CN108620740B - Method for preparing dry bonding structure surface by directly etching metal with laser - Google Patents

Method for preparing dry bonding structure surface by directly etching metal with laser Download PDF

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Publication number
CN108620740B
CN108620740B CN201810464676.4A CN201810464676A CN108620740B CN 108620740 B CN108620740 B CN 108620740B CN 201810464676 A CN201810464676 A CN 201810464676A CN 108620740 B CN108620740 B CN 108620740B
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metal
metal foil
laser
artificial
metal substrate
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CN108620740A (en
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潘俏菲
曹宇
薛伟
杨焕
朱德华
瞿建武
刘文文
张健
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Shuyang Huarui Metal Products Co ltd
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Institute of Laser and Optoelectronics Intelligent Manufacturing of Wenzhou University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming

Abstract

The invention provides a method for preparing a dry bonding structure surface by directly etching metal with laser, which comprises the following steps: preparing a metal substrate and a metal foil, and designing and arranging a plurality of setae on the metal substrate according to a dot matrix arrangement mode by imitating a gecko setae structure; respectively preparing super-hydrophobic microstructures on the surfaces of a metal substrate and a metal foil; attaching and fixing a metal foil on the surface of a metal substrate, performing anchor point welding on the metal foil and the metal substrate according to an artificial metal bristle dot matrix by adopting a laser fine spot welding process, and performing artificial metal bristle contour cutting on the metal foil according to an artificial metal bristle contour figure of the artificial metal bristle dot matrix by adopting a pulse laser fine etching process to form a cluster-shaped artificial metal bristle array. The structure prepared by the invention is the micro-nano level cluster-shaped artificial metal seta which is arranged in any pattern lattice and is warped in the horizontal direction and has a certain inclination angle, and the metal surface based on the structure can realize high adhesion, easy desorption, self-cleaning and super-hydrophobic properties.

