CN108626140A - Centrifugal heat radiation fan module - Google Patents
Centrifugal heat radiation fan module Download PDFInfo
- Publication number
- CN108626140A CN108626140A CN201710183864.5A CN201710183864A CN108626140A CN 108626140 A CN108626140 A CN 108626140A CN 201710183864 A CN201710183864 A CN 201710183864A CN 108626140 A CN108626140 A CN 108626140A
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- China
- Prior art keywords
- hollow thermal
- heat radiation
- radiation fan
- fan module
- bottom plate
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
A kind of centrifugal heat radiation fan module a, including bottom plate, side plate, a cover board, a flabellum and multiple first hollow thermal columns;There is bottom plate an inner surface, an outer surface and multiple first assembly holes, the first assembly hole to connect inner surface and outer surface;There is cover board an air intake vent, cover board, side plate and bottom plate to form an accommodating space, and the air outlet between cover board and bottom plate;Flabellum is located in accommodating space;First hollow thermal column is embedded at the first assembly hole of bottom plate respectively, and there is every 1 first hollow thermal column one first radiating channel, the first radiating channel to be connected to respectively with the first assembly hole.The centrifugal heat radiation fan of the present invention, not only cooling surface area increases, air-flow can flow through two sinking paths of the first heat dissipation channel inside the exterior space and the first hollow thermal column of the first hollow thermal column, and then the radiating rate of centrifugal heat radiation fan is accelerated by inside and outside double sinking paths.
Description
Technical field
The present invention relates to a kind of centrifugal heat radiation fan module more particularly to a kind of centrifugal heat dissipations of the hollow thermal column of tool
Blower module.
Background technology
In general, the electronic component in electronic equipment can be generated in running with heat.To enable electronic equipment to send out
Maximum efficiency is waved, electronic component temperature need to be kept in suitable interval.Therefore radiating module is needed to configure to exclude heat, is reduced
The temperature of electronic component.For portable electronic device especially laptop, common radiating mode is configuration
Centrifugal fan, the airflow driven by fan running achieve the effect that heat dissipation.
At present between common centrifugal heat radiation fan and electronic component there are two types of the modes of heat transfer, one is will using heat pipe
The heat of electronic component is sent to the cover board of fan or the radiating fin group of fan outlet, another, is by centrifugal radiation air
Fan is attached directly to the electronic component of fever.The market demand of development and actionization however as electronics technology, electronics are set
Standby radiating requirements of removing increase, and volume also tends to frivolous micromation.The heat of required exclusion in the space limited improves, therefore from
Core type fan faces the necessity of improving heat radiation efficiency.
Invention content
Technical problem to be solved by the present invention lies in provide a kind of centrifugal heat radiation fan in view of the deficiencies of the prior art
Thus module solves the heat dissipation that conventional centrifugal fan is provided and is difficult to meet asking for the increased radiating requirements of electronic equipment
Topic.
The technical problem to be solved by the present invention is to what is be achieved through the following technical solutions:
A kind of centrifugal heat radiation fan module, including:One bottom plate, side plate, a cover board, an air outlet, a flabellum with it is more
A first hollow thermal column;Bottom plate includes an inner surface and an outer surface and multiple first assembly holes, the connection of the first assembly hole
Inner surface and outer surface;There is cover board an air intake vent, cover board, side plate and bottom plate to form an accommodating space, and air outlet is located at bottom plate
Between cover board;Flabellum is located in accommodating space;First hollow thermal column is embedded at the first assembly hole respectively, and every 1 first is hollow
There is thermal column one first heat dissipation channel, every 1 first heat dissipation channel to be connected to respectively with the first assembly hole.
Preferably, wherein one end of multiple first hollow thermal columns protrudes from the inner surface, and multiple described first is empty
The opposite side face of heart thermal column is between the inner surface and the outer surface.
Preferably, the wherein end face of multiple first hollow thermal columns is between the inner surface and the outer surface,
The opposite side of multiple first hollow thermal columns protrudes from the outer surface.
Preferably, which has a side surface, which connects the inner surface and the outer surface, and the bottom plate has
Multiple side connections road, multiple side connection roads extend internally from the side surface and are connected to multiple first assembly holes.
Preferably, wherein one end of multiple first hollow thermal columns protrudes from the inner surface, and multiple described first is empty
The opposite side face of heart thermal column is trimmed with the outer surface.
Preferably, the wherein end face of multiple first hollow thermal columns is trimmed with the inner surface, and multiple described first
The opposite side of hollow thermal column protrudes from the outer surface.
