CN108592973A - Casing and the equipment conveying vibration with it and attitude monitoring device - Google Patents
Casing and the equipment conveying vibration with it and attitude monitoring device Download PDFInfo
- Publication number
- CN108592973A CN108592973A CN201810814374.5A CN201810814374A CN108592973A CN 108592973 A CN108592973 A CN 108592973A CN 201810814374 A CN201810814374 A CN 201810814374A CN 108592973 A CN108592973 A CN 108592973A
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- Prior art keywords
- mounting groove
- casing
- power supply
- upper shell
- pcb board
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- 238000012806 monitoring device Methods 0.000 title claims abstract description 10
- 238000009434 installation Methods 0.000 claims abstract description 14
- 230000001133 acceleration Effects 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 13
- 238000013016 damping Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 229920006351 engineering plastic Polymers 0.000 claims description 6
- 235000015110 jellies Nutrition 0.000 claims description 6
- 239000008274 jelly Substances 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 abstract description 8
- 238000005259 measurement Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000007860 aryl ester derivatives Chemical class 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000010261 cell growth Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 210000002683 foot Anatomy 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention provides a kind of casing and with its equipment conveying vibration and attitude monitoring device, wherein casing, including：Upper shell offers the first mounting groove on upper shell；Lower housing offers the second mounting groove compatible with the first mounting groove on lower housing；Wherein, power supply module is installed in the first mounting groove, circuit unit is installed in the second mounting groove, upper shell and lower housing are detachably connected, after upper shell and lower housing installation, power supply module and the setting of circuit unit interval.Technical scheme of the present invention efficiently solves the elements such as power supply in the prior art, pcb board, communication terminal and is arranged in upper shell, power supply is easy to happen bulging using long, the problem of power supply after expansion can oppress pcb board, the position between each element is caused to shift.
Description
Technical field
The present invention relates to equipment safety monitoring technical fields, are transported in particular to a kind of casing and with its equipment
Defeated vibration and attitude monitoring device.
Background technology
Traditional electronic equipment includes chassis body, and chassis body is divide into upper part and lower part：Bottom plate and upper shell, they
Between pass through bolts assemblies.Bottom plate is used for sensor and the equipment measured is needed to be attached.Installation power supply, electricity in upper shell
The elements such as road plate, communication terminal.
Since the elements such as power supply, pcb board, communication terminal are arranged in upper shell, power supply is easy to happen drum using long
Swollen, the power supply after expansion can oppress pcb board, and the position between each element is caused to shift, and the higher electronics of precision is set
It is standby to influence its precision；And power supply expansion will produce certain pressure, and one can be generated to power supply itself when pressure can not discharge
Fixed opposition generates the hidden danger for causing power supply to explode.
Invention content
The main purpose of the present invention is to provide a kind of casing and with its equipment conveying vibration and attitude monitoring device, with
It solves the elements such as power supply in the prior art, pcb board, communication terminal to be arranged in upper shell, power supply has used easy hair long
The problem of raw bulging, the power supply after expansion can oppress pcb board, the position between each element is caused to shift.
To achieve the goals above, according to an aspect of the invention, there is provided a kind of casing, including：Upper shell, upper casing
The first mounting groove is offered on body；Lower housing offers the second mounting groove compatible with the first mounting groove on lower housing；Its
In, power supply module is installed in the first mounting groove, circuit unit is installed in the second mounting groove, upper shell and lower housing are detachable
After connection, upper shell and lower housing installation, power supply module and the setting of circuit unit interval.
Further, circuit unit includes the pcb board being mounted in the second mounting groove and the acceleration core on pcb board
Piece.
Further, the first mounting hole is offered in the middle part of pcb board, the axially outer edge of pcb board offers multiple second installations
Hole is provided with the first erecting bed compatible with the first mounting hole and compatible with the second mounting hole second in the second mounting groove
Erecting bed.
Further, the first erecting bed is circumferentially provided with multiple transfer beams, multiple transmission distance between girders settings.
Further, chip is accelerated to be mounted on the amount of deflection maximum point of pcb board.
Further, be filled with jelly in the second mounting groove, jelly be filled in circuit unit and the second mounting groove it
Between gap in, with improve lower housing and accelerate chip between shock damping, convenient for vibrations it is effective transmit and rapid decay.
