CN108598284A - Display panel, display panel preparation method and display device - Google Patents
Display panel, display panel preparation method and display device Download PDFInfo
- Publication number
- CN108598284A CN108598284A CN201810455702.7A CN201810455702A CN108598284A CN 108598284 A CN108598284 A CN 108598284A CN 201810455702 A CN201810455702 A CN 201810455702A CN 108598284 A CN108598284 A CN 108598284A
- Authority
- CN
- China
- Prior art keywords
- encapsulated layer
- display panel
- substrate
- cover board
- groove
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
Abstract
The present invention provides a kind of display panel, the cover board being oppositely arranged including substrate, with the substrate, and the encapsulated layer of the bonding substrate and the cover board, the substrate surrounds the confined space of placement display part with the encapsulated layer and the cover board, it is laid on the encapsulated layer fluted, the slot opening direction fills solid-state heat-absorbing material in the cover board, the groove.The present invention also provides a kind of packaging method and a kind of display devices.The display panel provided by the invention on the encapsulated layer by opening up the groove, it is not contacted with the side wall of the groove when cutting tool cuts the encapsulated layer, to reduce end face contact area when cutting tool processes the encapsulated layer, to cut surplus in compression, while realizing narrow frame design, ensure the yields of packaging effect and encapsulation.
Description
Technical field
The present invention relates to a kind of electronic display technology field more particularly to display panel, packaging method and display devices.
Background technology
Display device is the screen display devices of the electronic equipments such as mobile phone, tablet, TV, wide in electronic technology field application
It is general.In numerous display devices, display of organic electroluminescence (Organic Light-Emitting Diode, OLED) because
It has the characteristics that actively to shine, light emission luminance height, high resolution, visual angle are wide, fast response time, low energy consumption and flexibility etc. is more
And widely paid close attention to, it is most likely that substitution liquid crystal display becomes follow-on display technology.Including OLED device
Numerous display devices contain for the extremely sensitive organic layer material of steam and oxygen, need to be packaged display device and incite somebody to action
Display device is isolated with external environment, can just ensure the service life of display device.
Existing display device generally requires to cut off glass using cutter when being packaged using glass glue-line (Frit)
Narrow frame design is realized to compress cutting surplus in the part of glue-line.But existing display panel is carrying out glass glue-line
When cutting technique, it is easy to leave crackle on the cutting end face of glass glue-line, the extension of micro-crack is easy to induce the mistake of glass glue-line
Effect, to cause the failure of entire encapsulation process.Existing display panel and packaging method are carrying out narrow frame design and are needing
When compressing the technique of cutting surplus, the effect not only encapsulated is relatively poor, but also the yields encapsulated is relatively low, entire to flow
The production technology of waterline is relatively low.
Invention content
In view of this, it is necessary to provide a kind of improved display panel, display panel preparation method and display device, this is aobvious
Show that the preparation method of panel and display panel can compress cutting surplus, realize narrow frame design, and can ensure encapsulation effect
Fruit and encapsulation yields.
The present invention provides a kind of display panel, including the cover board that substrate and the substrate are oppositely arranged, and described in bonding
The encapsulated layer of substrate and the cover board, the substrate surround the confined air of placement display part with the encapsulated layer and the cover board
Between, fluted, the slot opening direction or the filling solid-state in the cover board, the groove are laid on the encapsulated layer
Heat-absorbing material.
Further, the groove encloses the surface that the direction set is opened in the encapsulated layer along the encapsulated layer.
Further, the encapsulated layer is annular in shape, and the groove is arranged close to the encapsulated layer outer shroud.
Further, the groove thickness is less than the encapsulation layer thickness.
Further, the recess width is 1/2-1/3 times of the encapsulated layer width.
Further, heat-conducting silicone grease is filled in the groove.
Further, the groove is cambered surface along the section perpendicular to cover board direction.
The present invention also provides a kind of preparation methods of display panel, including：
Substrate, the substrate divides viewing area and encapsulation region, in the encapsulation region edge-coating solid-state heat-absorbing material；
Coated glass powder and the heat-absorbing material is completely covered on the heat-absorbing material；
Display device is set on the viewing area of substrate, substrate is bonded to form confined space with cover board；
It is cut along the heat-absorbing material applying area using laser.
