CN108599713A - Multichannel power management module - Google Patents
Multichannel power management module Download PDFInfo
- Publication number
- CN108599713A CN108599713A CN201810545668.2A CN201810545668A CN108599713A CN 108599713 A CN108599713 A CN 108599713A CN 201810545668 A CN201810545668 A CN 201810545668A CN 108599713 A CN108599713 A CN 108599713A
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- China
- Prior art keywords
- diode chip
- field electrode
- low
- electrode frame
- low pressure
- Prior art date
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- 230000005611 electricity Effects 0.000 claims description 3
- 230000003685 thermal hair damage Effects 0.000 abstract description 4
- 230000006378 damage Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 244000144985 peep Species 0.000 description 4
- 239000013068 control sample Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
- H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of multichannel power management module, including at least two low-field electrode frames, low pressure diode chip is provided between adjacent low-field electrode frame;The top of the low-field electrode frame offers convergent belt fairlead, and the lower part for being located at the low-field electrode frame in left side is equipped with the weld part of normal current input terminal, and the low-field electrode frame for being located at right side is equipped with the weld part of normal current output end;Further include two high-field electrode frames, high-voltage diode chip is provided between two high-field electrode frames;The weld part of component by-pass current input terminal is equipped with positioned at the high-field electrode frame in left side, the high-field electrode frame for being located at right side is equipped with the weld part of sampled signal output end;Further include a coordination electrode frame, which is equipped with the weld part of output end after a control.The multichannel power management module creepage distance of the present invention lengthens, and also has the function of component bypass output, has the characteristics that be less prone to cause thermal damage, further ensured that usability, heat sinking function are good.
Description
Technical field
The present invention relates to photovoltaic module technical fields, more particularly to a kind of multichannel power management module.
Background technology
Solar energy is a kind of renewable resource, and photovoltaic module is widely used in solar power generation, and photovoltaic junction box is used
In the interconnection for realizing photovoltaic module and external power supply component, the electric power of photovoltaic module is output to outside.Inside photovoltaic module
Battery occur it is hidden split or be blocked by shadow generate hot spot effect when, photovoltaic component terminal box assembling Schottky diode serve as
The bypass protector of photovoltaic module, to ensure that the normal operation of photovoltaic module.
Photovoltaic power source management module is an important component in photovoltaic terminal box, can be used for various assemblies simultaneously
Photovoltaic panel terminal box in, to be protected when there is hot spot effect caused by illumination component, energy may be shielded
Battery component is consumed.In general, the diode chip for backlight unit in the photovoltaic component terminal box is by riveting or crimping or weld or pass through
Auxiliary element is plugged on electric conductor, and is passed and radiated by the pin of diode.In this way, the PN of the diode chip for backlight unit ties production
Raw heat is difficult to dissipate, and leads to diode chip for backlight unit Wen Sheng higher, is easily damaged, and diode chip for backlight unit damages in existing technology
After bad, protective bypass effect cannot work normally.
Invention content
In view of the deficienciess of the prior art, the purpose of the present invention, which is that, provides a kind of multichannel power management mould
Block, creepage distance lengthen, and have component bypass output, have the characteristics that be less prone to cause thermal damage.
To achieve the goals above, the technical solution adopted by the present invention is such:A kind of multichannel power management module,
Including at least two low-field electrode frames, low pressure diode chip is provided between adjacent low-field electrode frame;The low pressure
The top of electrode framework offers convergent belt fairlead, and the lower part for being located at the low-field electrode frame in left side is inputted equipped with normal current
The weld part at end, the low-field electrode frame for being located at right side are equipped with the weld part of normal current output end;Further include two high-voltage electricity
Pole frame is provided with high-voltage diode chip between two high-field electrode frames;The high-voltage diode chip and two pole of low pressure
Tube chip is total to cathode connection, and the high-field electrode frame for being located at left side is equipped with the weld part of component by-pass current input terminal, is located at the right side
The high-field electrode frame of side is equipped with the weld part of sampled signal output end.
As a preferred embodiment, further include a coordination electrode frame, which exports after being equipped with a control
The weld part at end, after the control output end by single-pole double-throw switch (SPDT) respectively with normal current input terminal, component by-pass current
Input terminal connects.
As a preferred embodiment, the welding of the weld part and normal current input terminal of the component by-pass current input terminal
Portion is connected directly.