Description

method for preparing dry bonding structure surface by directly etching metal with laser
Background
Laser machining is the application of a laser beam to the surface of a workpiece to ablate, melt material and alter the surface properties of the object with the high energy of the laser. Because the laser processing is non-contact processing, the tool can not directly rub the surface of the workpiece to generate resistance, so the laser processing speed is extremely high, the range of the processing object affected by heat is small, and noise can not be generated. Since the energy of the laser beam and the moving speed of the beam are adjustable, the laser processing can be applied to different layers and ranges.
many organisms in nature have excellent mechanical properties, and the most outstanding representative is gecko. The sole of the gecko is a multi-stage and multi-fiber surface structure, millions of fine setae are grown on each toe of the gecko, the length of each setae is about 30-130 mu m, the diameter of each setae is 1/10 micrometers (the diameter of human hair), the tail ends of the setae are forked to form hundreds of finer shovel-shaped villi (100-1000), the length and width dimensions of each villi are about 200nm, and the thickness of each villi is about 5 nm. The gecko not only has anisotropic high adhesion, but also can realize the quick switching of the adhesion and desorption states of the pelma setae during crawling. In addition, the gecko setae also has excellent self-cleaning performance, can adapt to surfaces with different roughness, and has universality.
At present, the preparation method of the bionic gecko plantar seta structure surface (namely the bionic dry adhesion structure surface) is mostly related to chemistry and can be divided into two types: (1) etching and casting, namely pouring the polymer into an etching mould and then demoulding; (2) vapor phase growth, mainly using CVD (low pressure vapor deposition) to produce nanotubes or nanowires. The former method generally involves a complicated series of processes of preparing a substrate, spin coating, baking, exposing, developing, and the like, and requires a process in a clean room. Vapor phase growth, the process is expensive and complex, and the samples show no apparent normal adhesion. In addition, the size of the surface structures on the soles of geckos made by these methods typically varies from millimeters to several centimeters. A larger surface can only be achieved by a combination of small pieces, which may lead to misalignment problems. There are many dry adhesive surfaces, but few have been successfully used in engineering due to low throughput, high cost manufacturing processes. Therefore, simple and low-cost manufacturing techniques are needed to facilitate the application of gecko-like plantar surfaces in industry.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention provides a method for laser direct etching of metal to produce a dry bonded structured surface.
The technical scheme provided by the invention is as follows:
A method for preparing a dry bonding structure surface by directly etching metal by laser comprises the following steps:
(1) preparing a metal substrate and a metal foil, wherein the surface roughness Ra values of the metal substrate and the metal foil are both less than 3.2 mu m, the thickness of the metal substrate is more than 1mm, and the thickness range of the metal foil is 0.002 mm-0.2 mm; the metal foil has flexibility, and the surface of the metal substrate is a developable surface;
(2) designing a plurality of seta according to the seta structure of the gecko, and arranging the seta on the metal substrate according to the dot matrix arrangement mode to form an artificial metal seta dot matrix; the area where the artificial metal bristle dot matrix is located is a dry bonding structure pattern area to be processed;
(3) Respectively preparing super-hydrophobic microstructures on the surfaces of a metal substrate and a metal foil;
(4) Attaching and fixing a metal foil on the surface of a metal substrate, wherein the metal foil is required to completely cover a dry bonding structure pattern area to be processed on the metal substrate;
(5) Performing anchor point welding on the metal foil and the metal substrate according to an artificial metal bristle dot matrix by adopting a laser fine spot welding process, and requiring that metallurgical bonding is formed at a welding spot; the anchor point is a joint point of the artificial metal seta and the metal substrate;
(6) Adopting a pulse laser fine etching process, and carrying out artificial metal bristle contour cutting on the metal foil according to an artificial metal bristle contour pattern of an artificial metal bristle dot matrix, namely completely penetrating the metal foil to the surface of the metal substrate through repeated etching for multiple times; in the etching process, due to the action of the thermal stress of laser irradiation, the artificial metal setae are automatically warped except for anchor points to be partially separated from the surface of the metal substrate, and the residual material of the metal foil is completely separated from the surface of the metal substrate; and forming a cluster-shaped artificial metal bristle array after all the artificial metal bristle contour patterns are etched, thereby completing the preparation of the surface of the metal dry bonding structure.
The invention has the following beneficial effects:
1. the invention designs a dry adhesion structure surface for preparing a gecko-like plantar seta structure based on laser multi-channel combined processing, the prepared structure is micro-nano-scale cluster-shaped artificial metal seta which is arranged in any pattern lattice and is warped in the horizontal direction and has a certain inclination angle, the metal substrate and the seta surface generate abundant micro-nano hierarchical structures by utilizing pulse laser etching induction, and the gecko-like plantar seta structure based on the structure can realize high adhesion, easy desorption, self-cleaning and super-hydrophobic performance.
2. the invention completely adopts a graphical laser scanning processing technique, so that the patterns of the super-hydrophobic microstructures of a metal substrate and a metal foil are fine and controllable, the final artificial metal bristle can be in any pattern design structure (the shape and the size of the bristle can be randomly customized, and a plurality of bristles can be different from one another), and the method has no requirement on whether the shape of the substrate is a plane or not, and has higher industrial application value.
3. The invention aims at the surface of the metal dry bonding structure prepared by the metal material, and breaks through the difficulty that the traditional method is difficult to carry out microstructure processing on the metal; the metal material has good metal performance including strength, hardness, wear resistance, ductility, machinability and the like, and the micro-nano structure prepared by the metal foil material has a certain inclination angle and good resilience, can adapt to adhesion of different surfaces, ensures the stability of the micro-nano structure, and avoids the instability phenomenon caused by flattening or collapsing of the micro-nano structure; the selectivity of the metal material is wide, and is not restricted by the material properties, including aluminum, iron, nickel, steel and the like, so that the selection space of the material is greatly widened.
4. the high-adhesion super-hydrophobic metal surface of the gecko-like foot soles is prepared by ablating the surface of a metal material by high-power picosecond or nanosecond laser to form a periodic micro-nano structure and matching with a surface modifier of a substance with low free energy, the process is simple, the realization is easy, parameters of the micro-nano structure such as micron-sized protruding form, period and depth can be adjusted, so that the final adhesion can be adjusted, and the flexibility and the designability are good.
