CN108603032A - Curable organosilicon composition - Google Patents
Curable organosilicon composition Download PDFInfo
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- CN108603032A CN108603032A CN201680065197.4A CN201680065197A CN108603032A CN 108603032 A CN108603032 A CN 108603032A CN 201680065197 A CN201680065197 A CN 201680065197A CN 108603032 A CN108603032 A CN 108603032A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
- C23F13/02—Inhibiting corrosion of metals by anodic or cathodic protection cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
- C23F13/06—Constructional parts, or assemblies of cathodic-protection apparatus
- C23F13/08—Electrodes specially adapted for inhibiting corrosion by cathodic protection; Manufacture thereof; Conducting electric current thereto
- C23F13/10—Electrodes characterised by the structure
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
- C23F13/02—Inhibiting corrosion of metals by anodic or cathodic protection cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
- C23F13/06—Constructional parts, or assemblies of cathodic-protection apparatus
- C23F13/08—Electrodes specially adapted for inhibiting corrosion by cathodic protection; Manufacture thereof; Conducting electric current thereto
- C23F13/20—Conducting electric current to electrodes
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Abstract
The invention discloses a kind of curable silicon composition, the composition includes organopolysiloxane, which includes：The diakyl-polysiloxane of alkenyl functional averagely has at least two alkenyl groups in each of which molecule, and the degree of polymerization is between about 25 and about 10,000, the about 20 mass % to about 50 mass % of the organopolysiloxane；The organopolysiloxane of alkenyl functional, it includes SiO4/2Unit, R1 2R2SiO1/2Unit and R1 3SiO1/2Unit, wherein R1For C1‑10Alkyl and R2For alkenyl, the organopolysiloxane resins of the alkenyl functional are with the alkenyl group within the scope of about 1.0 mass % to about 4.5 mass % and with about 0.2 mass % to the OH contents of about 2.0 mass %, and weight-average molecular weight is about 2,000g/mol to about 22,000g/mol；Crosslinking agent；And the hydrosilylation catalyst of catalytic amount.
Description
Theme described herein be related to curable organosilicon composition, formed curable organosilicon composition method and its
Cured article provides the cured silicone material of highly transparent.
Background technology
In medical treatment, electronics and illuminating industry, the optimization balance of machinery and optical property can be achieved excellent functions of the equipments and
Performance.In these industries, resin tooth elastomer silicone is widely used in realizing or enhancing mechanical performance.Art technology
Personnel speculate and it is widely accepted that, it is necessary to include the organopolysiloxane resins (＞ of high quality flat average molecular weight alkenyl functional
22,000g/mol) to provide the abundant enhancing to these elastomer silicones.
In addition, thus it has been previously demonstrated that the organopolysiloxane resins of alkenyl functional provide excellent for elastomer silicone
Machinery enhancing, and be then that obtained curing materials provide excellent machinery and enhance.However, with alkene in composition
The amount of the organopolysiloxane resins of base function increases, and causes optical property impaired due to agglomeration and the cohesion of resin particle,
So as to cause light scattering and relevant mist degree.In many applications of optical clarity realization device function or efficiency, this mist
Degree is harmful.
Composition provided herein shows the significant and unexpected improvement of this performance characteristic balance.More specifically
Ground, the present invention are directed to traditional viewpoint, the i.e. alkenyl functional by the way that low quality average molecular weight (＜ 22,000g/mol) is used only
Organopolysiloxane resins balance, maintain and improve mechanical strength and optical clarity.
In addition, the concentration relative to the organopolysiloxane polymer of alkenyl functional in composition, these low quality are average
The organopolysiloxane resins of molecular weight alkenyl functional can be used in the composition with high concentration, to provide excellent superficiality
Matter, this is also required in optics and electronic application.Specifically, these compositions provide excellent visible light transmission and machine
Tool performance, while the surface viscosity of reduction and advantageous processing characteristics being provided.
Invention content
The curable organosilicon composition of the present invention includes that the Si―H addition reaction of organopolysiloxane, crosslinking agent and catalytic amount is urged
Agent.Organopolysiloxane has the resin of the polymer and alkenyl functional of alkenyl functional.The polymer has in each molecule
There are average at least two alkenyl groups, the degree of polymerization is in the range of about 25 to about 10,000, and with the pact of organopolysiloxane
Exist in the range of 20 mass % to about 50 mass %.Resin has SiO4/2Unit, R1 2R2SiO1/2Unit and R1 3SiO1/2It is single
Member, wherein R1For C1-10Alkyl and R2For alkenyl.Resin has the alkene within the scope of about 1.0 mass % to about 4.5 mass %
Hydroxy radical content and about 2,000g/mol to about 22,000g/mol on silicon within the scope of base, about 0.2 mass % to about 2.0 mass %
Weight-average molecular weight in range.
Description of the drawings
Fig. 1 show using optical evaluation sample preparation C for as the function of wavelength be discussed herein have 0.28
Total optical transmittance that the example of centimetre (cm) thickness measures.
Fig. 2 shows using optical evaluation sample preparation C for as the function of wavelength be discussed herein have
The Optical haze of the thickness measure of 0.28cm.
Fig. 3 show using optical evaluation sample preparation D for as the function of wavelength be discussed herein have 1.0cm
Thickness measure optical transmittance.
Fig. 4 show using optical evaluation sample preparation B for as the function of wavelength be discussed herein have 3.2cm
Thickness measure total optical transmittance.
Specific implementation mode
Exemplary composition described herein is consolidating for the basic components for including organopolysiloxane (A) as composition
Change silicon composition.Organopolysiloxane includes the organopolysiloxane polymer (A-1) and alkenyl functional of alkenyl functional
Organopolysiloxane resins (A-2).
In an exemplary embodiment, (A-1) has average at least two alkenyl groups in each molecule.(A-
1) have be substantially straight-chain molecular structure polymer form, but strand it is a part of may have it is branched to a certain extent.
(A-1) alkenyl in may include but be not limited to vinyl, alkyl, allyl, isopropenyl, cyclobutenyl, pentenyl, hexenyl and
The combination of cyclohexenyl group or its any two or more.The bonding position of the alkenyl may include but be not limited to the end on strand
End position and/or side chain positions.(A-1) alkyl in may include but be not limited to C1-10Alkyl such as methyl, ethyl, propyl, ring penta
The combination of base and cyclohexyl or its any two or more.