Preferably, the both ends of the surface of multiple first hollow thermal columns are trimmed with the inner surface and the outer surface respectively.
Preferably, the wherein end face of multiple first hollow thermal columns protrudes from the inner surface, and multiple described first
Protrude the outer surface in the opposite side face of hollow thermal column.
Preferably, a radiating fin group is further included, which is located on the outside of the air outlet.
Preferably, which has multiple second assembly holes, and multiple second hollow thermal columns are embedded at multiple respectively
Second assembly hole, each described second hollow thermal column have one second heat dissipation channel, multiple second heat dissipations logical
Road is connected to multiple second assembly holes respectively.
The centrifugal heat radiation fan of the present invention adds the multiple first hollow thermal columns in fan base plate.First hollow thermal column
It is embedded at respectively in the first assembly hole of centrifugal heat radiation fan bottom plate, and the first heat dissipation channel connection of the first hollow thermal column
First assembly hole of bottom plate.When centrifugal heat radiation fan being made to be attached at electronic element radiating, not only cooling surface area increases, air-flow
Two sinking paths of the first heat dissipation channel inside the exterior space and the first hollow thermal column of the first hollow thermal column can be flowed through,
And then the radiating rate of centrifugal heat radiation fan is accelerated by inside and outside double sinking paths.
The explanation of explanation and following implementation above with respect to the content of present invention to demonstrate and explain the present invention original
Reason, and the claims for providing the present invention are further explained.
Description of the drawings
Fig. 1 is the stereoscopic schematic diagram of the centrifugal heat radiation fan module described in the embodiment of the present invention one;
Fig. 2 is the three-dimensional disassembly diagram of the centrifugal heat radiation fan module described in the embodiment of the present invention one;
Fig. 3 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention one;
Fig. 4 is radiates to electronic component the electricity measured using the centrifugal heat radiation fan module of Fig. 1 fan of arranging in pairs or groups
The temperature time curve schematic diagram of subcomponent;
Fig. 5 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention two;
Fig. 6 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention three;
Fig. 7 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention four;
Fig. 8 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention five;
Fig. 9 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention six;
Figure 10 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention seven;
Figure 11 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention eight.
【Reference sign】
10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h centrifugal heat radiation fan module
20 electronic components
100 bottom plates
101 inner surfaces
102 outer surfaces
103 side surfaces
110 first assembly holes
120 sides connection road
200 side plates
210 air outlets
300 cover boards
310 air intake vents
320 second assembly holes
400 first hollow thermal columns
401 first ends
402 second ends
403 first end faces
404 second end faces
410 first heat dissipation channels
500 second hollow thermal columns
510 second heat dissipation channels
600 flabellums
700 accommodating spaces
800 radiating fin groups
Specific implementation mode
Embodiment one
It please refers to Fig.1, Fig. 2 and Fig. 3.Fig. 1 is the vertical of the centrifugal heat radiation fan module described in the embodiment of the present invention one
Body schematic diagram.Fig. 2 is the three-dimensional disassembly diagram of the centrifugal heat radiation fan module described in the embodiment of the present invention one.Fig. 3 is this hair
The diagrammatic cross-section of centrifugal heat radiation fan module described in bright embodiment one.The centrifugal heat radiation fan module of the present embodiment
10a includes a bottom plate 100, side plate 200, a cover board 300, an air outlet 210, a flabellum 600 and the multiple first hollow heat dissipations
Column 400.Bottom plate 100 has an inner surface 101 and an outer surface 102 and multiple first assembly holes 110.Cover board 300 has one
Air intake vent 310.First assembly hole 110 connects inner surface 101 and outer surface 102.Cover board 300, side plate 200 and the formation of bottom plate 100
One accommodating space 700.Air outlet 210 is between bottom plate 100 and cover board 300.Flabellum 600 is located in accommodating space 700.First
Hollow thermal column 400 is embedded at the first assembly hole 110 respectively.Every 1 first hollow thermal column 400 has one first heat dissipation channel
410, the first heat dissipation channel 410 is connected to the first assembly hole 110.Every 1 first hollow thermal column 400 have a first end 401 with
Opposite second end 402, the two correspond to a first end face 403 and a second end face 404 respectively.In the present embodiment, first is hollow
400 first end 401 of thermal column protrudes inner surface 101, and second end face 404 is between inner surface 101 and outer surface 102.
