CN108632405A - A kind of casing structure perceiving external stress - Google Patents
A kind of casing structure perceiving external stress Download PDFInfo
- Publication number
- CN108632405A CN108632405A CN201710166103.9A CN201710166103A CN108632405A CN 108632405 A CN108632405 A CN 108632405A CN 201710166103 A CN201710166103 A CN 201710166103A CN 108632405 A CN108632405 A CN 108632405A
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- Prior art keywords
- metal
- layer
- circuit
- casing structure
- printing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/22—Details of telephonic subscriber devices including a touch pad, a touch sensor or a touch detector
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
A kind of structure of mobile phone shell, being made on the shell has the first insulating layer, being made on first insulating layer has multiple strain gauges to form strain sensing layer circuit, strain gauge has extraction electrode, extraction electrode is connected to extraction circuit layer, it draws circuit layer to connect with the output electrode positioned at the casing structure edge again, an inner insulating layer is additionally provided on drawing circuit layer.The casing structure is the curved-surface structure of four sides bending, and the distribution of strain gauge layer is also to be distributed according to shell shape curved surface.The shell of the casing structure is using CNC digital control processings either plastic injection or the molding method molding of carbon fiber die-cast, first carry out the first insulating layer application, then strain sensing layer circuit is made by increasing material manufacturing technique or printing laser processing technology or spraying etch process or gluing process, then makes the extraction electrode of strain gauge by printing etch process or spraying process or coating etch process.
Description
Technical field
The invention belongs to technical field of electronic products, more particularly to a kind of casing structure perceiving external stress.
Background technology
Phone housing is usually made of the part such as back-cover and center at present, and main process includes injection molding and CNC processing.
As the shell of mobile phone, structural defence, support, installation internal components are played, and as functions such as appearance members.However as mobile phone
Intelligentized development, the component that smart mobile phone can carry out human-computer interaction with people is only positive touch display screen and some are pressed
Button cannot meet the complicated needs of human-computer interaction application.
Invention content
The present invention realizes a kind of casing that can perceive identification external stress, can be used as mobile phone or tablet computer outside
Shell.
The outermost layer of a kind of metal chassis structure, the casing is metal shell, on the metal shell make have first absolutely
Edge layer, being made on first insulating layer has multiple strain gauges to form strain sensing layer circuit,
There is strain gauge extraction electrode, extraction electrode to be connected to extraction circuit layer, draw circuit layer again with positioned at
The output electrode at the casing structure edge connects,
It is additionally provided with an inner insulating layer on drawing circuit layer.
The metal chassis structure is the curved-surface structure of four sides bending, and the distribution of strain gauge layer is also according to shell shape
Curved surface is distributed.
The metal shell of the casing structure uses CNC digital control processings either plastic injection or the molding side of carbon fiber die-cast
Method is molded, and first carries out the first insulating layer application, is then etched by increasing material manufacturing technique or printing laser processing technology or spraying
Technique or gluing process make strain sensing layer circuit, then by printing etch process or spraying process or coating etch process
Make the extraction electrode of strain gauge.
Strain sensing layer circuit includes three kinds of sensor materials,
The first is that grout material passes through printing, dispensing, spraying, the making of the technology modes such as three-dimensional circuits inkjet printing；
Second is that Metal wire material is bonded by metal foil three-dimensional surface, photoetching, and etch process makes；
The third is that metal coating deposits a ply strain metallic diaphragm, and circuit is formed by Lithography Etching.
Grout material is by carbon powder material, metal oxide particle and resin material composition, film forming thickness generally 0.5um~
50um；
Metal wire material is Cr, Mo material alloys, thickness control to 10um~500um；
Metal coating is Cr, Mo metal or alloy, and thickness control is in 0.03um~5um.
First insulating layer is that aluminium oxide or silica are non-using spraying, plating, magnetron sputtering or PVD methods, insulating materials
Metal material can also be plastic material, can also be resin material.
The making of extraction electrode is made or is used conductive material using the conductive ink material of three dimensional printing technology printing
The method of photoetching circuit makes after plated film, for exporting the electric signal of sensor.
