CN108592973B - Shell and equipment transportation vibration and posture monitor with same - Google Patents
Shell and equipment transportation vibration and posture monitor with same Download PDFInfo
- Publication number
- CN108592973B CN108592973B CN201810814374.5A CN201810814374A CN108592973B CN 108592973 B CN108592973 B CN 108592973B CN 201810814374 A CN201810814374 A CN 201810814374A CN 108592973 B CN108592973 B CN 108592973B
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- Prior art keywords
- mounting groove
- power supply
- shell
- mounting
- housing
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- 238000012546 transfer Methods 0.000 claims description 15
- 238000013016 damping Methods 0.000 claims description 9
- 229920006351 engineering plastic Polymers 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 6
- 230000001133 acceleration Effects 0.000 description 24
- VAHKBZSAUKPEOV-UHFFFAOYSA-N 1,4-dichloro-2-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=CC=C1Cl VAHKBZSAUKPEOV-UHFFFAOYSA-N 0.000 description 17
- 238000005259 measurement Methods 0.000 description 8
- 235000015110 jellies Nutrition 0.000 description 4
- 239000008274 jelly Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- -1 polyoxymethylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 206010040007 Sense of oppression Diseases 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention provides a machine shell and a device transportation vibration and attitude monitor with the same, wherein the machine shell comprises: the upper shell is provided with a first mounting groove; the lower shell is provided with a second mounting groove matched with the first mounting groove; wherein, install power supply module in the first mounting groove, install circuit subassembly in the second mounting groove, go up casing and lower casing and dismantle the connection, go up casing and lower casing installation back, power supply module and circuit subassembly interval setting. The technical scheme of the invention effectively solves the problems that in the prior art, elements such as a power supply, a PCB (printed circuit board), a communication terminal and the like are arranged in an upper shell, the power supply is easy to bulge after being used for a long time, the expanded power supply can press the PCB, and the positions of the elements are deviated.
Description
Technical Field
The invention relates to the technical field of equipment safety monitoring, in particular to a machine shell and an equipment transportation vibration and posture monitor with the same.
Background
The conventional electronic device includes a casing main body divided into upper and lower parts: the bottom plate and the upper shell are assembled through bolts. The base plate is used for connecting the sensor and the equipment to be measured. The upper shell is internally provided with components such as a power supply, a circuit board, a communication terminal and the like.
Because the power supply, the PCB, the communication terminal and other elements are arranged in the upper shell, the power supply is easy to bulge after being used for a long time, the expanded power supply can press the PCB, so that the positions of the elements are deviated, and the precision of the electronic equipment with higher precision can be influenced; and the power supply expands to generate certain pressure, and when the pressure cannot be released, certain reverse acting force is generated on the power supply, so that hidden danger of power supply explosion is generated.
Disclosure of Invention
The invention mainly aims to provide a shell and a device transportation vibration and posture monitor with the same, which are used for solving the problems that in the prior art, elements such as a power supply, a PCB (printed Circuit Board), a communication terminal and the like are arranged in an upper shell, the power supply is easy to bulge after being used for a long time, and the expanded power supply can press the PCB, so that the positions of the elements are deviated.
In order to achieve the above object, according to one aspect of the present invention, there is provided a casing comprising: the upper shell is provided with a first mounting groove; the lower shell is provided with a second mounting groove matched with the first mounting groove; wherein, install power supply module in the first mounting groove, install circuit subassembly in the second mounting groove, go up casing and lower casing and dismantle the connection, go up casing and lower casing installation back, power supply module and circuit subassembly interval setting.
Further, the circuit assembly includes a PCB board mounted in the second mounting groove and an accelerator chip mounted on the PCB board.
Further, a first mounting hole is formed in the middle of the PCB, a plurality of second mounting holes are formed in the outer edge of the axial direction of the PCB, and a first mounting table matched with the first mounting hole and a second mounting table matched with the second mounting hole are arranged in the second mounting groove.
Further, the first mount is circumferentially provided with a plurality of transfer beams, and the plurality of transfer beams are arranged at intervals.