Further, the heat-absorbing material is liquefying or is gasifying with generation after laser cutting.
The present invention also provides a kind of display devices, including display panel as described in any one of the above embodiments.
The display panel provided by the invention cuts institute by opening up the groove, cutting tool on the encapsulated layer
It is not contacted with the side wall of the groove when stating encapsulated layer, to reduce end face contact surface when cutting tool processes the encapsulated layer
Product, to while surplus is cut in compression, realizes narrow frame design, ensure the yields of packaging effect and encapsulation.
Description of the drawings
Fig. 1 is the schematic cross-sectional view of the display panel in one embodiment of the present invention.
Fig. 2 is the schematic cross-sectional view of display panel in the prior art.
Fig. 3 is the flow diagram of display panel manufacturing method in one embodiment of the present invention.
Main element symbol description
Following specific implementation mode will further illustrate this method in conjunction with above-mentioned attached drawing.
Specific implementation mode
Below in conjunction with the attached drawing in this method embodiment, the technical solution in this method embodiment is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only this method a part of the embodiment, instead of all the embodiments.It is based on
Embodiment in this method, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the range of this method protection.
It should be noted that when component is referred to as " being installed in " another component, it can be installed directly in another group
On part or there may also be components placed in the middle.When a component is considered as " being set to " another component, it can be straight
It connects and is arranged on another component or may be simultaneously present component placed in the middle.When a component be considered as " being fixed on " another
Component, it can be directly anchored on another component or may be simultaneously present component placed in the middle.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of this method
The normally understood meaning of technical staff is identical.Herein description tool is intended merely in the term used in the description of this method
The purpose of the embodiment of body, it is not intended that in limitation this method.Term as used herein " and/or " include one or more phases
Any and all combinations of the Listed Items of pass.
Referring to Fig. 1, Fig. 1 is the schematic cross-sectional view of the display panel 100 in one embodiment of the present invention, display panel
100 to realize the encapsulation to display device, display device is isolated with external environment, so as to steam in display device
Extremely sensitive organic layer material is in closed environment with oxygen, ensures the service life of display device.
In present embodiment, display device is OLED display device, and display panel 100 is realizing mobile phone OLED screen body
Encapsulation.It is appreciated that in other implementations, display device can also be the other kinds of display devices such as LCD, display
Panel 100 is also not limited to only be applicable in the encapsulation of mobile phone OLED screen body, in other implementations, display panel
100 can also be realizing the encapsulation process of other electronic product screen bodies such as tablet computer, notebook.
The display panel of existing display device is briefly described below：
Also referring to Fig. 2, Fig. 2 is the schematic cross-sectional view of display panel 200 in the prior art, existing display panel
200 include substrate 21, cover board 22, the display device 23 being set on substrate 21 and be located between cover board 22 and substrate 21
Encapsulated layer 24.Encapsulated layer 24 plays the role of sealing frame, and encapsulated layer 24 matches with substrate 21 with cover board 22 and merges to form confined space,
Display device 23 is placed in the sealing space, to realize the mutually isolated of display device 23 and external environment.
Since the direction that the screen of the electronic products such as mobile phone shields towards narrow frame, comprehensively continues to develop, the display after encapsulation
Device module needs compression as possible to cut surplus, improves screen accounting, often utilizes the portion of cutting tool excision encapsulated layer 24 thus
Point, to reduce encapsulation after display module frame, realize to cut surplus compression and shield accounting raising.
But current display panel 200, by cutting tool after cutting line 241 cuts off encapsulated layer 24, meeting can not
The remaining portion in encapsulated layer 24 avoided generates micro-crack 242, and the small molecule of the steam, oxygen in external environment can be with
The easily inside of the display module by these micro-cracks 242 into after encapsulating, the normal use of interferoscope part 23,
The failure of encapsulation is caused, or even the failure of display device 23 can be caused, display panel 100 provided by the invention can effectively press down
The micro-crack 242 generated when cutting tool processing glass-cutting glue-line processed is asked to solve the crackle under narrow frame design requires
Topic, improves the yields of encapsulation, effective protection display device 23.