In addition, a kind of nonmetallic casing structure, the outermost layer of the casing is non-metal shell, using ceramics or plastics or glass
Glass material makes, and being made on the non-metal shell has multiple strain gauges,
There is strain gauge extraction electrode, extraction electrode to be connected to extraction circuit layer, draw circuit layer again with positioned at
The output electrode at the casing structure edge connects,
It is additionally provided with an inner insulating layer on drawing circuit layer.
The nonmetallic casing structure is the curved-surface structure of four sides bending, and the distribution of strain gauge layer is also according to outer hull shape
Shape curved surface is distributed.
Either plastic injection or carbon fiber die-cast are molding using CNC digital control processings for the non-metal shell of the casing structure
Method is molded, and is then answered by increasing material manufacturing technique or printing laser processing technology or spraying etch process or gluing process making
Become sensing layer circuit, then makes the extraction of strain gauge by printing etch process or spraying process or coating etch process
Electrode.
Strain sensing layer circuit includes three kinds of sensor materials,
The first is that grout material passes through printing, dispensing, spraying, the making of the technology modes such as three-dimensional circuits inkjet printing；
Second is that Metal wire material is bonded by metal foil three-dimensional surface, photoetching, and etch process makes；
The third is that metal coating deposits a ply strain metallic diaphragm, and circuit is formed by Lithography Etching.
Grout material is by carbon powder material, metal oxide particle and resin material composition, film forming thickness generally 0.5um~
50um；
Metal wire material is Cr, Mo material alloys, thickness control to 10um~500um；
Metal coating is Cr, Mo metal or alloy, and thickness control is in 0.03um~5um.
The making of extraction electrode is made or is used conductive material using the conductive ink material of three dimensional printing technology printing
The method of photoetching circuit makes after plated film, for exporting the electric signal of sensor.
The present invention is by the way that in phone housing process, directly manufacture mounts mechanics detection sensor inside housings
Method, realize mobile phone shell when in use each position stress when can sense forced position and stress intensity, provide a kind of complete
New human-computer interaction may.
Description of the drawings
Fig. 1 is the structural scheme of mechanism of metal chassis in the embodiment of the present invention.
Fig. 2 is the principle schematic of phone housing in the embodiment of the present invention.
1 --- output electrode, 2 --- inner insulating layer, 3 --- extraction circuit layer, 4 --- the extraction electricity of sensor electric signal
Pole, 5 --- strain gauge, 6 --- the first insulating layer, 7 --- shell.
Specific implementation mode
As shown in Figure 1, phone housing 7 of the present invention uses CNC digital control processings either plastic injection or carbon fiber
The method of die cast forms blank, since metal is conductive material, will first make a layer insulating 6, absolutely for metal shell
Spraying may be used in edge layer, and plating, magnetron sputtering, the methods of PVD, insulating materials can be aluminium oxide, and silica etc. is nonmetallic
Material can also be plastic material, can also be resin material；It is required that E grades of the class of insulation reached.The shell of nonmetallic materials
Insulating layer need not be made.
Then strain gauge 5 being made on the surface of insulating layer 6, strain gauge can include three kinds of sensor materials,
One is grout material, (grout material can be carbon powder material, metal oxide particle, the materials such as resin composition；
Film forming thickness is generally in 0.5um~50um) pass through printing, dispensing, spraying, the making of the technology modes such as three-dimensional circuits inkjet printing；
Another kind be Metal wire material (material alloys such as Metal wire material Cr, Mo, thickness can control 10um~
It 500um) is bonded by metal foil three-dimensional surface, photoetching, etch process makes；
Also depositing a ply strain metallic diaphragm one is metal coating, (metal coating can be Cr, the metals such as Mo or conjunction
Gold, thickness control is in 0.03um~5um), circuit is formed by Lithography Etching.
Three kinds of materials are selected according to different performance requirements.It can also be separately employed in the different location of shell as required,
Have reached best using effect.It is wherein best compared with grout material sensitivity according to remolding sensitivity, metal coating secondly, wire
It is worst.Sensor layer is made of independent sensor 5 on the insulating layer of array distribution inside the housing, with the three-dimensional table of shell
Face shape rises and falls.