In addition, in this embodiment, due to the first heat dissipation channel 410 and the first of bottom plate 100 of the first hollow thermal column 400
Assembly hole 110 is connected to, therefore in addition to the arrangement spacing of 100 the first hollow thermal column 400 of top of bottom plate is for type of thermal communication, electronics member
The heat of part 20 also can be via 110 institute of the first heat dissipation channel 410 and the first assembly hole inside centrifugal heat radiation fan module 10a
The path of connection excludes.
Please refer to Fig. 4 and following table one.Fig. 4 is to be radiated to electronic component using the centrifugal heat radiation fan module of Fig. 1
And the temperature time curve schematic diagram of the electronic component measured.Following table one is the centrifugal heat radiation fan mould using Fig. 1 to electronics
Element is radiated and the list that changes over time of the electronic component temperature that measures.According to described in Fig. 4 and table one, it is traditional from
The bottom plate of core type fan is not embedded the first hollow thermal column, i.e., if the first hollow thermal column quantity of table one is the shape of zero
State.When traditional centrifugal fan radiates to temperature for 80 degree of electronic component 20 Celsius, the temperature of electronic component exists
Fan from 80 degree Celsius is down to 62 degree Celsius after opening 24 minutes.
In addition, in Table 1, centrifugal heat radiation fan module 10a, which is divided into 400 quantity of the first hollow thermal column, respectively is
33,57,81 three kinds of situations.When 400 quantity of the first hollow thermal column is 33 centrifugal heat radiation fan module 10a to temperature
When being radiated for 80 degree of electronic component 20 Celsius, the temperature of electronic component 20 is after fan is opened 24 minutes from 80 degree Celsius
It is down to 56 degree Celsius.Compared with bottom plate 100 is not embedded the first hollow thermal column 400, bottom plate 100 is embedded 33 first hollow heat dissipations
When column 400, the temperature of electronic component 20 reduces 6 degree Celsius more.
And when the centrifugal heat radiation fan module 10a that 400 quantity of the first hollow thermal column is 57 is 80 degree Celsius to temperature
Electronic component 20 when being radiated, the temperature of electronic component 20 is down to Celsius 51 after fan is opened 24 minutes from 80 degree Celsius
Degree, compared with bottom plate 100 is not embedded the first hollow thermal column 400, when bottom plate 100 is embedded 57 first hollow thermal columns 400, electricity
The temperature of subcomponent 20 reduces 11 degree Celsius more.
And when the centrifugal heat radiation fan module 10a that 400 quantity of the first hollow thermal column is 81 is 80 degree Celsius to temperature
Electronic component 20 when being radiated, the temperature of electronic component 20 is down to Celsius 49 after fan is opened 24 minutes from 80 degree Celsius
Degree, compared with bottom plate 100 is not embedded the first hollow thermal column 400, when bottom plate 100 is embedded 81 first hollow thermal columns 400, electricity
The temperature of subcomponent 20 reduces 13 degree Celsius more.
In general, when temperature is between 45 degree to 55 degree, the operational effectiveness of electronic component 20 is best.And it is surveyed according to heat dissipation
Centrifugal heat radiation fan module bottom plate 100 known to test result radiates after being embedded the first hollow thermal column 400, electronic component 20
Cooling rate become faster, and the temperature of electronic component 20 can be made comparatively fast to be cooled to close or fall within the preferable temperature of task performance
Section.
Table one
Embodiment two
Please refer to Fig. 5.Fig. 5 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention two.
The wherein centrifugal heat radiation fan module 10b of embodiment two label generations identical with the centrifugal heat radiation fan module of embodiment one
The same or similar structure of table and linking relationship, will not be described in great detail below.In addition to this, the centrifugal heat radiation fan of the present embodiment
The bottom plate 100 of module 10b has further included a side surface 103 (as shown in Figure 2) and has connect 120 with multiple sides, and side surface 103 connects
Inner surface 101 and outer surface 102, these side connection roads 120 extend internally from side surface 103 and are connected to the first assembly hole 110, remove energy
Increase outside cooling surface area, side connection road 120 also makes heat be dissipated by the side direction inside bottom plate 100.
Embodiment three
Please refer to Fig. 6.Fig. 6 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention three.