In an exemplary embodiment, (A-1) is the alkene for averagely having in each molecule at least two alkenyl groups
The diakyl-polysiloxane of base function.In another exemplary embodiment, (A-1) is diorganopolysiloxanecompositions, and can
Including but not limited in two molecule chain ends by the poly- silica of the dimethyl of dimethylvinylsiloxy group end capping
Alkane, in two molecule chain ends by the dimethyl siloxane-methyl ethylene of dimethylvinylsiloxy group end capping
Radical siloxane copolymer, in two molecule chain ends by the poly- silica of the methyl ethylene of trimethylsiloxy group end capping
Alkane, in two molecule chain ends by the dimethyl siloxane-methyl vinyl silica of trimethylsiloxy group end capping
The combination of alkyl copolymer or its any two or more.
In an exemplary embodiment, the viscosity of (A-1) is about 100 mpas (mPas) to about 2 at 25 DEG C,
000,000mPas, or more specifically about 1,500mPas is to about 100,000mPas, or even more specifically about
2000mPas to about 80,000mPas.When (A-1) is the mixing of the polysiloxane of two or more alkenyl functionals
When object, it may include the polysiloxane of high viscosity and low viscosity alkenyl functional, viscosity of the mixture at 25 DEG C is about
1,000mPas to about 200,000mPas.
The content of (A-1) is in the range of the about 20 mass % to about 50 mass % of (A) in composition, or more specifically
With the amount of the about 25 mass % to about 50 mass % of (A), or even more specifically with about 30 mass % to the amount of about 50 mass %.
At least some reasons include：When the amount of (A-1) is less than the lower limit of the range, by the cured silicone of composition solidification offer
The flexibility of material tends to decline；On the other hand, when the amount of (A-1) is more than the upper limit of the range, by consolidating for this composition
The hardness for changing the cured silicone material provided tends to decline.(A) in 30 mass % to (A-1) of 50 mass % content with
(A) composition of the content of (A-1) between 20 mass % and 30 mass % includes compared to providing preferred processing characteristics
Viscosity and flowability.
In an exemplary embodiment, the dimethyl silicone polymer of vinyl functional is that have only in the ethylene of end
Base group and average degree of polymerization are about 25 to about 10, the fluid of 000 polysiloxane chain, such as formula MVi 2D25To MVi 2D10,000,
Middle MViIt is averagely to include the siloxane unit of a vinyl groups and two methyl groups, and D is that there are two methyl bases for tool
The siloxane unit of group.
In another exemplary embodiment, the dimethyl silicone polymer of vinyl functional is that have only in the second of end
The fluid for the polysiloxane chain that alkenyl group and average degree of polymerization are 900, with formula MVi 2D900, wherein MViIt averagely includes one to be
The siloxane unit of a vinyl groups and two methyl groups, and D is that there are two the siloxane units of methyl group for tool.
In another exemplary embodiment, the dimethyl silicone polymer of vinyl functional is that have only in the second of end
The fluid for the polysiloxane chain that alkenyl group and average degree of polymerization are 500, with formula MVi 2D500, wherein MViIt is averagely to have one
The siloxane unit of a vinyl groups and two methyl groups, and D is that there are two the siloxane units of methyl group for tool.
In another exemplary embodiment, the dimethyl silicone polymer of vinyl functional is that have only in the second of end
The fluid for the polysiloxane chain that alkenyl group and average degree of polymerization are 300, with formula MVi 2D300, wherein MViIt is averagely to have one
The siloxane unit of a vinyl groups and two methyl groups, and D is that there are two the siloxane units of methyl group for tool.
In another exemplary implementation scheme, the dimethyl silicone polymer of vinyl functional is that have only in the second of end
The fluid for the polysiloxane chain that alkenyl group and average degree of polymerization are 165, with formula MVi 2D165, wherein MViIt is averagely to have one
The siloxane unit of a vinyl groups and two methyl groups, and D is that there are two the siloxane units of methyl group for tool.
In yet another embodiment, the dimethyl silicone polymer of vinyl functional is that have only in the vinyl base of end
The fluid for the polysiloxane chain that group and average degree of polymerization are 27, with formula MVi 2D27, wherein MViIt is that there are one ethylene for average tool
The siloxane unit of base group and two methyl groups, and D is that there are two the siloxane units of methyl group for tool.
In some cases, the degree of polymerization, which is 900 or smaller organopolysiloxanes, may not be able to provide enough viscosity, and
And may include that viscosity is more than 1,000,000mPas organopolysiloxane in composition, medium vinyl is not limited to be located at end
Position and/or in pendant positions and/or the side chain positions on strand.For example, the viscosity as (A-1) is less than 1 at 25 DEG C,
000mPas (cP), the then material provided by solidification composition filling tend to have unsatisfactory flexibility and/or low stretching
Intensity.In this example, suitable highly viscous organopolysiloxanes can be added satisfactory flexible to provide in composition
Property and/or high tensile.
In an exemplary embodiment, high viscosity polysiloxane has only in the vinyl groups of end peace
The right polysiloxane chain for being 2000 to 15,000 of homopolymerization, with formula MVi 2D2000To MVi 2D15,000, wherein MViIt is average to have
The siloxane unit of one vinyl groups and two methyl groups, and D is that there are two the siloxane units of methyl group for tool.
In another exemplary embodiment, high viscosity polysiloxane have only the vinyl groups of end simultaneously
And average degree of polymerization is 9,463, with formula MVi 2D9,463, wherein MViIt is that there are one vinyl groups and two methyl for average tool
The siloxane unit of group, and D is that there are two the siloxane units of methyl group for tool.
In another exemplary implementation scheme, high viscosity polysiloxane has the second on end and pendant positions
The polysiloxane chain that alkenyl group and average degree of polymerization are 9,437, including with formula MVi 2DVi 187D9,250D and DViUnit,
Middle MViIt is the siloxane unit that siloxanes has average a vinyl and two methyl, DViIt is that there are one vinyl for average tool
The siloxane unit of group and a methyl group, and D is that there are two the siloxane units of methyl group for tool.
As previously mentioned, organopolysiloxane further includes the resin (A-2) of alkenyl functional.(A-2) include SiO4/2Unit (" Q "
Unit), R1 2R2SiO1/2Unit (" M " unit rolled into a ball with alkenyl and alkyl functional) and R1 3SiO1/2(with alkyl functional group
" M " unit), wherein R1It is C1-10Alkyl and R2It is alkenyl.In an exemplary embodiment, (A-2) includes about 1.0 weights
Measure % to about 4.5 weight % contents of ethylene, about 0.2 weight % to about 2.0 weight % due to silanol OH contents and
The weight-average molecular weight of about 2,000g/mol to about 22,000g/mol.More specifically, (A-2) include about 2.0 weight % to about
The contents of ethylene of 4.0 weight %, the OH contents and about 2,000g/ on the silanol of about 0.4 weight % to about 1.8 weight %
The weight-average molecular weight of mol to about 20,000g/mol.Even more specifically, (A-2) includes about 2.8 weight % to about 3.8 weights
Measure the contents of ethylene of %, about 0.6 weight % to about 1.5 weight % due to the OH contents of silanol and about 2,000g/mol extremely
The weight-average molecular weight of about 15,000g/mol.