Further, the first mounting groove and power supply module clearance fit, to discharge the stress that power supply expansion generates.
Further, baffle is provided between upper shell and lower housing, baffle plate setting is above circuit unit.
Further, upper shell is made of engineering plastics, and lower housing is made of metal material.
According to another aspect of the present invention, a kind of vibration of equipment conveying and attitude monitoring device, including casing, casing are provided
For above-mentioned casing.
It applies the technical scheme of the present invention, there are casing upper shell and lower housing two parts, upper shell to be used for installing power supply
Component, lower housing are used for installing circuit unit, also, after upper shell and lower housing installation, power supply module and circuit unit interval
Power supply module and circuit unit, can thus be separated from each other by setting, to electricity after avoiding power supply from using generation bulging long
Road component generates compressing, to ensure the normal operation between each element.Technical scheme of the present invention efficiently solves existing
The elements such as power supply, pcb board, communication terminal in technology are arranged in upper shell, and power supply is easy to happen bulging using long, swollen
The problem of power supply after swollen can oppress pcb board, the position between each element is caused to shift.
Description of the drawings
The accompanying drawings which form a part of this application are used to provide further understanding of the present invention, and of the invention shows
Meaning property embodiment and its explanation are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 show casing according to the present invention and with its equipment conveying vibration and attitude monitoring device embodiment
Structural schematic diagram；
Fig. 2 shows the explosive views after casing installation power supply module and circuit unit；And
Fig. 3 shows the structural schematic diagram of lower housing.
Wherein, above-mentioned attached drawing includes the following drawings label：
10, upper shell；11, the first mounting groove；12, power supply module；20, lower housing；21, the second mounting groove；22, connecting pin
Mouthful；23, transfer beams；30, circuit unit；31, pcb board；311, the first mounting hole；312, the second mounting hole；32, accelerate chip；
40, baffle.
Specific implementation mode
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another
It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
For ease of description, herein can with use space relative terms, as " ... on ", " in ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, if the device in attached drawing is squeezed, it is described as " in other devices
It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and
" in ... lower section " two kinds of orientation.The device can also other different modes positioning (be rotated by 90 ° or be in other orientation), and
And respective explanations are made to the opposite description in space used herein above.
Now, the illustrative embodiments according to the application are more fully described with reference to the accompanying drawings.However, these are exemplary
Embodiment can be implemented by many different forms, and should not be construed to be limited solely to embodiment party set forth herein
Formula.It should be understood that thesing embodiments are provided so that disclosure herein is thoroughly and complete, and these are shown
The design of example property embodiment is fully conveyed to those of ordinary skill in the art, in the accompanying drawings, for the sake of clarity, expands layer
With the thickness in region, and make that identical device is presented with like reference characters, thus description of them will be omitted.
As shown in Figures 1 to 3, a kind of casing in the present embodiment, including upper shell 10 and lower housing 20.It is opened on upper shell 10
Equipped with the first mounting groove 11.Second mounting groove compatible with the first mounting groove 11 21 is offered on lower housing 20.Wherein, first
Power supply module 12 is installed in mounting groove 11, circuit unit 30, upper shell 10 and lower housing 20 are installed in second mounting groove 21
It is detachably connected, after upper shell 10 and the installation of lower housing 20, power supply module 12 and the setting of the interval of circuit unit 30.
Using the technical solution of the present embodiment, there are casing 20 two parts of upper shell 10 and lower housing, upper shell 10 to be used for
Power supply module 12 is installed, after lower housing 20 is used for installing circuit unit 30, also, upper shell 10 and lower housing 20 are installed, power supply
Power supply module 12 and circuit unit 30, can thus be separated from each other, avoid by component 12 and the setting of the interval of circuit unit 30
Power supply generates compressing after having used generation bulging long to circuit unit 30, to ensure the normal operation between each element.This reality
The technical solution for applying example efficiently solves the elements such as power supply in the prior art, pcb board 31, communication terminal and is arranged at upper casing
In body 10, power supply is easy to happen bulging using long, and the power supply after expansion can oppress pcb board 31, lead to the position between each element
Set the problem of shifting.
