.0mm of cutting knife, sawing sheet are cut out
4.0mm can be lost when cutting base material, base material loss is big, increases production cost；And to ensure the quality cut, the width of sawtooth is answered
The thickness of >=matrix, since cutting apparatus used in sawing sheet process requires the matrix of cutting knife fixation Pan Chu fixed thereto thick
Degree answers >=3.2mm, and when the thickness of fixed Pan Chu is less than 3.2mm, the substrate width cut can have deviation, therefore not change
It is bad to replace cutting knife of the matrix thickness less than 3.2mm to solve the above problems under existing cutting apparatus structure situation.
Invention content
The present invention provides a kind of novel PCB substrate cutting knife for the problem of drawbacks described above exists in the prior art, and uses
The cutting knife can reduce the waste consumed when base material cutting in the case where not changing existing cutting apparatus structure, reduce
Production cost.
In order to solve the above technical problem, the present invention provides a kind of novel PCB substrate cutting knife, including circular matrix
And multiple intervals, set on the sawtooth of described matrix neighboring, the center of described matrix is equipped with mounting hole；Described matrix includes
The thickness of the mounting portion of inner ring and the interconnecting piece of outer ring, the mounting portion is 3.2mm, and the thickness of the mounting portion is more than the company
The thickness of socket part, constitute in it is thick outer thin ladder-like, the thickness of the sawtooth is identical as the thickness of the interconnecting piece.
Preferably, the aperture of the mounting hole is 25.4mm, and the outer diameter of described matrix is 305mm, the mounting portion it is outer
Diameter is 205mm.
Preferably, the thickness of the interconnecting piece and sawtooth is 2.4mm.
Preferably, the material of described matrix is wolfram steel, and the material of the sawtooth is diamond.
Preferably, the mounting portion and thick outer thin single side in interconnecting piece composition are ladder-like.
Preferably, the mounting portion and interconnecting piece constitute in it is thick outer thin two-sided ladder-like, the interconnecting piece is integrally set to
The centre of the mounting portion side, that is, the height of the going up or down stairway formed are identical.
Additionally provide a kind of production method of above-mentioned novel PCB substrate cutting knife, which is characterized in that include the following steps：
S1, it selects suitable plank and cuts into circular matrix；
S2, the centre drill mounting hole in matrix；
S3, the thickness that corresponding connection parts on matrix are thinned by grinding technics, formed in it is thick outer thin ladder-like；
S4, the periphery that multiple thickness sawtooth identical with interconnecting piece is arranged at intervals to matrix by way of high temperature sintering
Cutting knife is made in edge.
Preferably, in step S1, circular matrix is cut by way of laser cutting.
Preferably, in step S3, it is described it is ladder-like for single side it is ladder-like or two-sided ladder-like.
Preferably, further include step S5 after step S4, cutting knife is integrally polished and is oiled, is completed the production.
Compared with prior art, the present invention has the advantages that：
The present invention provides a kind of novel PCB substrate cutting knife, by retain matrix mounting portion (i.e. with cutting apparatus it is fixed
Fixed Pan Chu) in the case of 3.2mm thickness, the thickness of interconnecting piece that outer ring connect with sawtooth (i.e. cutting knife cut position) is thinned
Degree, and the thickness of sawtooth is identical as the thickness of interconnecting piece, make it is thick outer thin ladder-like in being constituted between mounting portion and interconnecting piece,
Do not change existing cutting apparatus structurally and operationally in the case of mode, changes the structure of cutting knife, disappeared when reducing base material cutting
The waste of consumption, reduces production cost；The thickness of interconnecting piece and sawtooth is set as 2.4mm, can ensure cutting knife intensity and
Maximized to reduce base material waste under the premise of hardness, sawtooth thickness (i.e. width) is reduced to 2.4mm by original 4mm, damages
Consumption can reduce 40%.