In an exemplary embodiment, (A-2) has the weight-average molecular weight of about 3400g/mol, wherein ethylene
Base group content is 3.3 mass %, and hydroxyl group content is 1.1 mass % (0.044 mole of OH/ moles of Si), and
R1 2R2SiO1/2And R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The ratio between molal quantity of unit is 1.02.
In another exemplary embodiment, (A-2) has the weight-average molecular weight of 3,380g/mol, wherein ethylene
Base group content is 1.5 mass %, and hydroxyl group content is 1.1 mass % (0.045 mole of OH/ moles of Si), and
R1 2R2SiO1/2And R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The ratio between molal quantity of unit is 1.00.
In another exemplary implementation scheme, (A-2) has the weight-average molecular weight of 3,410g/mol, wherein ethylene
Base group content is 2.3 mass %, and hydroxyl group content is 1.0 mass % (0.040 mole of OH/ moles of Si), and
R1 2R2SiO1/2And R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The ratio between molal quantity of unit is 0.996.
In another exemplary embodiment, (A-2) has the weight-average molecular weight of 3,460g/mol, wherein ethylene
Base group content is 3.1 mass %, and hydroxyl group content is 1.2 mass % (0.046 mole of OH/ moles of Si), and
R1 2R2SiO1/2And R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The ratio between molal quantity of unit is 0.988.
In one embodiment, (A-2) there is the weight-average molecular weight of 3,360g/mol, wherein vinyl groups to contain
Amount is 1.6 mass %, and hydroxyl group content is 1.0 mass % (0.039 mole of OH/ moles of Si), and R1 2R2SiO1/2With
R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The ratio between molal quantity of unit is 1.00.
In another exemplary embodiment, (A-2) has the weight-average molecular weight of 3,880g/mol, wherein ethylene
Base group content is 3.4 mass %, and hydroxyl group content is 0.8 mass % (0.034 mole of OH/ moles of Si), and
R1 2R2SiO1/2And R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The ratio between molal quantity of unit is 1.00.
Mode by comparing, in the embodiment of non-present invention, organopolysiloxane resins have 23,400g/mol
Weight-average molecular weight, wherein vinyl groups content be 2.0 mass %, hydroxyl group content be 1.9 mass % (0.074
Mole OH/ moles of Si), and R1 2R2SiO1/2And R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The molal quantity of unit it
Than being 0.848.When mixing in preparation, which provides enough mechanical performances, but containing as (A-2)
When amount is more than the 50% of (A), optical transmissibility is poor.
In another non-present invention embodiment, organopolysiloxane resins have 26,000 weight-average molecular weight,
Wherein vinyl groups content is 4.0 mass %, and hydroxyl group content is 1.6 mass % (0.063 mole of OH/ moles of Si), and
And R1 2R2SiO1/2And R1 3SiO1/2The total mole number of unit and 1 mole of SiO4/2The ratio between molal quantity of unit is 0.882.Work as incorporation
When in preparation, which provides enough mechanical performances, but when the content of (A-2) is more than the 50% of (A)
When, optical transmissibility is poor.
In an exemplary embodiment, (A-2) is with the about 50 mass % to about 80 mass % of component (A) or more preferable
The range of the about 50 mass % to about 75 mass % of component (A) or the about 50 mass % to about 70 mass % of most preferred composition (A)
Interior amount exists.
As previously mentioned, the curable organosilicon composition of the present invention also includes crosslinking agent (B), including but not limited to organic hydrogen
The combination of oligosiloxane, organic hydrogen polysiloxanes, poly- organohydrogensiloxanes or its any two or more.
In an exemplary embodiment, (B) be any two different at least one of following parameter or
The combination of more kinds of poly- organohydrogensiloxanes：The content of silicon hydrate (SiH), molecular structure and composition (such as M, D, T, Q and he
Ratio；Side functional group, molecular structure, polymer lateral chain branch), viscosity, average molecular weight and molecular weight distribution, silicon
The number of oxygen alkane unit and the sequence with two or more different silicones units.
In another exemplary embodiment, (B) is the hydrogen atom that average per molecule has at least two silicon bondings
The organosiloxane crosslinking agent of SiH functions, and wherein (B) is selected from single poly- organohydrogensiloxanes or at least one of difference
Two or more poly- organohydrogensiloxanes combination：The number and sequence of structure, viscosity, average molecular weight, siloxane unit
Row.
In an exemplary embodiment, (B) is that averagely the hydrogen at least three silicon bondings is former in each molecule
The organopolysiloxane of son, the wherein group of the silicon bonding other than the hydrogen of silicon bonding are C1-10Alkyl, in an amount of from offer (B) about
Total alkenyl in every 1 molar constituent (A) of 0.4 mole of hydrogen to about 4.0 moles of silicon bondings.In this embodiment, (B) be comprising with
Under organopolysiloxane：(B-1) there is at least about hydrogen of 0.7 mass % silicon bondings and include SiO4/2Unit and HR3 2SiO1/2
The organopolysiloxane of unit, proportional region are about 1.5 moles to about 3.8 moles HR3 2SiO1/2The every 1 mole of SiO of unit4/2It is single
Member, R R3For C1-10Alkyl, (B-1) are about 5 mass % to about 100 mass % (the about 5 mass % to about 95 matter of component (B)
Measure %)；And (B-2) has the straight chain organopolysiloxane of at least about hydrogen of 0.1 mass % silicon bondings, the wherein hydrogen of silicon bonding
The group of silicon bonding in addition is C1-10Alkyl, (B-2) are the 0 mass % to 50 mass % of component (B).
As previously mentioned, the curable organosilicon composition of the present invention also includes the hydrosilylation catalyst of catalytic amount, provide
The cured silicone material (C) of highly transparent.In an exemplary embodiment, (C) is cured to be enough to promote composition
Amount is added.(C) it may include known in the art and commercially available hydrosilylation catalyst.Suitable hydrosilylation catalyst includes
But it is not limited to platinum group metal comprising platinum, rhodium, ruthenium, palladium, osmium or iridium metals or its organo-metallic compound and its any two
The combination of kind or more.In another embodiment, (C) is hydrosilylation catalyst comprising platinum black, platinum compounds is such as
Chloroplatinic acid, chloroplatinic acid hexahydrate, the reaction product of chloroplatinic acid and monohydric alcohol, bis- (ethyl acetoacetate) platinum, bis- (levulinics
Ketone) platinum, platinous chloride and platinum compounds and alkene complex compound or low molecular weight organopolysiloxane or micropackaging in matrix
Or the platinum compounds of core-shell type structure.