It is worth noting that, the first mounting groove 11 and the second mounting groove 21 can cooperatively form installation cavity, 12 He of power supply module
Circuit unit 30 is arranged in installation cavity, and power supply module 12 and circuit unit 30 are electrically connected, and can specifically be connected by conducting wire,
So that power supply module 12, which is circuit unit 30, provides electric energy.Upper shell 10 and lower housing 20 are detachably connected, specifically, upper shell
10 and lower housing 20 be bolted or clip assembly connection.When being connected by screw bolts, it is provided with multigroup bolt and cooperation
Through-hole structure so that the connection of upper shell 10 and lower housing 20 is more reliable and more stable.Clip assembly could be provided as buckle knot
Structure or hasp structure.Circuit unit 30 further includes SD card and communication module.Connectivity port 22 is offered on lower housing 20, so as to
It is connect in external equipment, is preferably arranged to USB interface, to use USB type interface to replace original aviation plug, can reduced
The overall thickness of shell, is easily installed；The versatility of data line is more preferable simultaneously.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, circuit unit 30 includes being mounted on the second mounting groove 21
Interior pcb board 31 and the acceleration chip 32 on pcb board 31.The PCB being mounted in above structure in the second mounting groove 21
Plate 31 can be spaced apart with power supply module 12, formed and oppressed to pcb board 31 when power supply module 12 being avoided to expand.Herein plus
Fast chip 32 refers to acceleration transducer, that is, can measure a kind of electronic equipment of acceleration, because it is micromechanics knot
Structure, size is small, can be directly welded on pcb board 31, therefore is referred to as accelerating chip 32.Chip 32 is accelerated preferably to set
It is set to three axis and accelerates chip 32.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, 31 middle part of pcb board offers the first mounting hole 311,
The axially outer edge of pcb board 31 offers multiple second mounting holes 312, is provided in the second mounting groove 21 and the first mounting hole 311
Compatible first erecting bed and second erecting bed compatible with the second mounting hole 312.First mounting hole 311 in above structure
Setting with multiple second mounting holes 312 can make the installation of pcb board 31 more reliable and more stable, improve lower housing 20 and pcb board 31
Between shock damping, and then improve accelerate 32 lower housing 20 of chip between shock damping, convenient for vibrations it is effective transmission with
Rapid decay, to ensure to accelerate chip 32 that there is higher measurement accuracy.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, the first erecting bed is circumferentially provided with multiple transfer beams 23,
The setting of the interval of multiple transfer beams 23.The setting of transfer beams 23 can further increase the vibrations between lower housing 20 and pcb board 31
Damping, so as to accelerate chip 32 that there is higher measurement accuracy.It is possible to further set pcb board 31 to rectangle, the second peace
Dress hole 312 is provided with 4, and four foots in pcb board 31,4 the second erecting beds and first are arranged in 4 the second mounting holes 312
Transfer beams 23 are both provided between erecting bed.With the cross transfer beams of formation " X " type, four tops of transfer beams 23 are close to sensing
Mounting hole between device and equipment, and bring together, with directly and on the first erecting bed of the connection of pcb board 31.Utilize cross
Transfer beams can be transmitted vibrations to directly on the acceleration chip on pcb board 31, so that lower housing 20 and acceleration chip 32 can
With more directly contact, to improve lower housing 20 and accelerate effective transmission of the vibrations between chip 32.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, accelerate the amount of deflection that chip 32 is mounted on pcb board 31 maximum
Point.The acceleration value on the direction x, y and z can be measured after accelerating chip 32 to be set as three axis acceleration chip 32, wherein x and the side y
Plane to place is parallel with the plane where 20 bottom of lower housing, and the directions z are perpendicular to the direction of 20 bottom surface of lower housing.When
Pcb board 31 can be led to acceleration chip 32 in the directions z by the amount of deflection deformation occurred when being impacted to high-g level (higher acceleration value)
Tilt, to generate secondary x and y to acceleration measurement, x and y to acceleration measurement can to z to acceleration survey
Magnitude generate interference, and then influence z to acceleration analysis precision.The amount of deflection that acceleration chip is mounted on to pcb board 31 is maximum