As a preferred embodiment, the low-field electrode frame has 4, respectively the first low-field electrode frame, second low
Electrode framework, third low-field electrode frame and the 4th low-field electrode frame are pressed, in the first low-field electrode frame, second low
It is provided with the first low pressure diode chip between pressure electrode framework, in the second low-field electrode frame, third low-field electrode frame
It is provided with the second low pressure diode chip between frame, is set between the third low-field electrode frame and the 4th low-field electrode frame
It is equipped with third low pressure diode chip;The first low pressure diode chip, the second low pressure diode chip, two pole of third low pressure
Tube chip is connected in series with, wherein the input terminal of the first low pressure diode chip is connected to the welding of normal current input terminal
The output end in portion, third low pressure diode chip is connected to the weld part of normal current output end.
As a preferred embodiment, the lower part of the first low-field electrode frame is the weld part of normal current input terminal.
As a preferred embodiment, the lower part of the 4th low-field electrode frame is the weld part of normal current output end,
The lower part for being wherein located at the weld part and the 4th low-field electrode frame of the sampled signal output end of the high-field electrode frame on right side is
The weld part of normal current output end is same weld part.
As a preferred embodiment, there are three the high-voltage diode chips, respectively the first high-voltage diode chip,
Two high-voltage diode chips, third high-voltage diode chip, the first high-voltage diode chip are parallel to first after series connection
Low pressure diode chip, the second low pressure diode chip, on third low pressure diode chip;The second high-voltage diode chip
It is parallel to the first low pressure diode chip after series connection, on the second low pressure diode chip, the third high-voltage diode chip
It is parallel to the second low pressure diode chip after series connection, on third low pressure diode chip.
As a preferred embodiment, further include a heat sink electrodes frame, be set to the weld part of normal current input terminal with
Between the weld part of component by-pass current input terminal.
As a preferred embodiment, there is the low pressure diode chip P knots to be tied with N, and the N of the low pressure diode chip
This is located on the low-field electrode frame on right side for knot electrical connection, while the P knots of the low pressure diode chip are electrically connected to by wire jumper
On the low-field electrode frame in left side.
As a preferred embodiment, there is the high-voltage diode chip P knots to be tied with N, and the N of the high-voltage diode chip
This is located on the high-field electrode frame on right side for knot electrical connection, while the P knots of the high-voltage diode chip are electrically connected to by wire jumper
On the high-field electrode frame in left side.
Compared with prior art, beneficial effects of the present invention:The multichannel power management module creepage distance of the present invention adds
It is long, also have the function of component bypass output, has the characteristics that be less prone to cause thermal damage, further ensured usability, radiate
Better function.
Description of the drawings
Fig. 1 is the structural schematic diagram of multichannel power management module in embodiment 1-1 in the present invention;
Fig. 2 is the schematic internal view of multichannel power management module in embodiment 1-1 in the present invention;
Fig. 3 is the schematic diagram of multichannel power management module in embodiment 1-1 in the present invention;
Fig. 4 is the structural schematic diagram of multichannel power management module in embodiment 1-2 in the present invention;
Fig. 5 is the schematic internal view of multichannel power management module in embodiment 1-2 in the present invention;
Fig. 6 is the schematic diagram of multichannel power management module in embodiment 1-2 in the present invention;
Fig. 7 is the structural schematic diagram of multichannel power management module in embodiment 1-3 in the present invention;
Fig. 8 is the schematic internal view of multichannel power management module in embodiment 1-3 in the present invention;
Fig. 9 is the schematic diagram of multichannel power management module in embodiment 1-3 in the present invention;
Figure 10 is the vertical view of intelligent wiring box in the present invention;
Figure 11 is the upward view of intelligent wiring box in the present invention;
Figure 12 is the sectional view along A-A of Figure 11 in the present invention;
Figure 13 is the explosive view of the intelligent wiring box with multichannel power management module in the present invention.
Specific implementation mode
With reference to specific embodiment, the invention will be further described.Following embodiment is only used for clearly illustrating
Technical scheme of the present invention, and not intended to limit the protection scope of the present invention.