In an exemplary embodiment, (C) is hydrosilylation catalyst solution comprising platinum is organic with low molecular weight
The complex compound of polysiloxanes, low molecular weight organopolysiloxane include 1,3- divinyl -1,1,3,3- tetramethyl disiloxanes
The complex compound of complex compound and platinum.These complex compounds can be with micropackaging in resinous substrates.In an alternative exemplary embodiment party
In case, catalyst includes 1,3- divinyl -1,1, the complex compound of 3,3- tetramethyl disiloxanes and platinum.
The example of suitable hydrosilylation catalyst for (C) is described in such as United States Patent (USP) 3,159,601；3,220,
972；3,296,291；3,419,593；3,516,946；3,814,730；3,989,668；4,784,879；5,036,117；With
In 5,175,325 and EP, 0 347 895 B.The hydrosilylation catalyst of micropackaging and the method for preparing them are illustrated in
United States Patent (USP) 4,766,176；And in United States Patent (USP) No.5,017,654.In another embodiment, platinum catalyst provides
In about 100ppm to the solution of the organopolysiloxane of the vinyl functional of about 100,000ppm concentration so that when finally making
When being diluted in agent, total concentration is between about 0.1ppm and about 100ppm.
Optionally, curable organosilicon composition also may include one or more supplementary elements (D).Supplementary element or ingredient
(D) combination may include such as hydrosilylation inhibitor, releasing agent, filler, adhesion promoter, heat stabilizer, fire-retardant
The combination of agent, reactive diluent, oxidation retarder or its any two or more.
In one embodiment, (D) includes the inhibitor of Si―H addition reaction.For example, (D) is curable organic for adjusting
The reaction suppressor of the solidification rate of silicon composition.In one embodiment, (D) includes but not limited to alkynol, such as 2- first
Base -3- butyne-2-alcohols, 3,5- dimethyl -1- hexin -3- alcohol, 1- acetylene -1- cyclohexanol, phenylbutynol or its any two
Or more combination；Yne compounds, such as 3- methyl-pirylene or 3,5- dimethyl -3- hexene -1- alkynes；
And such as 1,3,5,7- tetramethyls -1,3,5,7- tetravinyl cyclotetrasiloxanes, 1,3,5,7- tetramethyls -1,3,5,7- tetra- oneself
Alkenyl cyclotetrasiloxane or benzotriazole.There is no limit for the content of reaction suppressor in curable organosilicon composition, and
The content can be suitably selected according to forming method and condition of cure.In one embodiment, (D) is to be based on curable organosilicon
About 10 parts of composition total weight meter in parts per million (ppm) to about 10,000 parts in parts per million (ppm), and more specifically about
The amount of 100ppm to about 5,000ppm exists.
In one embodiment, (D) is that about 10 parts of the total weight based on composition is every to about 5,000 parts in parts per million
The hydrosilylation inhibitor of million parts of amount.
In one embodiment, curable organosilicon composition is cured to form the cured silicone production of highly transparent
Product.Curable silicon composition can be cured into desired property (including hardness, tensile strength, elongation, optics
Transmissivity and/or its two or more it is any appropriately combined) cured silicone product.In a further embodiment,
Curable organosilicon composition is cured to form cured organosilicon product comprising is formed with cured silicone layer single
The substrate of product.
In one embodiment, cured organosilicon product has the hardness of about 5 to about 95 (Durometer A hardness), and
The more specifically Shore hardness of about 10 to about 95 (Durometer A hardness), and more specifically about 20 to about 90 (Durometer A hardness) is hard
Degree, and the hardness of even more specifically about 30 to about 90 (Durometer A hardness).
In one embodiment, cured organosilicon product has the tensile strength of greater than about 3 megapascal (MPa), and
The more specifically greater than tensile strength of about 5 megapascal (MPa).
In one embodiment, cured organosilicon product has pair of 2.54 cm thicks under 598 nano wave lengths
Not corrected greater than about 80% optical transmittance, and more specifically greater than about 85% optical lens are lost in surface reflection
Penetrate rate, and greater than about 90% optical transmittance even specifically in 2.54 cm thicks under 598 nano wave lengths.
In another embodiment, curable organosilicon product has via the 598 of ASTM Test Method E1348-11
Under nano wave length 3.2 cm thicks for surface reflection be lost it is uncorrected greater than about 80% total optical transmittance, and
More specifically for greater than about the 85% of 598 nanometer wave strong points of 3.2 cm thicks, and more specifically for 3.2 cm thicks
Greater than about the 90% of 598 nanometer wave strong points of degree.
In another embodiment, curable organosilicon product has under 598 nanometers of wavelength by being less than about
0.01cm-1Reduction method measure optical attenuation coefficient.
In one embodiment, composition has the hardness of about 60 to about 95 (Durometer A hardness), greater than about 3 megapascal
(MPa) tensile strength and via ASTM Test Method E1348-11 under 598 nanometers 3.2 cm thicks it is anti-for surface
Penetrate the uncorrected greater than about 90% total optical transmittance of loss.
In one embodiment, formed composition illustrative methods include mixing comprising (A) organopolysiloxane,
(B) solution of crosslinking agent and (C) catalysts, (A) organopolysiloxane include the poly-organosilicon of (A-1) vinyl functional
Oxygen alkane and (A-2) organopolysiloxane resins.In another embodiment, mixed solution includes addition (D) reaction suppressor.
In certain embodiments, this method further includes heating combination to form cured article.Heating stepses can also wrap
Such as injection molding, transfer modling, casting, extrusion, molded, compression molding and cavity molding are included, and cured article is to include
Molded products, casted article or the extruded product of lens, light guide, optically clear adhesive layer or other optical elements.
