CN108597979A - A kind of semiconductor production plasma etching machine - Google Patents
A kind of semiconductor production plasma etching machine Download PDFInfo
- Publication number
- CN108597979A CN108597979A CN201810569471.2A CN201810569471A CN108597979A CN 108597979 A CN108597979 A CN 108597979A CN 201810569471 A CN201810569471 A CN 201810569471A CN 108597979 A CN108597979 A CN 108597979A
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- CN
- China
- Prior art keywords
- plasma etching
- etching machine
- fixed block
- elastic element
- supporting rod
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32807—Construction (includes replacing parts of the apparatus)
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of semiconductor production plasma etching machines, including plasma etching machine ontology, first elastic element and the second elastic element, the bottom of the plasma etching machine ontology is provided with the first fixed block, and first the inside of fixed block the first axis pin is installed, the bottom surface of plasma etching machine ontology is fixed in one end of first elastic element, and first the other end of elastic element be connected with the second fixed block, second fixed block is internally provided with the second axis pin, the avris of second fixed block is provided with baffle, the inside of supporting rod is fixed in one end of second elastic element, the outer wall of the supporting rod is connected with steel wire, it is provided with third fixed block at the center of the plasma etching machine body bottom portion.The semiconductor production plasma etching machine, has the effect of damping, to ensure that in transportational process, the safety of the device internal unit, and have the function of preventing the device from relative motion occurs.
Description
Technical field
The present invention relates to plasma etching machine technical field, specially a kind of semiconductor production plasma etching machine.
Background technology
Plasma etching machine is called plasma etcher, plasma flat etching machine, plasma etching machine, plasma
It is surface-treated instrument and plasma cleaning system etc.；Plasma etching, is the most common type form in dry etching, and principle is
The gas for being exposed to electronics regions forms plasma, resulting ionized gas and the gas for discharging high energy electron composition,
So as to form plasma or ion, when ionized gas atom passes through electric field acceleration, enough strength can be discharged and expelled with surface
Power tightly jointing material or etching surface.
However existing plasma etching machine, damping it is ineffective, to not readily transportable, and be not easy to its runner
It is fixed, use the device so as to cause inconvenience.In view of the above-mentioned problems, being badly in need of being created on the basis of original plasma etching machine
New design.
Invention content
The purpose of the present invention is to provide a kind of semiconductor production plasma etching machines, are carried with solving above-mentioned background technology
The plasma etching machine having, damping it is ineffective, and be not easy to the problem of the fixation of its runner.
To achieve the above object, the present invention provides the following technical solutions：A kind of semiconductor production plasma etching machine, packet
Include plasma etching machine ontology, the first elastic element and the second elastic element, the bottom setting of the plasma etching machine ontology
There is the first fixed block, and the inside of the first fixed block is equipped with the first axis pin, and is provided with the first cunning in the middle part of the first axis pin
Wheel, the bottom surface of plasma etching machine ontology, and the other end of the first elastic element are fixed in one end of first elastic element
It is connected with the second fixed block, second fixed block is internally provided with the second axis pin, and is equipped in the middle part of the second axis pin
The avris of two pulleys, second fixed block is provided with baffle, and the inside of baffle is equipped with third axis pin, and third axis pin
Middle part be provided with supporting rod, one end of second elastic element is fixed on the inside of supporting rod, and the second elastic element
The other end is set to the outside of the second fixed block, and the outer wall of the supporting rod is connected with steel wire, and steel wire is set to first pulley
On, and the side end of first pulley is fixed in one end of steel wire, is provided at the center of the plasma etching machine body bottom portion
Third fixed block, and the inside of third fixed block is equipped with shaft.
Preferably, first elastic element is provided with 4, and the first elastic element is about plasma etching machine ontology
Central axis is symmetrical.
Preferably, the baffle is symmetrical about the central axis of the second fixed block, and the third axis pin on baffle and support
Bar constitutes rotational structure.
Preferably, the supporting rod and the second elastic element are elastic connection, and one end of supporting rod is designed as arc knot
Structure.
Preferably, the supporting rod constitutes elevating mechanism by steel wire and first pulley with shaft, and first pulley is arranged
There are 8.
Preferably, the shaft is to be threadedly coupled, and third fixed block is provided with 2 with third fixed block.
Compared with prior art, the beneficial effects of the invention are as follows：The semiconductor production plasma etching machine is provided with
One elastic element ensure that the device will not be because of violent movement in transportational process, and lead to the damage of inner body, to
The probability that the device damages in transportational process is reduced, and is provided with first pulley, ensure that when pulling steel wire, first pulley
Steel wire can be driven to move, while supporting rod can be driven to move up and down, and then ensure that using plasma etching machine
Be not in mobile phenomenon when ontology, to ensure that etching machine at work will not because of the effect campaign of external force,
It ensure that the quality of finished product, and be provided with the second elastic element, it, can be in the second elasticity after ensure that supporting rod moves upwards
Element elastic force effect under, be restored to original state, to ensure the stability of the device, in addition to this, be additionally provided with shaft and
Third fixed block, ensure that after turning shaft, shaft will not under tension return to original position, without with the hand moment control turn
The position of axis.