Embodiment 1:
As shown in Fig. 1 ~ 3, a kind of multichannel power management module, including at least two low-field electrode frames 11, adjacent low pressure
Low pressure diode chip 12 is provided between electrode framework 11;The top of the low-field electrode frame 11 offers convergent belt extraction
Hole 13, the lower part for being located at the low-field electrode frame 11 in left side are equipped with the weld part of normal current input terminal 14, are located at the low of right side
Electrode framework 11 is pressed to be equipped with the weld part of normal current output end 15;Further include two high-field electrode frames 16, two high-voltage electricity
High-voltage diode chip 17 is provided between pole frame 16;The high-voltage diode chip 17 is negative altogether with low pressure diode chip 12
Pole connects, and the high-field electrode frame 16 for being located at left side is equipped with the weld part of component by-pass current input terminal 18, is located at the height on right side
Electrode framework 16 is pressed to be equipped with the weld part of sampled signal output end 15.
Further include a coordination electrode frame 19, the coordination electrode frame as shown in Fig. 1 ~ 3 as a kind of preferred embodiment 1-1
Frame 19 is equipped with the weld part of output end 110 after a control, and output end 110 is distinguished by single-pole double-throw switch (SPDT) 111 after the control
It is connect with normal current input terminal 14, component by-pass current input terminal 18.
Specifically, the low-field electrode frame 11 has 4, respectively the first low-field electrode frame 113, the second low-field electrode
Frame 114, third low-field electrode frame 115 and the 4th low-field electrode frame 116, the first low-field electrode frame 113,
The first low pressure diode chip 117 is provided between second low-field electrode frame 114, the second low-field electrode frame 114,
The second low pressure diode chip 118 is provided between third low-field electrode frame 115, in the third low-field electrode frame 115
Third low pressure diode chip 119 is provided between the 4th low-field electrode frame 116;The first low pressure diode chip
117, the second low pressure diode chip 118, third low pressure diode chip 119 are connected in series with, wherein two pole of the first low pressure
The input terminal of tube chip 117 is connected to the weld part of normal current input terminal 14, the output end of third low pressure diode chip 119
It is connected to the weld part of normal current output end 15.
Specifically, the lower part of the first low-field electrode frame 113 is the weld part of normal current input terminal 14.
Specifically, the lower part of the 4th low-field electrode frame 116 is the weld part of normal current output end 15, wherein position
It is in the lower part of the weld part and the 4th low-field electrode frame 116 of the sampled signal output end 15 of the high-field electrode frame 16 on right side
The weld part of normal current output end 15 is same weld part, therefore normal current output end 15 and sampled signal output end here
15 are all made of reference numerals 15 in the example shown.
Specifically, further including a heat sink electrodes frame 112, it is set to by the weld part and component of normal current input terminal 14
It between the weld part of road current input terminal 18, can further increase heat radiation function, prevent from damaging.
More specifically, the weld part of each frame is a flat copper sheet, instead of original bulky riveting,
Consumptive material can be reduced.
Specifically, there is the low pressure diode chip 12 P knots to be tied with N, and the N knots of the low pressure diode chip 12 are electrically connected
It connects this to be located on the low-field electrode frame 11 on right side, while the P knots of the low pressure diode chip 12 are electrically connected to by wire jumper 120
On the low-field electrode frame 11 in left side.
Specifically, there is the high-voltage diode chip 17 P knots to be tied with N, and the N knots of the high-voltage diode chip 17 are electrically connected
It connects this to be located on the high-field electrode frame 16 on right side, while the P knots of the high-voltage diode chip 17 are electrically connected to by wire jumper 120
On the high-field electrode frame 16 in left side.
Using the diode chip for backlight unit connection type of this structure, the heat not only generated is smaller, and heat dissipation is preferable, and is not easy to melt
There is the phenomenon that cause thermal damage;Wherein wire jumper 120 is made of metallic copper,.
Specifically, the outer enclosure of the low pressure diode chip 12, high-voltage diode chip 17, wire jumper 120 has epoxy
Resin layer 121, plastic packaging performance is good, and service life is long.