In an exemplary embodiment, curable organosilicon composition includes that (A) of 100 mass parts containing alkenyl are organic
Polysiloxanes, it includes the diakyl-polysiloxanes averagely in (A-1) each molecule at least two alkenyl groups, and
Viscosity is about 300mPas to about 2,000,000mPas at 25 DEG C, and (A-1) is the about 20 mass % to about 50 matter of component (A)
% is measured, and (A-2) includes SiO4/2Unit, R1 2R2SiO1/2Unit and R1 3SiO1/2The resin form containing alkenyl of unit it is organic
Polysiloxanes, wherein R1 2For C1-10Alkyl and R2For alkenyl, and the contents of ethylene in alkenyl group about 1 mass % extremely
In the range of about 4.5 mass %, and weight-average molecular weight is between about 2,000g/mol and about 22,000g/mol, (A-2)
For the about 50 mass % to about 80 mass % of component (A)；And (B) organopolysiloxane, averagely have in each molecule
There is the hydrogen atom of at least two silicon bondings, the wherein group of the silicon bonding other than the hydrogen of silicon bonding is C1-10Alkyl, content are to carry
For total alkenyl in every 1 molar constituent (A) of hydrogen of silicon bonding in about 0.4 mole to about 4 molar constituents (B), and wherein component (B)
For organopolysiloxane, it includes (B-1) organopolysiloxanes, have at least about hydrogen of 0.7 mass % silicon bondings and include
In about 1.50 moles to about 3.80 moles of HR3 2SiO1/2The every 1 mole of SiO of unit4/2The SiO of ratio within the scope of unit4/2Unit
And HR3 2SiO1/2Unit, wherein R3For C1-10Alkyl measures the about 5 mass % to about 95 mass % for component (B-1)；And (B-
2) straight chain organopolysiloxane, the hydrogen at least about 0.1 mass % silicon bondings, the wherein silicon bonding other than the hydrogen of silicon bonding
Group is C1-10Alkyl, (B-2) straight chain organopolysiloxane are the 0 mass % to about 50 mass % of component (B)；And (C) is urged
The catalyst for addition reaction of hydrogen and silicon of agent amount provides the cured silicone material of highly transparent.
The composition shows excellent optically and mechanically performance, is suitable for production clearly optics and electronic device.Group
The optical clarity and mechanical tenacity of conjunction are originated from the preferred mass average molecular weight of the organopolysiloxane of resin form.If
The weight-average molecular weight of the organopolysiloxane (A-2) of resin form is more than 22,000g/mol, then when the content of (A-2) is super
When crossing the 50% of component (A) by mass, the optical clarity of gained solidification composition filling reduces.Similarly, if resin form
Organopolysiloxane (A-2) weight-average molecular weight be less than 2000g/mol, then when (A-2) content be more than by mass
Component (A) 50% when, the mechanical tenacity of gained solidification composition filling reduces.Therefore, the poly- silica of organic group of resin form is controlled
The weight-average molecular weight of alkane is crucial for obtaining the optically and mechanically property needed for optics and electronic device.
Optic components can be used composition as described herein by include make composition molding and solidification composition filling with
It is formed and is for example produced for the method for the cured article of Optical devices.Injection molding, transfer modling, casting, extrusion, cladding can be passed through
Molding, compression molding or cavity mold to make composition molding, to produce moulding article, casted article, embedding product, assignment system
Product or extruded product.Make the method for composition molding that will depend on various factors, including the size of Optical devices to be produced and/
Or shape and selected composition.
In one embodiment, cured composition can be used in electronics or Optical devices application.For example, electronics or light
It can be charge coupled device, light emitting diode, light guide, photographic camera, photoelectrical coupler or waveguide to learn device.At another
In embodiment, cured composition can be used in Optical devices with promote equably irradiation extraction light from Optical devices
Surface.
In one embodiment, the cured silicone product of highly transparent is formed by solidification composition filling.At another
In embodiment, the cured silicone product of highly transparent is moulding article, casted article or extruded product.In another embodiment party
In case, the cured silicone product of highly transparent includes the substrate that single product is formed with cured silicone layer.
In another embodiment, composition can be applied to optical component by any manufacturing method, including but not
It is limited to lens, reflector, sheet material, film, item and pipe.The composition can be used for electronic equipment, display, soft lithographic and medical treatment and
Health care facility.In one embodiment, the composition is used as the diffusing globe of light or provides diffusion effect.
Embodiment
Embodiment is intended to illustrate certain embodiments of field those of ordinary skill, and it should not be constructed as limiting
Scope of the disclosure as described in the claims.
Be prepared by the following method sample for machinery and optical evaluation.For each embodiment, used method exists
It is indicated in table 1.
Mechanical assessment sample preparation Y
By the dimethyl silicone polymer of ethenyl blocking, the organic siliconresin of vinyl functional, Pt catalyst, hydrogen function
Crosslinking agent and Si―H addition reaction inhibitor are added in same container and in planetary-type mixer (Hauschild SpeedMixer DAZ
It is mixed 25 seconds with 3,540 revs/min (rpm) on 150FVZ).Transparency liquid is poured into aluminum dipping form, and then solid at 130 DEG C
Change 3 hours to form solid sample, wherein heat accelerates cross-linking reaction, wherein Pt to be catalyzed between the corsslinking molecular of hydrogen function
The formation of silicon-carbon bond and the dimethyl silicone polymer of vinyl functional and vinyl functional resins.Sample has the thickness of 2.50mm
Degree.The measurement of mechanical performance is texture analyzer (TA.HDPlus the Texture Analyzer, Texture at 23 ± 1 DEG C
Technologies Corp, NY, USA) on use dumbbell specimens (by the half module of D1708,1/2 scale, Fremont), speed
For 2mm/s.According to ASTM D2240 hardness is measured on Durometer A hardness hardometer.
Mechanical assessment sample preparation X
By the dimethyl silicone polymer of ethenyl blocking, the organic siliconresin of vinyl functional, Pt catalyst, hydrogen function
Crosslinking agent and Si―H addition reaction inhibitor are added in same container and in planetary-type mixer (Hauschild SpeedMixer DAZ
It is mixed 20 seconds with 3,540rpm on 150FVZ).Transparency liquid is poured into aluminum dipping form (1.5mm is thick), and is then pushed at 125 DEG C
System becomes solid sample in 30 minutes.Solid sample is removed from the molds and cures 1 hour afterwards at 150 DEG C to carry out mechanicalness
It can test.The measurement of mechanical performance be on Instron Mechanical Tester according to ASTM D412-06A with 2 inches/
What the speed of minute carried out.According to ASTM D2240 hardness is measured on Durometer A hardness hardometer.
Mechanical assessment sample preparation Z
By the dimethyl silicone polymer of ethenyl blocking, the organic siliconresin of vinyl functional, Pt catalyst, hydrogen function
Crosslinking agent and Si―H addition reaction inhibitor are added in same container and by planetary-type mixer (Hauschild SpeedMixer
DAZ 150FVZ) on asymmetric centrifugation mixing mixed 20 seconds with 3,540rpm.Then subject the material to be molded, wherein 750 pounds/
A certain amount of material is injected under the pressure of square inch (psi) for 15 seconds in the metal cavity heated at 150 DEG C
Retention time and 30 seconds hardening times are to produce ASTM Die C samples.Once being taken out from die cavity, sample is carried out 150 DEG C
Additional curing step 1 hour.The measurement of mechanical performance is on Instron Mechanical Tester according to ASTM
D412-06A is carried out with the speed of 20 inch/minutes.According to ASTM D2240 hardness is measured on Durometer A hardness hardometer.