Referring again to Fig. 1, the concrete structure of display panel 100 is illustrated below：
Display panel 100 includes substrate 11, cover board 12, display device 13 and encapsulated layer 14, and substrate 11 and cover board 12 are substantially
It is arranged in parallel, encapsulated layer 14 is located between substrate 11 and cover board 12, and encapsulated layer 14 forms confined air with substrate 11 and cover board 12
Between 15, display device 13 is set on substrate 11 and is placed in the confined space 15, to realize by display device 13 with it is outer
Boundary's environment is mutually isolated.
12 generally rectangular shaped structure of substrate 11 and cover board, substrate 11 and cover board 12 can selectivity carry out chamfered or
The processing of person's fillet, the part in substrate 11 and cover board 12 are contacted with encapsulated layer 14, in substrate 11 and cover board 12 not with encapsulated layer 14
The central part of contact matches to merge with encapsulated layer 14 surrounds confined space 15.
The first contacting film layer (not shown) can also be arranged in the surface that substrate 11 is contacted with encapsulated layer 14, first contact membranes
Layer is strengthening the isolation effect between substrate 11 and encapsulated layer 14 to extraneous steam and oxygen..
The second contacting film layer (not shown) can also be arranged in the surface that cover board 12 is contacted with encapsulated layer 14, second contact membranes
Layer to strengthen the isolation effect between cover board 12 and encapsulated layer 14 to extraneous steam and oxygen, the second contacting film layer by with envelope
Sinuous water oxygen channel is formed between dress layer 14, confined space 15 is entered by water oxygen channel to extend extraneous steam and oxygen
Interior path enhances the isolation effect of cover board 12 and encapsulated layer 14 to extraneous steam and oxygen using the principle of labyrinth seal.
It is appreciated that in other implementations, if do not consider to enhance substrate 11 and encapsulated layer 14 to extraneous steam and
The isolation effect of oxygen, the first contacting film layer can also be omitted；If not considering to enhance cover board 12 with encapsulated layer 14 to extraneous steam
And the isolation effect of oxygen, the second contacting film layer can also be omitted.
In present embodiment, substrate 11 and cover board 12 are glass material.
14 generally rectangular shaped structure of encapsulated layer, and carry out chamfered or fillet that can be selective be handled, encapsulation
One end of layer 14 is connect with substrate 11, and the other end is connect with cover board 12, and encapsulated layer 14 is substantially annular in shape.
In present embodiment, encapsulated layer 14 is surrounded by four orthogonal frame encloseds, and encapsulated layer 14 is substantially square
It is cyclic annular.It is appreciated that in other implementations, encapsulated layer 14 can also use the other forms such as circular rings, vesica piscis
Ring-type, as long as encapsulated layer 14 being capable of end to end formation closing.
Encapsulated layer 14 includes frit, and frit can select V2O5、P2O5、BaO、SiO2、B2O3、Al2O3、SnO、TeO2、
MgO、CaO、ZnO、TiO2、WO3、Bi2O3、Fe2O3、CuO、Sb2O3、Ru2O、Rb2O, tin-fluorophosphate glasses, vanadate glass and borosilicate
It is one or more than one kinds of in hydrochlorate.
When being packaged, substrate 11 is pressed with cover board 12 so that and encapsulated layer 14 is mutually bonded with substrate 11 and cover board 12,
It is scanned along encapsulated layer 14 using laser, laser beam reaches across cover board 12 at encapsulated layer 14, and the frit in encapsulated layer 14 is inhaled
It receives the high-energy of laser beam and melts, so that encapsulated layer 14 and 12 tight bond of substrate 11 and cover board, are realized to aobvious
Show the encapsulation process of device.
Display panel 100 provided by the invention improves encapsulation to solve the crack problem under narrow frame design requires
Yields, more efficient protection display device 13 open up fluted 141 on the encapsulated layer 14 in display panel 100, groove 141
The surface that the direction set is opened in encapsulated layer 14 is enclosed along encapsulated layer 14, the thickness of groove 141 is less than the thickness of encapsulated layer 14, groove
141 are located at the lower section of cutting line 142.It is equipped with heat-absorbing material in groove 141, the heat-absorbing material is absorbing laser processing procedure
The heat of middle introducing.