Description of the drawings
Fig. 1 is the front view of novel PCB substrate cutting knife in embodiment 1；
Fig. 2 is the schematic diagram of novel PCB substrate cutting knife in Examples 1 and 2；
Fig. 3 is the front view of novel PCB substrate cutting knife in embodiment 2.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment 1
As depicted in figs. 1 and 2, a kind of novel PCB substrate cutting knife shown in the present embodiment, including circular matrix and
Set on the sawtooth 1 of matrix neighboring, the center of matrix is equipped with the mounting hole 2 that aperture is 25.4mm at multiple intervals；Matrix includes
The mounting portion 3 of inner ring and the interconnecting piece 4 of outer ring, the thickness of mounting portion 3 are more than the thickness of interconnecting piece 4, constitute interior thick outer thin rank
The thickness of scalariform, sawtooth 1 is identical as the thickness of interconnecting piece 4；The case where not changing existing cutting apparatus structurally and operationally mode
Under, change the structure of cutting knife, be thinned the thickness of matrix outer ring interconnecting piece and sawtooth, can reduce being consumed when base material cutting
Waste reduces production cost
Specifically, the outer diameter of matrix is 305mm, the outer diameter of mounting portion 3 is 205mm, thickness 3.2mm, interconnecting piece 4 and saw
The thickness of tooth 1 is 2.4mm；The thickness of interconnecting piece 4 and sawtooth 1 is set as 2.4mm, can ensure cutting knife intensity and hardness
Under the premise of, maximized to reduce base material waste, 1 thickness of sawtooth (i.e. width) is reduced to 2.4mm, waste by original 4mm
40% can be reduced.
Specifically, the material of matrix is wolfram steel, the material of sawtooth 1 is diamond；Wolfram steel high, wear-resisting, intensity with hardness
With preferable, heat-resisting, the corrosion resistant feature of toughness, it is ensured that the intensity and hardness of matrix.
Specifically, mounting portion 3 is constituted with interconnecting piece 4, interior thick outer thin single side is ladder-like, i.e., the height of ladder 5 is 0.8mm.
Embodiment 2
As shown in Figures 2 and 3, a kind of novel PCB substrate cutting knife shown in the present embodiment, including circular matrix and
Set on the sawtooth 1 of matrix neighboring, the center of matrix is equipped with the mounting hole 2 that internal diameter is 25.4mm at multiple intervals；Matrix includes
The mounting portion 3 of inner ring and the interconnecting piece 4 of outer ring, the thickness of mounting portion 3 are more than the thickness of interconnecting piece 4, constitute interior thick outer thin rank
The thickness of scalariform, sawtooth 1 is identical as the thickness of interconnecting piece 4；The case where not changing existing cutting apparatus structurally and operationally mode
Under, change the structure of cutting knife, be thinned the thickness of matrix outer ring interconnecting piece and sawtooth, can reduce being consumed when base material cutting
Waste reduces production cost
Specifically, the outer diameter of matrix is 305mm, the outer diameter of mounting portion 3 is 205mm, thickness 3.2mm, interconnecting piece 4 and saw
The thickness of tooth 1 is 2.4mm；The thickness of interconnecting piece 4 and sawtooth 1 is set as 2.4mm, can ensure cutting knife intensity and hardness
Under the premise of, maximized to reduce base material waste, 1 thickness of sawtooth (i.e. width) is reduced to 2.4mm, waste by original 4mm
40% can be reduced.
Specifically, the material of matrix is wolfram steel, the material of sawtooth 1 is diamond；Wolfram steel high, wear-resisting, intensity with hardness
With preferable, heat-resisting, the corrosion resistant feature of toughness, it is ensured that the intensity and hardness of matrix.
Specifically, mounting portion 3 constitutes interior thick outer thin two-sided ladder-like, the height phase of upper and lower surface ladder 5 with interconnecting piece 4
With being 0.4mm, stress can be made more balanced.
In an alternative embodiment of the invention, sawtooth has 72.
Embodiment 3
A kind of production method of novel PCB substrate cutting knife is present embodiments provided, is included the following steps：
S1, the wolfram steel plank for selecting suitable size, by high temperature forging at the semifinished sheet that thickness is 3.2mm, then
Cut into the circular base that outer diameter is 305mm；
S2, the mounting hole for being 25.4mm in the centre drill aperture of circular base；
S3, corresponding connection parts on matrix (region i.e. on matrix at diameter 205mm to 305mm) are thinned by grinding technics
Thickness, it is 2.4mm to make the remaining thickness of interconnecting piece, formed in it is thick outer thin ladder-like；
S4, after being polished to matrix, by multiple thickness be 2.4mm diamond sawtooth by way of high temperature sintering between
Every the neighboring (i.e. interconnecting piece neighboring) for being set to matrix, cutting knife is made；
S5, cutting knife is integrally polished and is oiled, completed the production.