Further, the acceleration chip is mounted at the maximum deflection point of the PCB.
Further, the second mounting groove is filled with jelly, and the jelly is filled in a gap between the circuit assembly and the second mounting groove so as to improve vibration damping between the lower shell and the acceleration chip, and the vibration is conveniently and effectively transmitted and quickly attenuated.
Further, the first mounting groove is clearance fit with the power supply assembly to relieve stress from expansion of the power supply.
Further, a baffle is arranged between the upper shell and the lower shell and is arranged above the circuit component.
Further, the upper shell is made of engineering plastics, and the lower shell is made of metal materials.
According to another aspect of the present invention, there is provided a device transportation vibration and attitude monitor comprising a housing, the housing being the housing described above.
By applying the technical scheme of the invention, the shell is provided with the upper shell and the lower shell, the upper shell is used for installing the power supply assembly, the lower shell is used for installing the circuit assembly, and after the upper shell and the lower shell are installed, the power supply assembly and the circuit assembly are arranged at intervals, so that the power supply assembly and the circuit assembly can be separated from each other, the circuit assembly is prevented from being pressed after the power supply is inflated for a long time, and the normal operation among all elements is ensured. The technical scheme of the invention effectively solves the problems that in the prior art, elements such as a power supply, a PCB (printed circuit board), a communication terminal and the like are arranged in an upper shell, the power supply is easy to bulge after being used for a long time, the expanded power supply can press the PCB, and the positions of the elements are deviated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention. In the drawings:
FIG. 1 shows a schematic structural view of an embodiment of a chassis and device transport vibration and attitude monitor having the same according to the present invention;
FIG. 2 shows an exploded view of the chassis after mounting the power supply assembly and the circuit assembly; and
fig. 3 shows a schematic structural view of the lower case.
Wherein the above figures include the following reference numerals:
10. an upper housing; 11. a first mounting groove; 12. a power supply assembly; 20. a lower housing; 21. a second mounting groove; 22. a connection port; 23. a transfer beam; 30. a circuit assembly; 31. a PCB board; 311. a first mounting hole; 312. a second mounting hole; 32. accelerating the chip; 40. and a baffle.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Exemplary embodiments according to the present application will now be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It should be appreciated that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of these exemplary embodiments to those skilled in the art, that in the drawings, thicknesses of layers and regions are exaggerated for clarity, and identical reference numerals are used to denote identical devices, and thus descriptions thereof will be omitted.
As shown in fig. 1 to 3, a casing in the present embodiment includes an upper casing 10 and a lower casing 20. The upper case 10 is provided with a first installation groove 11. The lower housing 20 is provided with a second mounting groove 21 adapted to the first mounting groove 11. Wherein, install power module 12 in the first mounting groove 11, install circuit subassembly 30 in the second mounting groove 21, go up casing 10 and lower casing 20 detachable connection, go up casing 10 and lower casing 20 after the installation, power module 12 and circuit subassembly 30 interval set up.
By applying the technical scheme of the embodiment, the casing is provided with an upper casing 10 and a lower casing 20, the upper casing 10 is used for installing the power supply assembly 12, the lower casing 20 is used for installing the circuit assembly 30, and after the upper casing 10 and the lower casing 20 are installed, the power supply assembly 12 and the circuit assembly 30 are arranged at intervals, so that the power supply assembly 12 and the circuit assembly 30 can be spaced from each other, the circuit assembly 30 is prevented from being pressed after the power supply is inflated for a long time, and the normal operation among all elements is ensured. The technical scheme of this embodiment effectively solves the problems that in the prior art, elements such as a power supply, a PCB 31, a communication terminal and the like are all arranged in an upper housing 10, the power supply is easy to bulge after being used for a long time, the inflated power supply can press the PCB 31, and the positions among the elements are offset.