The standalone sensor point that sensor layer is made needs each to sense by extraction electrode 4 and extraction circuit layer 3
Device receives the conductive ink material (silver of the strain signal outflow after strain, lead-out wire and electrode using three dimensional printing technology printing
Slurry, gold paste, carbon slurry or other printable electrocondution slurries) make or using photoetching circuit after conductive material plated film method system
Make.Each sensor both ends connects an extraction electrode 4, and then extraction electrode 4, which is connected to, draws on circuit layer 3, will sense
Output electrode 1 of the device electric signal transmission to marginal position.
Shown in Fig. 2, the output electrode end in casing structure of the present invention is (preferably flexible by being electrically connected on signal transmssion line
Circuit board FPC), sensor electric signal is then conducted to sensing data processing chip, mobile phone is transmitted to after forming digital signal
Main control chip further controls mobile phone operating system or corresponding mobile phone application software, then fed back accordingly to people (including regard
Feel, the sense of hearing, vibrating tactile).
Claims (13)
1. a kind of casing structure, which is characterized in that the outermost layer of the casing is metal or ceramics or plastics or glass shell, at this
Being made on shell has the first insulating layer, and being made on first insulating layer has multiple strain gauges to form strain sensing layer electricity
Road,
There is strain gauge extraction electrode, extraction electrode to be connected to extraction circuit layer, draw circuit layer again with positioned at described
The output electrode at casing structure edge connects,
It is additionally provided with an inner insulating layer on drawing circuit layer.
2. metal chassis structure as described in claim 1, which is characterized in that the metal chassis structure is the curved surface of four sides bending
Structure, the distribution of strain gauge layer are also to be distributed according to shell shape curved surface.
3. metal chassis structure as described in claim 1, which is characterized in that the metal shell of the casing structure uses CNC numbers
Control processing either plastic injection or the molding method molding of carbon fiber die-cast, first carries out the first insulating layer application, then passes through
Increasing material manufacturing technique or printing laser processing technology or spraying etch process or gluing process make strain sensing layer circuit, then
The extraction electrode of strain gauge is made by printing etch process or spraying process or coating etch process.
4. metal chassis structure as claimed in claim 3, which is characterized in that strain sensing layer circuit includes three kinds of sensory devices
Material,
The first is that grout material passes through printing, dispensing, spraying, the making of the technology modes such as three-dimensional circuits inkjet printing；
Second is that Metal wire material is bonded by metal foil three-dimensional surface, photoetching, and etch process makes；
The third is that metal coating deposits a ply strain metallic diaphragm, and circuit is formed by Lithography Etching.
5. metal chassis structure as claimed in claim 4, which is characterized in that
Grout material is by carbon powder material, metal oxide particle and resin material composition, film forming thickness generally 0.5um~
50um；
Metal wire material is Cr, Mo material alloys, thickness control to 10um~500um；
Metal coating is Cr, Mo metal or alloy, and thickness control is in 0.03um~5um.
6. metal chassis structure as claimed in claim 3, which is characterized in that the first insulating layer is splashed using spraying, plating, magnetic control
It penetrates or PVD methods, insulating materials is aluminium oxide or silica nonmetallic materials, can also be plastic material, can also be resin
Material.
7. metal chassis structure as claimed in claim 6, which is characterized in that the making of extraction electrode uses three dimensional printing technology
The conductive ink material of printing makes or is made of the method for photoetching circuit after conductive material plated film, is used for sensor
Electric signal exports.
8. a kind of nonmetallic casing structure, which is characterized in that the outermost layer of the casing is non-metal shell, using ceramics or plastics
Or glass material makes, being made on the non-metal shell has multiple strain gauges,
There is strain gauge extraction electrode, extraction electrode to be connected to extraction circuit layer, draw circuit layer again with positioned at described
The output electrode at casing structure edge connects,
It is additionally provided with an inner insulating layer on drawing circuit layer.
9. nonmetallic casing structure as claimed in claim 8, which is characterized in that the nonmetallic casing structure is the bending of four sides
Curved-surface structure, the distribution of strain gauge layer are also to be distributed according to shell shape curved surface.
10. nonmetallic casing structure as claimed in claim 8, which is characterized in that the non-metal shell of the casing structure uses
CNC digital control processings either plastic injection or the molding method molding of carbon fiber die-cast, then passes through increasing material manufacturing technique or print
Brush laser processing technology or spraying etch process or gluing process make strain sensing layer circuit, then by printing etch process
Or spraying process or coating etch process make the extraction electrode of strain gauge.