Description of the drawings
Fig. 1 is positive structure diagram of the present invention；
Fig. 2 is side structure schematic view of the present invention；
Fig. 3 is partial enlargement structural representation at A in Fig. 1 of the present invention；
Fig. 4 is partial enlargement structural representation at B in Fig. 1 of the present invention.
In figure：1, plasma etching machine ontology；2, the first fixed block；3, the first axis pin；4, first pulley；5, the first elasticity
Element；6, the second fixed block；7, the second axis pin；8, second pulley；9, baffle；10, supporting rod；11, third axis pin；12, second
Elastic element；13, steel wire；14, shaft；15, third fixed block.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 4 are please referred to Fig.1, the present invention provides a kind of technical solution：A kind of semiconductor production plasma etching machine, including
Plasma etching machine ontology 1, the first fixed block 2, the first axis pin 3, first pulley 4, the first elastic element 5, the second fixed block 6,
Second axis pin 7, second pulley 8, baffle 9, supporting rod 10, third axis pin 11, the second elastic element 12, steel wire 13,14 and of shaft
The bottom of third fixed block 15, plasma etching machine ontology 1 is provided with the first fixed block 2, and the inside installation of the first fixed block 2
Have the first axis pin 3, and the middle part of the first axis pin 3 is provided with first pulley 4, one end of the first elastic element 5 is fixed on etc. from
The bottom surface of sub- etching machine ontology 1, and the other end of the first elastic element 5 is connected with the second fixed block 6, the second fixed block 6 it is interior
Portion is provided with the second axis pin 7, and the middle part of the second axis pin 7 is equipped with second pulley 8, and the avris of the second fixed block 6 is provided with gear
Plate 9, and the inside of baffle 9 is equipped with third axis pin 11, and the middle part of third axis pin 11 is provided with supporting rod 10, the second elasticity
The inside of supporting rod 10 is fixed in one end of element 12, and the other end of the second elastic element 12 is set to the second fixed block 6
The outer wall in outside, supporting rod 10 is connected with steel wire 13, and steel wire 13 is set in first pulley 4, and one end of steel wire 13 is solid
Third fixed block 15 is provided at the side end of first pulley 4, the center of 1 bottom of plasma etching machine ontology, and third is solid
The inside for determining block 15 is equipped with shaft 14,
First elastic element 5 is provided with 4, and central axis of first elastic element 5 about plasma etching machine ontology 1
Symmetrically, it is therefore prevented that the device due to strenuous exercise, causes internal unit to damage, so as to avoid unnecessary in transportational process
Loss,
Baffle 9 is symmetrical about the central axis of the second fixed block 6, and the third axis pin 11 on baffle 9 and 10 structure of supporting rod
At rotational structure, it is therefore prevented that plasma etching machine ontology 1 with second pulley 8 move, while ensure that supporting rod 10 can on
Lower movement,
Supporting rod 10 and the second elastic element 12 are elastic connection, and one end of supporting rod 10 is designed as arcuate structure, are protected
It has demonstrate,proved after supporting rod 10 moves upwards, the elastic force that can be generated in the second elastic element 12 under the action of, be restored to original state,
Supporting rod 10 constitutes elevating mechanism by steel wire 13 and first pulley 4 with shaft 14, and first pulley 4 is provided with 8
It is a, it ensure that and pull steel wire 13, supporting rod 10 just can move up and down with the power of very little,
Shaft 14 is to be threadedly coupled, and third fixed block 15 is provided with 2, ensure that and turns shaft with third fixed block 15
After 14, shaft 14 will not under tension return to original position, without with the hand moment control shaft 14 position.
Operation principle：When using the semiconductor production plasma etching machine, shaft 14 is turned clockwise with hand first
One end, at this time shaft 14 drive the steel wire 13 at its both ends to be moved at the center of the device, then steel wire 13 passes through first and slides
4 drive supporting rod 10 of wheel moves upwards, and the one end for simultaneously supporting bar 10 is rotated around third axis pin 11, and at the same time, second is solid
The second elastic element 12 determined between block 6 and supporting rod 10 is stretched, and can push plasma etching machine ontology 1 at this time, then
The second pulley 8 of 1 bottom of plasma etching machine ontology drives device movement, while the first elastic element 5 being arranged ensure that
During exercise, internal equipment will not be damaged plasma etching machine ontology 1, when fixing the device, you can turn shaft counterclockwise
14 one end, the contraction of the second elastic element 12, supporting rod 10 is pulled downward at this time, until the second elastic element 12 is restored to original
The state come, the device is that can be fixed at this time, to prevent the device to slide.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc.
With replacing, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection domain of invention.