It should be noted that the first mounting groove 11 and the second mounting groove 21 cooperate to form a mounting cavity, and the power module 12 and the circuit module 30 are disposed in the mounting cavity, and the power module 12 and the circuit module 30 are electrically connected, specifically by a wire, so that the power module 12 provides electric energy for the circuit module 30. The upper case 10 and the lower case 20 are detachably connected, specifically, the upper case 10 and the lower case 20 are connected by a bolt, or a clamping assembly. When the bolt connection is adopted, a plurality of groups of bolts and matched through hole structures are arranged, so that the connection between the upper shell 10 and the lower shell 20 is more stable and reliable. The clamping assembly can be provided in a snap-fit or snap-fit configuration. The circuit assembly 30 also includes an SD card and a communication module. The lower shell 20 is provided with a connecting port 22 so as to be connected with external equipment, and is preferably provided with a USB interface, so that the USB interface is used for replacing the original aviation plug, the total thickness of the shell can be reduced, and the installation is convenient; and meanwhile, the universality of the data line is better.
As shown in fig. 1 to 3, in the technical solution of the present embodiment, the circuit assembly 30 includes a PCB board 31 mounted in the second mounting groove 21 and an acceleration chip 32 mounted on the PCB board 31. The PCB 31 mounted in the second mounting groove 21 in the above structure may be spaced apart from the power module 12, so as to avoid the compression of the PCB 31 when the power module 12 expands. The acceleration chip 32 is referred to as an acceleration sensor, that is, an electronic device capable of measuring acceleration force, and is a micro-mechanical structure, and is small in size, and can be directly soldered to the PCB 31, so that it may also be referred to as the acceleration chip 32. The accelerator chip 32 is preferably configured as a tri-axial accelerator chip 32.
As shown in fig. 1 to 3, in the technical solution of this embodiment, a first mounting hole 311 is formed in the middle of a PCB board 31, a plurality of second mounting holes 312 are formed in the outer edge of the PCB board 31 in the axial direction, and a first mounting table adapted to the first mounting hole 311 and a second mounting table adapted to the second mounting hole 312 are disposed in the second mounting groove 21. The arrangement of the first mounting holes 311 and the plurality of second mounting holes 312 in the structure can enable the installation of the PCB 31 to be more stable and reliable, improve vibration damping between the lower shell 20 and the PCB 31, further improve vibration damping between the lower shell 20 of the acceleration chip 32, facilitate effective transmission and rapid attenuation of vibration, and ensure that the acceleration chip 32 has higher measurement accuracy.
As shown in fig. 1 to 3, in the technical solution of the present embodiment, the first mounting table is circumferentially provided with a plurality of transfer beams 23, and the plurality of transfer beams 23 are arranged at intervals. The arrangement of the transfer beam 23 can further improve vibration damping between the lower housing 20 and the PCB 31, so that the acceleration chip 32 has higher measurement accuracy. Further, the PCB 31 may be set to be rectangular, the second mounting holes 312 are provided with 4, the 4 second mounting holes 312 are provided at four feet of the PCB 31, and the transfer beams 23 are provided between the 4 second mounting tables and the first mounting table. To form an "X" cross transfer beam, the four tips of the transfer beam 23 are adjacent to mounting holes between the sensor and the device and are brought together to be directly connected to the first mounting station of the PCB board 31. The cross transfer beam can directly transfer vibration to the acceleration chip on the PCB 31, so that the lower housing 20 and the acceleration chip 32 can be in more direct contact, thereby improving the effective transfer of vibration between the lower housing 20 and the acceleration chip 32.
As shown in fig. 1 to 3, in the technical solution of the present embodiment, the acceleration chip 32 is mounted at the point of maximum deflection of the PCB board 31. The accelerator chip 32 is configured as a tri-axial accelerator chip 32, and is capable of measuring acceleration values in x, y, and z directions, wherein a plane in which the x and y directions are located is parallel to a plane in which the bottom of the lower case 20 is located, and the z direction is a direction perpendicular to the bottom surface of the lower case 20. When the PCB 31 is impacted by a high g value (higher acceleration value) in the z direction, the acceleration chip 32 is inclined due to the deflection deformation, so that secondary x and y-direction acceleration measurement values are generated, and the x and y-direction acceleration measurement values interfere with the z-direction acceleration measurement values, thereby affecting the z-direction acceleration measurement accuracy. The acceleration chip is mounted at the point of maximum deflection of the PCB 31 and does not experience secondary x and y acceleration measurements due to high z impact. The point of maximum deflection is not at the geometric center because the PCB has a cutout to accommodate the data connector. The specific location may be determined from finite element mechanical simulation calculations.