Point after would not experience due to x and y secondary to impact high z to acceleration measurement.Since PCB has installation data to connect
The notch of head, maximum defluxion point is not in geometric center.Specific position can be determined according to finite element dynamics simulation calculation.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, jelly, jelly are filled in the second mounting groove 21
It is filled in the gap between circuit unit 30 and the second mounting groove 21, to improve lower housing 20 and accelerate the shake between chip 32
Dynamic damping, convenient for effective transmission of vibrations and rapid decay.Above structure can improve between lower housing 20 and acceleration chip 32
Shock damping, and then convenient for vibrations it is effective transmission and rapid decay, raising measurement accuracy.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, the first mounting groove 11 and 12 clearance fit of power supply module,
To discharge the stress that power supply expansion generates.It can make to have between the first mounting groove 11 and power supply module 12 in above structure enough
Space, with discharge power supply module 12 used long expansion generate stress.Specific gap size can be carried out according to actual conditions
Setting, before the failure of power supply module 12 power will not be acted to pcb board 31.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, baffle is provided between upper shell 10 and lower housing 20
40, baffle 40 is arranged above circuit unit 30.The setting of baffle 40 can further avoid power supply module 12 in above structure
Before failure power will not be acted to pcb board 31.Power supply module 12 can be made to have used long by the segmentation of baffle 40 and expand production
Raw stress is on baffle 40, without acting directly on pcb board 31.Specifically, baffle 40 can be by the first mounting groove
11 and second mounting groove 21 cooperatively form installation cavity and be divided into two mutually independent chambers, wherein baffle 40 and first is installed
The chamber not filler that slot 11 is formed, the chamber filler of baffle 40 and the formation of the second mounting groove 21.
It is worth noting that, 40 preferred engineering plastics of baffle are made.Baffle 40 passes through the first erecting bed and multiple second peaces
It fills platform to be mounted in the second mounting groove 21, wherein in order to make pcb board 31 be spaced apart with baffle 40, the second erecting bed includes pcb board
40 positioning region of 31 positioning regions and baffle, 31 positioning region of pcb board and 40 positioning region of baffle are cylindrical structure, and pcb board 31 positions
The diameter in portion is more than the diameter of 40 positioning region of baffle, and 31 positioning region of pcb board is in the stage of 40 positioning region of baffle, preferably pcb board
31 positioning regions and the coaxial arrangement of 40 positioning region of baffle.
As shown in Figures 1 to 3, in the technical solution of the present embodiment, upper shell 10 is made of engineering plastics, and lower housing 20 is
Metal material is made.Upper shell 10 is made of engineering plastics in above structure, can make the rigidity of upper shell 10 is relatively low can in this way
It is discharged with the stress further generated to cell expansion.Engineering plastics herein refer to：Makrolon, polyamide, poly- first
Aldehyde, deformation polyphenylene oxide, polyester, polyphenylene sulfide, poly- aryl ester, unsaturated polyester (UP), phenola plastics and epoxy plastics etc..Meanwhile engineering
The setting of plastics can be such that wireless signal directly transfers out, without adding antenna.
Lower housing 20 is made of metal material, can make lower housing 20 that there is higher rigidity effectively to be passed convenient for vibration in this way
It passs and rapid decay.Specifically, lower housing 20 may be used the materials such as stainless steel, titanium alloy, aluminium alloy and copper alloy and be made.For
Keep the processing of lower housing 20 more convenient, lower housing 20 is processed using integral molding techniques, specifically, casting can be used
It makes, punching press or 3D printing are processed.Further, preferably processing system is arranged in transfer beams 23 on one side in the second erecting bed
It makes.
A kind of vibration of equipment conveying and attitude monitoring device, including casing, casing are above-mentioned casing.The equipment of the present embodiment
Transport Vibration and attitude monitoring device function admirable, and in high g value impact, signal-to-noise ratio is high, decaying is fast --- temporal resolution height,
The secondary signal strength of z-axis is low, x, the secondary signal of y-axis almost without.