The centrifugal heat radiation fan module 10c of the present embodiment includes a bottom plate 100, side plate 200, a cover board 300, an air outlet 210
(as shown in Figure 2), a flabellum 600 and the multiple first hollow thermal columns 400.Bottom plate 100 has an inner surface 101 and an outer surface
102 and multiple first assembly holes 110.Cover board 300 has an air intake vent 310.First assembly hole 110 connect inner surface 101 with
Outer surface 102.Cover board 300, side plate 200 and bottom plate 100 form an accommodating space 700.Air outlet 210 is located at bottom plate 100 and lid
Between plate 300.Flabellum 600 is located in accommodating space 700.First hollow thermal column 400 is embedded at the first assembly hole 110 respectively.
There is every 1 first hollow thermal column 400 one first heat dissipation channel 410, the first heat dissipation channel 410 and the first assembly hole 110 to connect
It is logical.There is every 1 first hollow thermal column 400 first end 401 and opposite second end 402, the two to correspond to a first end respectively
Face 403 and a second end face 404.In the present embodiment, 400 first end face 403 of the first hollow thermal column is between inner surface 101 and outside
Between surface 102, second end 402 protrudes from outer surface 102.Bottom plate 100 has further included a side surface 103 and has been connect with multiple sides
120, side surface 103 connects inner surface 101 and outer surface 102, these side connection roads 120 extend internally connection from side surface 103
First assembly hole 110, in addition to it can increase cooling surface area, side connection road 120 also makes heat be disappeared by the side direction inside bottom plate 100
It dissipates.
Example IV
Please refer to Fig. 7.Fig. 7 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention four.
The centrifugal heat radiation fan module 10d of the present embodiment includes a bottom plate 100, side plate 200, a cover board 300, an air outlet 210
(as shown in Figure 2), a flabellum 600 and the multiple first hollow thermal columns 400.Bottom plate 100 has an inner surface 101 and an outer surface
102 and multiple first assembly holes 110.Cover board 300 has an air intake vent 310.First assembly hole 110 connect inner surface 101 with
Outer surface 102.Cover board 300, side plate 200 and bottom plate 100 form an accommodating space 700.Air outlet 210 is located at bottom plate 100 and lid
Between plate 300.Flabellum 600 is located in accommodating space 700.First hollow thermal column 400 is embedded at the first assembly hole 110 respectively.
There is every 1 first hollow thermal column 400 one first heat dissipation channel 410, the first heat dissipation channel 410 and the first assembly hole 110 to connect
It is logical.There is every 1 first hollow thermal column 400 first end 401 and opposite second end 402, the two to correspond to a first end respectively
Face 403 and a second end face 404.In the present embodiment, 400 first end 401 of the first hollow thermal column protrudes from inner surface, second end
Face 404 is trimmed with outer surface 102.
Embodiment five
Please refer to Fig. 8.Fig. 8 is the diagrammatic cross-section of the centrifugal heat radiation fan module described in the embodiment of the present invention five.
The centrifugal heat radiation fan module 10e of the present embodiment includes a bottom plate 100, side plate 200, a cover board 300, an air outlet 210
(as shown in Figure 2), a flabellum 600 and the multiple first hollow thermal columns 400.Bottom plate 100 has an inner surface 101 and an outer surface
102 and multiple first assembly holes 110.Cover board 300 has an air intake vent 310.First assembly hole 110 connect inner surface 101 with
Outer surface 102.Cover board 300, side plate 200 and bottom plate 100 form an accommodating space 700.Air outlet 210 is located at bottom plate 100 and lid
Between plate 300.Flabellum 600 is located in accommodating space 700.First hollow thermal column 400 is embedded at the first assembly hole 110 respectively.
There is every 1 first hollow thermal column 400 one first heat dissipation channel 410, the first heat dissipation channel 410 and the first assembly hole 110 to connect
It is logical.There is every 1 first hollow thermal column 400 first end 401 and opposite second end 402, the two to correspond to a first end respectively
Face 403 and a second end face 404.In the present embodiment, 400 first end face 403 of the first hollow thermal column is trimmed with inner surface 101,
Second end 402 and protrude from outer surface 102.
