CN108588596B - Method for improving shock resistance of diamond compact - Google Patents
Method for improving shock resistance of diamond compact Download PDFInfo
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- CN108588596B CN108588596B CN201810371768.8A CN201810371768A CN108588596B CN 108588596 B CN108588596 B CN 108588596B CN 201810371768 A CN201810371768 A CN 201810371768A CN 108588596 B CN108588596 B CN 108588596B
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Abstract
The invention discloses a method for improving the shock resistance of a diamond composite sheet, which utilizes the fact that the diamond composite sheet is synthesized under high temperature and high pressure, and the diamond layer is separated from a hard alloy matrix in advance to fully release the interface stress, and then the applied pressure is adjusted to anneal the diamond composite sheet at high temperature, so that on one hand, the residual stress in the diamond layer is reduced, and on the other hand, the diamond layer is combined with the hard alloy matrix again to achieve the purpose of improving the shock resistance.
Description
Technical Field
The invention relates to the field of superhard materials, in particular to a method for improving the shock resistance of a diamond compact.
Background
The diamond composite sheet is formed by sintering diamond micro powder and a hard alloy matrix under the conditions of ultrahigh temperature and high pressure, mainly consists of the hard alloy matrix and a sintered polycrystalline diamond layer, has the high hardness, high wear resistance and heat conductivity of diamond and the strength and impact toughness of hard alloy, and is an ideal material for manufacturing cutting tools, drilling bits and other wear-resistant tools.
The wear resistance and the impact resistance are two most important technical indexes of the diamond compact, the two indexes are mutually contradictory, the thinner the used diamond micro powder is, the higher the wear resistance is, the lower the impact resistance is, otherwise, the lower the wear resistance is, the higher the impact resistance is, and the close relationship between the two performances shows that the improvement of any performance can bring the improvement of the performance of the whole product.
With the progress of equipment and technology, the synthesis pressure of the diamond compact is increased day by day, the wear resistance of the product is greatly improved, the drilling requirement can be basically met, the drilling stratum is complicated day by day as the drilling depth is increased continuously, and the shock resistance of the diamond compact becomes a short plate applied to the product. In order to improve the shock resistance of the diamond compact, designers continuously adjust the structure of the diamond powder and optimize the tooth profile design of the hard alloy matrix, but the inherent internal stress which cannot be avoided in the production process enables the shock resistance of the product to be improved slightly, so that the removal of the residual stress of the product becomes a direct and effective method for improving the shock resistance. In most industries, the best method for removing residual stress is annealing treatment at high temperature for a long time, the method can reduce stress and improve impact resistance when applied to the diamond composite sheet, but the diamond layer on the surface of the diamond composite sheet can be quickly damaged under the long-time high-temperature environment, so that the annealing temperature of the diamond composite sheet cannot be too high, the effect of removing stress by annealing is greatly reduced, and even if the performance of the diamond composite sheet is reduced by more than 10% by annealing each time.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a method for improving the impact resistance of a diamond compact, and aims to solve the problem that the impact resistance of the existing diamond compact is reduced due to residual stress caused by different expansion coefficients among substances.
The technical scheme of the invention is as follows:
a method for improving the shock resistance of a diamond compact is characterized in that the diamond compact is subjected to annealing treatment within the pressure range of 3-6 GPa.
The method for improving the impact resistance of the diamond compact comprises the following specific steps of:
cutting the diamond composite sheet in advance to obtain a diamond layer and a hard alloy matrix; assembling the diamond layer and the hard alloy matrix, and placing the diamond layer and the hard alloy matrix into a pyrophyllite block after the assembly is finished;
and placing the pyrophyllite block in a vacuum drying oven for baking, vacuumizing, then placing the pyrophyllite block into a top press, and annealing within a preset pressure range.
The method for improving the impact resistance of the diamond compact comprises the step of annealing at the temperature of 1100-1500 ℃.
The method for improving the impact resistance of the diamond compact comprises the step of annealing for 200-1000S.
The method for improving the shock resistance of the diamond compact is characterized in that the diamond compact is annealed in a constant-temperature and constant-pressure mode.
The method for improving the shock resistance of the diamond compact is characterized in that the diamond compact is annealed in a mode that the pressure, the temperature and the time are linearly reduced.