5. Compared with a photoetching mask assisted electrochemical corrosion method, a method for preparing a nano material by utilizing electrochemical polymerization of a polymer material and a method for growing a nano structure by chemical vapor deposition, the method does not need to manufacture a mask plate and an electrochemical polymerization for carrying out a chemical process of an electrode, even a preparation method with a complicated and expensive chemical deposition process is adopted, and a method for directly etching by utilizing laser is adopted, so that the processing process is simple, convenient and fast, and the processing efficiency is very high.
6. the invention can realize the large-area preparation of the dry adhesion structure surface of the gecko-like foot bottom seta structure, and compared with the traditional chemical deposition, electrochemical synthesis and casting method, the invention can be more suitable for the actual requirement of large-area preparation of the structure in the industry, breaks through the method of splicing small areas into large areas, and avoids the problem of splicing dislocation;
7. the method is green manufacturing, and compared with the traditional preparation method combining a chemical process, the method does not generate waste water and waste gas, and saves resources.
drawings
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a schematic diagram of an artificial metal bristle dot matrix;
FIG. 3 is a schematic view of a micro-pillar type super-hydrophobic microstructure;
FIG. 4 is a schematic view of a microporous superhydrophobic microstructure;
FIG. 5 is a schematic view of a micro-groove type super-hydrophobic microstructure;
FIG. 6 is a schematic view of an array of tufted artificial metal bristles.
Detailed Description
the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, the present invention provides a method for preparing a dry-bonded structure surface by directly etching metal with laser, which specifically comprises the following steps:
(1) preparing materials: the material comprises a metal substrate 1 and a metal foil 2; the metal substrate 1 and the metal foil 2 are made of stainless steel, copper alloy or aluminum alloy (the materials of the two can be different); the surface roughness Ra values of the metal substrate 1 and the metal foil 2 are required to be less than 3.2 mu m, the thickness of the metal substrate 1 is more than 1mm, and the thickness range of the metal foil 2 is 0.002 mm-0.2 mm; the metal foil 2 is required to have flexibility, and the surface of the metal substrate 1 is in a developable surface shape, that is, the metal foil 2 can be attached to and cover the pattern area of the dry bonding structure designed to be processed on the metal substrate 1. A typical combination of metal substrate 1 and metal foil 2 is a planar stainless steel substrate and copper foil.
(2) Designing a plurality of seta according to the seta structure, and arranging the seta on the metal substrate 1 according to the lattice arrangement mode to form an artificial metal seta lattice (as shown in fig. 2); and the area where the artificial metal bristle dot matrix is located is the dry bonding structure pattern area to be processed.
(3) And respectively preparing super-hydrophobic microstructures on the surfaces of the metal substrate 1 and the metal foil 2.
the method specifically comprises the following steps:
(3.1) etching a microstructure in a dry bonding structure pattern area to be processed on the surface of the metal substrate 1 by adopting a pulse laser beam; the microstructures shown in fig. 3-5 can be typical superhydrophobic microstructures such as micro-pillars, micro-holes, micro-grooves and the like; then, preparing a low-surface-energy chemical modifier film layer (the film layer thickness is less than 2 mu m) in a laser etching microstructure area of the metal substrate by adopting modes of atomization spraying or spin coating and the like, so that the laser etching microstructure area has super-hydrophobic performance and is not correspondingly called as a super-hydrophobic microstructure; the low surface energy chemical modifier comprises siloxane, sulfydryl, fatty acid, partial aromatic compound and the like; the super-hydrophobic property means that the static contact angle of a water drop is more than 150 degrees;
(3.2) etching microstructures (the microstructure can be selected in the same way) on the front side and the back side of the metal foil 2 by adopting a pulse laser beam, and preparing a low-surface-energy chemical modifier film layer (the film layer thickness is less than 1 mu m) in a laser etching microstructure area of the metal foil by adopting modes of atomization spraying or spin coating and the like, so that the laser etching microstructure area on the two sides of the metal foil has super-hydrophobic performance, namely a super-hydrophobic microstructure;
2 2Preferably, for copper foil made of copper alloy, a low surface energy chemical modifier film layer can be prepared in a laser etching microstructure area of a metal foil without atomization spraying or spin coating, and an ethanol-assisted low-temperature annealing process is adopted to quickly realize the superhydrophobic performance.
12CuO + CH 3 CH 2 OH → 6Cu 2 O +2CO 2 +3H 2 O (formula 1)
6Cu 2 O + CH 3 CH 2 OH → 12Cu +2CO 2 +3H 2 O (formula 2)
Preferably, the metal substrate or the metal foil with the prepared super-hydrophobic microstructure is placed at a low temperature of below 200 ℃ and baked for more than 10 minutes so as to enhance the bonding force between the low-surface-energy chemical modifier film layer and the metal substrate/the metal foil;
preferably, the pulse laser beam is ultrafast laser with the pulse width less than 100 picoseconds so as to obtain better cold working etching process effect;
(4) attaching and fixing the metal foil 2 and the metal substrate 1, wherein the metal foil 2 is required to completely cover a dry bonding structure pattern area to be processed on the metal substrate 1;
(5) Performing anchor point welding on the metal foil 2 and the metal substrate 1 according to an artificial metal seta dot matrix by adopting a laser fine spot welding process, wherein metallurgical bonding is required to be formed at the welding point, and the size of the welding point is less than 0.1mm 2;
Preferably, the laser beam used for the laser fine spot welding can be a nanosecond pulse laser beam or a continuous laser beam;
(6) Adopting a pulse laser fine etching process, and carrying out artificial metal bristle contour cutting on the metal foil 2 according to an artificial metal bristle contour pattern of an artificial metal bristle dot matrix, namely, completely penetrating the metal foil 2 to the surface of the metal substrate 1 through repeated etching for multiple times; in the etching process, due to the action of the thermal stress of laser irradiation, the artificial metal setae are automatically warped except for anchor points and partially separated from the surface of the metal substrate, and the residual material of the metal foil is completely separated from the surface of the metal substrate (can be removed by air blowing); when all the artificial metal bristle contour patterns are etched, a cluster-shaped artificial metal bristle array is formed (as shown in FIG. 6);
by this, the preparation of the metal dry-bonded structured surface is finished.
Preferably, the workpiece after step (6) may be placed in an ultrasonic cleaning vessel, water is added to the vessel, and ultrasonic cleaning vibration is initiated to remove the remaining material of the clean metal foil and allow the tufted artificial metal bristle array to stand completely.
it will be obvious to those skilled in the art that the present invention may be varied in many ways, and that such variations are not to be regarded as a departure from the scope of the invention. All such modifications as would be obvious to one skilled in the art are intended to be included within the scope of this claim.