Embodiment six
Please refer to Fig. 9.Fig. 9 is the diagrammatic cross-section of the centrifugal radiator fan module described in the embodiment of the present invention six.This
The centrifugal radiator fan module 10f of embodiment includes a bottom plate 100, side plate 200, a cover board 300, an air outlet 210 (as schemed
Shown in 2), a flabellum 600 and the multiple first hollow thermal columns 400.Bottom plate 100 have an inner surface 101 and an outer surface 102 with
And multiple first assembly holes 110.Cover board 300 has an air intake vent 310.First assembly hole 110 connects inner surface 101 and outer surface
102.Cover board 300, side plate 200 and bottom plate 100 form an accommodating space 700.Air outlet 210 be located at bottom plate 100 and cover board 300 it
Between.Flabellum 600 is located in accommodating space 700.First hollow thermal column 400 is embedded at the first assembly hole 110 respectively.Every 1 first
There is hollow thermal column 400 one first heat dissipation channel 410, the first heat dissipation channel 410 to be connected to the first assembly hole 110.Every 1
There is one hollow thermal column 400 first end 401 and opposite second end 402, the two to correspond to a first end face 403 and one respectively
Second end face 404.In the present embodiment, 400 first end face 403 of the first hollow thermal column is trimmed with inner surface 101, second end face
404 trim with outer surface 102.
Embodiment seven
Please refer to Fig.1 0.Figure 10 is the diagrammatic cross-section of the centrifugal radiator fan module described in the embodiment of the present invention seven.
The centrifugal radiator fan module 10g of the present embodiment include a bottom plate 100, side plate 200, a cover board 300, an air outlet 210 (such as
Shown in Fig. 2), a flabellum 600 and the multiple first hollow thermal columns 400.Bottom plate 100 has an inner surface 101 and an outer surface 102
And multiple first assembly holes 110.Cover board 300 has an air intake vent 310.First assembly hole 110 connects inner surface 101 and appearance
Face 102.Cover board 300, side plate 200 and bottom plate 100 form an accommodating space 700.Air outlet 210 is located at bottom plate 100 and cover board 300
Between.Flabellum 600 is located in accommodating space 700.First hollow thermal column 400 is embedded at the first assembly hole 110 respectively.Every 1
There is one hollow thermal column 400 one first heat dissipation channel 410, the first heat dissipation channel 410 to be connected to the first assembly hole 110.It is each
First hollow thermal column 400 has a first end 401 and an opposite second end 402, the two correspond to respectively a first end face 403 with
One second end face 404.In the present embodiment, 400 first end 401 of the first hollow thermal column protrudes from inner surface 101, second end 402
Protrude from outer surface 102.
Embodiment eight
Please refer to Fig.1 1.Figure 11 is the section signal of the centrifugal heat radiation fan module described in the embodiment of the present invention eight
Figure.Wherein the centrifugal heat radiation fan module 10h of embodiment eight is identical with the centrifugal heat radiation fan module of above-described embodiment
Label represents same or similar structure and linking relationship, will not be described in great detail below.In addition to this, the present embodiment further includes multiple
Second hollow thermal column 500.Second hollow thermal column 500 is respectively provided with the second heat dissipation channel 510.Cover board 300 further includes multiple
Second assembly hole 320.Second hollow thermal column 500 is embedded at the second assembly hole 320.Second heat dissipation channel 510 is connected to second group
Fill hole 320.For the present embodiment in addition to having the first hollow thermal column 400 except bottom plate 100, cover board 300 also adds the second hollow thermal column
500, thus can simultaneously for bottom plate 100 attach electronic component 20 with can by heat pipe be sent electronic component heat to cover board 300 into
Row heat dissipation.
According to the centrifugal heat radiation fan module of above-described embodiment, since the present invention is added in centrifugal heat radiation fan bottom plate
Multiple first hollow thermal columns, the first hollow thermal column is embedded at respectively in the first assembly hole of fan base plate, and first is hollow
First assembly hole of the first heat dissipation channel and side connection road the connection bottom plate of thermal column.Centrifugal heat radiation fan is set to be attached at electricity
It can be increased outside cooling surface area by means of the first hollow thermal column when subcomponent, pass through the external cooling of the first hollow thermal column
Approach and the first heat dissipation channel of inside are even formed by internal heat dissipating approach, make air-flow that there is inside and outside double sinking paths to accelerate
The speed of heat dissipation.If adding the second hollow thermal column, the heat of electronic component in the cover board of centrifugal heat radiation fan simultaneously in addition
Also the cover board of fan can be sent to by heat pipe, heat is conducted by the second hollow thermal column of cover board, can it is efficient simultaneously
Exclude the heat of the multiple electronic components of electronic equipment internal.