The method for improving the shock resistance of the diamond compact is characterized in that the diamond compact is subjected to annealing treatment in a mode of descending step by adopting pressure, temperature and time.
The method for improving the shock resistance of the diamond compact is characterized in that the diamond compact is subjected to annealing treatment in a mode of dividing pressure, temperature and time into three steps.
The method for improving the shock resistance of the diamond composite sheet comprises the following steps of annealing the diamond composite sheet in a mode of dividing pressure, temperature and time into three steps, wherein the first step has the constant pressure of 5GPa, the constant temperature of 1400 ℃, and annealing for 150S; the second step has a constant pressure of 4.5GPa, is annealed at the constant temperature of 1300 ℃ for 150S; the third step has constant pressure of 4GPa, constant temperature of 1200 ℃ and annealing for 150S.
Has the advantages that: according to the invention, by utilizing the characteristic that the diamond composite sheet is synthesized at high temperature and high pressure and can protect the diamond layer from being damaged at high temperature in a high-pressure environment, the diamond layer is separated from the hard alloy in advance, so that the interface stress is fully released, and the applied pressure is adjusted, so that the diamond composite sheet is annealed at high temperature, on one hand, the residual stress in the diamond layer is reduced, and on the other hand, the diamond layer is combined with the hard alloy matrix again, and the purpose of improving the shock resistance is achieved.
Drawings
FIG. 1 is a graph comparing the results of impact resistance tests.
Detailed Description
The invention provides a method for improving the shock resistance of a diamond compact, and the invention is further described in detail below in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The method for improving the shock resistance of the diamond compact provided by the invention is to anneal the diamond compact within the pressure range of 3-6 GPa.
As one embodiment of the present invention, first, a diamond compact blank (unprocessed after synthesis) is selected. Removing metal skin from a diamond compact blank, machining the outer diameter to be 0.5mm larger than the final size, grinding the diamond layer to be the machining allowance of 0.5mm larger than the final size, separating the diamond layer from the hard alloy matrix at a position 0.1-0.5mm below the composite diamond layer through a wire cut electrical discharge machine, namely performing cutting treatment, and then performing fine grinding treatment on the cutting surface of the separated diamond layer and the cutting surface of the hard alloy matrix.
Because the expansion coefficient difference between the diamond and the hard alloy substrate is large, the interface of the diamond and the hard alloy substrate gathers very large stress, and the stress at the interface of the diamond compact is fully released by separating the diamond layer from the hard alloy substrate in advance.
And further assembling the processed diamond layer and the hard alloy matrix according to a synthesis process, and placing the assembled diamond layer and the hard alloy matrix into a pyrophyllite block. The diamond layer and the hard alloy substrate are assembled according to a synthesis process, which is the prior art and is not described herein. For example, two assembled diamond compacts may be packed into a pyrophyllite block, the two diamond layers being placed opposite to each other, and a mica sheet may be placed between the diamond layers of the two diamond compacts in order to prevent the two diamond compacts from sticking together at high temperature.
And further, placing the pyrophyllite block in a vacuum drying oven for baking, then placing the pyrophyllite block into a cubic press, annealing within a preset pressure range, and releasing the stress inside the diamond composite sheet, so that the shock resistance of the diamond composite sheet is improved.
Preferably, the predetermined pressure range is 3-6GPa and the temperature range is 1100-1500 ℃ when the annealing treatment is performed.
Specifically, the annealing treatment may be performed at a constant pressure and a constant temperature, for example, the pressure is set to 3GPa, the temperature is set to 1100 ℃, and the annealing treatment time is 300S.
For better annealing effect, the annealing treatment can also adopt a mode that the pressure, the temperature and the time are linearly decreased. As an example, the rate of temperature decrease with time may be set to 0.5-2 deg.C/S and the rate of pressure decrease with time to 0.1-0.4 GPa/min. Stress relief inside the diamond compact is more complete because the temperature and pressure drops are more uniform.