It can be seen from the above description that the above embodiments of the present invention realize following technique effect：Casing has
20 two parts of upper shell 10 and lower housing, upper shell 10 are used for installing power supply module 12, and lower housing 20 is used for installing circuit unit
30, also, after upper shell 10 and the installation of lower housing 20, power supply module 12 and the setting of the interval of circuit unit 30 can thus incite somebody to action
Power supply module 12 and circuit unit 30 are separated from each other, and pressure is generated to circuit unit 30 after avoiding power supply from using generation bulging long
Compel, to ensure the normal operation between each element.Technical scheme of the present invention efficiently solve power supply in the prior art,
The elements such as pcb board 31, communication terminal are arranged in upper shell 10, and power supply is easy to happen bulging using long, the electricity after expansion
Source can oppress pcb board 31, the problem of causing the position between each element to shift.
It should be noted that term used herein above is merely to describe specific implementation mode, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or combination thereof.
It should be noted that term " first " in the description and claims of this application and above-mentioned attached drawing, "
Two " etc. be for distinguishing similar object, without being used to describe specific sequence or precedence.It should be appreciated that using in this way
Data can be interchanged in the appropriate case, so that presently filed embodiment described herein for example can be in addition to herein
Sequence other than those of diagram or description is implemented.In addition, term " comprising " and " having " and their any deformation, it is intended that
Be to cover it is non-exclusive include, for example, containing the process of series of steps or unit, method, system, product or equipment not
Those of be necessarily limited to clearly to list step or unit, but may include not listing clearly or for these processes, side
The intrinsic other steps of method, product or equipment or unit.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of casing, which is characterized in that including：
Upper shell (10) offers the first mounting groove (11) on the upper shell (10)；
Lower housing (20) offers compatible second mounting groove with first mounting groove (11) on the lower housing (20)
(21)；
Wherein, power supply module (12) is installed in first mounting groove (11), electricity is installed in second mounting groove (21)
Road component (30), the upper shell (10) and the lower housing (20) are detachably connected, the upper shell (10) and the lower casing
After body (20) installation, the power supply module (12) and the setting of the circuit unit (30) interval.
2. casing according to claim 1, which is characterized in that the circuit unit (30) includes being mounted on described second to pacify
Pcb board (31) in tankage (21) and the acceleration chip (32) on the pcb board (31).
3. casing according to claim 2, which is characterized in that offer the first mounting hole in the middle part of the pcb board (31)
(311), the axially outer edge of the pcb board (31) offers multiple second mounting holes (312), is set in second mounting groove (21)
It is equipped with the first erecting bed compatible with first mounting hole (311) and compatible with second mounting hole (312)
Two erecting beds.
4. casing according to claim 3, which is characterized in that first erecting bed is circumferentially provided with multiple transfer beams
(23), the multiple transfer beams (23) intervals setting.
5. casing according to claim 2, which is characterized in that the acceleration chip (32) is mounted on the pcb board (31)
Amount of deflection maximum point.
6. casing according to claim 2, which is characterized in that be filled with jelly in second mounting groove (21), institute
It states in the gap that jelly is filled between the circuit unit (30) and second mounting groove (21), to improve the lower casing
Body (20) and the shock damping accelerated between chip (32), convenient for effective transmission of vibrations and rapid decay.
7. casing according to claim 1, which is characterized in that first mounting groove (11) and the power supply module (12)
Clearance fit, to discharge the stress that power supply expansion generates.
8. casing according to any one of claim 1 to 7, which is characterized in that the upper shell (10) and the lower casing
Baffle (40) is provided between body (20), baffle (40) setting is above the circuit unit (30).
9. casing according to claim 8, which is characterized in that the upper shell (10) is made of engineering plastics, under described
Shell (20) is made of metal material.
10. a kind of vibration of equipment conveying and attitude monitoring device, including casing, which is characterized in that the casing be claim 1 to
Casing described in any one of 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814374.5A CN108592973B (en) | 2018-07-23 | 2018-07-23 | Shell and equipment transportation vibration and posture monitor with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814374.5A CN108592973B (en) | 2018-07-23 | 2018-07-23 | Shell and equipment transportation vibration and posture monitor with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108592973A true CN108592973A (en) | 2018-09-28 |
| CN108592973B CN108592973B (en) | 2024-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810814374.5A Active CN108592973B (en) | 2018-07-23 | 2018-07-23 | Shell and equipment transportation vibration and posture monitor with same |
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| CN (1) | CN108592973B (en) |
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