As shown in fig. 1 to 3, in the technical solution of the present embodiment, the second mounting groove 21 is filled with a jelly, and the jelly is filled in a gap between the circuit assembly 30 and the second mounting groove 21, so as to improve vibration damping between the lower housing 20 and the accelerator chip 32, thereby facilitating effective transmission and rapid attenuation of vibration. The structure can improve vibration damping between the lower shell 20 and the acceleration chip 32, thereby facilitating effective transmission and rapid attenuation of vibration and improving measurement accuracy.
As shown in fig. 1 to 3, in the technical solution of the present embodiment, the first mounting groove 11 is in clearance fit with the power supply assembly 12 to release the stress generated by the expansion of the power supply. The above structure allows enough space between the first mounting groove 11 and the power supply assembly 12 to release the stress generated by the expansion of the power supply assembly 12 after the power supply assembly 12 is used for a long time. The specific gap size may be set according to the actual situation so as not to generate a force on the PCB 31 before the power module 12 fails.
As shown in fig. 1 to 3, in the technical solution of the present embodiment, a baffle 40 is disposed between the upper case 10 and the lower case 20, and the baffle 40 is disposed above the circuit assembly 30. The baffle 40 in the above structure can further avoid that the power component 12 will not generate force to the PCB 31 before failure. The division of the baffle 40 allows stresses from expansion of the power module 12 over time to act on the baffle 40 and not directly on the PCB 31. Specifically, the baffle 40 will partition the mounting cavity formed by the first mounting groove 11 and the second mounting groove 21 into two independent cavities, wherein the cavity formed by the baffle 40 and the first mounting groove 11 is not filled with glue, and the cavity formed by the baffle 40 and the second mounting groove 21 is filled with glue.
Notably, the baffle 40 is preferably made of engineering plastic. Baffle 40 passes through first mount table and a plurality of second mount tables and installs in second mounting groove 21, wherein, in order to make PCB board 31 and baffle 40 spaced apart, the second mount table includes PCB board 31 location portion and baffle 40 location portion, PCB board 31 location portion and baffle 40 location portion are cylindrical structure, the diameter of PCB board 31 location portion is greater than the diameter of baffle 40 location portion, PCB board 31 location portion is in the ground of baffle 40 location portion, preferably PCB board 31 location portion and baffle 40 location portion coaxial arrangement.
As shown in fig. 1 to 3, in the technical solution of the present embodiment, the upper housing 10 is made of engineering plastic, and the lower housing 20 is made of metal material. The upper case 10 is made of engineering plastic in the above structure, so that the rigidity of the upper case 10 is low, and the stress generated by the expansion of the battery can be further released. The engineering plastic here means: polycarbonates, polyamides, polyoxymethylene, deformed polyphenylene oxides, polyesters, polyphenylene sulfides, polyarylesters, unsaturated polyesters, phenolic plastics, epoxy plastics and the like. Meanwhile, the arrangement of engineering plastics can enable wireless signals to be directly transmitted, and an antenna is not required to be added.
The lower housing 20 is made of a metal material, so that the lower housing 20 has high rigidity to facilitate efficient transmission and rapid damping of vibration. Specifically, the lower case 20 may be made of stainless steel, titanium alloy, aluminum alloy, copper alloy, or the like. In order to make the processing of the lower housing 20 more convenient and quick, the lower housing 20 is processed by adopting an integral molding technology, and in particular, casting, stamping or 3D printing can be adopted for processing. Further, the second mounting table is provided on the transfer beam 23 at one side for better machining.