Claims (4)

1. a method for preparing a dry bonding structure surface by directly etching metal by laser is characterized by comprising the following steps:
(1) Preparing a metal substrate and a metal foil, wherein the surface roughness Ra values of the metal substrate and the metal foil are both less than 3.2 mu m, the thickness of the metal substrate is more than 1mm, and the thickness range of the metal foil is 0.002 mm-0.2 mm; the metal foil has flexibility, and the surface of the metal substrate is a developable surface;
(2) Designing a plurality of seta according to the seta structure of the gecko, and arranging the seta on the metal substrate according to the dot matrix arrangement mode to form an artificial metal seta dot matrix; the area where the artificial metal bristle dot matrix is located is a dry bonding structure pattern area to be processed;
(3) respectively preparing super-hydrophobic microstructures on the surfaces of a metal substrate and a metal foil;
(4) Attaching and fixing a metal foil on the surface of a metal substrate, wherein the metal foil is required to completely cover a dry bonding structure pattern area to be processed on the metal substrate;
(5) Performing anchor point welding on the metal foil and the metal substrate according to an artificial metal bristle dot matrix by adopting a laser fine spot welding process, and requiring that metallurgical bonding is formed at a welding spot; the anchor point is a joint point of the artificial metal seta and the metal substrate;
(6) Adopting a pulse laser fine etching process, and carrying out artificial metal bristle contour cutting on the metal foil according to an artificial metal bristle contour pattern of an artificial metal bristle dot matrix, namely completely penetrating the metal foil to the surface of the metal substrate through repeated etching for multiple times; in the etching process, due to the action of the thermal stress of laser irradiation, the artificial metal setae are automatically warped except for anchor points to be partially separated from the surface of the metal substrate, and the residual material of the metal foil is completely separated from the surface of the metal substrate; and forming a cluster-shaped artificial metal bristle array after all the artificial metal bristle contour patterns are etched, thereby completing the preparation of the surface of the metal dry bonding structure.
2. The method for preparing a dry bonded structured surface by laser direct etching of metal according to claim 1, wherein step (3) specifically comprises:
(3.1) etching a microstructure in a dry bonding structure pattern area to be processed on the surface of the metal substrate by adopting a pulse laser beam; then preparing a low surface energy chemical modifier film layer with the thickness of less than 2 mu m in a laser etching microstructure area of the metal substrate by adopting an atomization spraying or spin coating mode, so that the laser etching microstructure area has super-hydrophobic performance;
and (3.2) etching microstructures on the front side and the back side of the metal foil by adopting a pulse laser beam, and preparing a low-surface-energy chemical modifier film layer with the thickness of less than 1 mu m in the laser etching microstructure area of the metal foil by adopting an atomization spraying or spin coating mode, so that the laser etching microstructure area on the two sides of the metal foil has super-hydrophobic performance.
3. the method for preparing a dry bonded structured surface by directly laser etching metal according to claim 1, wherein the laser beam used for the laser fine spot welding in the step (5) is a nanosecond pulsed laser beam or a continuous laser beam.
4. The method of claim 1, wherein the workpiece after step (6) is placed in an ultrasonic cleaning vessel, water is added to the vessel, and ultrasonic cleaning vibration is initiated to remove excess material from the clean metal foil and to allow the array of tufted artificial metal bristles to stand completely.
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CN110756997B (en) * 2019-11-08 2022-09-13 核工业理化工程研究院 Surface treatment method for improving bonding strength of aluminum foil
CN110983330A (en) * 2019-12-13 2020-04-10 西南交通大学 Preparation method and application of super-hydrophobic coating and product containing super-hydrophobic coating
CN110900687A (en) * 2019-12-20 2020-03-24 湖北理工学院 Preparation method of bionic rice leaf surface lattice anisotropic super-hydrophobic surface material
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