In present embodiment, the fusing point of the heat-absorbing material is less than the fusing point of encapsulated layer 14.Preferably, heat-absorbing material is used and is led
Hot silicone grease has preferable thermal conductivity when heat-absorbing material uses heat-conducting silicone grease, is vaporized from fat state in 230 DEG C of temperature
And it takes away laser beam and processes introduced heat.It is appreciated that in other implementations, heat-absorbing material can also be used and be led
Other materials except hot silicone grease, as long as the heat-absorbing material can vaporize or liquefy at a suitable temperature and take away laser beam
Process introduced heat.
In present embodiment, heat-absorbing material is filled up completely full groove 141, is recepted the caloric with improving the overall of heat-absorbing material.
In other embodiments, heat-absorbing material can also be partially filled in groove 141, to reduce the manufacturing cost of module packaging.
In present embodiment, groove 141 is cambered surface along the section perpendicular to 12 direction of cover board.It is appreciated that in others
In embodiment, groove 141 can also use other shapes, be housed to heat-absorbing material as long as the groove 141 can be realized
.
Preferably, the width of groove 143 be 14 width of encapsulated layer half to one third, groove 143 leans on near-ring
The outer shroud of shape encapsulated layer 14 is arranged.
The exterior portion of encapsulated layer 14 can preferably be supported at this time, and the exterior portion of encapsulated layer 14 can cut
When keep preferable bonding strength, can be integrally broken in cutting process to avoid the exterior portion of encapsulated layer 14.
When being packaged, high energy laser beam radial package layer 14, encapsulated layer 14 is issued in the laser emission of high energy high temperature
Raw melting, to realize the bonding to substrate 11 and cover board 12.Due to the presence of groove 141, cutting tool is in cutting encapsulated layer
14 part, to compress cutting surplus, when realizing narrow frame design, groove 141 becomes the residual path of tool sharpening, cutter with
The area of the processing section of encapsulated layer 14 is reduced, and is also reduced the quantity for causing micro-crack in cutter cutting process, is improved
The cut quality of encapsulated layer 14.
When being equipped with heat-absorbing material in groove 141, the heat-absorbing material being placed in groove 141 can absorb laser beam
Heat, heat-absorbing material vaporize under the irradiation of laser beam, and take away the partial heat of laser beam, reduce encapsulating for encapsulated layer 14
When temperature, this enables the first contacting film layer being in direct contact with encapsulated layer 14 and the second contacting film layer in 14 envelope of encapsulated layer
With relatively low temperature when dress, the first contacting film layer and the second contacting film layer can be protected, avoid the first contacting film layer with
Second contacting film layer is by high-temperature damage.
It is appreciated that if not considering the protection to the first contacting film layer and the second contacting film layer, filled in groove 141
Heat-absorbing material can also omit.
The present invention also provides a kind of packaging method, which cuts surplus in compression, realizes the same of narrow frame design
When, additionally it is possible to ensure packaging effect and encapsulation yields.Referring to Fig. 3, Fig. 3 is packaging method in one embodiment of the present invention
Flow diagram, which includes：
S31：Substrate, the substrate divides viewing area and encapsulation region, in the encapsulation region edge-coating heat-absorbing material；
S32：Coated glass powder and the heat-absorbing material is completely covered on the heat-absorbing material；
S33：Display device is set on the viewing area of substrate, substrate is bonded to form confined space with cover board；
S34：It is cut along the heat-absorbing material applying area using laser.
Due to opening up avoiding space in glass glue-line, cutting tool comparatively easily can once cut off glass cement
Layer, to compress cutting surplus, when realizing narrow frame design, avoiding space becomes the reserved passageway of cutting tool processing so that
The area of cutting tool and the processing section of glass glue-line is reduced, and also reduces the number for causing micro-crack in cutter cutting process
Amount, improves the cut quality of glass glue-line.
