CN108617101A8 - 冷冻打印装置 - Google Patents

冷冻打印装置 Download PDF

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Publication number
CN108617101A8
CN108617101A8 CN201810384827.5A CN201810384827A CN108617101A8 CN 108617101 A8 CN108617101 A8 CN 108617101A8 CN 201810384827 A CN201810384827 A CN 201810384827A CN 108617101 A8 CN108617101 A8 CN 108617101A8
Authority
CN
China
Prior art keywords
thermally conductive
liquid metal
printing
ink reservoir
conductive dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810384827.5A
Other languages
English (en)
Other versions
CN108617101A (zh
CN108617101B (zh
Inventor
国瑞
刘静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Dream Ink Technology Co Ltd
Original Assignee
Beijing Dream Ink Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Dream Ink Technology Co Ltd filed Critical Beijing Dream Ink Technology Co Ltd
Publication of CN108617101A publication Critical patent/CN108617101A/zh
Publication of CN108617101A8 publication Critical patent/CN108617101A8/zh
Application granted granted Critical
Publication of CN108617101B publication Critical patent/CN108617101B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)

Abstract

一种冷冻打印装置，包括：用于容纳液态金属的墨池，所述墨池的顶部为开口结构；底部设有印制图案的导热模具，所述导热模具位于所述墨池开口的上方；带动所述导热模具沿竖直方向移动的垂直移动机构，用于控制所述导热模具的底部接触、没入或脱离所述墨池中的液态金属；与所述导热模具之间热传导的控温机构，用于向所述导热模具传递低温，控制与所述印制图案接触的液态金属降温凝固。相对于液态金属打印领域传统的喷涂、加压印制等打印方式，提出了一种新型的液态金属打印机理，对于不同环境、条件下的液态金属打印方式的扩展了选择性。
CN201810384827.5A 2018-04-03 2018-04-26 冷冻打印装置 Active CN108617101B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2018102890909 2018-04-03
CN201810289090 2018-04-04

Publications (3)

Publication Number Publication Date
CN108617101A CN108617101A (zh) 2018-10-02
CN108617101A8 true CN108617101A8 (zh) 2019-09-17
CN108617101B CN108617101B (zh) 2020-01-07

Family

ID=63661302

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810384827.5A Active CN108617101B (zh) 2018-04-03 2018-04-26 冷冻打印装置

Country Status (1)

Country Link
CN (1) CN108617101B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110421901B (zh) * 2019-07-24 2021-05-11 山东协和学院 一种医药用铝塑包装模具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104416159B (zh) * 2013-08-20 2016-06-29 中国科学院理化技术研究所 一种低熔点金属多维结构的液相打印系统及打印方法
CN105033256B (zh) * 2015-08-06 2017-06-16 中国科学院理化技术研究所 一种低熔点金属冷冻打印系统及方法
CN208063571U (zh) * 2018-04-03 2018-11-06 北京梦之墨科技有限公司 冷冻打印装置

Also Published As

Publication number Publication date
CN108617101A (zh) 2018-10-02
CN108617101B (zh) 2020-01-07

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CI02 Correction of invention patent application
CI02 Correction of invention patent application

Correction item: Priority

Correct: 201810289090.9 2018.04.03 CN

False: 201810289090.9 2018.04.04 CN

Number: 40-01

Page: The title page

Volume: 34

Correction item: Priority

Correct: 201810289090.9 2018.04.03 CN

False: 201810289090.9 2018.04.04 CN

Number: 40-01

Volume: 34

GR01 Patent grant
GR01 Patent grant