Further, although a good annealing treatment effect (large stress reduction of the diamond compact) can be obtained by adopting a mode that the pressure, the temperature and the time are linearly reduced, the requirement on equipment is high, the existing equipment needs to be improved, and the time consumption is long. In practical production, a step-down method of pressure, temperature and time is usually adopted, that is, the annealing treatment is divided into different stages, and each stage corresponds to different pressure and temperature. For example, the annealing process can be completed in three stages, wherein the pressure of the first stage is set to be 5GPa, the temperature is set to be 1400 ℃, and the constant-temperature and constant-pressure annealing is carried out for 150S; setting the pressure to be 4.5GPa and the temperature to be 1300 ℃ in the second stage, and annealing for 150S at constant temperature and constant pressure; and setting the pressure to be 4GPa and the temperature to be 1200 ℃ in the third stage, and annealing for 150S at constant temperature and constant pressure.
The technical effects of the present invention will be described in detail below with reference to examples.
Example 1
The raw material is a diamond composite sheet produced by A manufacturer, and 6 synthesized diamond composite sheets are processed into diamond composite sheets with the diameter of 16.0mm, the height of 13.2mm, the thickness of the diamond layer of 2.0mm and the chamfer angle (45 degrees) of diamond of 0.3 mm. And directly carrying out drop hammer impact test on the processed composite sheet.
Example 2
6 diamond compacts of the same batch as in example 1 were processed to a diameter of 16.5mm and the diamond layer was ground to 2.5 mm. And (3) placing the processed composite sheet in a vacuum high-temperature furnace to be calcined for 450S at the temperature of 1200 ℃, taking out the composite sheet after sintering, naturally cooling the composite sheet, processing the sample into the same size as that of the sample in the example 1, and carrying out drop hammer impact test.
Example 3
6 diamond compacts of the same batch as in example 1 were processed to a diameter of 16.5mm and the diamond layer was ground to 2.5 mm. And (3) placing the processed composite sheet in a vacuum high-temperature furnace to be calcined for 450S, wherein the temperature is 700 ℃, taking out the composite sheet after sintering, naturally cooling the composite sheet, processing the sample into the same size as that of the embodiment 1, and performing drop hammer impact test.
Example 4
6 diamond compacts of the same batch as in example 1 were processed to a diameter of 16.5mm and the diamond layer was ground to 2.5 mm. And separating the diamond layer from the hard alloy matrix by a wire cut electric discharge machine, and then carrying out fine grinding treatment on the cutting surface. Assembling the two processed diamond layers and the two hard alloy substrates according to a synthesis process to obtain two diamond composite sheets, placing the two diamond composite sheet heads in the pyrophyllite in a collision way, and separating mica sheets between the two diamond composite sheets in order to prevent the diamond composite sheets from being adhered together at high temperature and high pressure. And (3) placing the assembled pyrophyllite block in a cubic press, and carrying out annealing treatment in three sections. A first stage: constant pressure 5GPa, constant temperature 1400 ℃ and annealing for 150S; and a second stage: constant pressure 4.5GPa, constant temperature 1300 ℃, annealing for 150S; a third stage: constant pressure of 3GPa, constant temperature of 1200 ℃ and annealing for 150S. The annealed composite sheet was processed to the same dimensions as in example 1 and subjected to drop weight impact testing.
Example 5
6 diamond compacts of the same batch as in example 1 were processed to a diameter of 16.5mm and the diamond layer was ground to 2.5 mm. And separating the diamond layer from the hard alloy matrix by a wire cut electric discharge machine, and then carrying out fine grinding treatment on the cutting surface. Assembling the two processed diamond layers and the two hard alloy substrates according to a synthesis process to obtain two diamond composite sheets, placing the two diamond composite sheet heads in the pyrophyllite in a collision way, and separating mica sheets between the two diamond composite sheets in order to prevent the diamond composite sheets from being adhered together at high temperature and high pressure. . And placing the assembled pyrophyllite block in a cubic press, and annealing by adopting a mode of linearly reducing pressure, temperature and time, wherein the initial pressure is 6GPa, the temperature is 1400 ℃, the time-dependent reduction rate of the pressure is set to be 0.1GPa/min, the time-dependent reduction rate of the temperature is set to be 0.5 ℃/S, and the treatment time is 18 min. The annealed composite sheet was processed to the same dimensions as in example 1 and subjected to drop weight impact testing.