Optical evaluation sample preparation A
By the dimethyl silicone polymer of ethenyl blocking, the organic siliconresin of vinyl functional, Pt catalyst, hydrogen function
Crosslinking agent and Si―H addition reaction inhibitor are added in same container and in planetary-type mixer (Hauschild SpeedMixer DAZ
It is mixed 20 seconds with 3540rpm on 150FVZ).Fluid sample is poured into polystyrene mould and cures 3 hours at 85 DEG C, so
Rear solidification 3 hours at 130 DEG C afterwards.Thickness of sample is set as 2.54cm.With 950 spectrophotometrics of Perkin Elmer Lambda
Collect the optical property of collection sample.Spectrophotometer is in the wave-length coverage of 200nm to 800nm with low sweep speed, 1nm slits
Width operates.Due to the refractive index difference between air and organosilicon product, the transmittance values reported are not directed to surface reflection
(so-called Fu Lunze reflections) is corrected.
Optical evaluation sample preparation B
By the dimethyl silicone polymer of ethenyl blocking, the organic siliconresin of vinyl functional, Pt catalyst, hydrogen function
Crosslinking agent and Si―H addition reaction inhibitor, which are added in same container and are centrifuged via asymmetry, mixes (Hauschild SpeedMixer
DAZ 150FVZ) it is mixed 60 seconds with 3,400rpm.Then material poured into polystyrene mould and at 65 DEG C solidification 14 it is small
When.Once being taken out from polystyrene die cavity, sample is carried out to 150 DEG C of additional curing step 1 hour.Then with integral
5000 spectrophotometers of Varian Cary of ball attachment collect the optical property of molding slab sample.Spectrophotometer exists
With medium sweep speed, the operation of 1nm slit widths in the wave-length coverage of 200nm to 800nm.Total transmittance passes through the test sides ASTM
Method E1348-11 is determined.
Optical evaluation sample preparation C
By the dimethyl silicone polymer of ethenyl blocking, the organic siliconresin of vinyl functional, Pt catalyst, hydrogen function
Crosslinking agent and Si―H addition reaction inhibitor, which are added in same container and are centrifuged via asymmetry, mixes (Hauschild SpeedMixer
DAZ 150FVZ) it is mixed 60 seconds with 3,400rpm.Then material is molded, wherein by a certain amount of material 750psi's
Retention time for 15 seconds in the metal die cavity heated at 150 DEG C and 30 seconds hardening times are injected under pressure to generate
Thickness is the slab of 0.28cm.Once being taken out from die cavity, sample is carried out to 150 DEG C of additional curing step 1 hour.With with
5000 spectrophotometers of Varian Cary of integrating sphere accessory collect the optical property of molding slab sample.Spectrophotometer exists
With medium sweep speed, the operation of 1nm slit widths in the wave-length coverage of 200nm to 800nm.Total transmittance and mist degree pass through ASTM
Test method E1348-11 is determined.
Optical evaluation sample preparation D
By the dimethyl silicone polymer of ethenyl blocking, the organic siliconresin of vinyl functional, Pt catalyst, hydrogen function
Crosslinking agent and Si―H addition reaction inhibitor, which are added in same container and are centrifuged via asymmetry, mixes (Hauschild SpeedMixer
DAZ 150FVZ) it is mixed 60 seconds with 3,400rpm.Then by material pour into length be 1.0cm, 2.5cm, 5.0cm and
In the mold of the cavity of 10.0cm, cure 14 hours at 60 DEG C.Sample is taken out to from die cavity and is carried out 150 DEG C additional solid
Change step 1 hour.Then Perkin Elmer Lambda950 spectrophotometers is used to collect the optical property of molding slab sample.
Spectrophotometer is in the wave-length coverage of 200nm to 800nm with low sweep speed, the operation of 1nm slit widths.Due to air and have
Refractive index difference between machine silicon product, the transmittance values reported are not directed to surface reflection (so-called Fu Lunze reflections) and carry out
Correction.
Fig. 1 shows that the function using optical evaluation sample preparation C as wavelength measures the sample of 0.28cm thickness
Optical transmittance.Fig. 2 shows use optical evaluation sample preparation C as wavelength function for 0.28cm thickness sample
The Optical haze of measurement.Fig. 3 shows sample of the function using optical evaluation sample preparation D as wavelength for 1.0cm thickness
The optical transmittance that product measure.Fig. 4 shows the function using optical evaluation sample preparation B as wavelength for 3.2cm thickness
Sample measure optical transmittance.Each in Fig. 1-4 show present disclosure exemplary composition reduce or
The problem of eliminating transmissivity and mist degree.
Weight-average molecular weight is assessed
By the resin for analyzing alkenyl functional for three re-detection gel permeation chromatographies of molecular weight determination.Chromatographic apparatus
It is made of the pumps of Waters 515,717 autosamplers of Waters and 2410 Differential Refractometers of Waters.Use two (300mm
× 7.5mm) 5 μm of Mixed-C columns of Polymer Laboratories PLgel (molecular weight separating ranges are 200 to 2,000,
000) it is detached, is 5 μm of guard columns (50mm × 7.5mm) of PLgel later.Use the HPLC grade first flowed with 1.0mL/min
Benzene is analyzed as eluent, and column and detector are all controlled at 45 DEG C.Sample is prepared in toluene with 5mg/mL,
It dissolves about 3 hours, shakes once in a while at room temperature, and filtered before analysis by 0.45 μm of PTFE injection filter.Use 75 μ L
Volume injected and collect data 25 minutes.Use ThermoLabsystems Atlas chromatographic softwares and Polymer
Laboratories Cirrus GPC softwares carry out data collection and analysis.Cover dividing for 580-2,300,000 relative to using
Son measures the calibration curve (three ranks) of the polystyrene standards establishment of range to determine Molecular weight Averages.