When it is implemented, in the present embodiment, be parallel on the first low pressure diode chip 117 first battery 122,
It is parallel with the second battery 123 on second low pressure diode chip 118, is parallel with third on third low pressure diode chip 119
Battery 124, when the first battery 122, the second battery 123, third battery 124 work normally, the first low pressure diode chip
117, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, and output end 110 passes through list after control
Double-pole double throw switch 111 is connect with normal current input terminal 14, and high-voltage diode chip 17 is not turned on, and is connected to output end after control
Sample devices 125 between 110 and normal current output end 15 works normally;When the first battery 122 damage, the second battery 123,
When third battery 124 works normally, the conducting of the first low pressure diode chip 117, the second low pressure diode chip 118, third
Low pressure diode chip 119 is not turned on, and output end 110 passes through single-pole double-throw switch (SPDT) 111 and normal current input terminal after control
14 connections, high-voltage diode chip 17 are not turned on, and are connected to adopting between output end 110 and normal current output end 15 after control
Sample equipment 125 works normally;When the first battery 122, the second battery 123 damage, when third battery 124 works normally, first is low
Diode chip for backlight unit 117, the conducting of the second low pressure diode chip 118 are pressed, third low pressure diode chip 119 is not turned on, after control
Output end 110 is connect by single-pole double-throw switch (SPDT) 111 with normal current input terminal 14, and high-voltage diode chip 17 is not turned on, even
The sample devices 125 after control between output end 110 and normal current output end 15 is connected to work normally;When the first battery 122,
When second battery 123, third battery 124 damage, the first low pressure diode chip 117, the second low pressure diode chip 118,
Third low pressure diode chip 119 is both turned on, and output end 110 passes through single-pole double-throw switch (SPDT) 111 and component bypass input after control
18 connection of end, high-voltage diode chip 17 are connected, and are connected to adopting between output end 110 and sampled signal output end 15 after control
Sample equipment 125 works normally.The present invention is provided with the function of component bypass output, has further ensured usability.
As a kind of preferred embodiment 1-2, as shown in Fig. 4 ~ 6, with embodiment 1-1 difference lies in:The component bypass
The weld part of current input terminal 18 and the weld part of normal current input terminal 14 are connected directly.The present embodiment is embodiment 1-1's
On the basis of it is simple in structure, reduce cost, service life is long.
When it is implemented, when the first battery 122, the second battery 123, third battery 124 work normally, the first low pressure
Diode chip for backlight unit 117, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, high-voltage diode
Chip 17 is not turned on;When the damage of the first battery 122, when the second battery 123, third battery 124 work normally, the first low pressure two
Pole pipe chip 117 is connected, and the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, two pole of high pressure
Tube chip 17 is not turned on;When the first battery 122, the damage of the second battery 123, when third battery 124 works normally, the first low pressure two
Pole pipe chip 117, the conducting of the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, high-voltage diode
Chip 17 is not turned on;When the first battery 122, the second battery 123, third battery 124 damage, high-voltage diode chip 17 is led
It is logical, further first low pressure diode chip 117, the second low pressure diode chip 118, third low pressure diode chip 119
It is not turned on.
As a kind of preferred embodiment 1-3, as shown in Fig. 7 ~ 9, with embodiment 1-2 difference lies in:Two pole of the high pressure
There are three tube chips 17, respectively the first high-voltage diode chip 171, the second high-voltage diode chip 172, two pole of third high pressure
Tube chip 173, the first low pressure diode chip 117, second that the first high-voltage diode chip 173 is parallel to after series connection are low
On pressure diode chip for backlight unit 118, third low pressure diode chip 119;After the second high-voltage diode chip 171 is parallel to series connection
The first low pressure diode chip 117, on the second low pressure diode chip 118, the third high-voltage diode chip 172 is in parallel
On the second low pressure diode chip 118, third low pressure diode chip 119 after series connection.The present embodiment is embodiment 1-2's
On the basis of warm ascending effect it is more preferable.