Please refer to fig. 1, which is a graph showing the results of the impact resistance tests of examples 1-5. As shown in fig. 1, example 1 is the result of impact resistance test of a diamond compact without annealing treatment. After the temperature at atmospheric pressure increased to 700 c during the annealing treatment, the impact resistance of the diamond compact decreased dramatically as in example 2 (the temperature at atmospheric pressure increased to 1200 c). Example 3 is the result of the impact resistance test of the diamond compact after the annealing treatment of the diamond compact at 700 ℃ under normal pressure and temperature, and the performance improvement is not obvious compared with the result of example 1. Examples 4 to 5 are the results of the impact resistance test of the diamond compact after the diamond compact was annealed in a stepwise manner with a temperature linearly decreasing with pressure, compared with the test results of the examples 1 to 3, the improvement of the shock resistance is very obvious, because the stress in the diamond compact is reduced along with the increase of the annealing time, the required annealing temperature and the required pressure are reduced along with the reduction of the annealing time, the damage to the diamond powder layer caused by overhigh temperature is avoided, the matching of the pressure and the temperature during the annealing is a key factor influencing the annealing effect, namely, the stress is released after annealing treatment and the adverse effect on the composite diamond sheet is minimum when the corresponding pressure is matched at a certain temperature, and the more segments, the more numerous segments, the linear relationship which is an infinite number of times, the best effect is achieved, but the promotion amplitude is limited.
In summary, according to the method for improving the impact resistance of the diamond compact, the diamond compact is synthesized at high temperature and high pressure, and the diamond layer can be protected from being damaged at high temperature in a high-pressure environment, the diamond compact is annealed at high temperature by adjusting applied pressure, so that the residual stress of the diamond layer is reduced, and the diamond layer and the substrate are cut and separated in advance, so that the interface stress is fully released, and the aim of improving the impact resistance of the diamond compact is fulfilled.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (8)
1. A method for improving the shock resistance of a diamond compact is characterized in that the diamond compact is annealed within the pressure range of 3-6 GPa;
the annealing treatment of the diamond compact in a preset pressure range specifically comprises the following steps:
cutting the diamond composite sheet in advance to obtain a diamond layer and a hard alloy matrix; assembling the diamond layer and the hard alloy matrix, and placing the diamond layer and the hard alloy matrix into a pyrophyllite block after the assembly is finished;
and placing the pyrophyllite block in a vacuum drying oven for baking, vacuumizing, then placing the pyrophyllite block into a top press, and annealing within a preset pressure range.
2. The method of claim 1, wherein the annealing is performed at a temperature of 1100-1500 ℃.
3. The method of claim 1, wherein the annealing is performed for a period of 200-1000 s.
4. The method for improving the impact resistance of the diamond compact as recited in claim 1, wherein the diamond compact is annealed at a constant temperature and a constant pressure.
5. The method of claim 1, wherein the annealing of the diamond compact is performed in a manner that pressure, temperature and time decrease linearly.
6. The method of claim 1, wherein the diamond compact is annealed in a stepwise decrease in pressure, temperature and time.
7. The method of claim 6, wherein the diamond compact is annealed by dividing pressure, temperature and time into three steps.
8. The method for improving the impact resistance of the diamond compact according to claim 7, wherein the diamond compact is annealed in a manner that the pressure, the temperature and the time are divided into three steps, the first step is performed at a constant pressure of 5GPa and a constant temperature of 1400 ℃ for 150 s; the second step has a constant pressure of 4.5GPa, is annealed at the constant temperature of 1300 ℃ for 150 s; the third step has constant pressure of 4GPa, constant temperature of 1200 ℃ and annealing for 150 s.
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| CN115283681A (en) * | 2022-08-03 | 2022-11-04 | 苏州思珀利尔工业技术有限公司 | Preparation method of low-internal-stress diamond compact |
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| GB0810184D0 (en) * | 2008-06-04 | 2008-07-09 | Element Six Production Pty Ltd | Method for producing a compact |
| CN103623747B (en) * | 2013-12-03 | 2016-03-02 | 深圳市海明润超硬材料股份有限公司 | A kind of diamond compact with high thermal conductivity and preparation method thereof |
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