CN108628112B - 一种半导体芯片生产用浸没式光刻机 - Google Patents
一种半导体芯片生产用浸没式光刻机 Download PDFInfo
- Publication number
- CN108628112B CN108628112B CN201810568948.5A CN201810568948A CN108628112B CN 108628112 B CN108628112 B CN 108628112B CN 201810568948 A CN201810568948 A CN 201810568948A CN 108628112 B CN108628112 B CN 108628112B
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- rod
- semiconductor chip
- immersion lithography
- lithography machine
- plate
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- 238000000671 immersion lithography Methods 0.000 title claims abstract description 16
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 229910052742 iron Inorganic materials 0.000 claims abstract description 8
- 239000012780 transparent material Substances 0.000 claims description 5
- 238000011068 loading method Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052710 silicon Inorganic materials 0.000 abstract description 16
- 239000010703 silicon Substances 0.000 abstract description 16
- 238000001259 photo etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
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Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810568948.5A CN108628112B (zh) | 2018-06-05 | 2018-06-05 | 一种半导体芯片生产用浸没式光刻机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810568948.5A CN108628112B (zh) | 2018-06-05 | 2018-06-05 | 一种半导体芯片生产用浸没式光刻机 |
Publications (2)
Publication Number | Publication Date |
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CN108628112A CN108628112A (zh) | 2018-10-09 |
CN108628112B true CN108628112B (zh) | 2020-07-21 |
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CN201810568948.5A Active CN108628112B (zh) | 2018-06-05 | 2018-06-05 | 一种半导体芯片生产用浸没式光刻机 |
Country Status (1)
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CN (1) | CN108628112B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6870952B2 (en) * | 2000-03-28 | 2005-03-22 | Adtec Engineering Co., Ltd. | Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same |
CN104511794A (zh) * | 2013-10-07 | 2015-04-15 | 约翰内斯﹒海德汉博士有限公司 | 用于相对于工件定位工具的装置 |
CN206556767U (zh) * | 2017-02-10 | 2017-10-13 | 西安中科飞图光电科技有限公司 | 一种高精度红外成像系统像面对接装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9105517B2 (en) * | 2013-09-12 | 2015-08-11 | International Business Machines Corporation | Wafer to wafer alignment by LED/LSD devices |
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2018
- 2018-06-05 CN CN201810568948.5A patent/CN108628112B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6870952B2 (en) * | 2000-03-28 | 2005-03-22 | Adtec Engineering Co., Ltd. | Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same |
CN104511794A (zh) * | 2013-10-07 | 2015-04-15 | 约翰内斯﹒海德汉博士有限公司 | 用于相对于工件定位工具的装置 |
CN206556767U (zh) * | 2017-02-10 | 2017-10-13 | 西安中科飞图光电科技有限公司 | 一种高精度红外成像系统像面对接装置 |
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CN108628112A (zh) | 2018-10-09 |
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Effective date of registration: 20200619 Address after: 325000 Dongbei Industrial Zone, Puxi village, Oubei street, Yongjia, Wenzhou, Zhejiang (Zhejiang Ding Pong Industrial Co., Ltd.) Applicant after: Wenzhou Jierui Electronic Technology Co.,Ltd. Address before: 310014 Energy Education Institute, Zhejiang University of Technology, 18 Chao Wang Road, Xiacheng District, Hangzhou, Zhejiang Applicant before: Wang Yujie |
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Effective date of registration: 20210907 Address after: 251800 north of West first road, industrial Second Road, Yangxin County Economic Development Zone, Binzhou City, Shandong Province Patentee after: SHANDONG YANGXIN MINGTAI ELECTRIC CO.,LTD. Address before: 325000 East Ou Industrial Zone, Puxi village, Oubei street, Yongjia County, Wenzhou City, Zhejiang Province (within Zhejiang Dingpai Industrial Co., Ltd.) Patentee before: Wenzhou Jierui Electronic Technology Co.,Ltd. |
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Effective date of registration: 20231130 Address after: 251800 no.377, Gongye 2nd Road, economic development zone, Yangxin County, Binzhou City, Shandong Province Patentee after: Yangxin cenxiang Electronic Technology Co.,Ltd. Address before: 251800 north of West first road, industrial Second Road, Yangxin County Economic Development Zone, Binzhou City, Shandong Province Patentee before: SHANDONG YANGXIN MINGTAI ELECTRIC CO.,LTD. |