The table of embodiment 1,3,4 and 5
The table of embodiment 2a, 2b and 2c
| Embodiment 2a | Embodiment 2b | Embodiment 2c | |
| Composition (part) | |||
| A-1a | 50.00 | 50.00 | 50.00 |
| A-2a (3.3 mass %Vi) | 50.00 | 50.00 | 50.00 |
| B-1 | 8.82 | 8.82 | 8.82 |
| C-1 | 0.052 | 0.052 | 0.052 |
| D-1a | 0.10 | 0.10 | 0.10 |
| D-1b | |||
| [SiH]/[Vi](mol/mol) | 1.40 | 1.40 | 1.40 |
| Characteristic | |||
| For optical sample preparation | B | C | D |
| For optical measurement and characterization | B | C | D |
| Sample preparation for machinery | X | Z | |
| Measurement for machinery and characterization | X | Z | |
| Hardness (Durometer A hardness) | 77 | ||
| Fracture tensile strength (MPa) | 9.54 | ||
| Elongation at break (%) | 125 | ||
| Total optical transmittance (%) 0.28cm@598nm | 94.0 | ||
| Optical transmittance (%) 1cm@598nm | 93.5 | ||
| Total optical transmittance (%) 3.2cm@598nm | 93.4 |
The table of embodiment 8,18,19 and 20
The table of embodiment 9,10,13 and 14
The table of embodiment 15,16 and 17
| Embodiment 15 | Embodiment 16 | Embodiment 17 | |
| Composition (part) | |||
| A-1a | 10.15 | 20.28 | 29.69 |
| A-1b | 39.85 | 29.72 | 20.31 |
| A-2a (3.3 mass %Vi) | 50.00 | 50.00 | 50.00 |
| B-1 | 9.06 | 9.05 | 8.84 |
| C-1 | 0.051 | 0.051 | 0.051 |
| D-1a | 0.10 | 0.10 | 0.10 |
| [SiH]/[Vi](mol/mol) | 1.43 | 1.43 | 1.40 |
| Characteristic | |||
| For optical sample preparation | B | B | C |
| For optical measurement and characterization | B | B | C |
| Sample preparation for machinery | X | X | Z |
| Measurement for machinery and characterization | X | X | Z |
| Hardness (Durometer A hardness) | 80 | 81 | 78 |
| Fracture tensile strength (MPa) | 11.78 | 6.86 | 9.16 |
| Elongation at break (%) | 113 | 73 | 124 |
| Total optical transmittance (%) 0.28cm@598nm | 94.1 |
The table of embodiment 21,22 and 24
The table of embodiment 23,25 and 26
The table of Comparative examples A-C
| Comparative examples A | Comparative example B | Comparative example C | |
| Composition (part) | |||
| A-1a | 7.36 | 15.23 | 72.28 |
| A-1b | 59.23 | 43.20 | |
| A-2g (2.0 mass %Vi) | 41.570 | 27.72 | |
| A-2h (4.0 mass %Vi) | 33.41 | ||
| B-1 | 9.52 | 4.61 | 3.07 |
| C-1 | 0.042 | 0.063 | 0.062 |
| D-1b | 0.20 | 0.20 | 0.20 |
| [SiH]/[Vi](mol/mol) | 1.39 | 1.43 | 1.39 |
| Characteristic | |||
| For optical sample preparation | D | D | D |
| For optical measurement and characterization | D | D | D |
| Sample preparation for machinery | X | X | X |
| Measurement for machinery and characterization | X | X | X |
| Hardness (Durometer A hardness) | 85 | 74 | 55 |
| Fracture tensile strength (MPa) | 6.15 | 9.10 | 5.43 |
| Elongation at break (%) | 32 | 155 | 395 |
| Optical transmittance (%) 1cm@598nm | 92.4 | 91.8 | 92.5 |
The table of Comparative Example D-F
Commercial Application
For example, the composition of present disclosure can be used for manufacturing optics and electronic device, such as light guide and LED encapsulation.It is logical
One or more benefits can be provided by crossing the product for curing these compositions and preparing, the enhancing of including but not limited to LED encapsulation
Light transmission, the reliability of enhancing and increased service life.Geometry can be had by forming the composition of cured article and method, including
But it is not limited to cylinder, rectangle, simple convex lens, patterning lens, texturizing surfaces, dome and cap.In Optical devices application
In, composition can be previously fabricated by molding (injection molding or transfer) or casting process.Alternatively, it is possible to use as described herein group
It closes object and carries out the process moulded on optical device components, referred to as " molded " or " embedded mould in rigidity or flexible substrates
Modeling ".The composition can form the cured article with high tensile strength.According to the expectation final use of cured article, can match
Composition processed is to generate with relatively high hardness or compared with the cured article of soft.The surface of cured article is not tacky, and has
There is bullet to mould characteristic.The combination of this property makes the composition be suitable for molded and other application.Above-mentioned light guide is available
In by internal reflection by light from lit transmissive to viewing surface.This application include illumination for illumination purposes include lamp and
Lighting apparatus is used for the back light unit of display, car lighting and message board application.
The foregoing description to embodiment and embodiment has been presented for the purpose of illustration and description.This is not intended to
Limit or the described form of limitation.In view of above-mentioned introduction, many modifications are possible.Some of modifications have been discussed,
And those skilled in the art understand that other modifications.These embodiment party are selected and describe in order to illustrate various embodiments
Case.Certainly, range is not limited to embodiment or embodiment set forth herein, but can be by those of ordinary skill in the art for appointing
In the application and equivalent apparatus of what quantity.On the contrary, it is defined by the appended claims to be thus expected the range.In addition, various realities
The feature of existing embodiment can be combined to form other embodiments.It indicates to be used as to show using word " exemplary " herein
Example, example or illustration.Be described herein as any aspect of " exemplary " or embodiment be not necessarily to be construed as relative to
Other aspects or embodiment are preferred or advantageous.
Throughout the specification the reference of " embodiment " or " embodiment " can be indicated to combine specific embodiment party
The a particular feature, structure, or characteristic of case description can be included at least one embodiment of claimed theme.Therefore,
The phrase " in one embodiment " occurred everywhere through this specification or " embodiment ", which are not necessarily intended, refers to same reality
Apply scheme or any one described particular embodiment.However, it should be understood that described special characteristic, structure
Or characteristic can in various ways combine in one or more embodiments.Certainly, in general, these and other problem may
Change with the specific environment used.Therefore, the use of the specific context or these terms of specification can provide about
In this case the useful guidance of the inference obtained.
Claims (15)
1. a kind of curable organosilicon composition, including：
Organopolysiloxane, wherein the organopolysiloxane includes：
(i) averagely there are in each of which molecule the organopolysiloxane of polymer form at least two alkenyl groups, the degree of polymerization to exist
In the range of about 25 to about 10,000, and with the about 20 mass % to about 50 mass % of the organopolysiloxane in the range of
In the presence of, and
(ii) organopolysiloxane of resin form, it includes SiO4/2Unit, R1 2R2SiO1/2Unit and R1 3SiO1/2Unit,
Middle R1For C1-10Alkyl and R2For alkenyl, wherein the resin contains the alkene within the scope of about 1.0 mass % to about 4.5 mass %
Base, with the hydroxy radical content on the silicon within the scope of about 0.2 mass % to about 2.0 mass %, and extremely with about 2,000g/mol
Weight-average molecular weight within the scope of about 22,000g/mol；
Crosslinking agent；And
The hydrosilylation catalyst of catalytic amount.