Claims (6)
1. a kind of semiconductor production plasma etching machine, including plasma etching machine ontology (1), the first elastic element (5) and
Second elastic element (12), it is characterised in that：The bottom of the plasma etching machine ontology (1) is provided with the first fixed block (2),
And first the inside of fixed block (2) the first axis pin (3) is installed, and be provided with first pulley in the middle part of the first axis pin (3)
(4), the bottom surface of plasma etching machine ontology (1), and the first elastic element are fixed in one end of first elastic element (5)
(5) the other end is connected with the second fixed block (6), and second fixed block (6) is internally provided with the second axis pin (7), and
Second pulley (8) is installed, the avris of second fixed block (6) is provided with baffle (9), and baffle in the middle part of two axis pins (7)
(9) inside is equipped with third axis pin (11), and supporting rod (10) is provided in the middle part of third axis pin (11), second bullet
Property element (12) one end be fixed on the insides of supporting rod (10), and to be set to second solid for the other end of the second elastic element (12)
Determine the outside of block (6), the outer wall of the supporting rod (10) is connected with steel wire (13), and steel wire (13) is set to first pulley (4)
On, and the side end of first pulley (4) is fixed in one end of steel wire (13), in plasma etching machine ontology (1) bottom
Third fixed block (15) is provided at the heart, and the inside of third fixed block (15) is equipped with shaft (14).
2. a kind of semiconductor production plasma etching machine according to claim 1, it is characterised in that：First elasticity
Element (5) is provided with 4, and the first elastic element (5) is symmetrical about the central axis of plasma etching machine ontology (1).
3. a kind of semiconductor production plasma etching machine according to claim 1, it is characterised in that：The baffle (9)
Central axis about the second fixed block (6) is symmetrical, and the third axis pin (11) on baffle (9) is constituted with supporting rod (10) and rotated
Structure.
4. a kind of semiconductor production plasma etching machine according to claim 1, it is characterised in that：The supporting rod
(10) it is elastic connection with the second elastic element (12), and one end of supporting rod (10) is designed as arcuate structure.
5. a kind of semiconductor production plasma etching machine according to claim 1, it is characterised in that：The supporting rod
(10) elevating mechanism is constituted with shaft (14) by steel wire (13) and first pulley (4), and first pulley (4) is provided with 8.
6. a kind of semiconductor production plasma etching machine according to claim 1, it is characterised in that：The shaft (14)
It is to be threadedly coupled, and third fixed block (15) is provided with 2 with third fixed block (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810569471.2A CN108597979B (en) | 2018-06-05 | 2018-06-05 | A kind of semiconductor production plasma etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810569471.2A CN108597979B (en) | 2018-06-05 | 2018-06-05 | A kind of semiconductor production plasma etching machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108597979A true CN108597979A (en) | 2018-09-28 |
| CN108597979B CN108597979B (en) | 2019-11-05 |
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ID=63630834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201810569471.2A Active CN108597979B (en) | 2018-06-05 | 2018-06-05 | A kind of semiconductor production plasma etching machine |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010042799A1 (en) * | 2000-02-16 | 2001-11-22 | Apex Co. Ltd. | Showerhead apparatus for radical-assisted deposition |
| CN206438746U (en) * | 2017-02-07 | 2017-08-25 | 浙江长兴汇丰建设工程有限公司 | Remove scaffold frame supporting roller with shock-absorbing function |
| CN206727502U (en) * | 2017-04-25 | 2017-12-08 | 哈尔滨铭哲科技发展有限公司 | A kind of power station electric power fittings equipment |
| CN107583548A (en) * | 2017-09-20 | 2018-01-16 | 天津科创复兴科技咨询有限公司 | A kind of chemical fertilizer production mixing stirring device |
| CN107963101A (en) * | 2017-11-17 | 2018-04-27 | 重庆茗昇医疗科技有限公司 | It is a kind of that there is the conveying arrangement of shock-absorbing type |
-
2018
- 2018-06-05 CN CN201810569471.2A patent/CN108597979B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010042799A1 (en) * | 2000-02-16 | 2001-11-22 | Apex Co. Ltd. | Showerhead apparatus for radical-assisted deposition |
| CN206438746U (en) * | 2017-02-07 | 2017-08-25 | 浙江长兴汇丰建设工程有限公司 | Remove scaffold frame supporting roller with shock-absorbing function |
| CN206727502U (en) * | 2017-04-25 | 2017-12-08 | 哈尔滨铭哲科技发展有限公司 | A kind of power station electric power fittings equipment |
| CN107583548A (en) * | 2017-09-20 | 2018-01-16 | 天津科创复兴科技咨询有限公司 | A kind of chemical fertilizer production mixing stirring device |
| CN107963101A (en) * | 2017-11-17 | 2018-04-27 | 重庆茗昇医疗科技有限公司 | It is a kind of that there is the conveying arrangement of shock-absorbing type |
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| Publication number | Publication date |
|---|---|
| CN108597979B (en) | 2019-11-05 |
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Effective date of registration: 20191014 Address after: 221000 north side of Huangshan Road, BEIGOU Town, Xinyi City, Xuzhou City, Jiangsu Province (Wuxi Xinyi Industrial Park) Applicant after: Jiangsu tin Yi High-tech Zone Technology Development Co. Ltd. Address before: 310014, Zhejiang City, No. 18 Chao Wang Road, Zhejiang University of Technology Applicant before: Liang Ya |
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