Specifically, in step S1, circular base is cut by way of laser cutting.
Specifically, in step S3, ladder-like is that single side is ladder-like or two-sided ladder-like；When ladder-like for single side, ladder
Height be 0.8mm, when to be two-sided ladder-like, the height of upper and lower surface ladder is 0.4mm.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (10)
1. a kind of novel PCB substrate cutting knife, which is characterized in that be set to described matrix including circular matrix and multiple intervals
The center of the sawtooth of neighboring, described matrix is equipped with mounting hole；Described matrix includes the mounting portion of inner ring and the connection of outer ring
The thickness in portion, the mounting portion is 3.2mm, and the thickness of the mounting portion is more than the thickness of the interconnecting piece, is constituted interior thick outer thin
It is ladder-like, the thickness of the sawtooth is identical as the thickness of the interconnecting piece.
2. novel PCB substrate cutting knife according to claim 1, which is characterized in that the aperture of the mounting hole is
The outer diameter of 25.4mm, described matrix are 305mm, and the outer diameter of the mounting portion is 205mm.
3. novel PCB substrate cutting knife according to claim 2, which is characterized in that the thickness of the interconnecting piece and sawtooth
For 2.4mm.
4. novel PCB substrate cutting knife according to claim 1, which is characterized in that the material of described matrix is wolfram steel, institute
The material for stating sawtooth is diamond.
5. according to the novel PCB substrate cutting knife of claim 1-4 any one of them, which is characterized in that the mounting portion and company
It is ladder-like that socket part constitutes interior thick outer thin single side.
6. according to the novel PCB substrate cutting knife of claim 1-4 any one of them, which is characterized in that the mounting portion and company
Socket part constitute in it is thick outer thin two-sided ladder-like.
7. a kind of production method of novel PCB substrate cutting knife as described in claim 1, which is characterized in that include the following steps：
S1, it selects suitable plank and cuts into circular matrix；
S2, the centre drill mounting hole in matrix；
S3, the thickness that corresponding connection parts on matrix are thinned by grinding technics, formed in it is thick outer thin ladder-like；
S4, the outer periphery that multiple thickness sawtooth identical with interconnecting piece is arranged at intervals to matrix by way of high temperature sintering
Cutting knife is made in edge.
8. production method according to claim 7, which is characterized in that in step S1, cut by way of laser cutting
Go out circular matrix.
9. production method according to claim 7, which is characterized in that in step S3, it is described it is ladder-like for single side it is ladder-like
Or it is two-sided ladder-like.
10. according to claim 7-9 any one of them production methods, which is characterized in that further include step S5 after step S4, it is right
Cutting knife is integrally polished and oils, and completes the production.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377924.1A CN108638134A (en) | 2018-04-25 | 2018-04-25 | A kind of novel PCB substrate cutting knife and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377924.1A CN108638134A (en) | 2018-04-25 | 2018-04-25 | A kind of novel PCB substrate cutting knife and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108638134A true CN108638134A (en) | 2018-10-12 |
Family