Due to adding heat-absorbing material, heat-absorbing material is liquefying or is gasifying with generation after laser cutting, can be better
Protective glass cover board and glass substrate have more good packaging effect.
The present invention also provides a kind of display device (not shown), which includes above-mentioned display panel 100.
Display panel 100 provided by the invention cuts encapsulated layer by opening up groove 141, cutting tool on encapsulated layer 14
It is not contacted with the side wall of groove 141 when 14, to reduce end face contact area when cutting tool processes encapsulated layer 14, thus
Compression cutting surplus, while realizing narrow frame design, ensures the yields of packaging effect and encapsulation.
Those skilled in the art it should be appreciated that more than embodiment be intended merely to illustrate this method,
And be not used as the restriction to this method, as long as in the spirit of this method, made by embodiment of above
Appropriate change and variation is all fallen in the range of process require that protecting.
Claims (10)
1. a kind of display panel, which is characterized in that the cover board being oppositely arranged including substrate, with the substrate, and described in bonding
The encapsulated layer of substrate and the cover board, the substrate surround the confined air of placement display part with the encapsulated layer and the cover board
Between, fluted, the slot opening direction or the filling solid-state in the cover board, the groove are laid on the encapsulated layer
Heat-absorbing material.
2. display panel as described in claim 1, which is characterized in that the groove encloses the direction set along the encapsulated layer and opens up
In the surface of the encapsulated layer.
3. display panel as described in claim 1, which is characterized in that the encapsulated layer is annular in shape, and the groove is close to described
Encapsulated layer outer shroud is arranged.
4. display panel as described in claim 1, which is characterized in that the groove thickness is less than the encapsulation layer thickness.
5. display panel as described in claim 1, which is characterized in that the recess width is the 1/2- of the encapsulated layer width
1/3 times.
6. display panel as described in claim 1, which is characterized in that fill heat-conducting silicone grease in the groove.
7. display panel as described in claim 1, which is characterized in that the groove is arc along the section perpendicular to cover board direction
Face.
8. a kind of preparation method of display panel, which is characterized in that including：
Substrate, the substrate divides viewing area and encapsulation region, in the encapsulation region edge-coating solid-state heat-absorbing material；
Coated glass powder and the heat-absorbing material is completely covered on the heat-absorbing material；
Display device is set on the viewing area of substrate, substrate is bonded to form confined space with cover board；
It is cut along the heat-absorbing material applying area using laser.
9. the preparation method of display panel as claimed in claim 8, which is characterized in that the heat-absorbing material and laser cutting
Liquefaction or gasification occur afterwards.
10. a kind of display device, which is characterized in that including such as claim 1-7 any one of them display panel.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810455702.7A CN108598284B (en) | 2018-05-14 | 2018-05-14 | Display panel, display panel preparation method and display device |
| PCT/CN2019/071468 WO2019214285A1 (en) | 2018-05-11 | 2019-01-11 | Display panel motherboard, display panel, and display panel manufacturing method |
| US16/565,504 US20200006714A1 (en) | 2018-05-11 | 2019-09-10 | Display panel motherboards, display panels, and methods for manufacturing display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810455702.7A CN108598284B (en) | 2018-05-14 | 2018-05-14 | Display panel, display panel preparation method and display device |
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| Publication Number | Publication Date |
|---|---|
| CN108598284A true CN108598284A (en) | 2018-09-28 |
| CN108598284B CN108598284B (en) | 2020-02-14 |
Family
ID=63637110
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810455702.7A Active CN108598284B (en) | 2018-05-11 | 2018-05-14 | Display panel, display panel preparation method and display device |
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| CN (1) | CN108598284B (en) |
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| WO2019214285A1 (en) * | 2018-05-11 | 2019-11-14 | 云谷（固安）科技有限公司 | Display panel motherboard, display panel, and display panel manufacturing method |
| CN111047970A (en) * | 2019-11-21 | 2020-04-21 | 昆山国显光电有限公司 | Display panel and display panel mother board |
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| Publication number | Publication date |
|---|---|
| CN108598284B (en) | 2020-02-14 |
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