Claims (10)
1. a kind of centrifugal heat radiation fan module, which is characterized in that including:
One bottom plate has an inner surface and an outer surface and multiple first assembly holes, and it is interior that multiple first assembly holes connect this
Surface and the outer surface;
Side plate;
There is one cover board an air intake vent, the cover board to form an accommodating space with the side plate, the bottom plate and be located at the bottom plate and the lid
An air outlet between plate;
One flabellum is located in the accommodating space;And
Multiple first hollow thermal columns, multiple first hollow thermal columns are embedded at multiple first assembly holes respectively, often
One first hollow thermal column has one first heat dissipation channel, and multiple first heat dissipation channels are respectively with multiple described the
One assembly hole is connected to.
2. centrifugal heat radiation fan module as described in claim 1, which is characterized in that multiple first hollow thermal columns
Wherein one end protrudes from the inner surface, and the opposite side face of multiple first hollow thermal columns is between the inner surface and the appearance
Between face.
3. centrifugal heat radiation fan module as described in claim 1, which is characterized in that multiple first hollow thermal columns
For wherein end face between the inner surface and the outer surface, the opposite side of multiple first hollow thermal columns protrudes from this
Outer surface.
4. centrifugal heat radiation fan module as claimed in claim 2 or claim 3, which is characterized in that the bottom plate has a side surface, should
Side surface connects the inner surface and the outer surface, and the bottom plate has multiple side connections road, and multiple side connection roads are from the side
Surface, which extends internally, is connected to multiple first assembly holes.
5. centrifugal heat radiation fan module as described in claim 1, which is characterized in that multiple first hollow thermal columns
Wherein one end protrudes from the inner surface, and the opposite side face of multiple first hollow thermal columns is trimmed with the outer surface.
6. centrifugal heat radiation fan module as described in claim 1, which is characterized in that multiple first hollow thermal columns
Wherein end face is trimmed with the inner surface, and the opposite side of multiple first hollow thermal columns protrudes from the outer surface.
7. centrifugal heat radiation fan module as described in claim 1, which is characterized in that multiple first hollow thermal columns
Both ends of the surface are trimmed with the inner surface and the outer surface respectively.
8. centrifugal heat radiation fan module as described in claim 1, which is characterized in that multiple first hollow thermal columns
Wherein end face protrudes from the inner surface, and the outer surface is protruded in the opposite side face of multiple first hollow thermal columns.
9. centrifugal heat radiation fan module as described in claim 1, which is characterized in that further include a radiating fin group, this is dissipated
Hot fins group is located on the outside of the air outlet.
10. centrifugal heat radiation fan module as described in claim 1, which is characterized in that the cover board has multiple second to assemble
Hole, multiple second hollow thermal columns are embedded at multiple second assembly holes respectively, each described second hollow heat dissipation
There is column one second heat dissipation channel, multiple second heat dissipation channels to be connected to respectively with multiple second assembly holes.
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CN201710183864.5A CN108626140A (en) | 2017-03-24 | 2017-03-24 | Centrifugal heat radiation fan module |
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CN201710183864.5A CN108626140A (en) | 2017-03-24 | 2017-03-24 | Centrifugal heat radiation fan module |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201144990A (en) * | 2010-06-09 | 2011-12-16 | Hon Hai Prec Ind Co Ltd | Heat dissipation device and centrifugal fan thereof |
CN204836929U (en) * | 2015-08-11 | 2015-12-02 | 安徽中普盛德电子科技有限公司 | High heat dissipation early warning case |
CN205318315U (en) * | 2016-01-21 | 2016-06-15 | 亓茉言 | Heat dispersion fan for computer |
CN205611137U (en) * | 2016-04-08 | 2016-09-28 | 东莞市泓卓电子科技有限公司 | Cylindrical fin radiator |
CN106354228A (en) * | 2016-10-20 | 2017-01-25 | 黄河科技学院 | Heat dissipation structure of computer case memory |
-
2017
- 2017-03-24 CN CN201710183864.5A patent/CN108626140A/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201144990A (en) * | 2010-06-09 | 2011-12-16 | Hon Hai Prec Ind Co Ltd | Heat dissipation device and centrifugal fan thereof |
CN204836929U (en) * | 2015-08-11 | 2015-12-02 | 安徽中普盛德电子科技有限公司 | High heat dissipation early warning case |
CN205318315U (en) * | 2016-01-21 | 2016-06-15 | 亓茉言 | Heat dispersion fan for computer |
CN205611137U (en) * | 2016-04-08 | 2016-09-28 | 东莞市泓卓电子科技有限公司 | Cylindrical fin radiator |
CN106354228A (en) * | 2016-10-20 | 2017-01-25 | 黄河科技学院 | Heat dissipation structure of computer case memory |
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Application publication date: 20181009 |