ID=63747616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810377924.1A Pending CN108638134A (en) | 2018-04-25 | 2018-04-25 | A kind of novel PCB substrate cutting knife and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108638134A (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2248629Y (en) * | 1995-08-10 | 1997-03-05 | 于贵生 | Diamond intayed teeth type circular sawing blade |
| CN2576396Y (en) * | 2002-11-18 | 2003-10-01 | 石家庄博深工具有限公司 | V-shape cutter-head diamond grooving sheet |
| CN2601161Y (en) * | 2003-03-05 | 2004-01-28 | 陈怀荣 | Diamond circular saw bit |
| CN2850880Y (en) * | 2005-12-06 | 2006-12-27 | 石家庄博深工具集团有限公司 | Segmented diamond circular saw blade |
| CN2889579Y (en) * | 2005-11-08 | 2007-04-18 | 陈跃武 | Primary and secondary teeth integral diamond sintered saw blade |
| CN201002311Y (en) * | 2007-01-30 | 2008-01-09 | 三河市燕郊晶日金刚石工业有限公司 | Ultra-thin diamond sintering saw blade |
| CN101590666A (en) * | 2009-07-10 | 2009-12-02 | 丹阳市华锋钻石工具机械有限公司 | A kind of processing method of diamond disc |
| CN201405246Y (en) * | 2009-04-08 | 2010-02-17 | 胡永强 | High-precision sawtooth-type ultra-thin diamond grinding wheel cutter specialized for processing optical glass |
| CN202037613U (en) * | 2010-12-27 | 2011-11-16 | 陈兆魁 | A cutting cutter |
| CN202894331U (en) * | 2012-11-07 | 2013-04-24 | 安阳富达金刚石工具有限责任公司 | Coordinated corrugated saw blade hot pressed sintering boat |
| CN203092786U (en) * | 2013-02-05 | 2013-07-31 | 泉州市山硕超硬工具科技有限公司 | Diamond circular saw web |
| CN203495333U (en) * | 2013-10-15 | 2014-03-26 | 济南金迈达机械有限公司 | Step type base body circular saw blade |
| CN206253741U (en) * | 2016-11-25 | 2017-06-16 | 上海沃兹金田锯业有限公司 | Saw blade |
| CN206732266U (en) * | 2017-02-20 | 2017-12-12 | 株洲天成金属激光高科有限公司 | A kind of cemented carbide tipped circular saw blade |
| CN206937404U (en) * | 2017-05-03 | 2018-01-30 | 信丰福昌发电子有限公司 | A kind of pcb board sawing sheet cutter |
-
2018
- 2018-04-25 CN CN201810377924.1A patent/CN108638134A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2248629Y (en) * | 1995-08-10 | 1997-03-05 | 于贵生 | Diamond intayed teeth type circular sawing blade |
| CN2576396Y (en) * | 2002-11-18 | 2003-10-01 | 石家庄博深工具有限公司 | V-shape cutter-head diamond grooving sheet |
| CN2601161Y (en) * | 2003-03-05 | 2004-01-28 | 陈怀荣 | Diamond circular saw bit |
| CN2889579Y (en) * | 2005-11-08 | 2007-04-18 | 陈跃武 | Primary and secondary teeth integral diamond sintered saw blade |
| CN2850880Y (en) * | 2005-12-06 | 2006-12-27 | 石家庄博深工具集团有限公司 | Segmented diamond circular saw blade |
| CN201002311Y (en) * | 2007-01-30 | 2008-01-09 | 三河市燕郊晶日金刚石工业有限公司 | Ultra-thin diamond sintering saw blade |
| CN201405246Y (en) * | 2009-04-08 | 2010-02-17 | 胡永强 | High-precision sawtooth-type ultra-thin diamond grinding wheel cutter specialized for processing optical glass |
| CN101590666A (en) * | 2009-07-10 | 2009-12-02 | 丹阳市华锋钻石工具机械有限公司 | A kind of processing method of diamond disc |
| CN202037613U (en) * | 2010-12-27 | 2011-11-16 | 陈兆魁 | A cutting cutter |
| CN202894331U (en) * | 2012-11-07 | 2013-04-24 | 安阳富达金刚石工具有限责任公司 | Coordinated corrugated saw blade hot pressed sintering boat |
| CN203092786U (en) * | 2013-02-05 | 2013-07-31 | 泉州市山硕超硬工具科技有限公司 | Diamond circular saw web |
| CN203495333U (en) * | 2013-10-15 | 2014-03-26 | 济南金迈达机械有限公司 | Step type base body circular saw blade |
| CN206253741U (en) * | 2016-11-25 | 2017-06-16 | 上海沃兹金田锯业有限公司 | Saw blade |
| CN206732266U (en) * | 2017-02-20 | 2017-12-12 | 株洲天成金属激光高科有限公司 | A kind of cemented carbide tipped circular saw blade |
| CN206937404U (en) * | 2017-05-03 | 2018-01-30 | 信丰福昌发电子有限公司 | A kind of pcb board sawing sheet cutter |
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| PB01 | Publication | ||
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Application publication date: 20181012 |