A vibration and attitude monitor for equipment transportation comprises a casing, wherein the casing is the casing. The equipment transportation vibration and attitude monitor of the embodiment has excellent performance, and has high signal-to-noise ratio, fast attenuation, high time resolution, low z-axis secondary signal intensity and almost no x-axis secondary signal and y-axis secondary signal when impacted by high g value.
From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects: the casing has two parts of last casing 10 and lower casing 20, and last casing 10 is used for installing power supply module 12, and lower casing 20 is used for installing circuit subassembly 30 to, after last casing 10 and lower casing 20 are installed, power supply module 12 and circuit subassembly 30 interval set up, just so can separate power supply module 12 and circuit subassembly 30 each other, avoid the power to produce the oppression to circuit subassembly 30 after having taken place the bulge for a long time, thereby guarantee the normal operating between each component. The technical scheme of the invention effectively solves the problems that in the prior art, elements such as a power supply, a PCB (printed circuit board) 31, a communication terminal and the like are arranged in an upper shell 10, the power supply is easy to bulge after being used for a long time, the expanded power supply can press the PCB 31, and the positions among the elements are offset.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be capable of being practiced otherwise than as specifically illustrated and described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A housing, comprising:
an upper shell (10), wherein a first mounting groove (11) is formed in the upper shell (10);
the lower shell (20), the lower shell (20) is provided with a second mounting groove (21) which is matched with the first mounting groove (11);
the power supply assembly (12) is arranged in the first mounting groove (11), the circuit assembly (30) is arranged in the second mounting groove (21), the upper shell (10) is detachably connected with the lower shell (20), and after the upper shell (10) and the lower shell (20) are mounted, the power supply assembly (12) and the circuit assembly (30) are arranged at intervals;
the first mounting groove (11) is in clearance fit with the power supply assembly (12) so as to release stress generated by power supply expansion, a baffle (40) is arranged between the upper shell (10) and the lower shell (20), the baffle (40) is arranged above the circuit assembly (30), a cavity formed by the baffle (40) and the first mounting groove (11) is not filled with glue, and a cavity formed by the baffle (40) and the second mounting groove (21) is filled with glue.
2. The chassis according to claim 1, wherein the circuit assembly (30) comprises a PCB board (31) mounted in the second mounting groove (21) and an accelerator chip (32) mounted on the PCB board (31).
3. The casing according to claim 2, wherein a first mounting hole (311) is formed in the middle of the PCB board (31), a plurality of second mounting holes (312) are formed in the outer edge of the PCB board (31), and a first mounting table adapted to the first mounting hole (311) and a second mounting table adapted to the second mounting hole (312) are arranged in the second mounting groove (21).
4. A casing according to claim 3, wherein the first mounting table is circumferentially provided with a plurality of transfer beams (23), a plurality of the transfer beams (23) being arranged at intervals.
5. A chassis according to claim 2, characterized in that the accelerator chip (32) is mounted at the point of maximum deflection of the PCB board (31).
6. The housing according to claim 2, wherein the second mounting groove (21) is filled with a gel, which is filled in a gap between the circuit assembly (30) and the second mounting groove (21) to improve vibration damping between the lower housing (20) and the accelerator chip (32), facilitating efficient transmission and rapid damping of vibrations.
7. The housing according to claim 1, wherein the upper housing (10) is made of engineering plastic and the lower housing (20) is made of metal material.
8. A device transportation vibration and attitude monitor comprising a housing, wherein the housing is as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814374.5A CN108592973B (en) | 2018-07-23 | 2018-07-23 | Shell and equipment transportation vibration and posture monitor with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814374.5A CN108592973B (en) | 2018-07-23 | 2018-07-23 | Shell and equipment transportation vibration and posture monitor with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108592973A CN108592973A (en) | 2018-09-28 |
| CN108592973B true CN108592973B (en) | 2024-04-16 |
Family
ID=63618217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810814374.5A Active CN108592973B (en) | 2018-07-23 | 2018-07-23 | Shell and equipment transportation vibration and posture monitor with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108592973B (en) |
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