2. composition according to claim 1 also includes supplementary element selected from the following：Inhibitor, releasing agent, filling
The group of agent, adhesion promoter, heat stabilizer, fire retardant, reactive diluent, oxidation retarder and its any two or more
It closes.
3. composition according to claim 2, wherein the supplementary element includes hydrosilylation inhibitor, and institute
Supplementary element is stated with about 10 parts of the total weight based on the composition in parts per million to about 5,000 parts of in parts per million dense
Degree.
4. composition according to claim 1, wherein the composition has the hard of about 60 to about 95 (Durometer A hardness)
Degree, the greater than about tensile strength of 3 megapascal (MPa)s, and as by ASTM Test Method E1348-11 measure at 598 nanometers
For greater than about 90% total optical transmittance of 3.2 cm thicks under wavelength.
5. composition according to claim 1, wherein the composition has the hard of about 60 to about 95 (Durometer A hardness)
Degree, the greater than about tensile strength of 3 megapascal (MPa)s, and what is measured under 598 nanometers of wavelength are less than about 0.01cm-1Optics decline
Subtract coefficient.
6. the cured silicone product of a kind of highly transparent, by curing combination according to any one of claim 1 to 3
Object and formed.
7. the cured silicone product of highly transparent according to claim 6, wherein the cured article be moulding article,
Casted article or extruded product.
8. the cured silicone product of highly transparent according to claim 7, including being formed with cured silicone layer
The substrate of single product.
9. purposes of the cured article according to claim 6 in Optical devices application.
10. a kind of method being used to form curable organosilicon composition, the method includes：
Mixing includes solution below：
Organopolysiloxane, it includes：
(i) averagely there are in each of which molecule the diakyl-polysiloxane of alkenyl functional at least two alkenyl groups, the degree of polymerization to exist
In the range of about 25 and about 10,000, the diakyl-polysiloxane of the alkenyl functional is about 20 mass % of component (A) to group
Divide the about 50 mass % of (A)；And
(ii) organopolysiloxane of alkenyl functional, it includes SiO4/2Unit, R1 2R2SiO1/2Unit and R1 3SiO1/2Unit,
Middle R1For C1-10Alkyl and R2For alkenyl, wherein the alkenyl group content is in about 1.0 mass % to the model of about 4.5 mass %
In enclosing, the hydroxy radical content on silicon is in the range of about 0.2 mass % to about 2.0 mass %, and weight-average molecular weight is about
2,000g/mol to about 22,000g/mol；
Crosslinking agent；And
The hydrosilylation catalyst of catalytic amount is to form curable organosilicon composition.
11. according to the method described in claim 10, further including adding reaction suppressor to the solution.
12. composition according to claim 11, wherein reaction suppressor inhibit Si―H addition reaction, and with based on described
About 10 parts of the total weight of composition is in parts per million to about 5,000 parts of concentration in parts per million.
13. having to form solidification according to the method described in claim 10, further including the heating curable organosilicon composition
Machine silicon product.
14. according to the method for claim 13, wherein the heating stepses further include using injection molding, transfer modling, casting,
One kind in extrusion, molded, compression molding and cavity molding curing the solution to produce molded products, casted article
Or extruded product.
15. a kind of curable organosilicon composition, including：
Organopolysiloxane of 100 mass parts containing alkenyl, it includes：
Diakyl-polysiloxane has average at least two alkenyl groups and the about 300mPa at 25 DEG C in each molecule
The viscosity of s to about 2,000,000mPas, the diakyl-polysiloxane be the organopolysiloxane about 20 mass % extremely
About 50 mass %, and
The organopolysiloxane of resin form containing alkenyl, it includes SiO4/2Unit, R1 2R2SiO1/2Unit and R1 3SiO1/2It is single
Member, wherein R1 2For C1-10Alkyl and R2For alkenyl, and alkenyl group content is in about 1 mass % to the model of about 4.5 mass %
In enclosing, the hydroxy radical content on silicon is about 0.2 mass % to about 2.0 mass %, organic poly- silicon of the resin form containing alkenyl
Oxygen alkane is the about 50 mass % to about 80 mass % of the organopolysiloxane；
Crosslinking agent averagely has the hydrogen atom of at least three silicon bondings, wherein other than the hydrogen of silicon bonding in each molecule
The group of silicon bonding is C1-10Alkyl has in an amount of from providing described in about 0.8 mole of every 1 mole of hydrogen to about 2.0 moles of silicon bondings
Total alkenyl of machine polysiloxanes, wherein the crosslinking agent sheet, as organopolysiloxane, the crosslinking agent includes：
Organopolysiloxane has the hydrogen of 0.7 mass % silicon bondings and is included in about 1.50 moles to about 3.80 moles
HR3 2SiO1/2The every 1 mole of SiO of unit4/2The SiO of ratio within the scope of unit4/2Unit and HR3 2SiO1/2Unit, wherein R R3For
C1-10Alkyl, the organopolysiloxane be component (B) about 5 mass % to about 100 mass %, and
Straight chain organopolysiloxane, the hydrogen at least about 0.3 mass % silicon bondings, wherein other than the hydrogen of the silicon bonding
The group of silicon bonding is C1-10Alkyl, the straight chain organopolysiloxane are the 0 mass % to about 50 mass % of component (B)；With
And
The catalyst for addition reaction of hydrogen and silicon of catalytic amount.
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| PCT/US2016/061961 WO2017087351A1 (en) | 2015-11-18 | 2016-11-15 | Curable silicone composition |
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| CN102300932A (en) * | 2009-02-02 | 2011-12-28 | 道康宁东丽株式会社 | Curable silicone rubber composition |
| CN102300931A (en) * | 2009-02-02 | 2011-12-28 | 道康宁东丽株式会社 | Curable silicone composition that provides a highly transparent cured silicone material |
| CN102959015A (en) * | 2010-06-29 | 2013-03-06 | 道康宁东丽株式会社 | Curable organopolysiloxane composition and optical semiconductor device |
| CN103797073A (en) * | 2011-09-29 | 2014-05-14 | 道康宁东丽株式会社 | Curable silicone composition and cured product thereof |
| WO2014130784A1 (en) * | 2013-02-22 | 2014-08-28 | Dow Corning Toray Co., Ltd. | Curable silicone composition, cured product threreof, and optical semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017085612A1 (en) | 2017-05-26 |
| JP2018532864A (en) | 2018-11-08 |
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