When it is implemented, when the first battery 122, the second battery 123, third battery 124 work normally, the first low pressure
Diode chip for backlight unit 117, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, the first high pressure two
Pole pipe chip 171 is not turned on, the second high-voltage diode chip 172 is not turned on, third high-voltage diode chip 173 is not turned on;When
First battery 122 damages, and when the second battery 123, third battery 124 work normally, the first low pressure diode chip 117 is led
Logical, the second low pressure diode chip 118, third low pressure diode chip 119 are not turned on, the first high-voltage diode chip 171
It is not turned on, the second high-voltage diode chip 172 is not turned on, third high-voltage diode chip 173 is not turned on;When the first battery 122,
Second battery 123 damages, when third battery 124 works normally, the conducting of the first high-voltage diode chip 171, two pole of the second high pressure
Tube chip 172 is not turned on, the advanced tube chip of third high pressure 173 is not turned on, and further first low pressure diode chip 117 is not led
Lead to, the second low pressure diode chip 118 is not turned on, third low pressure diode chip 119 is not turned on;When the first battery 122, second
When battery 123, third battery 124 damage, the first high-voltage diode chip 171, the second high-voltage diode chip 172 are not led
Logical, third high-voltage diode chip 173 is connected, further first low pressure diode chip 117, the second low pressure diode chip
118, third low pressure diode chip 119 is not turned on;When the first battery 122 normal work, the second battery 123, third battery
124 when damaging, and the first high-voltage diode chip 171 is not turned on, the conducting of the second high-voltage diode chip 172, third high pressure two
Pole pipe chip 173 is not turned on, and further first low pressure diode chip 117, the second low pressure diode chip 118, third are low
Pressure diode chip for backlight unit 119 is not turned on.
Embodiment 2:
As shown in Figure 10 ~ 13, a kind of intelligent wiring box, including box cover 21, box body 22, cassette bottom 23, the cassette bottom 23 are set to box
The bottom of body 22 simultaneously forms an encapsulating chamber with box body 22, and the box cover 21 is set to the top of box body 22;In the cassette bottom 23
Portion is provided with only glue portion 24, and cassette bottom 23 is separated into top and lower part;The top of the cassette bottom 23 is provided with the remittance of boss-shaped
Band guiding port 25 is flowed, multiple grooves 26 are offered on the convergent belt guiding port 25;The lower part of the cassette bottom 23 is provided with encapsulating mouth
27, it is located at the centre position of bottom end.
Specifically, the both sides at the middle part of the cassette bottom 23 offer encapsulating peep hole 28, it is convenient to be observed in encapsulating.
Specifically, the on both sides of the middle of the box body 22 is provided with cable fastening receiving portion 29, which fastens receiving portion 29
It is corresponding with encapsulating peep hole 28, cable 4 is set in intelligent wiring box by briquetting 3 in cable fastens receiving portion 29,
The inner end of the cable 4 is connected to multichannel power management module 1, outer end extends in the outside of the intelligent wiring box.
Specifically, it is in wavy raised line that the only glue portion 24, which is one, it is located at the top position of encapsulating peep hole 28, right
When intelligent wiring box first time encapsulating, prevent glue by the top of intelligent wiring box.
Specifically, the top of the cassette bottom 23 is provided with the first fastener 210, for being clamped multichannel power management module 1.
Specifically, the lower part of the cassette bottom 23 is provided with the second fastener 211, for being clamped pcb board 2.
The intelligent wiring box integral sealing of the present embodiment, small, encapsulating is more easily by the light between different terminal boxes
Hint cable 4 is easy to connect.
Embodiment 3:
As shown in Fig. 1 ~ 13, a kind of intelligent wiring box with multichannel power management module,
Including wiring box body, multichannel power management module 1, pcb board 2, the multichannel power management module 1 and pcb board 2
It is set in wiring box body;The both sides of the wiring box body are respectively arranged with cable 4 by briquetting 3, the inner end of the cable 4
It is connected on multichannel power management module 1, outer end extends outwardly in terminal box body exterior;
The multichannel power management module 1 include at least two low-field electrode frames 11, adjacent low-field electrode frame 11 it
Between be provided with low pressure diode chip 12;The top of the low-field electrode frame 11 offers convergent belt fairlead 13, is located at a left side
The lower part of the low-field electrode frame 11 of side is equipped with the weld part of normal current input terminal 14, is located at the low-field electrode frame 11 on right side
Weld part equipped with normal current output end 15;The multichannel power management module 1 further includes two high-field electrode frames 16,
It is provided with high-voltage diode chip 17 between two high-field electrode frames 16;The high-voltage diode chip 17 and low pressure diode
Chip 12 is total to cathode connection, and the high-field electrode frame 16 for being located at left side is equipped with the weld part of component by-pass current input terminal 18, position
High-field electrode frame 16 in right side is equipped with the weld part of sampled signal output end 15;The multichannel power management module 1 is also
Including a coordination electrode frame 19, which is equipped with the weld part of output end 110 after a control, after the control
Output end 110 is connect with normal current input terminal 14, component by-pass current input terminal 18 respectively by single-pole double-throw switch (SPDT) 111;
The wiring box body includes box cover 21, box body 22, cassette bottom 23, and the cassette bottom 23 is set to the bottom of box body 22 and and box
Body 22 forms an encapsulating chamber, and the box cover 21 is set to the top of box body 22;The middle part of the cassette bottom 23 is provided with only glue portion 24,
And cassette bottom 23 is separated into the top for accommodating multichannel power management module 1 and the lower part for accommodating pcb board 2;The cassette bottom 23
Top is provided with the convergent belt guiding port 25 with 13 matched boss-shaped of convergent belt fairlead, is opened up on the convergent belt guiding port 25
There are multiple grooves 26;The lower part of the cassette bottom 23 is provided with encapsulating mouth 27, is located at the centre position of bottom end.