11. nonmetallic casing structure as claimed in claim 10, which is characterized in that strain sensing layer circuit includes three kinds of sensings
Equipment material,
The first is that grout material passes through printing, dispensing, spraying, the making of the technology modes such as three-dimensional circuits inkjet printing；
Second is that Metal wire material is bonded by metal foil three-dimensional surface, photoetching, and etch process makes；
The third is that metal coating deposits a ply strain metallic diaphragm, and circuit is formed by Lithography Etching.
12. nonmetallic casing structure as claimed in claim 11, which is characterized in that
Grout material is by carbon powder material, metal oxide particle and resin material composition, film forming thickness generally 0.5um~
50um；
Metal wire material is Cr, Mo material alloys, thickness control to 10um~500um；
Metal coating is Cr, Mo metal or alloy, and thickness control is in 0.03um~5um.
13. nonmetallic casing structure as claimed in claim 10, which is characterized in that the making of extraction electrode uses three dimensional printing
The conductive ink material of technology print makes or is made of the method for photoetching circuit after conductive material plated film, for that will sense
The electric signal of device exports.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710166103.9A CN108632405B (en) | 2017-03-20 | 2017-03-20 | Casing structure capable of sensing external stress |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710166103.9A CN108632405B (en) | 2017-03-20 | 2017-03-20 | Casing structure capable of sensing external stress |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108632405A true CN108632405A (en) | 2018-10-09 |
| CN108632405B CN108632405B (en) | 2020-10-20 |
Family
ID=63687913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710166103.9A Active CN108632405B (en) | 2017-03-20 | 2017-03-20 | Casing structure capable of sensing external stress |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108632405B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225915A (en) * | 2021-04-13 | 2021-08-06 | 微泰医疗器械(杭州)股份有限公司 | Double-sided sensor structure and blood glucose monitoring device |
| CN113766754A (en) * | 2021-06-08 | 2021-12-07 | 何欣 | Manufacturing method of battery sensor |
| CN113819836A (en) * | 2021-09-13 | 2021-12-21 | 西北工业大学 | Multi-material paper-cut structure extensible strain sensor and preparation method thereof |
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| DE102010028920A1 (en) * | 2010-03-31 | 2011-10-06 | Askey Computer Corp. | Mobile communication terminal |
| CN102746640A (en) * | 2012-07-24 | 2012-10-24 | 杜辉 | Protective sleeve for mobile phone and manufacturing technology thereof |
| CN102801835A (en) * | 2012-09-07 | 2012-11-28 | 江苏物联网研究发展中心 | Mobile telephone shell provided with pressing input function |
| CN105060238A (en) * | 2015-07-09 | 2015-11-18 | 武汉大学 | Ultrathin film based capacitive pressure sensor manufacture method |
-
2017
- 2017-03-20 CN CN201710166103.9A patent/CN108632405B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010028920A1 (en) * | 2010-03-31 | 2011-10-06 | Askey Computer Corp. | Mobile communication terminal |
| CN102746640A (en) * | 2012-07-24 | 2012-10-24 | 杜辉 | Protective sleeve for mobile phone and manufacturing technology thereof |
| CN102801835A (en) * | 2012-09-07 | 2012-11-28 | 江苏物联网研究发展中心 | Mobile telephone shell provided with pressing input function |
| CN105060238A (en) * | 2015-07-09 | 2015-11-18 | 武汉大学 | Ultrathin film based capacitive pressure sensor manufacture method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225915A (en) * | 2021-04-13 | 2021-08-06 | 微泰医疗器械(杭州)股份有限公司 | Double-sided sensor structure and blood glucose monitoring device |
| CN113225915B (en) * | 2021-04-13 | 2022-07-22 | 微泰医疗器械(杭州)股份有限公司 | Double-sided sensor structure and blood glucose monitoring device |
| CN113766754A (en) * | 2021-06-08 | 2021-12-07 | 何欣 | Manufacturing method of battery sensor |
| CN113819836A (en) * | 2021-09-13 | 2021-12-21 | 西北工业大学 | Multi-material paper-cut structure extensible strain sensor and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108632405B (en) | 2020-10-20 |
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