In the present embodiment, it using the multichannel power management module 1 in embodiment 1, is connect using the intelligence in embodiment 2
Wire box is the wiring box body of the present embodiment, when it is implemented, in the present embodiment, by the multichannel power supply pipe in embodiment 1
Reason module 1 is connected in the top of cassette bottom 23 by the first fastener 210, and pcb board 2 is connected in cassette bottom 23 by the second fastener 211
Top, then box body 22 is connect with cassette bottom 23 and by encapsulating mouth 27 first time encapsulating, stopping glue portion 24 prevents glue logical
It crosses to the top of intelligent wiring box, the encapsulating peep hole 28 is used to observe state when encapsulating, when solar energy convergent belt is from remittance
Stream band guiding port 25 introduces, and is connected to low-field electrode frame from the extraction of the convergent belt fairlead 13 of multichannel power management module 1
With regard to carrying out second of encapsulating on frame 11, the top of cassette bottom 23 is provided with the convergent belt guiding port 25 of boss-shaped, and the convergent belt
Offering multiple grooves 26 on guiding port 25, encapsulating is easier pass-out, after encapsulating, in 22 upper cover upper box cover 21 of box body, into
The whole sealing of row.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvement and deformations can also be made, these improvement and deformations
Also it should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of multichannel power management module, it is characterised in that:Including at least two low-field electrode frames, adjacent low tension
Low pressure diode chip is provided between the frame of pole;The top of the low-field electrode frame offers convergent belt fairlead, is located at
The lower part of the low-field electrode frame in left side is equipped with the weld part of normal current input terminal, and the low-field electrode frame positioned at right side is equipped with
The weld part of normal current output end;Further include two high-field electrode frames, high pressure is provided between two high-field electrode frames
Diode chip for backlight unit;The high-voltage diode chip is total to cathode with low pressure diode chip and connect, and is located at the high-field electrode frame in left side
It is provided with the weld part of component by-pass current input terminal, the high-field electrode frame for being located at right side is equipped with the weldering of sampled signal output end
Socket part.
2. a kind of multichannel power management module according to claim 1, it is characterised in that:It further include a coordination electrode frame
Frame, the coordination electrode frame are equipped with the weld part of output end after a control, and output end passes through single-pole double-throw switch (SPDT) after the control
It is connect respectively with normal current input terminal, component by-pass current input terminal.
3. a kind of multichannel power management module according to claim 1, it is characterised in that:The component by-pass current is defeated
The weld part for entering the weld part and normal current input terminal at end is connected directly.
4. according to a kind of multichannel power management module described in claim 1 ~ 3, it is characterised in that:The low-field electrode frame
There are 4, respectively the first low-field electrode frame, the second low-field electrode frame, third low-field electrode frame and the 4th low tension
Pole frame is provided with the first low pressure diode chip between the first low-field electrode frame, the second low-field electrode frame,
It is provided with the second low pressure diode chip between the second low-field electrode frame, third low-field electrode frame, in the third
Third low pressure diode chip is provided between low-field electrode frame and the 4th low-field electrode frame;First low pressure diode
Chip, the second low pressure diode chip, the connection of third low pressure diode chip-in series, wherein the first low pressure diode core
The input terminal of piece is connected to the weld part of normal current input terminal, and the output end of third low pressure diode chip is connected to normal electricity
Flow the weld part of output end.
5. a kind of multichannel power management module according to claim 4, it is characterised in that:The first low-field electrode frame
The lower part of frame is the weld part of normal current input terminal.
6. a kind of multichannel power management module according to claim 4, it is characterised in that:The 4th low-field electrode frame
The lower part of frame is the weld part of normal current output end, wherein be located at the sampled signal output end of the high-field electrode frame on right side
The lower part of weld part and the 4th low-field electrode frame is that the weld part of normal current output end is same weld part.
7. a kind of multichannel power management module according to claim 4, it is characterised in that:The high-voltage diode chip
There are three, respectively the first high-voltage diode chip, the second high-voltage diode chip, third high-voltage diode chip, described
One high-voltage diode chip is parallel to the first low pressure diode chip after series connection, the second low pressure diode chip, third low pressure
On diode chip for backlight unit;The second high-voltage diode chip is parallel to the first low pressure diode chip after series connection, the second low pressure
On diode chip for backlight unit, the third high-voltage diode chip is parallel to the second low pressure diode chip after series connection, third low pressure
On diode chip for backlight unit.
8. a kind of multichannel power management module according to claim 1, it is characterised in that:It further include a heat sink electrodes frame
Frame is set between the weld part of normal current input terminal and the weld part of component by-pass current input terminal.
9. a kind of multichannel power management module according to claim 1, it is characterised in that:The low pressure diode chip
It is tied with N with P knots, and the N knots of the low pressure diode chip are electrically connected this and are located on the low-field electrode frame on right side, while this is low
The P knots of pressure diode chip for backlight unit are electrically connected to by wire jumper on the low-field electrode frame in left side.
10. a kind of multichannel power management module according to claim 9, it is characterised in that:The high-voltage diode core
Piece is tied with P knots with N, and the N knots of the high-voltage diode chip are electrically connected this and are located on the high-field electrode frame on right side, simultaneously should
The P knots of high-voltage diode chip are electrically connected to by wire jumper on the high-field electrode frame in left side.
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CN201810545668.2A CN108599713B (en) | 2018-05-31 | 2018-05-31 | Multichannel power management module |
PCT/CN2018/094170 WO2019227568A1 (en) | 2018-05-31 | 2018-07-03 | Multi-channel power supply management module |
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CN201810545668.2A CN108599713B (en) | 2018-05-31 | 2018-05-31 | Multichannel power management module |
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Citations (5)
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CN103208916A (en) * | 2012-01-11 | 2013-07-17 | 太阳能安吉科技有限公司 | Photovoltaic Module |
CN104052391A (en) * | 2013-03-15 | 2014-09-17 | 索兰托半导体公司 | Photovoltaic Bypass And Output Switching |
CN204794891U (en) * | 2015-07-30 | 2015-11-18 | 苏州同泰新能源科技有限公司 | Photovoltaic terminal box with integrated module of bypass |
WO2018054835A1 (en) * | 2016-09-23 | 2018-03-29 | Sma Solar Technology Ag | Solar module, phovoltaic system, and voltage limitation method |
CN208337498U (en) * | 2018-05-31 | 2019-01-04 | 苏州同泰新能源科技有限公司 | Multichannel power management module |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106130469A (en) * | 2016-08-31 | 2016-11-16 | 济南晶恒电子有限责任公司 | Encapsulated member stagewise photovoltaic bypass diode (led) module |
CN107425808A (en) * | 2017-06-07 | 2017-12-01 | 江苏通灵电器股份有限公司 | It is a kind of to rapidly switch off system applied to photovoltaic generation |
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2018
- 2018-05-31 CN CN201810545668.2A patent/CN108599713B/en active Active
- 2018-07-03 WO PCT/CN2018/094170 patent/WO2019227568A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103208916A (en) * | 2012-01-11 | 2013-07-17 | 太阳能安吉科技有限公司 | Photovoltaic Module |
CN104052391A (en) * | 2013-03-15 | 2014-09-17 | 索兰托半导体公司 | Photovoltaic Bypass And Output Switching |
CN204794891U (en) * | 2015-07-30 | 2015-11-18 | 苏州同泰新能源科技有限公司 | Photovoltaic terminal box with integrated module of bypass |
WO2018054835A1 (en) * | 2016-09-23 | 2018-03-29 | Sma Solar Technology Ag | Solar module, phovoltaic system, and voltage limitation method |
CN208337498U (en) * | 2018-05-31 | 2019-01-04 | 苏州同泰新能源科技有限公司 | Multichannel power management module |
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WO2019227568A1 (en) | 2019-12-05 |
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